CN102097391B - 功率半导体模块 - Google Patents

功率半导体模块 Download PDF

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Publication number
CN102097391B
CN102097391B CN201010537891.6A CN201010537891A CN102097391B CN 102097391 B CN102097391 B CN 102097391B CN 201010537891 A CN201010537891 A CN 201010537891A CN 102097391 B CN102097391 B CN 102097391B
Authority
CN
China
Prior art keywords
contact
power semiconductor
capacitor
semiconductor modular
load connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010537891.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN102097391A (zh
Inventor
托马斯·弗兰克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of CN102097391A publication Critical patent/CN102097391A/zh
Application granted granted Critical
Publication of CN102097391B publication Critical patent/CN102097391B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CN201010537891.6A 2009-11-04 2010-11-04 功率半导体模块 Expired - Fee Related CN102097391B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009046403.4 2009-11-04
DE102009046403.4A DE102009046403B4 (de) 2009-11-04 2009-11-04 Leistungshalbleitermodul in Druckkontakttechnik

Publications (2)

Publication Number Publication Date
CN102097391A CN102097391A (zh) 2011-06-15
CN102097391B true CN102097391B (zh) 2014-12-10

Family

ID=42848832

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010537891.6A Expired - Fee Related CN102097391B (zh) 2009-11-04 2010-11-04 功率半导体模块

Country Status (6)

Country Link
US (1) US8427836B2 (https=)
EP (1) EP2320459A2 (https=)
JP (1) JP5695884B2 (https=)
KR (1) KR101688663B1 (https=)
CN (1) CN102097391B (https=)
DE (1) DE102009046403B4 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8837166B2 (en) * 2011-10-28 2014-09-16 Hamilton Sundstrand Corporation Vertically mounted capacitor assembly
DE102012211952B4 (de) * 2012-07-09 2019-04-25 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit mindestens einem stressreduzierenden Anpasselement
FI20126120A7 (fi) * 2012-10-29 2014-04-30 Tellabs Oy Jousikiinnitteisellä elementillä varustettu piirikorttijärjestelmä
JP5932704B2 (ja) * 2013-04-04 2016-06-08 株式会社日本自動車部品総合研究所 電力変換装置
DE102013104950B3 (de) * 2013-05-14 2014-04-30 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und Anordnung hiermit
DE102013209431B4 (de) 2013-05-22 2018-04-05 Siemens Aktiengesellschaft Leistungshalbleitermodul
DE102014101024B3 (de) * 2014-01-29 2014-12-04 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
DE102014116058B3 (de) * 2014-11-04 2015-12-17 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
DE102015115140B4 (de) * 2015-09-09 2023-12-21 Infineon Technologies Ag Stromrichteranordnung mit verbesserter Befestigung
US10555425B2 (en) 2016-02-18 2020-02-04 Magna Closures Inc. Enclosure assembly for an electronic controller having an over-molded part to protect electronic components
DE102016105783B4 (de) 2016-03-30 2019-05-16 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
DE102016112777B4 (de) 2016-07-12 2021-03-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
DE102018125852B3 (de) * 2018-10-18 2020-03-12 Semikron Elektronik Gmbh & Co. Kg Anordnung und Verfahren zur Herstellung einer solchen Anordnung sowie Leistungshalbleitereinrichtung
DE102019103402B4 (de) * 2019-02-12 2020-12-17 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
EP4109480A4 (en) * 2020-02-21 2023-06-28 Panasonic Intellectual Property Management Co., Ltd. Electronic component holder and electrical instrument

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004061936A1 (de) * 2004-12-22 2006-07-06 Siemens Ag Anordnung eines Halbleitermoduls und einer elektrischen Verschienung
DE102005055608B3 (de) * 2005-11-22 2007-05-10 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit zueinander parallel geschalteten Kondensatoren
DE102006006425A1 (de) * 2006-02-13 2007-08-23 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontaktausführung
CN101047172A (zh) * 2006-03-22 2007-10-03 塞米克朗电子有限及两合公司 具有连接装置的紧凑型功率半导体模块

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4111247C3 (de) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Schaltungsanordnung
JPH0947037A (ja) * 1995-07-25 1997-02-14 Aisin Aw Co Ltd インバータ装置
EP1289014B1 (en) * 2001-04-02 2013-06-19 Mitsubishi Denki Kabushiki Kaisha Power semiconductor device
DE10121970B4 (de) * 2001-05-05 2004-05-27 Semikron Elektronik Gmbh Leistungshalbleitermodul in Druckkontaktierung
KR200300838Y1 (ko) * 2002-10-28 2003-01-14 조경호 버어니어 캘리퍼스의 기능이 구비된 휴대용 저울
DE10355925B4 (de) 2003-11-29 2006-07-06 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und Verfahren seiner Herstellung
DE102005024900B4 (de) * 2004-06-08 2012-08-16 Fuji Electric Co., Ltd. Leistungsmodul
JP4764979B2 (ja) * 2004-06-08 2011-09-07 富士電機株式会社 半導体装置
DE102006006424B4 (de) * 2006-02-13 2011-11-17 Semikron Elektronik Gmbh & Co. Kg Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren
JP2007281127A (ja) * 2006-04-05 2007-10-25 Shindengen Electric Mfg Co Ltd コンデンサを備える回路装置及びコンデンサモジュール
JP2008029093A (ja) * 2006-07-20 2008-02-07 Hitachi Ltd 電力変換装置
DE102007054709B4 (de) * 2007-11-16 2014-11-13 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Substrat und mit einer Druckeinrichtung
JP5292823B2 (ja) * 2008-01-22 2013-09-18 日産自動車株式会社 電力変換装置
EP2340560B1 (en) * 2008-01-25 2013-07-10 Letrika Lab d.o.o. Power switching module
DE102008057832B4 (de) * 2008-11-19 2010-07-01 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit vorgespannter Hilfskontaktfeder

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004061936A1 (de) * 2004-12-22 2006-07-06 Siemens Ag Anordnung eines Halbleitermoduls und einer elektrischen Verschienung
DE102005055608B3 (de) * 2005-11-22 2007-05-10 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit zueinander parallel geschalteten Kondensatoren
DE102006006425A1 (de) * 2006-02-13 2007-08-23 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontaktausführung
CN101047172A (zh) * 2006-03-22 2007-10-03 塞米克朗电子有限及两合公司 具有连接装置的紧凑型功率半导体模块

Also Published As

Publication number Publication date
JP2011101010A (ja) 2011-05-19
DE102009046403A1 (de) 2011-05-05
DE102009046403B4 (de) 2015-05-28
US20110103024A1 (en) 2011-05-05
CN102097391A (zh) 2011-06-15
JP5695884B2 (ja) 2015-04-08
US8427836B2 (en) 2013-04-23
KR20110049690A (ko) 2011-05-12
KR101688663B1 (ko) 2016-12-21
EP2320459A2 (de) 2011-05-11

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