CN102057000A - 绝缘膜形成用油墨组合物、由该油墨组合物形成的绝缘膜 - Google Patents
绝缘膜形成用油墨组合物、由该油墨组合物形成的绝缘膜 Download PDFInfo
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- CN102057000A CN102057000A CN2009801218843A CN200980121884A CN102057000A CN 102057000 A CN102057000 A CN 102057000A CN 2009801218843 A CN2009801218843 A CN 2009801218843A CN 200980121884 A CN200980121884 A CN 200980121884A CN 102057000 A CN102057000 A CN 102057000A
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Abstract
本发明提供一种用于形成充分兼具低烧结温度、耐溶剂性、绝缘性的绝缘膜的绝缘性油墨组合物。本发明还提供一种利用印刷法可形成高集成有机晶体管的形成所必须的微细绝缘膜图形的绝缘膜形成用油墨组合物。本发明的绝缘膜形成用油墨组合物含有有机溶剂、聚乙烯基酚系树脂、环氧树脂以及交联助剂。特别是涉及如下的绝缘膜形成用油墨组合物:有机溶剂是一种包括20℃时的蒸气压为11.3×102Pa以上且大气压下的沸点不足115℃的有机溶剂和20℃时的蒸气压不足11.3×102Pa且大气压下的沸点为115℃以上的有机溶剂的溶剂,含有体积平均粒径为1~150nm的体质成分和有机硅系脱模剂成分。
Description
技术领域
本发明涉及一种适用于电子元件的制造的绝缘膜形成用油墨组合物以及由该油墨组合物形成的绝缘膜。
背景技术
晶体管作为构成电视机和计算机的重要电子元件(电子部件)被广泛应用,当前以硅等无机物为主材料被制造。近年来,在这种晶体管的部件中使用有机物的有机晶体管(OFET)引人注目(参考非专利文献1)。OFET不仅柔软有韧性,而且若从每单位面积来考虑还具有能够以低廉的原材料来进行制备的优点,可以认为是泛网(ubiquitous)时代的必须品,即,实现柔韧且低成本终端所不可或缺的构成要素。
OFET是以三个电极、绝缘层以及半导体层作为必须部件的电子元件。图1显示了元件构造的一个例子。在图中号码3所示的该栅极绝缘层(GI)的形成法中,有印刷法等湿式工艺和真空蒸镀或溅射等干式工艺,若考虑价格低廉化则优选湿式工艺(参考非专利文献2)。一方面,湿式工艺通常需要在制膜后经过过热(烧结)过程。而将耐热温度低的柔韧材料用于基板时,要求该过热(烧结)过程以更低温度来进行。例如,将聚萘二甲酸乙二醇酯(PEN)用于基材时,要求150℃以下的烧结温度。另外,作为湿式工艺适用印刷法时,有时要求绝缘膜形成用油墨具有能够应对形成微细图形的优异的印刷特性。
另一方面,在GI本身所要求的诸多特性中,有与元件制造工艺相关的特性和与元件电特性(FET特性)相关的特性。前者包括:不溶于GI上层的有机半导体层所使用的溶剂的特性,即耐溶剂性。而就后者而言,薄膜状态下的绝缘性越高(泄露电流小),表面平滑度越高,则越能提高元件特性。作为绝缘膜形成用材料,例如,已知以聚酰亚胺系材料作为固化剂的聚乙烯基酚系材料(I)(参考非专利文献3)。另外,已知以三聚氰胺系树脂作为固化剂的聚乙烯基酚系材料(参考非专利文献4)。
但是,这种材料需要200℃左右的高温烧结,通常适用于以玻璃素材作为基板来使用的情况,很难适用于以柔软性作为特征且耐热温度低的塑料基材。为了省去高温烧结工序,聚甲基丙烯酸甲酯系和聚苯乙烯系所代表的热塑性树脂(II)也为已知(参考非专利文献5)。但是,热塑性树脂耐溶剂性低劣,用印刷法在其上层层压导电性层、半导体层等十分困难,需要蒸镀等设备的干式工艺工序成为必要。另外,固体或者液体的双酚型通用环氧树脂(III)也为已知(参考非专利文献6)。但是,已知由该材料所形成的绝缘膜的泄露电流大。专利文献1公开了一种含有硅烷偶联剂和环氧树脂的绝缘材料(参考专利文献1)。另外,专利文献2公开了一种利用凸版反转印刷法的电路元件的制造方法,但是并没有低温烧结的相关记载(参考专利文献2)。因此,没有一种为了在具有柔软性的基材上设置绝缘膜来形成电子元件而充分兼具烧结温度、耐溶剂性、绝缘性的绝缘膜形成用油墨技术。进而,现状是尚没有充分兼具精密图形形成功能的绝缘膜形成用油墨技术。
先行技术文献
专利文献
专利文献1:日本特开2007-305950号公报
专利文献2:日本特开2007-273712号公报
非专利文献
非专利文献1:アドバンスドマテリアルズ(Advanced Materials)(《先进材料》)2002年第14号,P.99
非专利文献2:ケミストリ一オブマテリアルズ(Chemistry of Materials)(《材料化学》)2004年第16号,P.4543
非专利文献3:アプライドフイジツクスレタ一ズ(Applied Physics Letters)(《应用物理快报》)1998年第72号,P.2716
非专利文献4:ジヤ一ナルオブアプライドフイジツクス(Journal of Applied Physics)(《应用物理学杂志》)2002年第92号,P.5259
非专利文献5:サイエンス(Science)2007年第318号,P.76
非专利文献6:ジヤパニ一ズジヤ一ナルオブアツプライドフイジツクス(Japanese Journal of Applied Physics)(《日本应用物理学杂志》)2003年第42号,P.L523
发明内容
发明所要解决的课题
本发明的第一课题在于提供一种用于形成充分兼具烧结温度、耐溶剂性、绝缘性的绝缘膜的绝缘性油墨组合物。第二课题在于提供一种利用印刷法可形成高集成有机晶体管的形成所必须的微细绝缘膜图形的绝缘膜形成用油墨组合物,而第三课题在于提供一种由该油墨组合物所形成的绝缘性膜。
解决课题的手段
为了解决上述课题,本发明的第一技术方案是,提供一种绝缘膜形成用油墨组合物,其特征在于,作为必须成分含有有机溶剂、聚乙烯基酚系树脂、环氧树脂以及交联助剂。本发明第二技术方案是,提供一种能够形成更微细的绝缘膜图形的绝缘膜形成用油墨组合物,,其中,上述有机溶剂是包含了20℃时的蒸气压为11.3×102Pa以上且大气压下的沸点不足115℃的有机溶剂和20℃时的蒸气压不足11.3×102Pa且大气压下的沸点为115℃以上的有机溶剂的溶剂,含有体积平均粒径为1~150nm的体质成分和有机硅系脱模成分,25℃时的油墨的表面张力为17~30mN/m,油墨的粘度为0.5~30mPa·s。第三技术方案是,提供一种由上述绝缘膜形成用油墨组合物所形成的绝缘膜。
发明效果
通过使用本发明的绝缘膜形成用油墨组合物,能够获得在100~140℃的烧结温度下作为绝缘膜的优异的特性,并能在PEN等柔软性基材上形成绝缘膜。进而,由于形成的绝缘膜具有耐溶剂性,利用印刷法可在其上层层压导电层、半导体层等其他的层。另外,泄露电流也很小,能使该绝缘膜作为有机场效应晶体管(OFET)等的栅极绝缘膜而适用。
附图说明
图1是示意地表示使用了本发明的绝缘膜的电子元件的一个例子的概略构成图。
具体实施方式
本发明的绝缘膜形成用油墨组合物是一种含有有机溶剂、聚乙烯基酚系树脂、环氧树脂以及交联助剂作为必须成分的绝缘膜形成用油墨组合物。
作为本发明的绝缘膜形成用油墨组合物中使用的有机溶剂,只要是能够溶解上述聚乙烯基酚系树脂,可以使用任意的溶剂,例如有戊烷、己烷、庚烷、辛烷、癸烷、十二烷、异戊烷、异己烷、异辛烷、环己烷、甲基环己烷、环戊烷等脂肪族烃系有机溶剂,苯、甲苯、邻二甲苯、间二甲苯、对二甲苯、乙苯、均三甲苯、萘、环己基苯、二乙基苯等芳香族烃系溶剂,甲酸甲酯、甲酸乙酯、甲酸丙酯、乙酸甲酯、乙酸乙酯、乙酸异丙酯、乙酸正丙酯、乙酸异丁酯、乙酸正丁酯、丙酸甲酯、丙酸乙酯等酯系溶剂,甲醇、乙醇、丙醇、异丙醇、仲丁醇、叔丁醇、环己醇、α-松油醇等醇系溶剂,丙酮、甲基乙基酮、甲基异丁基酮、环己酮、2-己酮、2-庚酮、2-辛酮、四氢呋喃等酮系溶剂,碳酸乙烯酯、碳酸丙烯酯等碳酸酯系,二乙二醇乙基醚、二乙二醇二乙基醚、丙二醇单甲基醚、丙二醇单乙基醚、丙二醇单丙基醚、丙二醇单丁基醚、丙二醇单甲基醚乙酸酯、二乙二醇甲基醚乙酸酯、二乙二醇乙基醚乙酸酯、二乙二醇丙基醚乙酸酯、二乙二醇异丙基醚乙酸酯、二乙二醇丁基醚乙酸酯、二乙二醇叔丁基醚乙酸酯、三乙二醇甲基醚乙酸酯、三乙二醇乙基醚乙酸酯、三乙二醇丙基醚乙酸酯、三乙二醇异丙基醚乙酸酯、三乙二醇丁基醚乙酸酯、三乙二醇叔丁基醚乙酸酯、二丙二醇二甲基醚、二丙二醇单丁基醚等亚烷基醇系溶剂,乙醚、二正丙醚、二异丙醚、二丁醚、二己醚、乙基乙烯基醚、丁基乙烯基醚、苯甲醚、丁基苯基醚、戊基苯基醚、甲氧基甲苯、苄基乙基醚、二苯醚、二苄醚、二噁烷、呋喃、四氢呋喃等醚系溶剂,N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、N-甲基吡咯烷酮等酰胺系溶剂等,并没有特别限定。另外,这些可单独使用或2种以上并用。
作为本发明的绝缘膜形成用油墨组合物所使用的聚乙烯基酚系树脂,有对乙烯基酚的均聚物、对乙烯基酚与其他乙烯基单体(例如,甲基丙烯酸甲酯、甲基丙烯酸-2-羟基乙酯、苯乙烯、丙烯酸丁酯、丙烯酸-2-羟基乙酯、苯基马来酰亚胺、马来酸、富马酸)的共聚物、把对乙烯基苯进行了溴取代而得到的溴取代对乙烯基酚的均聚物、溴取代对乙烯基酚与其他乙烯基树脂的共聚物、把对乙烯基苯酚进行了磺化、叔丁基化、胺化而得到的对乙烯基酚衍生物的均聚物、对乙烯基酚衍生物与其他乙烯基单体的共聚物等,并没有特别限定。另外,这些可单独使用或2种以上并用。在本发明中,聚乙烯基酚系树脂优选在除去绝缘膜形成用油墨组合物的体质颜料之外的整个固体成分中含有10质量%以上。更优选25质量%以上。
就本发明的绝缘膜形成用油墨组合物所使用的环氧树脂而言,只要是起到聚乙烯基酚系树脂的交联剂的作用且是具有2个官能度以上的反应性的环氧基的公知常用的环氧树脂,则任意环氧树脂均可,例如有双酚A型环氧树脂、双酚F型环氧树脂、多官能度环氧树脂、柔性环氧树脂、溴化环氧树脂、缩水甘油酯型环氧树脂、高分子型环氧树脂、联苯型环氧树脂等,并没有特别限定。另外,这些可单独使用或2种以上并用。
本发明的绝缘膜形成用油墨组合物中使用交联助剂。作为交联助剂,胺系化合物、聚酰胺树脂、咪唑类、聚硫醇类、三氟化硼类、双氰胺类、有机酸酰肼、三苯基膦、以及其他公知常用的交联助剂的任意均可。这些交联助剂可单独使用,也可2种以上并用。若从室温稳定性和150℃以下的低温固化的观点出发,则优选2-乙基-4-甲基咪唑。这些交联助剂在整个固体成分中含有0.3~10.0质量%,优选含有1.0~5.0质量%。该含量在该范围外的情况下,若量过少则固化不足,量过多则由于所得到的绝缘树脂膜内残留有极性强的交联助剂而产生阻碍绝缘特性的问题而不理想。在添加有后述的体质成分的情况下,在除去体质成分之外的整个固体成分中含有0.3~10.0质量%,优选含有1.0~5.0质量%。
就本发明的绝缘膜形成用油墨组合物而言,可以根据需要添加脱模剂、体质成分以及以调整油墨表面张力、提高流平性为主要目的的各种表面活性剂等来使用。
作为表面活性剂,可适用烃系、有机硅系、氟系以及这些表面活性剂的2种以上的混合系。特别是氟系表面活性剂,不仅具有优异的调整油墨表面张力、提高流平性的效果,而且,添加有该表面活性剂的油墨所形成的绝缘膜与聚噻吩系等结晶性有机半导体的相溶性方面优异,不仅油墨特性而且晶体管特性的提高也可期望,因此是最合适的表面活性剂。其中理想的氟系表面活性剂是具有直链状的全氟烃基,链长为C6以上、更优选为C8以上的非离子系的氟系表面活性剂。具体来说,例如,有MEGAFACE F-482、MEGAFACE F-470(R-08)、MEGAFACE F-472SF、MEGAFACE R-30、MEGAFACE F-484、MEGAFACE F-486、MEGAFACE F-172D、MEGAFACE F178RM(以上为商品名,DIC株式会社制造)等,并没有特别限定。另外,这些可单独使用或2种以上并用。这些表面活性剂在整个油墨组合物中以有效成分计含有0.01~5.0质量%,优选以有效成分计含有0.05~1.0质量%。
作为形成电子元件的基板,例如有玻璃织布环氧层压板、玻璃非织造布环氧层压板、纸环氧层压板、纸酚醛层压板、玻璃织布聚酰胺层压板等玻璃纤维增强塑料,聚萘二甲酸酯乙二醇酯、聚酰亚胺、聚对苯二甲酸乙二醇酯、聚碳酸酯等塑料薄膜,用绝缘体覆盖的铜、铝、不锈钢、铁等的金属板或者箔、板状的玻璃、氧化铝、氧化锆、二氧化硅等,特别地,通过使用聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯、聚碳酸酯等具有柔软性的塑料素材而能够有效利用本发明特征的低温固化性。
在本发明的绝缘膜形成用油墨组合物的制膜化中,可采用各种印刷方式。能够使用公知常用的印刷方式,采用单层或多层构造的涂布物制造方式进行制造。具体来说,例如,可举出照相凹版印刷法、胶版印刷法、凸版法、丝网印刷法、反转法、气刀涂布法(air doctor coater)、刮刀涂布法、气刀涂布法(air knife coater)、挤压涂布法、浸渍涂布法、传递辊式涂布法、吻合式涂布机、流延涂布法、喷涂法、模头涂布法、旋转涂布法、刮棒涂布法、微接触法、凸版反转印刷法等。就本发明的油墨组合物而言,对应于各种印刷方式,含有该印刷方式所适合的添加剂,选择印刷方式所适合的溶剂,并以印刷方式所适合的树脂成分浓度进行调制。
在印刷方式中,为了形成精密电路,更优选使用能够再现性良好地把细线等图形化的凸版反转印刷方式。这里所说的凸版反转印刷法是指,在由聚二甲基硅氧烷(PDMS)等形成的平滑脱模性表面上涂布油墨,在该油墨涂布面上按压作为起模板的凸版,将与该凸版接触的油墨部分从该脱模性表面除去,再把残存的图形反转转印到被印刷体上的方法。对于适用于该印刷法的油墨,要求能够均匀润湿脱模性表面,在凸版按压时按照凸版的图形彻底将油墨从脱模性表面除去,并且能够将残存的油墨图形从脱模性表面完全转印到被印刷体上。适用于相关印刷法的本发明的绝缘膜形成用油墨组合物,除必须成分以外,优选含有2种以上的速干性及迟干性溶剂、体质成分、表面能量调整剂、脱模剂。通过这些成分的添加,可提高油墨印刷特性,实现构成有机晶体管等电子部件所必须的微细图形形成性。
作为速干性有机溶剂,可采用20℃时的蒸气压为11.3×102Pa(8.5mmHg)以上且大气压下的沸点不到115℃的溶剂中的任意一种以上,该速干性有机溶剂在整个油墨组合物中含有5.0~90.0质量%,优选含有10.0~60.0质量%,更优选含有20.0~40.0质量%。
就这些速干性有机溶剂而言,可以考虑树脂的溶解性、对颜料分散体系的亲和性来选择分别适应的溶剂,可采用例如以下列举的物质。作为脂系溶剂可举出乙酸乙酯、乙酸正丙酯、乙酸异丙酯,作为醇系溶剂可举出甲醇、乙醇、1-丙醇、2-丙醇,作为烃系溶剂可举出戊烷、己烷、环己烷、甲基环己烷、甲苯、二甲苯,作为酮系溶剂可举出四氢呋喃等。另外,这些也可以是各自体系内以及多个体系的混合物。其中特别是乙酸异丙酯和乙醇以及2-丙醇,从其蒸发速度和表面张力来看是优选的。
作为迟干性有机溶剂,可采用20℃时的蒸气压不到11.3×102Pa(8.5mmHg)且大气压下的沸点为115℃以上的溶剂中的任意一种以上,该迟干性有机溶剂在整个油墨组合物中含有5.0~90.0质量%,优选含有30.0~70.0质量%,更优选含有40.0~60.0质量%。就这些溶剂而言,可以考虑树脂的溶解性、对颜料分散体系的亲和性来选择分别适应的溶剂,可采用例如以下列举的物质。作为酯系溶剂可以是丙二醇单甲基醚乙酸酯(PGMAc)、3-甲氧基-3-甲基-丁基乙酸酯、乙氧基乙基丙酸酯(EEP),作为醇系溶剂可以是1-丁醇、带德鲁(ダイヤド一ル)135(商品名,三菱丽阳株式会社制造)、3-甲氧基-3-甲基-1-丁醇、1-己醇、1,3-丁二醇、1-戊醇、2-甲基-1-丁醇、4-甲基-2-戊醇,作为醚系溶剂可以是丙二醇单甲基醚、丙二醇单乙基醚、丙二醇叔丁基醚、二丙二醇单甲基醚、乙二醇丁基醚、乙二醇乙基醚、乙二醇甲基醚、二乙二醇丁基醚、二乙二醇乙基醚,作为碳酸脂类可以是碳酸乙烯酯、碳酸丙烯酯,作为烃系溶剂可以是SOLVESSO 100、SOLVESSO 150(商品名,埃克森美孚化工公司制造),另外这些也可以是各自的体系内以及多个体系的混合物。其中特别是丙二醇单甲基醚乙酸酯、3-甲氧基-3-甲基-丁基乙酸酯、乙氧基乙基丙酸酯以及带德鲁(ダイヤド一ル)135,从其蒸发速度和表面张力来看是优选的。
脱模剂可使用公知常用的有机硅系化合物的1种或2种以上。作为具体例子有二甲基硅油、二甲基硅橡胶、有机硅树脂、有机改性硅氧烷、甲基苯基硅油、长链烷基改性硅油、氟化合物和有机硅聚合物的混合物、氟改性有机硅等,并没有特别限定。另外,这些可单独使用或2种以上并用。这些之中,从脱模性和与PVP树脂的相溶性方面来看,KF-96L系列(信越化学制造)比较理想。这些脱模剂在整个油墨组合物中含有0.0~5.0质量%,优选含有0.0~1.0质量%。该含量在该范围外的情况下,若量过多则不仅使印刷特性低下,还会产生阻碍绝缘膜特性的问题而不理想。
作为体质成分,只要能保持涂膜的绝缘性,可使用公知常用的彩色颜料单体、微粒粉末单体、将这些彩色颜料单体和微粒粉末单体预先分散到分散剂、有机溶剂中的而得的颜料分散体中的1种或2种以上。具体而言,有EXCEDIC BLUE0565、EXCEDIC RED 0759、EXCEDIC YELLOW 0599、EXCEDICGREEN0358、EXCEDIC YELLOW0648(商品名,DIC株式会社制造)、AEROSIL系列(商品名,EVONIK公司制造)、SYLYSIA、SYLOPHOBIC、SYLOPUTE、SYLOPAGE、SYLOPURE、SYLOSPHERE、SYLOMASK、SILWELL、FUJI BALLON(商品名,富士硅化工有限公司制造)、PMA-ST、IPA-ST(商品名,日产化学)、NANOBIC3600系列、NANOBIC3800系列(商品名,毕克化学公司制造)等,并没有特别限定。另外,这些可单独使用或2种以上并用。为了提高绝缘膜的绝缘性,优选这些体质成分本身的电绝缘性高且这些体质成分均匀且致密地分散在绝缘膜中。另外,本发明的绝缘油墨用于电子元件例如有机晶体管的栅极绝缘膜时,要求膜的表面平滑性。因此,油墨中添加的体质成分的平均粒径优选1~150nm,更优选5~50nm。优选作为微粒硅石分散、氧化铝分散体的PMA-ST、IPA-ST(商品名,日产化学)、NANOBIC3600系列(商品名,毕克化学公司制造)。关于体质成分的平均粒径,例如用动态光散射法可容易测定。这些体质成分在整个固体成分中含有20~90质量%,优选含有40~70质量%。在该含量在该范围外的情况下,若量过多则导致绝缘膜变脆而不理想。另一方面,若过少则导致油墨的微细图形形成特性不充分而不理想。
在本发明的油墨组合物中,适用于凸版反转印刷方式的油墨具有上述组成,但其物性也是重要因素。作为该物性,首先温度为25℃时的油墨粘度在0.5mPa·s~30.0mPa·s的范围内。其中更优选1.0~5.0mPa·s。其次,油墨组合物的表面能量也是重要因素。油墨组合物的表面能量优选17mN/m~30mN/m,但是理想的是大概比22mN/m低的表面能量的程度。
实施例
下面,通过实施例对本发明进行更为具体地说明,但是本发明并不局限于以下的实施例。
(实施例1)
在作为聚乙烯基酚系树脂的2.3g Maruka Lyncur M(丸善石油化学公司制造)、作为交联剂的3.3g环氧树脂“EPICLON 850CPR”(DIC公司制造)、作为交联助剂的0.14g 2-乙基-4-甲基咪唑中,混合作为溶剂的22.0g的乙酸异丙酯(以下称IPAc)来调制成实施例1的油墨。
(实施例2)
在作为聚乙烯基酚系树脂的2.3g聚(4-乙烯基苯酚-共聚-甲基丙烯酸甲酯共聚物)(Sigma Aldrich Corporation制造)、作为交联剂的3.3g环氧树脂“EPICLON 850CPR”(DIC公司制造)、作为交联助剂的0.06g 2-乙基-4-甲基咪唑中,混合作为溶剂的22.0g环己酮、作为氟系表面活性剂的0.5g F-482来调制成实施例2的油墨。
(实施例3)
作为聚乙烯基酚系树脂的2.3g Maruka Lyncur M(丸善石油化学公司制造)、作为交联剂的3.3g环氧树脂“EPICLON 850CPR”(DIC公司制造)、作为交联助剂的0.15g 2-乙基-4-甲基咪唑、作为溶剂的15g IPAc、29g丙二醇单甲基醚、6.0g碳酸丙烯酯、作为脱模剂的2.0g KF96L-1cs(信越化学工业公司制造)、作为氟系表面活性剂的1.0gF-482(DIC公司制造)以及0.3gMCF-350SF(DIC公司制造)、作为体质成分的25g PMA-ST(日产化学制造),将以上物质进行混合来调制成实施例3的油墨。
(比较例1)
作为树脂成分,用20.0g作为丙烯酸树脂的聚甲基丙烯酸甲酯(PMMA)(Sigma Aldrich Corporation制造:Mw 120,000)代替聚乙烯基酚系树脂、环氧树脂,与80.0g溶剂环己酮混合来调制成比较例1的油墨。
(比较例2)
作为树脂成分,用20.0g聚苯乙烯树脂(Sigma Aldrich Corporation制造:Mw 44,000)代替聚乙烯基酚系树脂、环氧树脂,与80.0g溶剂环己酮混合来调制成比较例2的油墨。
(比较例3)
将20.0g聚乙烯基酚系树脂Maruka Lyncur M(丸善石油化学公司制造)代替作为交联剂的环氧树脂,与8.0g Cymel 303(日本Cytec公司制造)、100.0g溶剂环己酮混合来调制成比较例3的油墨。
(比较例4)
在1.9g线性酚醛树脂(Phenolite TD-2090-60M:固体成分为60%的MEK溶液)和2.0g环氧树脂“EPICLON 850CPR”(DIC公司制造)、0.1g作为交联助剂的2-乙基-4-甲基咪唑中,混合作为溶剂的4.0g乙酸异丙酯(以下称IPAc)、3.8g甲基乙基酮来调制成比较例4的油墨。
(耐溶剂性评价)
采用旋转涂布印刷方式,在厚度1.5mm的玻璃板上将实施例1至比较例3的油墨调制为干燥膜厚为1μm的厚度。之后,在140℃烧结30分钟,形成耐溶剂性评价样本。耐溶剂性评价就是,把如上述那样而制作的薄膜连玻璃板一起浸泡在丁基卡必醇乙酸酯中20小时,以薄膜是否残留进行评价。将结果表示在表1、2中。
(漏泄电流评价)
与上述耐溶剂性评价样本相同,在厚度1.5mm的带ITO的玻璃板上印刷上述各油墨组合物,在140℃烧结30分钟,得到干燥膜厚约1μm的绝缘膜。采用真空蒸镀法在该绝缘膜上部形成银电极,测定在绝缘膜上施加150V时的电流值。单位是mAcm-2。
(反转印刷物的图像质量)
使用实施例3的油墨在橡皮布(blanket)的PDMS表面上形成绝缘性油墨涂膜,在该涂膜上按压作为起模板的凸版玻璃板,除去多余的油墨,在橡皮布上形成线宽20μm的格子状的图形后,将它转印到作为被印刷基材的玻璃板上,形成图像。使用光学显微镜观察在该玻璃板上形成的图像质量,对上述凸版的图形是否正确再现进行评价。将结果表示在图1中。
(晶体管特性评价)
制备图1所示的具有底栅极底接触(BGBC)构造的晶体管特性测定用元件。
(1)栅极电极的形成:将厚度约125μm的带硬涂层的PEN薄膜切割为规定的大小,通过旋转涂布将均匀分散有纳米银粒子的导电油墨均匀涂布在薄膜上,并在清洁烘箱中在150℃烧结40分钟。
(2)绝缘膜的形成:在由上述导电油墨形成的栅极电极上,通过旋转涂布使用本发明的绝缘膜形成用油墨进行涂布,并在清洁烘箱中在140℃进行约1小时热处理,形成膜厚约1μm的栅极绝缘膜。
(3)源电极、漏电极的形成:通过凸版反转印刷,使用反转印刷用的导电油墨,在先前形成的栅极绝缘膜上形成沟道(channel)长50μm、沟道宽4mm的源电极、漏电极图形,并在清洁烘箱中在170℃烧结40分钟从而形成银电极。
(4)有机半导体层的形成:通过旋转涂布法,使用0.5重量%的有机半导体(P3HT)聚(3-己基噻吩)的二甲苯溶液,在绝缘膜、源电极、漏电极上形成P3HT薄膜。
(5)制备的元件在手套箱中进行了在150℃、约5分钟的热处理后,利用半导体参数测定装置(吉时利仪器公司4200)对Id-Vg、Id-Vd特性进行测定。通过公知方法求得场效应迁移率以及ON/OFF。迁移率的单位是cm2/Vs。
表1
表2
产业上的可利用性
本发明的绝缘膜形成用油墨组合物使得低温下的烧成成为可能,并可适用于以柔韧薄膜作为基板的电子元件的制造。
符号说明
1 基板
2 栅极电极
3 绝缘膜
4 有机半导体层
5 源电极、漏电极。
Claims (4)
1.一种绝缘膜形成用油墨组合物,其特征在于,含有有机溶剂、聚乙烯基酚系树脂、环氧树脂以及交联助剂。
2.根据权利要求1所述的绝缘膜形成用油墨组合物,其特征在于,含有氟系表面活性剂。
3.根据权利要求1或2所述的绝缘膜形成用油墨组合物,其特征在于,
上述有机溶剂是包括20℃时的蒸气压为11.3×102Pa以上且在大气压下的沸点不足115℃的有机溶剂和20℃时的蒸气压不到11.3×102Pa且在大气压下的沸点为115℃以上的有机溶剂的溶剂,
含有体积平均粒径为1~150nm的体质成分和有机硅系脱模成分,25℃时的油墨的表面张力为17~30mN/m,油墨的粘度为0.5~30mPa·s。
4.一种绝缘膜,其特征在于,由权利要求1-3中任意一项所述的绝缘膜形成用油墨组合物形成。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105899626A (zh) * | 2014-02-27 | 2016-08-24 | 株式会社日立产机系统 | 喷墨印刷用墨水 |
CN110819169A (zh) * | 2018-08-08 | 2020-02-21 | 纪州技研工业株式会社 | 喷墨用油墨 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010245379A (ja) * | 2009-04-08 | 2010-10-28 | Hitachi Chem Co Ltd | 絶縁体インク、絶縁被覆層の作製方法及び半導体装置 |
KR101164945B1 (ko) * | 2010-09-13 | 2012-07-12 | 한국과학기술원 | 플렉시블 소자의 제작 방법 |
KR20160119093A (ko) | 2014-02-04 | 2016-10-12 | 로레알 | 적어도 2개의 구획부를 포함하는 전기 마스크 |
JPWO2015163076A1 (ja) * | 2014-04-25 | 2017-04-13 | 株式会社ダイセル | 銀粒子塗料組成物 |
FR3024368A1 (fr) | 2014-07-29 | 2016-02-05 | Oreal | Dispositif d'iontophorese a embout multi-electrodes |
US10522771B2 (en) | 2014-12-01 | 2019-12-31 | Samsung Electronics Co., Ltd. | Composition, electronic device, and thin film transistor |
KR102407114B1 (ko) * | 2015-05-29 | 2022-06-08 | 삼성전자주식회사 | 절연액, 절연체, 박막 트랜지스터 및 전자 소자 |
KR102380151B1 (ko) | 2015-08-31 | 2022-03-28 | 삼성전자주식회사 | 박막 트랜지스터, 및 이를 포함하는 전자 장치 |
US9828520B2 (en) * | 2016-04-15 | 2017-11-28 | Xerox Corporation | Interlayer composition and devices made therefrom |
TW201811940A (zh) * | 2016-05-16 | 2018-04-01 | 迪愛生股份有限公司 | 活性能量線硬化性反向平板印刷用油墨 |
JP7234668B2 (ja) * | 2019-02-06 | 2023-03-08 | コニカミノルタ株式会社 | 画像形成装置および画像形成方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827737A (ja) * | 1981-08-12 | 1983-02-18 | Mitsubishi Rayon Co Ltd | 光学式情報記録体用メタクリル樹脂組成物 |
DE3564957D1 (en) * | 1984-06-23 | 1988-10-20 | Shikoku Chem | Epoxy resin composition |
JP2992856B2 (ja) * | 1992-07-06 | 1999-12-20 | 株式会社サクラクレパス | 転写紙用印刷インキ組成物および転写紙 |
JPH0734022A (ja) | 1993-07-23 | 1995-02-03 | Ajinomoto Co Inc | 熱硬化性ソルダーレジスト用インキ組成物 |
JP3281473B2 (ja) * | 1994-01-17 | 2002-05-13 | 日本化薬株式会社 | フレキシブルプリント配線板用レジストインキ組成物及びその硬化物 |
JP3590481B2 (ja) * | 1996-08-07 | 2004-11-17 | サカタインクス株式会社 | 顔料分散物及びそれを用いた被覆剤組成物 |
JP2001192539A (ja) * | 2000-01-13 | 2001-07-17 | Jsr Corp | 熱硬化性樹脂組成物、その硬化物およびその硬化物を含む回路基板 |
JP2002040632A (ja) | 2000-07-21 | 2002-02-06 | Showa Denko Kk | レジストインキ組成物 |
JP2002040647A (ja) * | 2000-07-31 | 2002-02-06 | Taiyo Ink Mfg Ltd | レジストインキ組成物 |
TW594390B (en) * | 2001-05-21 | 2004-06-21 | Tokyo Ohka Kogyo Co Ltd | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same |
JP4549651B2 (ja) | 2003-10-24 | 2010-09-22 | 光村印刷株式会社 | カラーフィルター作製用インキ組成物 |
JP4828791B2 (ja) * | 2003-10-24 | 2011-11-30 | 光村印刷株式会社 | 精密パターニング用インキ組成物 |
JP4662793B2 (ja) * | 2005-03-01 | 2011-03-30 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | エポキシ含有物質を含むネガ型感光性樹脂組成物 |
US20090163615A1 (en) * | 2005-08-31 | 2009-06-25 | Izhar Halahmi | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
JP5399603B2 (ja) * | 2005-10-07 | 2014-01-29 | 昭和電工株式会社 | シリコーンパウダーを含む熱硬化性樹脂組成物 |
US7571999B2 (en) * | 2005-11-30 | 2009-08-11 | Xerox Corporation | Overcoat compositions, oil-based ink compositions, and processes for ink-jet recording using overcoat and oil-based ink compositions |
JP5506010B2 (ja) * | 2006-03-17 | 2014-05-28 | 昭和電工株式会社 | 樹脂組成物 |
JP4828988B2 (ja) | 2006-03-31 | 2011-11-30 | Dic株式会社 | 電子部品の製造方法 |
JP4807159B2 (ja) | 2006-04-12 | 2011-11-02 | 凸版印刷株式会社 | 絶縁塗料、これから形成された有機絶縁膜、その形成方法および有機トランジスタ |
JP2008077057A (ja) * | 2006-08-21 | 2008-04-03 | Jsr Corp | 感光性絶縁樹脂組成物及びその硬化物並びにそれを備える電子部品 |
JP5326236B2 (ja) * | 2006-10-26 | 2013-10-30 | 日立化成株式会社 | インク、液晶表示装置用スペーサの形成方法及び液晶表示装置 |
-
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CN110819169A (zh) * | 2018-08-08 | 2020-02-21 | 纪州技研工业株式会社 | 喷墨用油墨 |
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