WO2015058491A1 - 免焊接端子的功率模块 - Google Patents

免焊接端子的功率模块 Download PDF

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Publication number
WO2015058491A1
WO2015058491A1 PCT/CN2014/074134 CN2014074134W WO2015058491A1 WO 2015058491 A1 WO2015058491 A1 WO 2015058491A1 CN 2014074134 W CN2014074134 W CN 2014074134W WO 2015058491 A1 WO2015058491 A1 WO 2015058491A1
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WO
WIPO (PCT)
Prior art keywords
terminal
terminals
pressure pad
housing
power module
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PCT/CN2014/074134
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English (en)
French (fr)
Inventor
麻长胜
王晓宝
赵善麒
Original Assignee
江苏宏微科技股份有限公司
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Publication of WO2015058491A1 publication Critical patent/WO2015058491A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates

Definitions

  • the invention relates to a power module without soldering terminals, belonging to the technical field of power module manufacturing. Background technique
  • Power modules are widely used in AC motor frequency conversion speed regulation and DC motor chopper speed regulation and various high-performance power sources, such as UPS, induction heating, electric welding machine, active compensation, DC-DC converter, etc., as well as industrial electrical automation.
  • the conventional power semiconductor module mainly comprises a casing, a main circuit board and a driving circuit board, and the MOSFET or IGBT chip and the diode chip are integrated and soldered or adhered to the metal layer of the metal-clad substrate, and the electrode terminal and the signal terminal are also soldered.
  • the metal circuit board is covered with a main circuit board, and the printed circuit board soldered with the integrated circuit chip and each device constitutes a driving circuit board.
  • the driving circuit board is mounted on the outer casing by screws, and the signal terminals are required.
  • the terminal hole on the cover of the outer casing and the terminal hole on the driving circuit board are pierced, and the signal terminal is connected to the driving circuit board through solder, and the connection between the power semiconductor module and the external circuit and the input of the signal are realized through the electrode terminal and the signal terminal. Output.
  • the main circuit board to which the terminals are soldered needs to be mounted on the outer casing, and the cover plate is mounted on the outer casing, and the terminals are pierced through the terminal holes on the cover plate, so that the cover can limit the terminals, the terminals thereof
  • the gap between the hole and the terminal is small, but since the outer casing is usually injection molded of insulating plastic, the wall thickness of the outer casing is inconsistent, which may cause deformation of the cover after installation and affect the installation efficiency and assembly quality of each terminal.
  • the terminal also needs to pass through the terminal hole on the driving circuit board, and the upper part of the terminal is a needle-like structure or a plate-like structure, especially the pin-shaped terminal is not high in strength, and the terminal is easily received during the mounting process. Deformation occurs after external force, and even deformation occurs during welding. When the terminal is deformed too much, it will cause failure, which not only affects assembly efficiency and installation quality, but also affects the service life of the semiconductor module.
  • the existing terminals are soldered on the driving circuit board, which causes inconvenience in maintenance of the power module.
  • the terminals on the power module are sintered on the metal layer of the cermet substrate by solder at a high temperature.
  • the metal layer and the terminal of the cermet substrate are welded at the solder layer at a high temperature.
  • the working environment of the power module is circulated at -40 to 125 ° C. Therefore, after a period of operation, the metal layer of the metal-clad substrate and the signal terminal are eventually disconnected, resulting in welding fatigue, which affects The life of the overall power device.
  • the signal terminal is soldered on the metal layer of the metal-clad substrate through the connection surface, which not only requires high surface of the metal-clad substrate and the surface of the signal terminal, but also covers the metal ceramic.
  • the object of the present invention is to provide a power module which is reasonable in structure, requires no soldering of terminals, and can be reliably connected to the metal-ceramic substrate after assembly, and has good processability and convenient installation.
  • a power module without a soldering terminal comprising a casing, a plurality of terminals, a metal-clad base connected to the bottom of the casing, and a cover plate mounted on the casing, wherein:
  • the terminal includes an upper connecting portion having an elastic portion and a main body portion having a shoulder.
  • the bottom surface of the terminal is a toothed bottom surface.
  • the outer casing is provided with a socket for guiding the main body portion of each terminal, and the top of each jack has and The corresponding shoulder of the terminal shoulder, each terminal is disposed in a corresponding socket of the outer casing, and the shoulder of the terminal is disposed on the sinking table, the elastic insulating pressure pad is disposed on the upper part of the outer casing, and the cover is snap-fitted on the outer casing and pressed Connected to the elastic insulating pressure pad, each terminal passes through the corresponding terminal hole on the elastic insulating pressure pad and the corresponding terminal hole on the cover plate, and the elastic insulating pressure pad is pressed on the shoulder of each terminal, and the tooth bottom surface of the bottom of the terminal is The pressure is bonded to the metal-clad substrate, and the connection portion of each terminal is elastically connected to the terminal hole of the driving circuit board.
  • the present invention has the following features and advantages:
  • the terminal of the invention adopts an elastic connecting portion and a main body portion with a shoulder.
  • the bottom surface of the main body portion is a tooth-shaped bottom surface, so that a large contact area is obtained on the bottom surface of the terminal, so that the terminal and the metal layer of the metal-clad substrate are effectively formed.
  • the connection and the connection part of the terminal have elasticity, and the connection part of each terminal can be elastically connected with the terminal hole of the external driving circuit board, which can facilitate the terminal customer to use the power module installation and docking, and eliminate the terminal and the driving circuit board.
  • the welding process is convenient for the maintenance of the power module and has a reasonable structure.
  • the bottom surface of the terminal of the present invention is a tooth-shaped bottom surface.
  • the elastic insulating pressure pad can be pressed by the cover plate, and then pressed onto the shoulder of the terminal through the elastic insulating pressure pad, and the terminal is pressed by pressure.
  • the bottom surface can be reliably pressed on the cermet substrate to achieve a good contact effect, and the terminal is solder-free, eliminating the welding process of the terminal in production assembly and customer use, thereby simplifying the assembly process of the power module and assembling during use. Process.
  • a layer of elastic insulating pressure pad is added between the outer casing and the cover plate of the invention. Since the elastic insulating pressure pad has elasticity, the pressure of the cover plate can be effectively and uniformly transmitted to each terminal, so that the terminal and the metal are covered. Ceramic substrate effective connection At the same time, the elasticity of the elastic insulating pressure pad also makes the terminal have better buffering stress, so the terminal of the invention does not need to be bent, and also has the function of buffering stress, can greatly reduce the thermal stress and mechanical stress of the terminal, and improve the terminal. Its own strength and the life of the power module.
  • the terminal of the invention is arranged in the jack of the outer casing, and the terminal is guided through the jack, and the installation is convenient, and the installation efficiency and assembly quality of the power module can also be improved.
  • FIG. 1 is a perspective view showing the three-dimensional structure of a power module removal driving circuit board of the solderless terminal of the present invention.
  • FIG. 2 is a schematic structural view of a power module removal driving circuit board of the solderless terminal of the present invention.
  • Figure 3 is a cross-sectional view showing the structure of A-A of Figure 2;
  • Figure 4 is a schematic view showing the structure of the terminal of the present invention.
  • Figure 5 is a schematic view showing the structure of an elastic insulating pressure pad of the present invention.
  • FIG. 6 is a schematic structural view of a power module of the solderless terminal of the present invention.
  • the power module of the solderless terminal of the present invention comprises a casing 3, a plurality of terminals 1, a metal-clad substrate 5 connected to the bottom of the casing 3, and a cover 2 mounted on the casing 3.
  • Metal coating of the present invention A semiconductor chip and a plurality of terminals 1 are fixed on the ceramic substrate 5, and the MOSFET or IGBT chip and the diode chip can be integrated and soldered or adhered to the metal layer of the cermet substrate, and the cermet substrate 5 and the semiconductor are covered.
  • the chip implements a circuit connection.
  • the terminal 1 of the present invention is an electrode terminal and a signal terminal, and the connection to the power semiconductor module, the connection to an external circuit, and the input and output of signals are realized through the terminal 1.
  • the terminal 1 of the present invention includes an upper connecting portion 1-1 having an elastic portion and a shoulder portion.
  • the bottom surface of the terminal 1 is a tooth-shaped bottom surface 1-3, so that the tooth shape of the bottom surface of the terminal 1 is crimped onto the cermet substrate 5, thereby increasing the effective effect of the bottom surface of the terminal 1 and the metal layer of the metal-clad substrate 5. Contact area for reliable connection.
  • the outer casing 3 of the present invention is provided with a socket 3-4 for guiding the main body portion of each terminal 1 , and the top of each jack 3-4 has a shoulder 1-2 corresponding to each terminal 1 .
  • each terminal 1 is disposed in the corresponding socket 3-4 of the outer casing 3, and the shoulder 1-2 of the terminal 1 is disposed at the sinking platform 3-5 at the upper portion of the jack 3-4, and the sinking table 3_5 allows
  • the shoulder 1-2 is pressed into and out of the sinking table 3-5 through the upper end opening of the sunken table 3-5, which not only facilitates the insertion of the terminals 1, but also the terminal 1 can be opposite to the outer casing 3 when the terminal 1 is depressed.
  • the upper jack 3-4 is relatively moved, and the shoulder 1-2 is moved downward by the sinking table 3-5 without interfering with the outer casing 3, so that the bottom of the terminal 1 is crimped onto the cermet substrate 5.
  • the elastic insulating pressure pad 4 is disposed on the upper portion of the outer casing 3.
  • the cover plate 2 is snap-fitted on the outer casing 3 and is crimped onto the elastic insulating pressure pad 4.
  • Each terminal 1 passes through a corresponding terminal hole 4 of the elastic insulating pressure pad 4. 1 and the corresponding terminal hole 2-1 on the cover plate 2, the elastic insulating pressure pad 4 is pressed on the shoulder 1-2 of each terminal 1, and the bottom tooth-shaped bottom surface 1-3 of the terminal 1 is crimped to the metal-clad substrate. 5, the metal layer on the metal-clad substrate 5 is reliably contacted, and the terminal 1 has a certain buffering stress through the elastic insulating pressure pad 4, and the terminal 1 and the metal-clad substrate 5 can be made in any working environment. Achieve good contact.
  • the connecting portion 1-1 of each terminal 1 of the present invention is elastically connected to the terminal hole 6-1 of the driving circuit board 6, and the driving circuit board 6 is integrated by the printed circuit board and soldered on the printed circuit board.
  • the circuit chip and each device are configured.
  • the connecting portion 1-1 of the terminal 1 of the present invention has a tapered prism shape, and the connecting portion 1-1 is provided with a long slot hole for convenient connection with the terminal hole 6-1 of the driving circuit board 6.
  • the terminal 1 not only has good mechanical strength, but also has good elasticity and is reliably connected to the terminal hole 6-1 on the driving circuit board 6, thereby realizing connection with an external circuit and input and output of signals.
  • the present invention has better versatility for the outer casing 3, the cover plate 2 and the elastic insulating pressure pad 4.
  • the sockets 3-4 of the outer casing 3 are arranged in a regular array and can be set.
  • the jacks 3-4 are arranged in a plurality of horizontal and vertical directions, and the terminals 1 can be inserted into the corresponding jacks 3-4 of the outer casing 3 as needed, and the elastic insulating pads 4 are arranged.
  • Terminal hole 4-1 and terminal hole 2_1 on cover 2 and jack on housing 3 3-4 corresponding settings.
  • the outer casing 3 of the present invention is provided with a boss 3-1 at the four corners, and the inner side of the boss 3-1 is provided with an inner side surface for limiting the cover 2, which is convenient for the cover 2
  • the two side plates 2-2 of the cover 2 are provided with the legs 2-3
  • the outer portion of the outer casing 3 is provided with a corresponding card slot 3-3
  • the legs 2-3 of the cover plate 2 are engaged with the outer casing
  • the cover plate 2 is mounted on the outer casing 3
  • the cover plate 2 is provided with a certain pressing force to the terminal 1 through the elastic insulating pressure pad 4, and the drive circuit board 6 is placed on the convex portion of the outer casing 3.
  • the fasteners are fixed, and the bottoms of the outer casings 3 are provided with mounting seats 3-2, so that the power module of the present invention can be conveniently installed in the workplace.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本发明涉及一种免焊接端子的功率模块，端子包括上部具有弹性的连接部分和带有轴肩的主体部分，端子的底面为齿形底面；外壳上设有对各端子主体部分进行导向的插孔，各插孔顶部具有与各端子轴肩对应的沉台，各端子设置在外壳各自对应的插孔内，端子的轴肩设置在沉台上，弹性绝缘压垫设置在外壳上部，盖板卡接安装在外壳上并压接在弹性绝缘压垫上，各端子穿过弹性绝缘压垫上各自对应的端子孔及盖板上各自对应的端子孔，弹性绝缘压垫压在各端子的轴肩处，将端子底部的齿形底面压接在覆金属陶瓷基板上，各端子的连接部分与驱动电路板的端子孔弹性相接。本发明结构合理，端子无需焊接，装配后各端子能与覆金属陶瓷基板可靠连接，工艺性好。

Description

免焊接端子的功率模块
技术领域
本发明涉及一种免焊接端子的功率模块， 属于功率模块制造技术领域。 背景技术
功率模块广泛应用于交流电机变频调速和直流电机斩波调速以及各种高性能电源， 如 UPS、感应加热、 电焊机、有源补偿、 DC-DC转换器等以及工业电气自动化等领域， 有 着广阔的市场。 传统功率半导体模块主要包括外壳、 主电路板和驱动电路板， MOSFET 或 IGBT芯片以及二极管芯片被集成并被焊接于或被粘贴于覆金属陶瓷基板的金属层上， 而电极端子和信号端子也焊接在覆金属陶瓷基板并构成主电路板，焊接有集成电路芯片 及各器件的印刷电路板构成驱动电路板， 为减小功率模块的体积， 将驱动电路板通过螺 钉安装外壳上， 各信号端子需穿出外壳盖板上的端子孔和驱动电路板上的端子孔， 再通 过焊料将信号端子与驱动电路板连接，通过电极端子和信号端子实现与功率半导体模块 与外部电路的连接以及信号的输入输出。
在安装过程中需要将焊接有各端子的主电路板安装在外壳上， 外壳上安装有盖板， 各端子穿出盖板上的端子孔， 为了使盖板能对端子进行限位， 其端子孔与端子之间的间 隙较小， 但由于外壳通常采用绝缘塑料注塑而成， 由于外壳壁厚不一致， 会导致盖板安 装后会产生变形进而影响各端子的安装效率和装配质量。再则， 由于端子还需要穿出驱 动电路板上的端子孔， 而端子中上部均为针状结构或板状结构， 尤其是针状的端子强度 不高， 在安装过程中很容易使端子受到外力后产生变形， 甚至在焊接过程中也会产生变 形， 当端子变形过大又会产生失效， 不仅影响装配效率和安装质量， 而且也影响半导体 模块的使用寿命。 另外， 现有各端子均焊接在驱动电路板上， 造成功率模块维修不便。
还有， 目前功率模块上的端子大都通过焊料高温烧结在覆金属陶瓷基板的金属层 上， 在焊接过程中， 高温下会使覆金属陶瓷基板的金属层与端子在焊料层处产生焊接应 力， 而功率模块的工作环境是在 -40 至 125°C进行循环， 因此经过一段时间工作后， 最终会引起覆金属陶瓷基板的金属层与信号端子连接处脱落， 而产生焊接疲劳现象， 从 而影响到整体功率器件的寿命。其次， 信号端子通过连接面焊接在覆金属陶瓷基板的金 属层上， 不仅对覆金属陶瓷基板的金属层表面及信号端子表面要求较高， 尤其覆金属陶 瓷基板的金属层即铜箔与信号端子的铜材之间还会存在热膨胀差别， 焊接性能不高， 而 影响导其电性， 同时焊接过程不仅需要焊料、 助焊剂以及焊接时的保护性气体， 不仅高 温烧结焊接工序时间长， 而所产生的高温又易导致其他部位材料金属特性弱化， 加之焊 接过程中的焊料流淌以及阻焊油墨等因素， 又会造成焊接面沾污的风险， 存在着焊接面 不易控制， 工艺操作复杂， 焊接效率低的技术问题。 发明内容
本发明的目的是提供一种结构合理， 端子无需焊接， 装配后各端子能与覆金属陶瓷 基板可靠连接， 工艺性好， 安装方便的免焊接端子的功率模块。
本发明为达到上述目的的技术方案是： 一种免焊接端子的功率模块， 包括外壳、 复 数个端子、连接在外壳底部的覆金属陶瓷基以及安装在外壳上的盖板， 其特征在于： 所 述端子包括上部具有弹性的连接部分和带有轴肩的主体部分， 端子的底面为齿形底面； 所述外壳上设有对各端子主体部分进行导向的插孔，各插孔顶部具有与各端子轴肩对应 的沉台， 各端子设置在外壳各自对应的插孔内， 且端子的轴肩设置在沉台上， 弹性绝缘 压垫设置在外壳上部， 盖板卡接安装在外壳上并压接在弹性绝缘压垫上， 各端子穿过弹 性绝缘压垫上各自对应的端子孔及盖板上各自对应的端子孔，弹性绝缘压垫压在各端子 的轴肩处， 将端子底部的齿形底面压接在覆金属陶瓷基板上， 各端子的连接部分与驱动 电路板的端子孔弹性相接。
与现有技术相比， 本发明具有以下特点和优点：
1、 本发明端子采用具有弹性的连接部分和带轴肩的主体部分， 主体部分的底面为 齿形底面， 使端子底面获得较大的接触面积， 故而端子与覆金属陶瓷基板的金属层形成 有效连接， 同时端子的连接部分具有弹性， 能将各端子的连接部分与外部的驱动电路板 的端子孔弹性相接， 能方便终端客户在使用功率模块的安装对接， 免除了端子与驱动电 路板的焊接工艺， 故而便于功率模块的维修， 结构合理。
2、 本发明端子的底面为齿形底面， 当盖板安装在外壳上时， 可通过盖板压住弹性 绝缘压垫， 再通过弹性绝缘压垫压在端子的轴肩上， 通过压力使端子的底面能可靠压在 覆金属陶瓷基板上， 从而达到良好的接触效果， 实现端子免焊接， 省去了端子在生产装 配和客户使用的焊接过程， 从而简化功率模块生产装配工艺以及使用过程中装配工序。
3、本发明外壳与盖板之间增加了一层弹性绝缘压垫， 由于弹性绝缘压垫具有弹性， 因此能有效、均匀的将盖板的压力传导至每个端子上， 使端子与覆金属陶瓷基板有效连 接， 同时弹性绝缘压垫的弹性也使端子具有较好缓冲应力作用， 故而本发明的端子无需 折弯， 也具有缓冲应力的作用， 能大幅度减小端子的热应力和机械应力， 提高端子的自 身强度和功率模块的使用寿命。
4、 本发明端子设置在外壳的插孔内， 通过插孔对端子进行导向， 安装方便， 也能 提高功率模块的安装效率和装配质量。 附图说明
在此描述的附图仅用于解释目的， 而不意图以任何方式来限制本发明公开的范围。 另外， 图中的各部件的形状和比例尺寸等仅为示意性的， 用于帮助对本发明的理解， 并 不是具体限定本发明各部件的形状和比例尺寸。 本领域的技术人员在本发明的教导下， 可以根据具体情况选择各种可能的形状和比例尺寸来实施本发明。
图 1是本发明免焊接端子的功率模块拆除驱动电路板的立体结构示意图。
图 2是本发明免焊接端子的功率模块拆除驱动电路板的结构示意图。
图 3是图 2的 A-A剖视结构示意图。
图 4是本发明端子的结构示意图。
图 5是本发明弹性绝缘压垫的结构示意图。
图 6是本发明免焊接端子的功率模块的结构示意图。
附图标记说明：
1 端子， 1-1一连接部分， 1-2 轴肩， 1-3—齿形底面， 2 盖板， 2-1—端子孔， 2-2 侧板， 2-3 卡脚， 3 外壳， 3-1 凸台， 3-2—安装座， 3-3 卡槽， 3-4—插孔， 3-5 沉台， 4一弹性绝缘压垫， 4-1一端子孔， 5—覆金属陶瓷基板， 6 驱动电路板， 6-1—端子孔。 具体实施方式
结合附图和本发明具体实施方式的描述，能够更加清楚地了解本发明的细节。但是， 在此描述的本发明的具体实施方式， 仅用于解释本发明的目的， 而不能以任何方式理解 成是对本发明的限制。在本发明的教导下， 技术人员可以构想基于本发明的任意可能的 变形， 这些都应被视为属于本发明的范围。
如图 1至图 6所示， 本发明的免焊接端子的功率模块， 包括外壳 3、 复数个端子 1、 连接在外壳 3底部的覆金属陶瓷基板 5以及安装在外壳 3上的盖板 2。 本发明的覆金属 陶瓷基板 5上固定有半导体芯片和多个端子 1， 可将 M0SFET或 IGBT芯片以及二极管芯 片被集成并被焊接于或被粘贴于覆金属陶瓷基板的金属层上，通过覆金属陶瓷基板 5与 半导体芯片实现电路连接。本发明的端子 1为电极端子和信号端子， 通过端子 1实现与 功率半导体模块的连接， 与外部电路的连接， 以及信号的输入输出。
如图 1至图 4所示，本发明的端子 1包括上部具有弹性的连接部分 1-1和带有轴肩
1-2的主体部分， 端子 1底面为齿形底面 1-3， 使端子 1底面的齿形压接在覆金属陶瓷 基板 5上， 从而增加端子 1底面与覆金属陶瓷基板 5金属层的有效接触面积， 达到可靠 连接的目的。
如图 1至图 6所示，本发明外壳 3上设有用于对各端子 1主体部分进行导向的插孔 3-4， 各插孔 3-4顶部具有与各端子 1轴肩 1-2对应的沉台 3_5， 各端子 1设置在外壳 3 各自对应的插孔 3-4内，端子 1的轴肩 1-2设置在插孔 3-4上部的沉台 3-5处，沉台 3_5 允许轴肩 1-2通过沉台 3-5的上端开口压进和顶出该沉台 3-5， 这样不仅方便插装各端 子 1， 而且在端子 1压下时， 端子 1能相对于外壳 3上的插孔 3-4相对移动， 并通过沉 台 3-5使轴肩 1-2下移而不会与外壳 3干涉，使端子 1底部压接在覆金属陶瓷基板 5上。 弹性绝缘压垫 4设置在外壳 3上部，盖板 2卡接安装在外壳 3上并压接在弹性绝缘压垫 4上， 各端子 1穿过弹性绝缘压垫 4上各自对应的端子孔 4-1及盖板 2上各自对应的端 子孔 2-1， 弹性绝缘压垫 4压在各端子 1的轴肩 1-2上， 将端子 1底部齿形底面 1-3压 接在覆金属陶瓷基板 5上， 与覆金属陶瓷基板 5上的金属层可靠接触， 同时通过弹性绝 缘压垫 4使端子 1具有一定缓冲应力的功能， 在任何工作环境下， 都能使端子 1与覆金 属陶瓷基板 5达到良好的接触。
如图 6所示，本发明各端子 1的连接部分 1-1与驱动电路板 6的端子孔 6-1弹性相 接，该驱动电路板 6由印刷电路板和焊接在印刷电路板上的集成电路芯片及各器件构成， 本发明端子 1的连接部分 1-1为锥状的棱柱形， 连接部分 1-1内设有长槽孔， 方便与驱 动电路板 6的端子孔 6-1连接， 使端子 1不仅具有良好的机械强度， 同时也具有较好的 弹性而与驱动电路板 6上的端子孔 6-1可靠接触连接，实现与外电路的连接及信号的输 入输出。
如图 1、 图 2以及图 5所示， 本发明为使外壳 3、 盖板 2以及弹性绝缘压垫 4具有 更好的通用性， 外壳 3的插孔 3-4呈规律阵列设置， 可设置为但不限于长方形阵列， 使 插孔 3-4按横向和纵向排列设置多个，可根据需要将端子 1插装在外壳 3的对应的插孔 3-4中， 而弹性绝缘压垫 4上的端子孔 4-1和盖板 2上的端子孔 2_1与外壳 3上的插孔 3-4对应设置。
如图 1〜图 3以及图 6所示， 本发明外壳 3的四角处设有凸台 3-1， 凸台 3-1的内 侧设有对盖板 2限位的内侧面，方便盖板 2的安装，盖板 2的两个侧板 2-2设有卡脚 2-3， 外壳 3的外部设有对应的卡槽 3-3， 盖板 2上的卡脚 2-3卡接在外壳的卡槽 3-3内， 使 盖板 2安装在外壳 3上， 并使盖板 2通过弹性绝缘压垫 4对端子 1提供一定的压紧力， 而驱动电路板 6放置在外壳 3的凸台 3-1上， 通过紧固件固定， 而外壳 3的两侧底部设 有安装座 3-2， 能方便将本发明的功率模块安装在工作场所。
针对上述各实施方式的详细解释， 其目的仅在于对本发明进行解释， 以便于能够更 好地理解本发明， 但是， 这些描述不能以任何理由解释成是对本发明的限制， 特别是， 在不同的实施方式中描述的各个特征也可以相互任意组合， 从而组成其他实施方式， 除 了有明确相反的描述， 这些特征应被理解为能够应用于任何一个实施方式中， 而并不仅 局限于所描述的实施方式。

Claims

权利要求书
1、 一种免焊接端子的功率模块， 包括外壳（3) 、 复数个端子 (1)、 连接在所述外 壳（3)底部的覆金属陶瓷基板（5) 以及安装在所述外壳（3)上的盖板（2) ， 其特征 在于： 所述端子（1)包括上部具有弹性的连接部分（1-1 ) 和带有轴肩 （1-2 ) 的主体部 分， 所述端子（1 )的底面为齿形底面（1-3)； 所述外壳（3)上设有对各所述端子（1 ) 主体部分进行导向的插孔（3-4) ， 各所述插孔 （3-4)顶部具有与各所述端子（1 ) 的 轴肩 （1-2)对应的沉台 （3-5) ， 各所述端子（1)设置在所述外壳（3)各自对应的所述 插孔（3-4) 内， 且所述端子（1 ) 的轴肩 （1-2)设置在所述沉台（3-5)处， 弹性绝缘压 垫（4)设置在所述外壳（3)上部， 所述盖板（2)卡接安装在所述外壳（3)上并压接 在所述弹性绝缘压垫 （4) 上， 各所述端子（1 ) 穿过所述弹性绝缘压垫 （4) 上各自对 应的端子孔 （4-1 )及所述盖板（2 )上各自对应的端子孔 （2-1 ) ， 所述弹性绝缘压垫 (4)压在各所述端子（ 1 )的轴肩（ 1-2)上，将所述端子（ 1 )底部的所述齿形底面（ 1-3) 压接在所述覆金属陶瓷基板 （5) 上， 各所述端子 （1 ) 的连接部分（1-1 ) 与驱动电路 板 (6) 的端子孔 (6-1 ) 弹性相接。
2、 根据权利要求 1所述的免焊接端子的功率模块， 其特征在于： 所述端子（1 ) 的 连接部分（1-1 )呈锥状的棱柱形， 所述连接部分（1-1 ) 内设有长槽孔。
3、 根据权利要求 1所述的免焊接端子的功率模块， 其特征在于： 所述盖板（2) 的 两个侧板（2-2)分别设有卡脚（2-3)， 所述外壳（3)的外部设有对应的卡槽（3-3)， 所述盖板（2)上的卡脚 （2-3)卡接在所述外壳（3) 的卡槽（3-3) 内。
4、 根据权利要求 1所述的免焊接端子的功率模块， 其特征在于： 所述外壳（3) 的 插孔 （3-4) 呈规律阵列设置， 且所述弹性绝缘压垫 （4) 上的端子孔 （4-1 )和所述盖 板（2)上的端子孔（2-1 ) 与所述外壳（3)上的插孔（3-4)对应设置。
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