KR101688663B1 - 전력 반도체 모듈 - Google Patents

전력 반도체 모듈 Download PDF

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Publication number
KR101688663B1
KR101688663B1 KR1020100106789A KR20100106789A KR101688663B1 KR 101688663 B1 KR101688663 B1 KR 101688663B1 KR 1020100106789 A KR1020100106789 A KR 1020100106789A KR 20100106789 A KR20100106789 A KR 20100106789A KR 101688663 B1 KR101688663 B1 KR 101688663B1
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KR
South Korea
Prior art keywords
contact
power semiconductor
semiconductor module
connection
electrolytic capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100106789A
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English (en)
Korean (ko)
Other versions
KR20110049690A (ko
Inventor
프란크 토마스
Original Assignee
세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 filed Critical 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지
Publication of KR20110049690A publication Critical patent/KR20110049690A/ko
Application granted granted Critical
Publication of KR101688663B1 publication Critical patent/KR101688663B1/ko
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
KR1020100106789A 2009-11-04 2010-10-29 전력 반도체 모듈 Expired - Fee Related KR101688663B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009046403.4 2009-11-04
DE102009046403.4A DE102009046403B4 (de) 2009-11-04 2009-11-04 Leistungshalbleitermodul in Druckkontakttechnik

Publications (2)

Publication Number Publication Date
KR20110049690A KR20110049690A (ko) 2011-05-12
KR101688663B1 true KR101688663B1 (ko) 2016-12-21

Family

ID=42848832

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100106789A Expired - Fee Related KR101688663B1 (ko) 2009-11-04 2010-10-29 전력 반도체 모듈

Country Status (6)

Country Link
US (1) US8427836B2 (https=)
EP (1) EP2320459A2 (https=)
JP (1) JP5695884B2 (https=)
KR (1) KR101688663B1 (https=)
CN (1) CN102097391B (https=)
DE (1) DE102009046403B4 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8837166B2 (en) * 2011-10-28 2014-09-16 Hamilton Sundstrand Corporation Vertically mounted capacitor assembly
DE102012211952B4 (de) * 2012-07-09 2019-04-25 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit mindestens einem stressreduzierenden Anpasselement
FI20126120A7 (fi) * 2012-10-29 2014-04-30 Tellabs Oy Jousikiinnitteisellä elementillä varustettu piirikorttijärjestelmä
JP5932704B2 (ja) * 2013-04-04 2016-06-08 株式会社日本自動車部品総合研究所 電力変換装置
DE102013104950B3 (de) * 2013-05-14 2014-04-30 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und Anordnung hiermit
DE102013209431B4 (de) 2013-05-22 2018-04-05 Siemens Aktiengesellschaft Leistungshalbleitermodul
DE102014101024B3 (de) * 2014-01-29 2014-12-04 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
DE102014116058B3 (de) * 2014-11-04 2015-12-17 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
DE102015115140B4 (de) * 2015-09-09 2023-12-21 Infineon Technologies Ag Stromrichteranordnung mit verbesserter Befestigung
US10555425B2 (en) 2016-02-18 2020-02-04 Magna Closures Inc. Enclosure assembly for an electronic controller having an over-molded part to protect electronic components
DE102016105783B4 (de) 2016-03-30 2019-05-16 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
DE102016112777B4 (de) 2016-07-12 2021-03-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
DE102018125852B3 (de) * 2018-10-18 2020-03-12 Semikron Elektronik Gmbh & Co. Kg Anordnung und Verfahren zur Herstellung einer solchen Anordnung sowie Leistungshalbleitereinrichtung
DE102019103402B4 (de) * 2019-02-12 2020-12-17 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung
EP4109480A4 (en) * 2020-02-21 2023-06-28 Panasonic Intellectual Property Management Co., Ltd. Electronic component holder and electrical instrument

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200300838Y1 (ko) * 2002-10-28 2003-01-14 조경호 버어니어 캘리퍼스의 기능이 구비된 휴대용 저울
JP2008029093A (ja) * 2006-07-20 2008-02-07 Hitachi Ltd 電力変換装置
WO2009093982A1 (en) * 2008-01-25 2009-07-30 Iskralab D.O.O. Power switching module

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4111247C3 (de) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Schaltungsanordnung
JPH0947037A (ja) * 1995-07-25 1997-02-14 Aisin Aw Co Ltd インバータ装置
EP1289014B1 (en) * 2001-04-02 2013-06-19 Mitsubishi Denki Kabushiki Kaisha Power semiconductor device
DE10121970B4 (de) * 2001-05-05 2004-05-27 Semikron Elektronik Gmbh Leistungshalbleitermodul in Druckkontaktierung
DE10355925B4 (de) 2003-11-29 2006-07-06 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und Verfahren seiner Herstellung
DE102005024900B4 (de) * 2004-06-08 2012-08-16 Fuji Electric Co., Ltd. Leistungsmodul
JP4764979B2 (ja) * 2004-06-08 2011-09-07 富士電機株式会社 半導体装置
DE102004061936A1 (de) 2004-12-22 2006-07-06 Siemens Ag Anordnung eines Halbleitermoduls und einer elektrischen Verschienung
DE102005055608B3 (de) 2005-11-22 2007-05-10 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit zueinander parallel geschalteten Kondensatoren
DE102006006425B4 (de) 2006-02-13 2009-06-10 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontaktausführung
DE102006006424B4 (de) * 2006-02-13 2011-11-17 Semikron Elektronik Gmbh & Co. Kg Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren
DE102006013078B4 (de) * 2006-03-22 2008-01-03 Semikron Elektronik Gmbh & Co. Kg Kompaktes Leistungshalbleitermodul mit Verbindungseinrichtung
JP2007281127A (ja) * 2006-04-05 2007-10-25 Shindengen Electric Mfg Co Ltd コンデンサを備える回路装置及びコンデンサモジュール
DE102007054709B4 (de) * 2007-11-16 2014-11-13 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Substrat und mit einer Druckeinrichtung
JP5292823B2 (ja) * 2008-01-22 2013-09-18 日産自動車株式会社 電力変換装置
DE102008057832B4 (de) * 2008-11-19 2010-07-01 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit vorgespannter Hilfskontaktfeder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200300838Y1 (ko) * 2002-10-28 2003-01-14 조경호 버어니어 캘리퍼스의 기능이 구비된 휴대용 저울
JP2008029093A (ja) * 2006-07-20 2008-02-07 Hitachi Ltd 電力変換装置
WO2009093982A1 (en) * 2008-01-25 2009-07-30 Iskralab D.O.O. Power switching module

Also Published As

Publication number Publication date
JP2011101010A (ja) 2011-05-19
DE102009046403A1 (de) 2011-05-05
CN102097391B (zh) 2014-12-10
DE102009046403B4 (de) 2015-05-28
US20110103024A1 (en) 2011-05-05
CN102097391A (zh) 2011-06-15
JP5695884B2 (ja) 2015-04-08
US8427836B2 (en) 2013-04-23
KR20110049690A (ko) 2011-05-12
EP2320459A2 (de) 2011-05-11

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