CA2719179C - Power module assembly with reduced inductance - Google Patents

Power module assembly with reduced inductance Download PDF

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Publication number
CA2719179C
CA2719179C CA2719179A CA2719179A CA2719179C CA 2719179 C CA2719179 C CA 2719179C CA 2719179 A CA2719179 A CA 2719179A CA 2719179 A CA2719179 A CA 2719179A CA 2719179 C CA2719179 C CA 2719179C
Authority
CA
Canada
Prior art keywords
positive
power semiconductor
negative
output
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2719179A
Other languages
English (en)
French (fr)
Other versions
CA2719179A1 (en
Inventor
Richard Alfred Beaupre
Eladio Clemente Delgado
Ljubisa Dragoljub Stevanovic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CA2719179A1 publication Critical patent/CA2719179A1/en
Application granted granted Critical
Publication of CA2719179C publication Critical patent/CA2719179C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Inverter Devices (AREA)
  • Rectifiers (AREA)
CA2719179A 2009-10-30 2010-10-28 Power module assembly with reduced inductance Expired - Fee Related CA2719179C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/609,400 US8076696B2 (en) 2009-10-30 2009-10-30 Power module assembly with reduced inductance
US12/609,400 2009-10-30

Publications (2)

Publication Number Publication Date
CA2719179A1 CA2719179A1 (en) 2011-04-30
CA2719179C true CA2719179C (en) 2013-08-13

Family

ID=43533445

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2719179A Expired - Fee Related CA2719179C (en) 2009-10-30 2010-10-28 Power module assembly with reduced inductance

Country Status (6)

Country Link
US (1) US8076696B2 (https=)
EP (1) EP2317551B1 (https=)
JP (1) JP2011097053A (https=)
CN (1) CN102110680B (https=)
BR (1) BRPI1004830B1 (https=)
CA (1) CA2719179C (https=)

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JP6594000B2 (ja) 2015-02-26 2019-10-23 ローム株式会社 半導体装置
CN106340513B (zh) * 2015-07-09 2019-03-15 台达电子工业股份有限公司 一种集成控制电路的功率模块
JP6488940B2 (ja) * 2015-08-07 2019-03-27 富士電機株式会社 半導体装置
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CN105957860B (zh) * 2016-05-03 2018-07-20 扬州国扬电子有限公司 一种设有绝缘隔板的功率模块
CN105789192B (zh) * 2016-05-03 2018-11-30 扬州国扬电子有限公司 一种设有电极大臂的功率模块
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JP7210446B2 (ja) * 2016-11-25 2023-01-23 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト パワー半導体モジュール
US10212838B2 (en) * 2017-01-13 2019-02-19 Cree Fayetteville, Inc. High power multilayer module having low inductance and fast switching for paralleling power devices
IT201700033230A1 (it) * 2017-03-27 2018-09-27 S M E S P A Modulo di potenza per un convertitore di grandezze elettriche
WO2018207406A1 (ja) * 2017-05-12 2018-11-15 三菱電機株式会社 半導体モジュールおよび電力変換装置
JP7119399B2 (ja) * 2018-02-06 2022-08-17 株式会社デンソー 半導体装置
CN109860160B (zh) * 2018-12-25 2020-10-09 扬州国扬电子有限公司 一种结构紧凑且寄生电感低的功率模块
DE102019204889A1 (de) * 2019-04-05 2020-10-08 Robert Bosch Gmbh Elektronische Schaltungseinheit
JP7050732B2 (ja) * 2019-09-24 2022-04-08 ローム株式会社 半導体装置
JP7240541B2 (ja) * 2019-09-24 2023-03-15 ローム株式会社 半導体装置
CN111162051B (zh) * 2019-12-23 2021-08-03 湖南国芯半导体科技有限公司 功率端子、功率模块封装结构及封装方法
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WO2022176675A1 (ja) * 2021-02-16 2022-08-25 住友電気工業株式会社 半導体装置
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Also Published As

Publication number Publication date
JP2011097053A (ja) 2011-05-12
CN102110680B (zh) 2019-08-06
EP2317551A1 (en) 2011-05-04
CN102110680A (zh) 2011-06-29
EP2317551B1 (en) 2020-04-29
BRPI1004830B1 (pt) 2020-02-27
US8076696B2 (en) 2011-12-13
CA2719179A1 (en) 2011-04-30
BRPI1004830A2 (pt) 2013-02-19
US20110101515A1 (en) 2011-05-05

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Effective date: 20201028