US20090039494A1 - Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it - Google Patents

Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it Download PDF

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Publication number
US20090039494A1
US20090039494A1 US12/220,871 US22087108A US2009039494A1 US 20090039494 A1 US20090039494 A1 US 20090039494A1 US 22087108 A US22087108 A US 22087108A US 2009039494 A1 US2009039494 A1 US 2009039494A1
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Prior art keywords
substrate carrier
housing
power semiconductor
semiconductor module
recess
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US12/220,871
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US8053884B2 (en
Inventor
Christian Kroneder
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Semikron Elektronik GmbH and Co KG
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Semikron Elektronik GmbH and Co KG
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Assigned to SEMIKRON ELEKTRONIK GMBH & CO. KG reassignment SEMIKRON ELEKTRONIK GMBH & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KRONEDER, CHRISTIAN
Publication of US20090039494A1 publication Critical patent/US20090039494A1/en
Publication of US8053884B2 publication Critical patent/US8053884B2/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4878Mechanical treatment, e.g. deforming
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/10Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/291Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/8384Sintering
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20Parameters
    • H01L2924/203Ultrasonic frequency ranges, i.e. KHz

Abstract

A power semiconductor module comprising a housing of a first plastic, at least one substrate carrier with a circuit constructed thereon and electric terminating elements extending therefrom. The housing includes attachment means for its permanent connection with the substrate carrier. The housing has a permanently elastic sealing device of a second plastic which is formed integrally with the housing and encircles and is directed towards a first inner main surface of the substrate carrier. A method for constructing such a module includes the steps of constructing a housing of a first mechanically stable plastic and a sealing device of a second permanently elastic plastic; disposing the at least one substrate carrier on the housing; and permanently connecting the housing to the substrate carrier.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The invention is directed a power semiconductor module and, more particularly, to such a module having a housing, at least one substrate carrier, preferably arranged in a recess of the housing and laterally enclosed by the housing, with a power-electronics circuit arrangement constructed thereon and electrical terminating elements extending therefrom.
  • 2. Description of the Related Art
  • By way of example, a power semiconductor module generally of the inventive type is disclosed in German Patent No. DE 101 00 460 A1 has long been known in its basic form. Such known power semiconductor modules have a substrate carrier which forms the lower termination of the power semiconductor module. The module includes a housing formed of insulating material and protrudes slightly above the substrate carrier on its longitudinal sides, thereby enclosing it. Such substrate carriers are frequently formed as a flat molded metal body, preferably of copper. This results in low thermal resistance with effective spreading of the heat for dissipating heat from the power-electronics circuit arrangement to a cooling component.
  • According to the prior art, it is also known that the substrate carrier is bonded to the housing in order to prevent the outflow of a liquid insulating material from the housing, when the housing is filled with such a liquid insulating material, for example a silicone rubber. Furthermore, the housing is connected to the substrate carrier by means of metallic rivet connections. These rivet connections are constructed as hollow bodies with a continuous recess in order to also enable the power semiconductor module to be attached to a cooling component by means of a screw connection. According to the prior art, these rivet connections are preferably made of brass since the lead component of the brass allows for a certain deformation.
  • On the substrate carrier itself, the circuit arrangement of the power semiconductor module is insulated from the carrier. In this context, various circuit arrangements with power transistors, power diodes and/or power thyristors are known. The circuit arrangement is insulated from the substrate carrier by insulating substrates, for example DCB (direct copper bonding) substrates.
  • Various terminating elements for load and auxiliary terminals are known, such as control terminals for controlled power semiconductor components. In this context, various technologies for connecting these terminating elements to the substrate or the power semiconductor components of the circuit arrangement are known. For example, solder connections, pressure contact connections and/or sintered pressure connections are particularly preferred.
  • The disadvantage of known power semiconductor modules is that the substrate carrier is bonded to the housing by an adhesive bond in order to ensure a tightness of the housing to prevent outflow of the silicone rubber during production. The permanently durable bond is additionally achieved by the rivet connection described above.
  • SUMMARY OF THE INVENTION
  • The invention is directed to a novel power semiconductor module with a substrate carrier, wherein the carrier is bonded to the housing of the power semiconductor module and wherein the associated production method is both cost-effective and automatable.
  • The invention is a power semiconductor module with a housing and at least one substrate carrier preferably disposed in a recess of the housing and laterally enclosed by the housing, preferably on all sides. A power-electronics circuit is arranged on the substrate carrier from which electrical terminating elements for load and auxiliary terminals extend. It is preferred if at least one connecting element is a spring contact device. Furthermore, the housing has means for permanently connecting it to the substrate carrier. The substrate carrier thus forms an outside surface of the housing facing the cooling component, or part of an exterior surface of the power semiconductor module.
  • According to the invention, the housing, preferably the recess of the housing, has a sealing device formed integrally therewith. This sealing device is preferably arranged in the recess of the housing and encircles a first inner main surface of the substrate carrier. According to the invention, the sealing device is preferably formed of a second permanently elastic plastic.
  • The inventive method for producing such a power semiconductor module includes the following steps:
  • constructing a housing, preferably with at least one recess for an associated substrate carrier, in a two-component injection method of a first mechanically stable plastic for the housing with a sealing device of a second permanently elastic plastic;
  • arranging the at least one substrate carrier in the housing, preferably in the associated recess of the housing; and
  • Permanently connecting the housing and the substrate carrier by an attachment means.
  • The connection established by the attachment means preferably includes projections on the housing which extend through recesses in the substrate carrier. A rivet connection is formed by exposing the ends of these projections to heat and/or ultrasound, thereby deforming them. In this context, it is preferred if the sealing device at least partially encloses the attachment means of the substrate carrier and directs them towards the recess. A tight construction of this rivet connection to the extent that it may prevent outflow when the power semiconductor module is filled with a silicone rubber, is thus unnecessary.
  • It can also be particularly preferred if the substrate carrier is replaced in its functionality by the substrate itself. In this context, the substrate forms the boundary of the power semiconductor module and, in turn, has the necessary recesses for the rivet connection.
  • Particularly preferred developments of this semiconductor component are mentioned in the respective description of the illustrative embodiment. The inventive solution is also explained in greater detail with reference to the illustrative embodiments and FIGS. 1 to 4.
  • Other objects and features of the present invention will become apparent from the following detailed description considered in conjunction with the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims. It should be further understood that the drawings are not necessarily drawn to scale and that, unless otherwise indicated, they are merely intended to conceptually illustrate the structures and procedures described herein.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of a housing without a substrate carrier of a power semiconductor module according to the invention;
  • FIG. 2 is a top plan view of the housing of FIG. 1;
  • FIG. 3 is a cross-section through the housing of FIG. 1; and
  • FIG. 4 is a cross-section of a part of the power semiconductor module of FIG. 1 with a substrate carrier arranged thereon.
  • DETAILED DESCRIPTION OF THE PRESENTLY PREFERRED EMBODIMENTS
  • FIG. 1 shows, generally at 1, a power semiconductor module in accordance with the invention. Module 1 includes a housing 10, preferably of a plastic which is temperature-stable up to about 150° C., and without a substrate carrier (40 in FIG. 4). Housing 10 has on the side facing a cooling device, (not shown), a recess 12 for receiving a substrate carrier, and two holes 16 for screw connections with the cooling component. Recess 12 advantageously has a web 120 on each of the two longitudinal sides of power semiconductor module 1 to enclose the arrangeable substrate carrier on all sides.
  • Further holes 14 for arranging connecting elements, in this case auxiliary power semiconductor module 1, connecting elements constructed as contact springs (not shown), are disposed within. These auxiliary connecting elements are used for the external connection of a circuit which is arranged on a substrate carrier which can be disposed within recess 12.
  • In the area of recess 12, advantageously in its edge area 122 of its narrow sides, housing 10 includes projections 20 preferably constructed integrally therewith. Projections 20 are constructed to be pin-like in this case and protrude above housing 10 in the direction of the substrate carrier to be disposed thereon.
  • A sealing device 30 of an elastic plastic which was preferably produced jointly with the housing 10 in a two-component injection method is also shown. Sealing device 30 forms a sealing lip disposed about the edge area of recess 12 which preferably encloses projections 20 in such a manner that projections 20 are outside the sealing area of the sealing lip.
  • FIG. 2 shows a top plan view of housing 10 of power semiconductor module 1, showing recess 12 for the arrangement of the substrate carrier, without details in the interior of the recess. In this case, housing 10 with holes 16 for the screw connection with an arrangeable cooling component is again shown. In the area of recess 12, projections 20 are also shown.
  • In the interior of recess 12, sealing device 30 according to the invention is disposed. Sealing device 30 is advantageously arranged in such a manner that it leaves open connecting means such as projections 20. Projections 20 are thus located in an area of the recess 12 which is not sealed towards the substrate carrier by sealing device 30. This is advantageous since, as a result, the rivet connection between the projections 20 and the substrate carrier does not have to meet any special requirements for tightness.
  • However, it may also be preferred to exclusively or additionally arrange connecting means in the area of the surface of the substrate carrier to be sealed, as a result of which the requirements for the rivet connection rise to the extent that it must be constructed to be tight. According to the prior art, it is known to introduce an insulating casting compound into the module during production. When introduced, the compound is a liquid that at least partially fills the module and could thus emerge in the area of the rivet connections.
  • FIG. 3 shows a cross section through housing 10. Housing 10 includes recess 20 and, arranged in the area of recess 20, a connecting means for the rivet connection with a substrate carrier in the form of a projection of housing 10 and hole 14 for arranging an auxiliary connecting element constructed, for example, as a contact spring. Recess 12 itself is bounded laterally with respect to the longitudinal sides of power semiconductor module 1 by two webs 120 which form stop means for a substrate carrier to be arranged thereon. Sealing device 30 is arranged directly adjacent to webs 120 in the interior of recess 12. According to the method described, sealing device 30 is constructed of a second permanently elastic plastic and produced of a first plastic, together with housing 10, in a two-component injection.
  • FIG. 4 shows, in cross section, a part of power semiconductor module 1 according to the invention with a substrate carrier 40 arranged thereon. In this context, substrate carrier 40 is designed as a surface-finished copper plate. Substrate carrier 40 includes recesses 42 which are continuous and flush with projections 20 of housing 10. To achieve a rivet connection of substrate carrier 40 with housing 10, these projections have been deformed by applying heat or ultrasound thereto in such a manner that projection 20 no longer protrudes over an outer main surface 46 of substrate carrier 40.
  • A power-electronics circuit 50 is arranged on an inner main surface 44 of substrate carrier 40, facing the interior of power semiconductor module 1, and electrically insulated therefrom.
  • Thus, while there have shown and described and pointed out fundamental novel features of the invention as applied to a preferred embodiment thereof, it will be understood that various omissions and substitutions and changes in the form and details of the devices illustrated, and in their operation, may be made by those skilled in the art without departing from the spirit of the invention. For example, it is expressly intended that all combinations of those elements and/or method steps which perform substantially the same function in substantially the same way to achieve the same results are within the scope of the invention. Moreover, it should be recognized that structures and/or elements and/or method steps shown and/or described in connection with any disclosed form or embodiment of the invention may be incorporated in any other disclosed or described or suggested form or embodiment as a general matter of design choice. It is the intention, therefore, to be limited only as indicated by the scope of the claims appended hereto.

Claims (10)

1. A power semiconductor module comprising:
a housing formed of a first plastic;
at least one substrate carrier for receiving a circuit thereon and having electric terminating elements extending therefrom, said substrate carrier also having a first inner main surface;
attachment means for permanently attaching said housing to said substrate carrier; and
a permanently elastic sealing device of a second plastic which is formed integrally in said housing, and encircles and is directed towards said first inner main surface of said substrate carrier.
2. The power semiconductor module of claim 1, wherein said substrate carrier is formed as a surface-finished copper plate, and is disposed on said inner main surface of said substrate carrier, on which surface a power-electronics circuit that is electrically insulated from the copper plate, may be disposed.
3. The power semiconductor module of claim 1, wherein said housing includes a recess, and said substrate carrier is disposed in said recess and is laterally enclosed by said housing and said permanently elastic sealing device is arranged in said recess.
4. The power semiconductor module of claim 1, wherein at least one electronic terminating element is a spring contact device.
5. The power semiconductor module according to claim 1, wherein said substrate carrier includes a recess; and
wherein said sealing device at least partially encircles said attachment means and separates said attachment means from said recess.
6. The power semiconductor module of claim 1,
wherein said substrate carrier includes recesses therein; and
wherein said attachment means includes projections on said housing that extend through said recesses in said substrate carrier;
whereby a rivet connection between said housing and said substrate carrier may be effected by the application of at least one of temperature and ultrasound to the ends of said projections.
7. The power semiconductor modules of claim 1, further comprising an electrically insulating casting compound disposed so as to at least partly fill the internal space of the module.
8. A method for producing a power semiconductor module comprising the following steps:
forming a housing of a first mechanically stable plastic and a sealing device of a second permanently elastic plastic;
disposing at least one substrate carrier on the housing; and
permanently connecting said housing and said substrate carrier.
9. The method of claim 8, wherein the attachment means consists of projections on the housing which extend through recesses in the substrate carrier and wherein a rivet connection is established by deformation by means of applying at least one of temperature and ultrasound to the ends of said projections.
10. The method of claim 8, further comprising the step of filling, at least partially, an internal space of the power semiconductor module with an electrically insulating casting compound.
US12/220,871 2007-07-26 2008-07-28 Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it Active 2029-07-15 US8053884B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102007034848.9 2007-07-26
DE102007034848 2007-07-26
DE102007034848 2007-07-26

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US8053884B2 US8053884B2 (en) 2011-11-08

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EP (1) EP2019424B1 (en)
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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2017207164A1 (en) * 2016-05-31 2017-12-07 Endress+Hauser Gmbh+Co. Kg Encapsulation of a circuit board

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Publication number Priority date Publication date Assignee Title
DE102009037257B4 (en) * 2009-08-12 2014-07-31 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with circuit carriers and load connection element and manufacturing method therefor
DE102011056848A1 (en) * 2011-12-22 2013-06-27 Semikron Elektronik Gmbh & Co. Kg The power semiconductor module or control module for this purpose
DE102012222015B4 (en) * 2012-11-30 2019-07-18 Infineon Technologies Ag Moisture-proof semiconductor module and a method for its production

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Publication number Priority date Publication date Assignee Title
US4731644A (en) * 1985-06-15 1988-03-15 Brown, Boveri & Cie Ag Semiconductor power module with ceramic substrate
US5461774A (en) * 1994-03-25 1995-10-31 Motorola, Inc. Apparatus and method of elastically bowing a base plate
US6233153B1 (en) * 1994-11-08 2001-05-15 Temic Telefunken Microelectronic Gmbh Subassembly having a housing with an integral electrical plug unit
US6624432B1 (en) * 1999-10-12 2003-09-23 Shielding For Electronics, Inc. EMI containment apparatus
US7193852B2 (en) * 2003-09-05 2007-03-20 Robert Bosch Gmbh Control unit and method for producing the same
US7275958B2 (en) * 2005-07-25 2007-10-02 Siemens Aktiengesellschaft Sealing arrangement of a piezoactuator in a fuel injector

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017207164A1 (en) * 2016-05-31 2017-12-07 Endress+Hauser Gmbh+Co. Kg Encapsulation of a circuit board

Also Published As

Publication number Publication date
CN101355061A (en) 2009-01-28
US8053884B2 (en) 2011-11-08
EP2019424A3 (en) 2009-12-30
JP5135101B2 (en) 2013-01-30
JP2009033170A (en) 2009-02-12
EP2019424B1 (en) 2016-11-23
EP2019424A2 (en) 2009-01-28
CN101355061B (en) 2012-02-29

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