DE60308340D1 - Komponentenanbringverfahren, komponentenanbringvorrichtung und ultraschall-bondierungskopf - Google Patents
Komponentenanbringverfahren, komponentenanbringvorrichtung und ultraschall-bondierungskopfInfo
- Publication number
- DE60308340D1 DE60308340D1 DE60308340T DE60308340T DE60308340D1 DE 60308340 D1 DE60308340 D1 DE 60308340D1 DE 60308340 T DE60308340 T DE 60308340T DE 60308340 T DE60308340 T DE 60308340T DE 60308340 D1 DE60308340 D1 DE 60308340D1
- Authority
- DE
- Germany
- Prior art keywords
- component
- attachment device
- ultrasonic bonding
- bonding head
- attaching method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75264—Means for applying energy, e.g. heating means by induction heating, i.e. coils
- H01L2224/75266—Means for applying energy, e.g. heating means by induction heating, i.e. coils in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/75353—Ultrasonic horns
- H01L2224/75355—Design, e.g. of the wave guide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8121—Applying energy for connecting using a reflow oven
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
- H01L2224/81222—Induction heating, i.e. eddy currents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
- H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H01L2224/81815—Reflow soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002087594 | 2002-03-27 | ||
JP2002087596A JP4056276B2 (ja) | 2002-03-27 | 2002-03-27 | 部品実装方法及び装置 |
JP2002087595A JP4093781B2 (ja) | 2002-03-27 | 2002-03-27 | 超音波ヘッド |
JP2002087596 | 2002-03-27 | ||
JP2002087595 | 2002-03-27 | ||
JP2002087594A JP4109000B2 (ja) | 2002-03-27 | 2002-03-27 | 電子部品実装装置 |
PCT/JP2003/003906 WO2003081644A2 (en) | 2002-03-27 | 2003-03-27 | Electronic component mounting method and apparatus and ultrasondic bonding head |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60308340D1 true DE60308340D1 (de) | 2006-10-26 |
DE60308340T2 DE60308340T2 (de) | 2007-01-11 |
Family
ID=28457587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60308340T Expired - Lifetime DE60308340T2 (de) | 2002-03-27 | 2003-03-27 | Komponentenanbringverfahren, komponentenanbringvorrichtung und ultraschallbondierungskopf |
Country Status (7)
Country | Link |
---|---|
US (2) | US7229854B2 (de) |
EP (1) | EP1488449B1 (de) |
KR (2) | KR100950619B1 (de) |
CN (1) | CN100377293C (de) |
DE (1) | DE60308340T2 (de) |
TW (1) | TWI230102B (de) |
WO (1) | WO2003081644A2 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7122095B2 (en) | 2003-03-14 | 2006-10-17 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Methods for forming an assembly for transfer of a useful layer |
JP3966217B2 (ja) * | 2003-04-23 | 2007-08-29 | 松下電器産業株式会社 | ボンディング装置およびボンディングツール |
US7591409B2 (en) * | 2005-06-13 | 2009-09-22 | Panasonic Corporation | Semiconductor device bonding apparatus and method for bonding semiconductor device using the same |
WO2008030262A1 (en) * | 2005-12-29 | 2008-03-13 | 3M Innovative Properties Company | Method for atomizing material for coating processes |
JP4650309B2 (ja) * | 2006-03-20 | 2011-03-16 | 株式会社デンソー | 超音波接合方法および超音波接合装置 |
US7980444B2 (en) | 2006-05-09 | 2011-07-19 | Panasonic Corporation | Electronic component mounting head, and apparatus and method for mounting electronic component |
KR100861952B1 (ko) * | 2007-04-02 | 2008-10-09 | 삼성전자주식회사 | 본딩장치 |
JP2008307710A (ja) * | 2007-06-12 | 2008-12-25 | Canon Inc | インクジェット記録ヘッド、インクジェット記録ヘッドの製造方法およびインクジェット記録ヘッドの実装ツール |
JP4399869B2 (ja) * | 2007-07-30 | 2010-01-20 | Tdk株式会社 | 超音波振動を用いて実装部品を被実装部品に実装する実装装置 |
CN101635498B (zh) * | 2008-07-22 | 2012-06-20 | 鸿富锦精密工业(深圳)有限公司 | 音圈马达组装治具 |
JP5296722B2 (ja) * | 2009-03-02 | 2013-09-25 | パナソニック株式会社 | ボンディングツール、電子部品装着装置、および電子部品装着方法 |
JP5491081B2 (ja) * | 2009-06-22 | 2014-05-14 | 株式会社アルテクス | 超音波振動金属接合用共振器 |
KR101060429B1 (ko) | 2009-11-05 | 2011-08-29 | 서울과학기술대학교 산학협력단 | 초음파 혼 및 이를 구비하는 플립칩 접합 장치 |
US20120006810A1 (en) * | 2010-07-09 | 2012-01-12 | GM Global Technology Operations LLC | Induction heating-assisted vibration welding method and apparatus |
US8561879B2 (en) * | 2012-01-09 | 2013-10-22 | Apple Inc. | Hotbar device and methods for assembling electrical contacts to ensure co-planarity |
DE102012111734A1 (de) * | 2012-12-03 | 2014-06-05 | Schunk Sonosystems Gmbh | Ultraschallschweißvorrichtung sowie Verfahren zum Verschweißen von elektrischen Leitern |
KR102073189B1 (ko) * | 2013-04-04 | 2020-02-04 | 삼성에스디아이 주식회사 | 이차전지용 용접혼 |
CH708278A1 (de) * | 2013-07-08 | 2015-01-15 | Besi Switzerland Ag | Vorrichtung zum Auftragen und Verteilen von Lot auf einem Substrat. |
US9776270B2 (en) * | 2013-10-01 | 2017-10-03 | Globalfoundries Inc. | Chip joining by induction heating |
CN104923906B (zh) * | 2015-07-05 | 2017-03-08 | 浙江正统钢业有限公司 | 一种用于金属薄片的超声波焊接装置及其焊接方法 |
DE102015120156B4 (de) * | 2015-11-20 | 2019-07-04 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung zur materialschlüssigen Verbindung von Verbindungspartnern eines Leistungselekronik-Bauteils und Verwendung einer solchen Vorrichtung |
DE102017220079A1 (de) * | 2017-11-10 | 2019-05-16 | Schunk Sonosystems Gmbh | Ultraschall-Schweißeinrichtung |
CN110666333A (zh) * | 2018-07-03 | 2020-01-10 | 东莞矩华超声技术有限公司 | 超声波焊接机主轴系统 |
US11155042B2 (en) | 2018-11-05 | 2021-10-26 | GM Global Technology Operations LLC | Hybrid ultrasonic staking for joining panels |
EP3923692A4 (de) * | 2019-02-05 | 2022-02-16 | Fuji Corporation | Montagebezogene vorrichtung und schienenvorrichtung |
CN115707329A (zh) * | 2021-06-14 | 2023-02-17 | 株式会社新川 | 超声波焊头及半导体装置的制造装置 |
Family Cites Families (18)
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US3166840A (en) * | 1961-06-28 | 1965-01-26 | Aeroprojects Inc | Apparatus and method for introducing high levels of vibratory energy to a work area |
US3727822A (en) * | 1970-10-05 | 1973-04-17 | Gen Electric | Electromagnetic force system for integrated circuit fabrication |
FR2773642B1 (fr) * | 1998-01-13 | 2000-03-03 | Schlumberger Ind Sa | Procede de connexion de plots d'un composant a circuits integres a des plages de connexion d'un substrat plastique au moyen de protuberances |
JP2000068327A (ja) * | 1998-08-20 | 2000-03-03 | Matsushita Electric Ind Co Ltd | 部品の実装方法と装置 |
DE69919822T2 (de) * | 1998-12-10 | 2005-09-15 | Ultex Corp. | Ultraschallschwingungsschweissverfahren |
JP3244664B2 (ja) * | 1998-12-10 | 2002-01-07 | 株式会社アルテクス | 超音波振動接合装置 |
JP3290632B2 (ja) * | 1999-01-06 | 2002-06-10 | 株式会社アルテクス | 超音波振動接合装置 |
JP2000306957A (ja) * | 1999-04-21 | 2000-11-02 | Tdk Corp | 超音波ボンディング実装方法及び超音波ボンディング装置 |
JP2000339648A (ja) * | 1999-05-24 | 2000-12-08 | Tdk Corp | 磁気ヘッド装置の製造方法 |
JP3539315B2 (ja) * | 1999-06-22 | 2004-07-07 | 株式会社村田製作所 | 電子デバイス素子の実装方法、および弾性表面波装置の製造方法 |
JP3533992B2 (ja) * | 1999-06-28 | 2004-06-07 | 松下電器産業株式会社 | 電子部品のボンディング装置およびボンディングツール |
JP3745927B2 (ja) * | 1999-10-12 | 2006-02-15 | 松下電器産業株式会社 | 実装装置 |
JP3451373B2 (ja) * | 1999-11-24 | 2003-09-29 | オムロン株式会社 | 電磁波読み取り可能なデータキャリアの製造方法 |
JP4666546B2 (ja) * | 1999-11-29 | 2011-04-06 | パナソニック株式会社 | 加圧装置とこれを用いたバンプボンディング装置、貼り付け装置、及び圧着装置 |
JP2001308141A (ja) | 2000-02-18 | 2001-11-02 | Sony Corp | 電子回路装置の製造方法 |
JP2001308145A (ja) * | 2000-04-25 | 2001-11-02 | Fujitsu Ltd | 半導体チップの実装方法 |
JP3491827B2 (ja) * | 2000-07-25 | 2004-01-26 | 関西日本電気株式会社 | 半導体装置及びその製造方法 |
JP2002076590A (ja) * | 2000-08-29 | 2002-03-15 | Matsushita Electric Ind Co Ltd | 部品装着装置、部品装着方法、及び部品実装システム、並びに回路基板 |
-
2003
- 2003-03-10 TW TW092105078A patent/TWI230102B/zh not_active IP Right Cessation
- 2003-03-27 DE DE60308340T patent/DE60308340T2/de not_active Expired - Lifetime
- 2003-03-27 KR KR1020097002605A patent/KR100950619B1/ko not_active IP Right Cessation
- 2003-03-27 KR KR1020047015150A patent/KR100934064B1/ko not_active IP Right Cessation
- 2003-03-27 US US10/508,460 patent/US7229854B2/en not_active Expired - Lifetime
- 2003-03-27 WO PCT/JP2003/003906 patent/WO2003081644A2/en active IP Right Grant
- 2003-03-27 EP EP03745015A patent/EP1488449B1/de not_active Expired - Fee Related
- 2003-03-27 CN CNB038071347A patent/CN100377293C/zh not_active Expired - Fee Related
-
2007
- 2007-03-30 US US11/731,312 patent/US7861908B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20090032115A (ko) | 2009-03-31 |
US7229854B2 (en) | 2007-06-12 |
KR100934064B1 (ko) | 2009-12-24 |
KR20040091152A (ko) | 2004-10-27 |
EP1488449A2 (de) | 2004-12-22 |
US20070187457A1 (en) | 2007-08-16 |
WO2003081644A3 (en) | 2004-04-15 |
CN1643652A (zh) | 2005-07-20 |
DE60308340T2 (de) | 2007-01-11 |
US20050227429A1 (en) | 2005-10-13 |
KR100950619B1 (ko) | 2010-04-01 |
TWI230102B (en) | 2005-04-01 |
TW200305472A (en) | 2003-11-01 |
US7861908B2 (en) | 2011-01-04 |
CN100377293C (zh) | 2008-03-26 |
EP1488449B1 (de) | 2006-09-13 |
WO2003081644A2 (en) | 2003-10-02 |
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