CN102016387B - 具有led管芯的发光体及其制造 - Google Patents
具有led管芯的发光体及其制造 Download PDFInfo
- Publication number
- CN102016387B CN102016387B CN200880121777.6A CN200880121777A CN102016387B CN 102016387 B CN102016387 B CN 102016387B CN 200880121777 A CN200880121777 A CN 200880121777A CN 102016387 B CN102016387 B CN 102016387B
- Authority
- CN
- China
- Prior art keywords
- recess
- led die
- molded part
- open side
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H10W72/552—
-
- H10W72/5522—
-
- H10W72/5525—
-
- H10W90/00—
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007061261A DE102007061261A1 (de) | 2007-12-19 | 2007-12-19 | Leuchtkörper mit LED-DIEs und deren Herstellung |
| DE102007061261.5 | 2007-12-19 | ||
| PCT/EP2008/010414 WO2009077105A1 (de) | 2007-12-19 | 2008-12-09 | Leuchtkörper mit led-dies und deren herstellung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102016387A CN102016387A (zh) | 2011-04-13 |
| CN102016387B true CN102016387B (zh) | 2014-12-03 |
Family
ID=40351577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880121777.6A Expired - Fee Related CN102016387B (zh) | 2007-12-19 | 2008-12-09 | 具有led管芯的发光体及其制造 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8487322B2 (esLanguage) |
| EP (1) | EP2235429A1 (esLanguage) |
| JP (1) | JP2011507291A (esLanguage) |
| KR (1) | KR101556807B1 (esLanguage) |
| CN (1) | CN102016387B (esLanguage) |
| DE (1) | DE102007061261A1 (esLanguage) |
| TW (1) | TW200945508A (esLanguage) |
| WO (1) | WO2009077105A1 (esLanguage) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2675390A1 (en) * | 2009-08-13 | 2011-02-13 | Norik Bonyadi | Moulding with embedded lighting |
| DE102009060896A1 (de) * | 2009-12-30 | 2011-07-07 | ERCO GmbH, 58507 | Lichtquellenmodul u. a. |
| DE102014110470A1 (de) * | 2014-07-24 | 2016-01-28 | Osram Opto Semiconductors Gmbh | Beleuchtungsmodul |
| KR101847100B1 (ko) * | 2017-01-02 | 2018-04-09 | 박승환 | Uv 임프린팅 기술을 이용한 투명 발광장치 제조 방법 및 그에 따라 제조되는 투명 발광장치 |
| DE102019106546A1 (de) * | 2019-03-14 | 2020-09-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil |
| CN112936734A (zh) * | 2021-03-08 | 2021-06-11 | 东莞广华汽车饰件科技有限公司 | 一种灯板定位式胶膜汽车装饰件的注塑制造方法 |
| DE102023107545A1 (de) | 2023-03-24 | 2024-09-26 | Marelli Automotive Lighting Reutlingen (Germany) GmbH | Vorrichtung zum Ausleuchten eines Emblems oder eines Schriftzugs eines Kraftfahrzeugs, ausgeleuchtetes Emblem oder ausgeleuchteter Schriftzug und Anordnung umfassend ein Frontpanel eines Kraftfahrzeugs mit mehreren ausleuchtbaren Emblemen oder Schriftzügen und Vorrichtungen zum Ausleuchten der Embleme oder Schriftzüge |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1693969A (zh) * | 2004-04-29 | 2005-11-09 | Lg.菲利浦Lcd株式会社 | 发光二极管灯单元 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0553511A (ja) * | 1991-08-28 | 1993-03-05 | Toyoda Gosei Co Ltd | カラーデイスプレイ装置 |
| JPH10150227A (ja) * | 1996-11-15 | 1998-06-02 | Rohm Co Ltd | チップ型発光素子 |
| JPH10308535A (ja) * | 1997-05-02 | 1998-11-17 | Citizen Electron Co Ltd | 表面実装型発光ダイオード及びその製造方法 |
| JP3116085B2 (ja) * | 1997-09-16 | 2000-12-11 | 東京農工大学長 | 半導体素子形成法 |
| JP3746173B2 (ja) * | 1999-03-12 | 2006-02-15 | 松下電器産業株式会社 | 面照明装置及びそれを用いた携帯端末装置 |
| JP3774616B2 (ja) * | 2000-06-29 | 2006-05-17 | 株式会社日立製作所 | 照明装置及び導光板の製造方法 |
| US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
| JP4431925B2 (ja) * | 2000-11-30 | 2010-03-17 | 信越半導体株式会社 | 発光素子の製造方法 |
| JP2003011416A (ja) * | 2001-06-28 | 2003-01-15 | Kyocera Corp | 光プリンタヘッド |
| JP2003023183A (ja) * | 2001-07-06 | 2003-01-24 | Stanley Electric Co Ltd | 面実装型ledランプ |
| JP4067802B2 (ja) * | 2001-09-18 | 2008-03-26 | 松下電器産業株式会社 | 照明装置 |
| JPWO2003030274A1 (ja) * | 2001-09-27 | 2005-01-20 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
| JP4108318B2 (ja) * | 2001-11-13 | 2008-06-25 | シチズン電子株式会社 | 発光装置 |
| JP2003158301A (ja) * | 2001-11-22 | 2003-05-30 | Citizen Electronics Co Ltd | 発光ダイオード |
| JP3875914B2 (ja) | 2002-05-14 | 2007-01-31 | 株式会社ケンウッド | 電子機器および書き込み動作制御方法 |
| WO2004017407A1 (de) * | 2002-07-31 | 2004-02-26 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares halbleiterbauelement und verfahren zu dessen herstellung |
| US20040048033A1 (en) * | 2002-09-11 | 2004-03-11 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd. | Oled devices with improved encapsulation |
| BE1015302A3 (fr) * | 2003-01-10 | 2005-01-11 | Glaverbel | Vitrage comportant des composants electroniques. |
| DE202004005799U1 (de) * | 2003-04-29 | 2004-06-24 | Potthoff, Marc | Leuchtkörper |
| KR20050092300A (ko) * | 2004-03-15 | 2005-09-21 | 삼성전기주식회사 | 고출력 발광 다이오드 패키지 |
| US7055969B2 (en) * | 2004-04-29 | 2006-06-06 | Hewlett-Packard Development Company, L.P. | Reflective optical assembly |
| US7997771B2 (en) * | 2004-06-01 | 2011-08-16 | 3M Innovative Properties Company | LED array systems |
| JP4395104B2 (ja) * | 2004-11-08 | 2010-01-06 | アルプス電気株式会社 | 照明装置 |
| DE102004054822A1 (de) | 2004-11-13 | 2006-05-18 | Schefenacker Vision Systems Germany Gmbh | Leuchte für Fahrzeuge, vorzugsweise für Kraftfahrzeuge |
| JP2006179572A (ja) * | 2004-12-21 | 2006-07-06 | Sharp Corp | 発光ダイオード、バックライト装置および発光ダイオードの製造方法 |
| JP5209177B2 (ja) * | 2005-11-14 | 2013-06-12 | 新光電気工業株式会社 | 半導体装置および半導体装置の製造方法 |
| KR100828891B1 (ko) * | 2006-02-23 | 2008-05-09 | 엘지이노텍 주식회사 | Led 패키지 |
| TWM302039U (en) * | 2006-03-13 | 2006-12-01 | Belletech Technology Co Ltd | LED backlight module of display |
| US20070263408A1 (en) * | 2006-05-09 | 2007-11-15 | Chua Janet Bee Y | Backlight module and method of making the module |
| JP5028562B2 (ja) * | 2006-12-11 | 2012-09-19 | 株式会社ジャパンディスプレイイースト | 照明装置及びこの照明装置を用いた表示装置 |
| US9024349B2 (en) * | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
-
2007
- 2007-12-19 DE DE102007061261A patent/DE102007061261A1/de not_active Ceased
-
2008
- 2008-12-09 KR KR1020107013521A patent/KR101556807B1/ko not_active Expired - Fee Related
- 2008-12-09 WO PCT/EP2008/010414 patent/WO2009077105A1/de not_active Ceased
- 2008-12-09 CN CN200880121777.6A patent/CN102016387B/zh not_active Expired - Fee Related
- 2008-12-09 EP EP08862318A patent/EP2235429A1/de not_active Withdrawn
- 2008-12-09 JP JP2010538409A patent/JP2011507291A/ja active Pending
- 2008-12-18 US US12/337,884 patent/US8487322B2/en not_active Expired - Fee Related
- 2008-12-18 TW TW097149311A patent/TW200945508A/zh unknown
-
2013
- 2013-06-17 US US13/919,311 patent/US20130277695A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1693969A (zh) * | 2004-04-29 | 2005-11-09 | Lg.菲利浦Lcd株式会社 | 发光二极管灯单元 |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2000-331523A 2000.11.30 * |
| JP特开平5-53551A 1993.03.05 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011507291A (ja) | 2011-03-03 |
| WO2009077105A1 (de) | 2009-06-25 |
| KR20100115343A (ko) | 2010-10-27 |
| US20090242903A1 (en) | 2009-10-01 |
| TW200945508A (en) | 2009-11-01 |
| US8487322B2 (en) | 2013-07-16 |
| CN102016387A (zh) | 2011-04-13 |
| EP2235429A1 (de) | 2010-10-06 |
| DE102007061261A1 (de) | 2009-07-02 |
| KR101556807B1 (ko) | 2015-10-01 |
| US20130277695A1 (en) | 2013-10-24 |
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Legal Events
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| REG | Reference to a national code |
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Effective date of registration: 20160622 Address after: German Monheim Patentee after: BAYER INTELLECTUAL PROPERTY GmbH Address before: Germany Leverkusen Patentee before: BAYER MATERIALSCIENCE AG Effective date of registration: 20160622 Address after: Leverkusen, Germany Patentee after: COVESTRO DEUTSCHLAND AG Address before: German Monheim Patentee before: BAYER INTELLECTUAL PROPERTY GmbH |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141203 Termination date: 20161209 |
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