CN101992347A - 焊头元件的摄像机辅助调整 - Google Patents
焊头元件的摄像机辅助调整 Download PDFInfo
- Publication number
- CN101992347A CN101992347A CN2010102487911A CN201010248791A CN101992347A CN 101992347 A CN101992347 A CN 101992347A CN 2010102487911 A CN2010102487911 A CN 2010102487911A CN 201010248791 A CN201010248791 A CN 201010248791A CN 101992347 A CN101992347 A CN 101992347A
- Authority
- CN
- China
- Prior art keywords
- soldering tip
- supersonic welder
- reference element
- orientable
- welder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 title abstract description 12
- 238000005476 soldering Methods 0.000 claims description 76
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 6
- 238000005286 illumination Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000004590 computer program Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
Description
Claims (31)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10338809.5 | 2003-08-21 | ||
DE10338809A DE10338809B4 (de) | 2003-08-21 | 2003-08-21 | Verfahren und Vorrichtung zur Justage von Bondkopfelementen |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800239623A Division CN1839010B (zh) | 2003-08-21 | 2004-07-17 | 焊头元件的摄像机辅助调整 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101992347A true CN101992347A (zh) | 2011-03-30 |
CN101992347B CN101992347B (zh) | 2012-02-15 |
Family
ID=34201923
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010102487911A Active CN101992347B (zh) | 2003-08-21 | 2004-07-17 | 具有焊头的超声波焊机 |
CN2004800239623A Active CN1839010B (zh) | 2003-08-21 | 2004-07-17 | 焊头元件的摄像机辅助调整 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800239623A Active CN1839010B (zh) | 2003-08-21 | 2004-07-17 | 焊头元件的摄像机辅助调整 |
Country Status (10)
Country | Link |
---|---|
US (2) | US7461768B2 (zh) |
EP (1) | EP1656230B1 (zh) |
JP (2) | JP4685773B2 (zh) |
KR (1) | KR101118858B1 (zh) |
CN (2) | CN101992347B (zh) |
DE (1) | DE10338809B4 (zh) |
HK (1) | HK1152008A1 (zh) |
MY (1) | MY142885A (zh) |
TW (1) | TWI318902B (zh) |
WO (1) | WO2005028150A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110729612A (zh) * | 2018-07-16 | 2020-01-24 | 先进科技新加坡有限公司 | 具有可更换接合工具的接合设备 |
CN111315492A (zh) * | 2017-10-18 | 2020-06-19 | 格鲁博-工厂有限及两合公司 | 用于将导丝件安装在涂覆系统的焰炬头上的方法和装置 |
CN113411515A (zh) * | 2021-06-18 | 2021-09-17 | 吉林大学 | 基于摄像头的tip头辅助定位系统及其定位和信息采集处理方法 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10338809B4 (de) * | 2003-08-21 | 2008-05-21 | Hesse & Knipps Gmbh | Verfahren und Vorrichtung zur Justage von Bondkopfelementen |
EP1625911B1 (de) * | 2004-08-11 | 2007-10-10 | F&K Delvotec Bondtechnik GmbH | Drahtbonder mit einer Kamera, einer Bildverarbeitungseinrichtung, Speichermittel und Vergleichermittel und Verfahren zum Betrieb eines solchen |
JP2007214342A (ja) * | 2006-02-09 | 2007-08-23 | Shinkawa Ltd | ワイヤボンディング装置のキャピラリ接地位置データ設定方法 |
US20080197461A1 (en) * | 2007-02-15 | 2008-08-21 | Taiwan Semiconductor Manufacturing Co.,Ltd. | Apparatus for wire bonding and integrated circuit chip package |
US7597235B2 (en) * | 2007-11-15 | 2009-10-06 | Infineon Technologies Ag | Apparatus and method for producing a bonding connection |
US8847100B2 (en) * | 2008-01-08 | 2014-09-30 | Fanuc America Corporation | Weld cap and tip inspection method and apparatus |
JP4343985B2 (ja) * | 2008-01-24 | 2009-10-14 | 株式会社新川 | ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法 |
US7810698B2 (en) * | 2008-11-20 | 2010-10-12 | Asm Assembly Automation Ltd. | Vision system for positioning a bonding tool |
WO2010090778A2 (en) * | 2009-01-20 | 2010-08-12 | Orthodyne Electronics Corporation | Cutting blade for a wire bonding system |
US8091762B1 (en) * | 2010-12-08 | 2012-01-10 | Asm Assembly Automation Ltd | Wedge bonding method incorporating remote pattern recognition system |
WO2012092058A2 (en) | 2010-12-29 | 2012-07-05 | Orthodyne Electroncis Corporation | Methods and systems for aligning tooling elements of ultrasonic bonding systems |
US8777086B2 (en) * | 2012-04-20 | 2014-07-15 | Asm Technology Singapore Pte. Ltd. | Image-assisted system for adjusting a bonding tool |
US9136243B2 (en) * | 2013-12-03 | 2015-09-15 | Kulicke And Soffa Industries, Inc. | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements |
JP6339651B1 (ja) * | 2016-12-02 | 2018-06-06 | ファナック株式会社 | アーク溶接ロボットシステム |
DE102017204657A1 (de) | 2017-03-21 | 2018-09-27 | Schunk Sonosystems Gmbh | Verfahren und Vorrichtung zur Herstellung einer Schweißbaugruppe |
CN111938450B (zh) * | 2019-05-15 | 2023-08-22 | 广东美的生活电器制造有限公司 | 上盖组件及加热容器 |
CN114206148A (zh) * | 2019-06-04 | 2022-03-18 | 斯纳普斯投资有限公司 | 用于帽子的附件 |
Family Cites Families (37)
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US3700155A (en) * | 1970-05-20 | 1972-10-24 | Mech El Ind Inc | Apparatus for improving alignment of beam leaded bonding tools |
US3838274A (en) * | 1973-03-30 | 1974-09-24 | Western Electric Co | Electro-optical article positioning system |
JPS59117225A (ja) * | 1982-12-24 | 1984-07-06 | Hitachi Tokyo Electronics Co Ltd | フエイスダウンボンダ |
JPS59177945U (ja) * | 1983-05-13 | 1984-11-28 | 日本電気株式会社 | ダイボンデイングツ−ル位置確認治具 |
US4976392A (en) * | 1989-08-11 | 1990-12-11 | Orthodyne Electronics Corporation | Ultrasonic wire bonder wire formation and cutter system |
JPH03114240A (ja) * | 1989-09-28 | 1991-05-15 | Toshiba Seiki Kk | ワイヤボンディング方法 |
JP2815626B2 (ja) * | 1989-09-28 | 1998-10-27 | 東芝メカトロニクス株式会社 | ボンディング工具のアームへの取付誤差検知方法 |
JP2814121B2 (ja) * | 1989-12-12 | 1998-10-22 | 東芝メカトロニクス株式会社 | ワイヤボンディング方法 |
JP2944250B2 (ja) * | 1991-04-12 | 1999-08-30 | 株式会社東芝 | ヘッド組み立て装置及びヘッド組み立て方法 |
JPH05235077A (ja) * | 1991-04-26 | 1993-09-10 | Texas Instr Inc <Ti> | 半導体デバイスボンディング用の極座標運動ボンディングヘッド |
US5547537A (en) * | 1992-05-20 | 1996-08-20 | Kulicke & Soffa, Investments, Inc. | Ceramic carrier transport for die attach equipment |
JPH05347326A (ja) * | 1992-06-15 | 1993-12-27 | Sony Corp | ワイヤボンディング装置におけるキャピラリのセッティング方法 |
DE4239039C2 (de) * | 1992-11-20 | 2001-08-16 | Hesse Gmbh | Verfahren zur Erfassung der Daten von Bondpads zur Steuerung eines Bonders |
US5340011A (en) * | 1992-12-09 | 1994-08-23 | Lsi Logic Corporation | Adjustable height work holder for bonding semiconductor dies |
JP3009564B2 (ja) * | 1993-07-16 | 2000-02-14 | 株式会社カイジョー | ワイヤボンディング装置及びその方法 |
JPH09162222A (ja) * | 1995-12-01 | 1997-06-20 | Hitachi Ltd | ワイヤボンディング装置 |
JP3618439B2 (ja) * | 1996-01-29 | 2005-02-09 | 三星テクウィン株式会社 | 部品搭載装置 |
GB9707954D0 (en) * | 1997-04-19 | 1997-06-11 | Integrated Sensor Systems Limi | An improved remote operator viewing system for arc welding |
JP2000002810A (ja) * | 1998-04-14 | 2000-01-07 | Toshiba Corp | ホログラム素子とその装着装置及び装着方法、光モジュ―ルとその製造方法、光ヘッド装置、光ディスク装置 |
JP2982000B1 (ja) * | 1998-07-03 | 1999-11-22 | 株式会社新川 | ボンディング方法及びその装置 |
JP3761357B2 (ja) * | 1999-02-22 | 2006-03-29 | 株式会社東芝 | 露光量モニタマスク、露光量調整方法及び半導体装置の製造方法 |
JP3827273B2 (ja) * | 1999-12-24 | 2006-09-27 | Ykk株式会社 | 超音波接着方法と装置 |
JP3757254B2 (ja) * | 1999-12-28 | 2006-03-22 | 株式会社新川 | ボンディング装置およびボンディング方法 |
JP3416091B2 (ja) * | 2000-01-21 | 2003-06-16 | 株式会社新川 | ボンディング装置およびボンディング方法 |
JP3967518B2 (ja) * | 2000-03-06 | 2007-08-29 | 株式会社新川 | オフセット測定方法、ツール位置検出方法およびボンディング装置 |
JP4074426B2 (ja) * | 2000-07-06 | 2008-04-09 | 三菱電機株式会社 | 半導体モジュール製造方法 |
DE10133885A1 (de) * | 2000-07-21 | 2002-03-21 | Esec Trading Sa | Vorrichtung zur Herstellung von Drahtverbindungen |
JP2002261114A (ja) * | 2001-03-02 | 2002-09-13 | Nec Corp | ワイヤーボンディング装置、及び、ワイヤボンディング方法 |
US6412683B1 (en) * | 2001-07-24 | 2002-07-02 | Kulicke & Soffa Investments, Inc. | Cornercube offset tool |
JP4761672B2 (ja) * | 2001-09-05 | 2011-08-31 | 株式会社東芝 | ボンディング方法及びボンディング装置 |
JP3802403B2 (ja) * | 2001-11-27 | 2006-07-26 | 株式会社新川 | ワイヤボンディング方法及び装置 |
IL151255A0 (en) * | 2002-08-14 | 2003-04-10 | Ariel Yedidya | System and method for interacting with computer using a video-camera image on screen and appurtenances useful therewith |
JP4105926B2 (ja) * | 2002-09-30 | 2008-06-25 | 株式会社新川 | ボンディング装置におけるオフセット測定機構及びボンディング装置におけるオフセット測定方法 |
JP3941706B2 (ja) * | 2003-02-17 | 2007-07-04 | トヨタ自動車株式会社 | 調整方法と冶具 |
JP4128540B2 (ja) * | 2003-06-05 | 2008-07-30 | 株式会社新川 | ボンディング装置 |
DE10338809B4 (de) * | 2003-08-21 | 2008-05-21 | Hesse & Knipps Gmbh | Verfahren und Vorrichtung zur Justage von Bondkopfelementen |
WO2006023612A2 (en) * | 2004-08-19 | 2006-03-02 | Zetetic Institute | Sub-nanometer overlay, critical dimension, and lithography tool projection optic metrology systems based on measurement of exposure induced changes in photoresist on wafers |
-
2003
- 2003-08-21 DE DE10338809A patent/DE10338809B4/de not_active Expired - Lifetime
-
2004
- 2004-07-17 JP JP2006523545A patent/JP4685773B2/ja active Active
- 2004-07-17 WO PCT/EP2004/008018 patent/WO2005028150A1/de active Application Filing
- 2004-07-17 CN CN2010102487911A patent/CN101992347B/zh active Active
- 2004-07-17 KR KR1020067003195A patent/KR101118858B1/ko active IP Right Grant
- 2004-07-17 EP EP04763315.1A patent/EP1656230B1/de active Active
- 2004-07-17 CN CN2004800239623A patent/CN1839010B/zh active Active
- 2004-08-09 TW TW093123803A patent/TWI318902B/zh active
- 2004-08-19 MY MYPI20043385A patent/MY142885A/en unknown
-
2006
- 2006-02-16 US US11/355,329 patent/US7461768B2/en active Active
- 2006-07-18 US US11/488,716 patent/US7591408B2/en active Active
-
2010
- 2010-10-14 JP JP2010231039A patent/JP5921062B2/ja active Active
-
2011
- 2011-06-15 HK HK11106126.1A patent/HK1152008A1/xx unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111315492A (zh) * | 2017-10-18 | 2020-06-19 | 格鲁博-工厂有限及两合公司 | 用于将导丝件安装在涂覆系统的焰炬头上的方法和装置 |
CN110729612A (zh) * | 2018-07-16 | 2020-01-24 | 先进科技新加坡有限公司 | 具有可更换接合工具的接合设备 |
CN110729612B (zh) * | 2018-07-16 | 2021-10-26 | 先进科技新加坡有限公司 | 具有可更换接合工具的接合设备 |
CN113411515A (zh) * | 2021-06-18 | 2021-09-17 | 吉林大学 | 基于摄像头的tip头辅助定位系统及其定位和信息采集处理方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1839010B (zh) | 2011-06-29 |
JP4685773B2 (ja) | 2011-05-18 |
DE10338809B4 (de) | 2008-05-21 |
JP5921062B2 (ja) | 2016-05-24 |
DE10338809A1 (de) | 2005-03-24 |
US7591408B2 (en) | 2009-09-22 |
MY142885A (en) | 2011-01-31 |
CN101992347B (zh) | 2012-02-15 |
KR20060060692A (ko) | 2006-06-05 |
JP2007503111A (ja) | 2007-02-15 |
EP1656230A1 (de) | 2006-05-17 |
US7461768B2 (en) | 2008-12-09 |
HK1152008A1 (en) | 2012-02-17 |
US20060157537A1 (en) | 2006-07-20 |
TW200513332A (en) | 2005-04-16 |
JP2011040780A (ja) | 2011-02-24 |
EP1656230B1 (de) | 2017-04-05 |
US20060255097A1 (en) | 2006-11-16 |
CN1839010A (zh) | 2006-09-27 |
WO2005028150A1 (de) | 2005-03-31 |
TWI318902B (en) | 2010-01-01 |
KR101118858B1 (ko) | 2012-03-19 |
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