HK1152008A1 - Ultrasonic bonder having a bonding head - Google Patents

Ultrasonic bonder having a bonding head

Info

Publication number
HK1152008A1
HK1152008A1 HK11106126.1A HK11106126A HK1152008A1 HK 1152008 A1 HK1152008 A1 HK 1152008A1 HK 11106126 A HK11106126 A HK 11106126A HK 1152008 A1 HK1152008 A1 HK 1152008A1
Authority
HK
Hong Kong
Prior art keywords
bonding head
ultrasonic bonder
bonder
ultrasonic
bonding
Prior art date
Application number
HK11106126.1A
Other languages
English (en)
Inventor
Frank Walther
Original Assignee
Hesse & Knipps Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse & Knipps Gmbh filed Critical Hesse & Knipps Gmbh
Publication of HK1152008A1 publication Critical patent/HK1152008A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
HK11106126.1A 2003-08-21 2011-06-15 Ultrasonic bonder having a bonding head HK1152008A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10338809A DE10338809B4 (de) 2003-08-21 2003-08-21 Verfahren und Vorrichtung zur Justage von Bondkopfelementen

Publications (1)

Publication Number Publication Date
HK1152008A1 true HK1152008A1 (en) 2012-02-17

Family

ID=34201923

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11106126.1A HK1152008A1 (en) 2003-08-21 2011-06-15 Ultrasonic bonder having a bonding head

Country Status (10)

Country Link
US (2) US7461768B2 (xx)
EP (1) EP1656230B1 (xx)
JP (2) JP4685773B2 (xx)
KR (1) KR101118858B1 (xx)
CN (2) CN101992347B (xx)
DE (1) DE10338809B4 (xx)
HK (1) HK1152008A1 (xx)
MY (1) MY142885A (xx)
TW (1) TWI318902B (xx)
WO (1) WO2005028150A1 (xx)

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US20080197461A1 (en) * 2007-02-15 2008-08-21 Taiwan Semiconductor Manufacturing Co.,Ltd. Apparatus for wire bonding and integrated circuit chip package
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US7810698B2 (en) * 2008-11-20 2010-10-12 Asm Assembly Automation Ltd. Vision system for positioning a bonding tool
WO2010090778A2 (en) * 2009-01-20 2010-08-12 Orthodyne Electronics Corporation Cutting blade for a wire bonding system
US8091762B1 (en) * 2010-12-08 2012-01-10 Asm Assembly Automation Ltd Wedge bonding method incorporating remote pattern recognition system
SG190962A1 (en) 2010-12-29 2013-07-31 Orthodyne Electronics Corp Methods and systems for aligning tooling elements of ultrasonic bonding systems
US8777086B2 (en) * 2012-04-20 2014-07-15 Asm Technology Singapore Pte. Ltd. Image-assisted system for adjusting a bonding tool
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
JP6339651B1 (ja) * 2016-12-02 2018-06-06 ファナック株式会社 アーク溶接ロボットシステム
DE102017204657A1 (de) 2017-03-21 2018-09-27 Schunk Sonosystems Gmbh Verfahren und Vorrichtung zur Herstellung einer Schweißbaugruppe
DE102017124303A1 (de) * 2017-10-18 2019-04-18 Grob-Werke Gmbh & Co. Kg Verfahren und Vorrichtung zur Montage einer Drahtführung an einem Brennerkopf für eine Beschichtungsanlage
US11205634B2 (en) * 2018-07-16 2021-12-21 Asm Technology Singapore Pte Ltd Bonding apparatus with replaceable bonding tool
CN111938450B (zh) * 2019-05-15 2023-08-22 广东美的生活电器制造有限公司 上盖组件及加热容器
EP3979868A4 (en) * 2019-06-04 2023-07-12 Snaps Ventures Inc. ATTACHMENT FOR CAPS
CN113411515A (zh) * 2021-06-18 2021-09-17 吉林大学 基于摄像头的tip头辅助定位系统及其定位和信息采集处理方法

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DE10338809B4 (de) * 2003-08-21 2008-05-21 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Justage von Bondkopfelementen
WO2006023612A2 (en) * 2004-08-19 2006-03-02 Zetetic Institute Sub-nanometer overlay, critical dimension, and lithography tool projection optic metrology systems based on measurement of exposure induced changes in photoresist on wafers

Also Published As

Publication number Publication date
TW200513332A (en) 2005-04-16
TWI318902B (en) 2010-01-01
JP2011040780A (ja) 2011-02-24
CN1839010B (zh) 2011-06-29
WO2005028150A1 (de) 2005-03-31
JP2007503111A (ja) 2007-02-15
CN101992347B (zh) 2012-02-15
US20060157537A1 (en) 2006-07-20
MY142885A (en) 2011-01-31
DE10338809A1 (de) 2005-03-24
EP1656230B1 (de) 2017-04-05
EP1656230A1 (de) 2006-05-17
US7591408B2 (en) 2009-09-22
CN101992347A (zh) 2011-03-30
KR20060060692A (ko) 2006-06-05
JP5921062B2 (ja) 2016-05-24
CN1839010A (zh) 2006-09-27
DE10338809B4 (de) 2008-05-21
KR101118858B1 (ko) 2012-03-19
US20060255097A1 (en) 2006-11-16
JP4685773B2 (ja) 2011-05-18
US7461768B2 (en) 2008-12-09

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