CN102057074A - A1基合金溅射靶材的制造方法 - Google Patents

A1基合金溅射靶材的制造方法 Download PDF

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Publication number
CN102057074A
CN102057074A CN200980121618.0A CN200980121618A CN102057074A CN 102057074 A CN102057074 A CN 102057074A CN 200980121618 A CN200980121618 A CN 200980121618A CN 102057074 A CN102057074 A CN 102057074A
Authority
CN
China
Prior art keywords
powder
maximum particle
sputtering target
particle diameter
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200980121618.0A
Other languages
English (en)
Chinese (zh)
Inventor
得平雅也
松崎均
田内裕基
高木胜寿
岩崎祐纪
中井淳一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Kobelco Research Institute Inc
Original Assignee
Kobe Steel Ltd
Kobelco Research Institute Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd, Kobelco Research Institute Inc filed Critical Kobe Steel Ltd
Publication of CN102057074A publication Critical patent/CN102057074A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0408—Light metal alloys
    • C22C1/0416—Aluminium-based alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Powder Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
CN200980121618.0A 2008-06-09 2009-06-08 A1基合金溅射靶材的制造方法 Pending CN102057074A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-150527 2008-06-09
JP2008150527A JP5342810B2 (ja) 2008-06-09 2008-06-09 Ａｌ基合金スパッタリングターゲット材の製造方法
PCT/JP2009/060476 WO2009151032A1 (ja) 2008-06-09 2009-06-08 Ａｌ基合金スパッタリングターゲット材の製造方法

Publications (1)

Publication Number Publication Date
CN102057074A true CN102057074A (zh) 2011-05-11

Family

ID=41416739

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980121618.0A Pending CN102057074A (zh) 2008-06-09 2009-06-08 A1基合金溅射靶材的制造方法

Country Status (4)

Country Link
JP (1) JP5342810B2 (ja)
CN (1) CN102057074A (ja)
TW (1) TWI431140B (ja)
WO (1) WO2009151032A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102400082A (zh) * 2011-11-15 2012-04-04 燕山大学 一种镁合金表面导电防腐涂料及其制备方法
CN105624619A (zh) * 2016-03-14 2016-06-01 无锡舒玛天科新能源技术有限公司 一种平板显示器触摸屏用铝稀土合金旋转溅射靶材的制备方法及其制备靶材
CN113373414A (zh) * 2020-02-25 2021-09-10 湖南东方钪业股份有限公司 一种铝钪合金溅射靶的制备方法及应用
CN115058694A (zh) * 2022-06-22 2022-09-16 苏州六九新材料科技有限公司 一种TiAlZr靶材及其制备方法
CN116904942A (zh) * 2023-08-01 2023-10-20 苏州六九新材料科技有限公司 一种铝基合金靶材及其制备方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009020587A1 (en) 2007-08-06 2009-02-12 H.C. Starck, Inc. Refractory metal plates with improved uniformity of texture
JP2012224942A (ja) * 2010-10-08 2012-11-15 Kobe Steel Ltd Ａｌ基合金スパッタリングターゲットおよびその製造方法
JP6461543B2 (ja) * 2013-10-08 2019-01-30 株式会社フルヤ金属 アルミニウムと希土類元素との合金ターゲット及びその製造方法
US10023953B2 (en) 2014-04-11 2018-07-17 H.C. Starck Inc. High purity refractory metal powders and their use in sputtering targets which may have random texture
AT14576U1 (de) * 2014-08-20 2016-01-15 Plansee Se Metallisierung für ein Dünnschichtbauelement, Verfahren zu deren Herstellung und Sputtering Target
CN105132759B (zh) * 2015-09-29 2017-01-25 济南大学 Al‑Ta中间合金及其制备方法和应用
CN111155063B (zh) * 2019-12-31 2022-03-08 广州市尤特新材料有限公司 一种钛铝合金靶材及其制备方法
CN114535576B (zh) * 2022-04-01 2023-05-02 中南大学 一种含Al难熔高熵合金及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3212024B2 (ja) * 1996-11-14 2001-09-25 日立金属株式会社 Ａｌ系スパッタリング用タ−ゲット材およびその製造方法
JPH10147860A (ja) * 1996-11-15 1998-06-02 Hitachi Metals Ltd Ａｌ系スパッタリング用タ−ゲット材およびその製造方法
JPH1143765A (ja) * 1997-07-22 1999-02-16 Hitachi Metals Ltd Ａｌ合金系ターゲットおよびその製造方法
JPH11140636A (ja) * 1997-11-11 1999-05-25 Daido Steel Co Ltd 多元系粉末の混合方法および多元系粉末焼結ターゲットの製造方法
JPH11293454A (ja) * 1998-04-14 1999-10-26 Hitachi Metals Ltd Ａｌ系スパッタリング用ターゲット材及びその製造方法
WO2004001092A1 (ja) * 2002-06-24 2003-12-31 Nikko Materials Company, Limited AlRuスパッタリングターゲット及びその製造方法
JP4377906B2 (ja) * 2006-11-20 2009-12-02 株式会社コベルコ科研 Ａｌ−Ｎｉ−Ｌａ系Ａｌ基合金スパッタリングターゲット、およびその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102400082A (zh) * 2011-11-15 2012-04-04 燕山大学 一种镁合金表面导电防腐涂料及其制备方法
CN105624619A (zh) * 2016-03-14 2016-06-01 无锡舒玛天科新能源技术有限公司 一种平板显示器触摸屏用铝稀土合金旋转溅射靶材的制备方法及其制备靶材
CN105624619B (zh) * 2016-03-14 2018-06-19 无锡舒玛天科新能源技术有限公司 一种平板显示器触摸屏用铝稀土合金旋转溅射靶材的制备方法及其制备靶材
CN113373414A (zh) * 2020-02-25 2021-09-10 湖南东方钪业股份有限公司 一种铝钪合金溅射靶的制备方法及应用
CN113373414B (zh) * 2020-02-25 2023-10-27 湖南东方钪业股份有限公司 一种铝钪合金溅射靶的制备方法及应用
CN115058694A (zh) * 2022-06-22 2022-09-16 苏州六九新材料科技有限公司 一种TiAlZr靶材及其制备方法
CN115058694B (zh) * 2022-06-22 2024-03-22 苏州六九新材料科技有限公司 一种TiAlZr靶材及其制备方法
CN116904942A (zh) * 2023-08-01 2023-10-20 苏州六九新材料科技有限公司 一种铝基合金靶材及其制备方法

Also Published As

Publication number Publication date
TWI431140B (zh) 2014-03-21
JP5342810B2 (ja) 2013-11-13
WO2009151032A1 (ja) 2009-12-17
JP2009293108A (ja) 2009-12-17
TW201011116A (en) 2010-03-16

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Application publication date: 20110511