CN101981234A - 耐磨损性、插入性及耐热性优异的铜合金镀锡条 - Google Patents
耐磨损性、插入性及耐热性优异的铜合金镀锡条 Download PDFInfo
- Publication number
- CN101981234A CN101981234A CN2009801115368A CN200980111536A CN101981234A CN 101981234 A CN101981234 A CN 101981234A CN 2009801115368 A CN2009801115368 A CN 2009801115368A CN 200980111536 A CN200980111536 A CN 200980111536A CN 101981234 A CN101981234 A CN 101981234A
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- alloy
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 25
- 238000003780 insertion Methods 0.000 title abstract description 22
- 230000037431 insertion Effects 0.000 title abstract description 22
- 238000005299 abrasion Methods 0.000 title abstract description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 101
- 229910017755 Cu-Sn Inorganic materials 0.000 claims abstract description 100
- 229910017927 Cu—Sn Inorganic materials 0.000 claims abstract description 100
- 229910000905 alloy phase Inorganic materials 0.000 claims abstract description 78
- 238000007747 plating Methods 0.000 claims abstract description 73
- 239000010949 copper Substances 0.000 claims abstract description 68
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 24
- 239000000956 alloy Substances 0.000 claims abstract description 24
- 239000011248 coating agent Substances 0.000 claims description 51
- 238000000576 coating method Methods 0.000 claims description 51
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 210000000981 epithelium Anatomy 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 10
- 238000009713 electroplating Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 31
- 238000010438 heat treatment Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 12
- 229910052718 tin Inorganic materials 0.000 description 12
- 230000005501 phase interface Effects 0.000 description 9
- 230000006866 deterioration Effects 0.000 description 7
- 239000008151 electrolyte solution Substances 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 6
- 238000005868 electrolysis reaction Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000003490 calendering Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000013013 elastic material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008034 disappearance Effects 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical class S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 1
- 241000446313 Lamella Species 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012858 resilient material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005480 shot peening Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 210000001138 tear Anatomy 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008093903 | 2008-03-31 | ||
JP2008-093903 | 2008-03-31 | ||
PCT/JP2009/056544 WO2009123144A1 (ja) | 2008-03-31 | 2009-03-30 | 耐摩耗性、挿入性及び耐熱性に優れた銅合金すずめっき条 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101981234A true CN101981234A (zh) | 2011-02-23 |
CN101981234B CN101981234B (zh) | 2013-06-12 |
Family
ID=41135518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009801115368A Active CN101981234B (zh) | 2008-03-31 | 2009-03-30 | 耐磨损性、插入性及耐热性优异的铜合金镀锡条 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2009123144A1 (zh) |
KR (1) | KR101243454B1 (zh) |
CN (1) | CN101981234B (zh) |
TW (1) | TW200948526A (zh) |
WO (1) | WO2009123144A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367961A (zh) * | 2012-03-30 | 2013-10-23 | 株式会社神户制钢所 | 连接部件用导电材料 |
CN104204310A (zh) * | 2012-04-06 | 2014-12-10 | 株式会社自动网络技术研究所 | 镀敷部件、连接器用镀敷端子、镀敷部件的制造方法以及连接器用镀敷端子的制造方法 |
CN104604036A (zh) * | 2012-08-31 | 2015-05-06 | 株式会社自动网络技术研究所 | 连接器用镀敷端子以及端子对 |
CN108699717A (zh) * | 2016-03-31 | 2018-10-23 | 日新制钢株式会社 | 连接部件用材料 |
CN109267119A (zh) * | 2018-11-05 | 2019-01-25 | 深圳和而泰智能控制股份有限公司 | 磷青铜工件及其制作方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009249716A (ja) * | 2008-04-10 | 2009-10-29 | Sumitomo Kinzoku Kozan Shindo Kk | 錫めっき銅合金材 |
US8956735B2 (en) | 2010-03-26 | 2015-02-17 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy and electrically conductive material for connecting parts, and mating-type connecting part and method for producing the same |
CN102234827B (zh) * | 2010-04-20 | 2014-01-08 | Jx日矿日石金属株式会社 | 焊料润湿性、插拔性能优良的铜合金镀锡条 |
JP5140171B2 (ja) * | 2011-03-18 | 2013-02-06 | Jx日鉱日石金属株式会社 | 充電用電池タブ材に用いられる銅合金条 |
TW201311944A (zh) * | 2011-08-12 | 2013-03-16 | Mitsubishi Materials Corp | 插拔性優異的鍍錫銅合金端子材及其製造方法 |
JP6221695B2 (ja) * | 2013-03-25 | 2017-11-01 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材 |
JP6100203B2 (ja) * | 2014-05-19 | 2017-03-22 | 日新製鋼株式会社 | 接続部品用材料 |
JP6662685B2 (ja) | 2016-03-31 | 2020-03-11 | Jx金属株式会社 | めっき層を有するチタン銅箔 |
KR20190101466A (ko) * | 2017-01-30 | 2019-08-30 | 제이엑스금속주식회사 | 표면 처리 도금재, 커넥터 단자, 커넥터, ffc 단자, ffc, fpc 및 전자 부품 |
JP7014695B2 (ja) * | 2018-10-18 | 2022-02-01 | Jx金属株式会社 | 導電性材料、成型品及び電子部品 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3926355B2 (ja) * | 2004-09-10 | 2007-06-06 | 株式会社神戸製鋼所 | 接続部品用導電材料及びその製造方法 |
JP2007063624A (ja) * | 2005-08-31 | 2007-03-15 | Nikko Kinzoku Kk | 挿抜性及び耐熱性に優れる銅合金すずめっき条 |
JP4771970B2 (ja) | 2006-02-27 | 2011-09-14 | 株式会社神戸製鋼所 | 接続部品用導電材料 |
-
2009
- 2009-03-30 WO PCT/JP2009/056544 patent/WO2009123144A1/ja active Application Filing
- 2009-03-30 JP JP2009541670A patent/JPWO2009123144A1/ja active Pending
- 2009-03-30 CN CN2009801115368A patent/CN101981234B/zh active Active
- 2009-03-30 KR KR1020107021439A patent/KR101243454B1/ko active IP Right Grant
- 2009-03-31 TW TW098110572A patent/TW200948526A/zh unknown
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367961A (zh) * | 2012-03-30 | 2013-10-23 | 株式会社神户制钢所 | 连接部件用导电材料 |
CN103367961B (zh) * | 2012-03-30 | 2015-11-18 | 株式会社神户制钢所 | 连接部件用导电材料 |
CN104204310A (zh) * | 2012-04-06 | 2014-12-10 | 株式会社自动网络技术研究所 | 镀敷部件、连接器用镀敷端子、镀敷部件的制造方法以及连接器用镀敷端子的制造方法 |
CN104204310B (zh) * | 2012-04-06 | 2016-11-23 | 株式会社自动网络技术研究所 | 镀敷部件、连接器用镀敷端子、镀敷部件的制造方法以及连接器用镀敷端子的制造方法 |
CN104604036A (zh) * | 2012-08-31 | 2015-05-06 | 株式会社自动网络技术研究所 | 连接器用镀敷端子以及端子对 |
CN108699717A (zh) * | 2016-03-31 | 2018-10-23 | 日新制钢株式会社 | 连接部件用材料 |
CN109267119A (zh) * | 2018-11-05 | 2019-01-25 | 深圳和而泰智能控制股份有限公司 | 磷青铜工件及其制作方法 |
CN109267119B (zh) * | 2018-11-05 | 2020-06-23 | 深圳和而泰智能控制股份有限公司 | 磷青铜工件及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI366498B (zh) | 2012-06-21 |
WO2009123144A1 (ja) | 2009-10-08 |
JPWO2009123144A1 (ja) | 2011-07-28 |
KR20100118147A (ko) | 2010-11-04 |
CN101981234B (zh) | 2013-06-12 |
TW200948526A (en) | 2009-12-01 |
KR101243454B1 (ko) | 2013-03-13 |
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Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX NIPPON MINING & METALS CORPORATION |
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CP01 | Change in the name or title of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |
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CP02 | Change in the address of a patent holder |