CN102347289A - 具有至少一个用于衬底的定位装置的功率半导体模块 - Google Patents
具有至少一个用于衬底的定位装置的功率半导体模块 Download PDFInfo
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Abstract
本发明涉及一种具有至少一个用于衬底的定位装置的功率半导体模块,所述功率半导体模块具有:框架状或者杯状壳体;以及用于至少一个衬底的至少一个凹处。该衬底仅构造为开关衬底或者构造为基板,所述基板带有至少一个布置于该基板上的开关衬底。此外,壳体在所述凹处中具有至少一个带弹性部段和接触元件的定位装置,其中,至少一个接触元件力配合地贴靠在衬底的所配属的侧面上,并且由此将压力施加到该侧面上。通过根据本发明的功率半导体模块,衬底在壳体中的布置方案得到改进,并且该布置方案使得简单地装配成功率半导体模块是行得通的。
Description
技术领域
本发明涉及一种紧凑的功率半导体模块,其具有框架状或者杯状的壳体以及至少一个衬底,该衬底借助所配属的定位装置被相对于功率半导体模块的壳体地布置。
背景技术
如由EP 2 037 498 A1所公知的那样的功率半导体模块形成了本发明的出发点。EP 2 037 498 A1公开了具有衬底的功率半导体模块,所述衬底带有布置于衬底上的功率半导体构件以及辅助和负载接线元件。同样地,壳体具有用于容纳衬底的凹处。所述衬底与壳体的固定例如借助粘接连接件来进行。
由普遍现有技术公知了功率半导体模块的其它设计方案,该功率半导体模块同样具有带用于容纳衬底的凹处的壳体,其中,所述衬底在凹处中仅通过如下方式得到固定,即,将壳体以铸造物料填充,该铸造物料例如实施为有机硅凝胶,所述有机硅凝胶在注入过程之后固化,并且因此构成粘附作用,通过该粘附作用而将在壳体的凹处中的衬底保持粘附在壳体的边缘上。
借助铸造物料的连接-如那些借助专用粘接连接件的连接一样,在如下方面是不利的,即,衬底在固化或硬化时,必须占据所设置的位置,并且必须保持一定的时间段。因此,衬底的精确定位在常用的生产工艺中仅以高消耗才可行。此外,在这样的固定方案中,在运行中,在受到变换的温度负荷的诱导,连接可能部分地断开,这可能导致在衬底相对于散热体(功率半导体模块定位于该散热体上)的电绝缘方面引发问题。
发明内容
本发明基于如下任务,即,提出一种功率半导体模块,其中,衬底在壳体中的布置方案得到改进,并且该布置方案使得简单地装配成功率半导体模块是行得通的。
依据本发明,该任务通过具有权利要求1的特征的功率半导体模块得以解决。优选的实施方式在从属权利要求中被加以介绍。
本发明基于如下构思,即,将至少一个动态的定位装置布置在壳体中,该定位装置构成了用于衬底的力配合的固定,由此,可以使制造公差和装配公差最小化。
本发明的构思由具有优选为框架状或杯状的壳体和至少一个衬底的功率半导体模块出发,其中,所述衬底优选至少部分地形成功率半导体模块的外侧。同样地,壳体可以被构造为较大的功率电子复合件中的保持框架,并且衬底以适合于此的方式来布置。衬底自身优选地构造为开关衬底/切换衬底/转换衬底(Schaltsubstrat)或构造为带有布置于其上的开关衬底/切换衬底/转换衬底的基板。公知的开关衬底这里例如是IMS(绝缘金属衬底)或DCB(直接敷铜)衬底,其中,直接敷铜衬底具有绝缘材料体,该绝缘材料体具有布置于其第一主面和第二主面上的金属遮盖部,并且在这种情况下,各朝向功率半导体模块内部的金属遮盖部被结构化,并且由此构造彼此绝缘的导体带。在衬底的导体带上,布置有至少一个功率半导体模块。该功率半导体模块依据现有技术还具有功率半导体构件以及接线和连接元件,但功率半导体构件以及接线和连接元件的具体的设计方案对于这里提到的衬底相对于壳体的布置方案而言并不重要。
依据本发明,将至少一个衬底布置在壳体的所配属的凹处中,其中,衬底优选地居中布置在该凹处中。为此,壳体的凹处具有至少一个一但优选为至少三个定位装置。同样优选的是,为至少一个定位装置优选地配属有至少一个一但又优选为至少三个用于居中布置方案的支座。在此情况下,各支座在本发明的意义上构造为止挡元件或者构造为专用的定位装置。
定位装置在其那方面具有弹性部段以及接触元件。弹性部段用于将压力施加到衬底上,由此,接触元件力配合地贴靠在衬底上。为此,接触元件优选具有斜切部,以便当将衬底装配在壳体的凹处中时,能够容易地实施装配过程。通过该斜切部,弹性部段在装配过程中由于衬底的布置而自行预紧。
在至少一个具有弹性部段和接触元件的定位装置的各个设计方案中,通过所述的预紧,产生接触元件与衬底的所配属的侧面的力配合的接触,其中,所述衬底布置在壳体的凹处中。
原则上可行的是,定位装置与壳体一件式或者多件式地构造。在多件式布置方案中,例如可以设置有各自特别构造的定位装置与壳体的插接连接件。
此外有利的是,定位装置的接触元件或者是止挡元件与衬底的接触面,分别仅为衬底的整个侧面的5%。优选的是,定位装置以如下方式相对于衬底的相应侧面来布置,即,衬底不仅是居中地置于凹处中,而且作用到衬底上的旋转力将尽可能小的力施加到定位装置的弹性部段上。因此,例如优选在衬底的第一侧面上,将一个定位装置相对于衬底的第一侧面居中地布置。于是,为与第一侧面正交的第二侧面配属有两个定位装置,使得力的导入尽可能地在衬底的角部附近进行。
定位装置的数目和构造方案依赖于衬底的重量和尺寸,使得不会导致对衬底过高的压力加载,并且同时施加足够的定位力到衬底上。
附图说明
本发明的构思结合在图1至图6中的实施例被详细阐述:
图1以剖视图示意地示出依据本发明的功率半导体模块的第一设计方案的概要图;
图2以剖面图示意地示出依据本发明的功率半导体模块的第二设计方案的概要图;
图3示出依据本发明的功率半导体模块的第三设计方案的三维视图;
图4至6示出依据本发明的功率半导体模块的定位装置的不同的实施方式。
具体实施方式
图1示出地示出依据本发明的带有衬底30的功率半导体模块1的第一设计方案的概要图,衬底30这里构造为基板38,并且基板38带有布置于基板上的开关衬底36。开关衬底36在其那方面来讲,由绝缘材料本体组成,并且该绝缘材料本体带有在其第一主面和第二主面上布置的金属遮盖部,其中,金属遮盖部在朝向功率半导体模块内部的主面上,本身可以被结构化,并且因此构造彼此绝缘的导体带。辅助和负载接线元件自导体带出发,用于对功率半导体模块进行外部连接。
在开关衬底的导体带上,布置有功率半导体构件,例如大多呈功率晶体管形式的功率二极管和/或功率开关,并且功率半导体构件彼此以适合于电路的方式被连接。
此外,功率半导体元件1具有带有凹处200的框架状或杯状壳体20,衬底30布置在该凹处200中。由此,衬底在这里构造了功率半导体模块1的壳体底部。为了优选居中地布置衬底30,在壳体20的凹处200中,作为该壳体的一部分设置有多个定位装置60,所述定位装置60分别与衬底30的所配属的侧面300保持接触。
在此情况下,定位装置60优选分别具有弹性部段68和带有接触面620(也可以参考图4至6)的接触元件62。借助弹性部段68,接触元件62以其接触面620压向衬底30的侧面300,并且持久地、力配合地贴靠在所述侧面300上。在此情况下,优选的是,接触元件62的接触面620的尺寸不多于所配属的侧面300的尺寸的5%。
为了接受压力,或者为了建立反作用力,壳体20在定位装置60的相对置的侧上配属于定位装置60地具有至少一个支座50。通过合适的定位装置60还有支座50的设计方案,可行的是,衬底30力配合地居中地布置在壳体20的凹处200中。在此情况下,有利的是,但仅在很少的应用情况中必需的是,通过定位装置60施加的力足够将衬底30无需要其它辅助机构的情况下就被保持在凹部200中。
图2示意地以剖面图示出依据本发明的功率半导体模块1的第二设计方案的概要图。与依据图1的设计方案相对照地,在这里衬底30被构造为不具有附加基板38(参考图1)的开关衬底36。此外,在这里至少一个定位装置60具有突起64,该突起64贴靠在朝向功率半导体模块内部的面310-衬底30的主面上。该突起64附加地具有的任务是,使得呈止挡形式的衬底30正交于定位装置60的两个基本定位方向地定位。在此情况下,定位装置60必要时连同所配属的支座50一起,对衬底30的水平位置加以确定,而突起64阻止衬底30朝向功率半导体模块1内部的方向运动。
图3示出依据本发明的功率半导体模块的第三设计方案的三维视图。在这里,示出了壳体20的一部分,该壳体20在这里仅构造为保持框架,并且具有用于容纳衬底30的凹处200。该衬底30被缩小地示出,以便阐明定位装置60的布置方案和功能。
在壳体20的两个彼此正交布置的内部面上分别设置有两个定位装置60,而在各相对置的内部面上设置有所配属的支座50。在这里,在较长的侧上设置有三个支座50,在较短的侧上仅设置了两个这样的支座50。这些支座50构造为从边缘突出的凸鼻,并且分别具有与衬底30的所配属的侧面相接触的接触面,所述接触面的尺寸最大为这些所配属的侧面的尺寸的5%。
定位装置60以两种设计方案来设置,其具体的设计方案在图4或者6中放大地示出。各定位装置60具有弹性部段68和接触元件62,接触元件62在这里分别设置有斜切部66。该斜切部66用于在将衬底30装配在壳体20的凹处200中时,在无需其它辅助机构的情况下,对定位装置60加以预紧。定位装置60在装配之后借助接触元件62以接触元件62的接触面620贴靠在衬底30的侧面300、302上,并且借助弹性部段68产生与衬底30的力配合,该力配合通过相对置的支座50而受到其反作用力。在衬底30装配之后,衬底30由此为了功率半导体模块的其它装配过程以及为了功率半导体模块居中地在壳体20的凹处中运行而被定中心。
图4至6示出依据本发明的功率半导体模块的定位装置的不同的实施方式。图4示出壳体的附加的留空部(Freisparung)202以及在其中朝衬底方向突出的定位装置第一设计方案。该定位装置与壳体是一体化构造,壳体在其那方面由合适的塑料构成。弹性部段68在这里构造为可运动的接片,接触元件62直接连接到该接片上。该接触元件62具有接触面620,用以力配合地与衬底30的侧面300接触。为了将壳体20与定位装置60和衬底30彼此之间较容易地布置,接触元件62具有已经介绍过的斜切部66。
图5示出壳体20的定位装置60的第二实施方式。弹性部段68在此情况下构造为弹簧弓形件,该弹簧弓形件优选朝向功率半导体模块内部的方向伸出,由此,获得定位装置60的非常紧凑的设计方案。
图6示出壳体20的定位装置60的第三实施方式。在此情况下,弹性部段68呈波浪状地构造,由此,实现了较高的弹簧力,并且同时实现了接触元件的较大的运动区域。
Claims (8)
1.功率半导体模块(1),具有:框架状或者杯状壳体(20),所述壳体(20)具有用于至少一个衬底(30)的至少一个凹处(200),所述衬底(30)构造为开关衬底(36)或者构造为基板(38),所述基板(38)具有至少一个布置于所述基板(38)上的开关衬底(36),其中,所述壳体(20)在所述凹处(200)中具有至少一个带弹性部段(68)和接触元件(62)的定位装置(60),其中,至少一个所述接触元件(62)力配合地贴靠在所述衬底(30)的所配属的侧面(300、302)上,并且由此,将压力施加到所述侧面(300、302)上。
2.按照权利要求1所述的功率半导体模块(1),其中,所述接触元件(60)大致呈点状地以占所配属的所述侧面(300、302)的小于5%的接触面(620)贴靠在所述侧面(300、302)上。
3.按照权利要求1所述的功率半导体模块(1),其中,为一侧的至少一个所述定位装置(60)配属有在所述壳体(20)的所述凹处(200)的相对置的侧上的至少一个支座(50),并且所述支座(50)构造为止挡元件。
4.按照权利要求1所述的功率半导体模块(1),其中,为一侧的至少一个所述定位装置(60)配属有在所述壳体(20)的所述凹处(200)的相对置的侧上的至少一个支座(50),所述支座(50)同样构造为定位装置(60)。
5.按照权利要求1所述的功率半导体模块(1),其中,至少一个所述定位装置(60)具有突起(64),所述突起(64)贴靠在所述衬底(30)的主面朝向所述功率半导体模块内部的面(310)上。
6.按照权利要求1所述的功率半导体模块(1),其中,为所述衬底(30)的第一侧面(300)配属有一个定位装置(60),并且为所述衬底(30)的与所述第一侧面(300)正交的第二侧面(302)配属有两个定位装置(60)。
7.按照权利要求1所述的功率半导体模块(1),其中,所述接触元件(62)在所述接触元件(62)的朝向所述衬底(30)的侧上具有斜切部(66)。
8.按照权利要求1所述的功率半导体模块(1),其中,至少一个所述定位装置(60)与所述壳体(20)一体地由绝缘的塑料构造。
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CN106252291A (zh) * | 2016-09-25 | 2016-12-21 | 东莞市联洲知识产权运营管理有限公司 | 一种集成电路挤压式封装装置 |
CN111199960A (zh) * | 2018-11-20 | 2020-05-26 | 三菱电机株式会社 | 半导体装置及其制造方法、以及电力转换装置 |
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DE102013104950B3 (de) * | 2013-05-14 | 2014-04-30 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Anordnung hiermit |
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US7019390B2 (en) * | 2004-02-03 | 2006-03-28 | Visteon Global Technologies, Inc. | Silicon nitride insulating substrate for power semiconductor module |
CN201041911Y (zh) * | 2007-03-23 | 2008-03-26 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
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DE102010038723B4 (de) | 2014-08-14 |
BRPI1103846A2 (pt) | 2012-12-18 |
KR101847652B1 (ko) | 2018-04-10 |
EP2413357A3 (de) | 2015-01-28 |
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