JP6100203B2 - 接続部品用材料 - Google Patents
接続部品用材料 Download PDFInfo
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- JP6100203B2 JP6100203B2 JP2014103080A JP2014103080A JP6100203B2 JP 6100203 B2 JP6100203 B2 JP 6100203B2 JP 2014103080 A JP2014103080 A JP 2014103080A JP 2014103080 A JP2014103080 A JP 2014103080A JP 6100203 B2 JP6100203 B2 JP 6100203B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- plating
- metal plate
- test piece
- contact resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 45
- 238000007747 plating Methods 0.000 claims description 133
- 239000002184 metal Substances 0.000 claims description 42
- 229910052751 metal Inorganic materials 0.000 claims description 42
- 230000003746 surface roughness Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 85
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 72
- 238000012360 testing method Methods 0.000 description 49
- 235000019592 roughness Nutrition 0.000 description 24
- 229910001220 stainless steel Inorganic materials 0.000 description 20
- 239000010935 stainless steel Substances 0.000 description 19
- 229910000881 Cu alloy Inorganic materials 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 239000010949 copper Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 11
- 239000002585 base Substances 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 9
- 239000011247 coating layer Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 5
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 4
- 239000004327 boric acid Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 229910017755 Cu-Sn Inorganic materials 0.000 description 3
- 229910016347 CuSn Inorganic materials 0.000 description 3
- 229910017927 Cu—Sn Inorganic materials 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- FTLYMKDSHNWQKD-UHFFFAOYSA-N (2,4,5-trichlorophenyl)boronic acid Chemical compound OB(O)C1=CC(Cl)=C(Cl)C=C1Cl FTLYMKDSHNWQKD-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001105 martensitic stainless steel Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229940085605 saccharin sodium Drugs 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Electroplating Methods And Accessories (AREA)
- Conductive Materials (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Multi-Conductor Connections (AREA)
- Chemically Coating (AREA)
Description
母材として、ステンレス鋼板(SUS430)を用い、粗面化したワークロールまたは研摩ベルトを用いてステンレス鋼板の表面に粗面化処理を適宜行なうことにより、各種の表面粗さを有する板厚が0.2mmのステンレス鋼板を得た。
ステンレス鋼板から縦50mm、横50mmの大きさの試験片を切り出し、アセトンを用いて試験片に超音波洗浄を施した後、接触式粗さ計〔(株)東京精密製、商品名:サーフコム1400B〕を用いてISO12085に準じて試験片の粗さモチーフ平均深さRを測定し、JIS B0601−1994に準じて凹凸の平均間隔RSmを測定した。
・Niめっき液(ウッド浴):塩化ニッケル240g/L、塩酸125mL/L(pH:1.2)
・めっき液の液温:35℃
・電流密度:8A/dm2
・Niめっき液(ワット浴):硫酸ニッケル300g/L、塩化ニッケル45g/L、ホウ酸35g/L(pH:3.9)
・めっき液の液温:50℃
・電流密度:8A/dm2
・Snめっき液[上村工業(株)製、製品名:TYNADES GHS−51](Sn2+50g/L、遊離酸120mL/L)(pH:0.2)
・陽極:Sn板
・液温:35℃
・電流密度:10A/dm2
Niめっき層の厚さおよびSnめっき層の厚さは、いずれも電解式めっき厚さ測定器〔(株)中央製作所製〕を用い、JIS H8501に規定の「電解式試験法」に基づいて測定した。
嵌合型接続部品における電気接点部を模擬し、(株)山崎精機研究所製の摺動試験機を用いて材料同士の微摺動部の接触抵抗の変化を評価した。
Snめっき層が形成された試験片から縦40mm、横40mmの大きさの試験片を切り出し、直径10mmのステンレス鋼球を用い、摩擦摩耗試験機〔(株)レスカ製〕にて荷重4N、半径7.5mm、回転速度12.7rpm、50回転後の動摩擦係数を測定した。なお、動摩擦係数が0.3以下であることを合格基準とした。
実施例1において、Niめっきの条件を以下の条件に変更したこと以外は、実施例1と同様にして、Snめっき層が形成された試験片を作製した。
・Niめっき液(ワット浴+光沢剤):硫酸ニッケル300g/L、塩化ニッケル45g/L、ホウ酸35g/L(pH:3.9)、サッカリンナトリウム2g/L、2−ブチン−1,4−ジオール0.2g/L
・めっき液の液温:50℃
・電流密度:8A/dm2
実施例1において、ステンレス鋼板の代わりに銅合金板〔(株)神戸製鋼所製、品番:CAC60、板厚:0.2mm〕を用いたこと以外は、実施例1と同様にしてSnめっき層が形成された試験片を作製した。
実施例1において、Niめっきの条件を以下の条件に変更したこと以外は、実施例1と同様にして、Snめっき層が形成された試験片を作製した。
〔Niめっきの条件〕
・Niめっき液(ワット浴):硫酸ニッケル300g/L、塩化ニッケル45g/L、ホウ酸35g/L(pH:3.9)
・めっき液の液温:50℃
・電流密度:2A/dm2
実施例1において、Niめっきの条件を以下の条件に変更したこと以外は、実施例1と同様にして、Snめっき層が形成された試験片を作製した。
〔Niめっきの条件〕
・Niめっき液(塩化物浴):塩化ニッケル300g/L、ホウ酸35g/L(pH:3.9)
・めっき液の液温:50℃
・電流密度:2A/dm2
ステンレス鋼板の代わりに銅合金板(板厚:0.2mm)を用い、特開2011−204617号公報に記載の方法に準じて細かい凹凸が一定のピッチで形成されている金型を表面に押し当てることによって粗面化処理を行ない、凹凸形状を有する銅合金板を得た。得られた凹凸形状を有する銅合金板の粗さモチーフ平均深さRおよび凹凸の平均間隔RSmを前記と同様にして測定した。その結果を表1に示す。
・Cuめっき液(硫酸銅めっき浴):硫酸銅200g/L、硫酸45g/L
・めっき液の液温:30℃
・電流密度:15A/dm2
・Cuめっきの膜厚:0.15μm
Claims (1)
- 接続部品の素材として使用される接続部品用材料であって、金属板の表面にNiめっき層が形成され、当該Niめっき層の表面における少なくとも一方向での表面の粗さモチーフの平均深さRが1.0μm以上であり、当該Niめっき層の表面の粗さモチーフの平均深さRと同一方向におけるNiめっき層の表面の凹凸の平均間隔RSmが0μmを超え200μm以下であるNiめっき金属板が用いられ、当該Niめっき金属板のNiめっき層上に厚さが0.3〜5μmのSnめっき層が形成されていることを特徴とする接続部品用材料。
Priority Applications (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014103080A JP6100203B2 (ja) | 2014-05-19 | 2014-05-19 | 接続部品用材料 |
KR1020167034587A KR102157062B1 (ko) | 2014-05-19 | 2015-04-23 | 접속 부품용 재료 |
CN201580026254.3A CN106414810B (zh) | 2014-05-19 | 2015-04-23 | 连接部件用材料 |
US15/312,429 US10230180B2 (en) | 2014-05-19 | 2015-04-23 | Connecting component material |
BR112016026911A BR112016026911A2 (pt) | 2014-05-19 | 2015-04-23 | Material para um membro de conexão |
AU2015262624A AU2015262624B9 (en) | 2014-05-19 | 2015-04-23 | Connecting component material |
CA2949027A CA2949027C (en) | 2014-05-19 | 2015-04-23 | Connecting component material |
RU2016149620A RU2659509C1 (ru) | 2014-05-19 | 2015-04-23 | Материал соединительного компонента |
SG11201609549YA SG11201609549YA (en) | 2014-05-19 | 2015-04-23 | Connecting component material |
PCT/JP2015/062385 WO2015178156A1 (ja) | 2014-05-19 | 2015-04-23 | 接続部品用材料 |
MX2016015178A MX2016015178A (es) | 2014-05-19 | 2015-04-23 | Material de componente conector. |
EP15795710.1A EP3147391B1 (en) | 2014-05-19 | 2015-04-23 | Connecting component material |
MYPI2016704205A MY183324A (en) | 2014-05-19 | 2015-04-23 | Connecting component material |
TW104114225A TWI642818B (zh) | 2014-05-19 | 2015-05-05 | Material for connecting components |
PH12016502241A PH12016502241A1 (en) | 2014-05-19 | 2016-11-11 | Connecting component material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014103080A JP6100203B2 (ja) | 2014-05-19 | 2014-05-19 | 接続部品用材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015218363A JP2015218363A (ja) | 2015-12-07 |
JP6100203B2 true JP6100203B2 (ja) | 2017-03-22 |
Family
ID=54553832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014103080A Expired - Fee Related JP6100203B2 (ja) | 2014-05-19 | 2014-05-19 | 接続部品用材料 |
Country Status (15)
Country | Link |
---|---|
US (1) | US10230180B2 (ja) |
EP (1) | EP3147391B1 (ja) |
JP (1) | JP6100203B2 (ja) |
KR (1) | KR102157062B1 (ja) |
CN (1) | CN106414810B (ja) |
AU (1) | AU2015262624B9 (ja) |
BR (1) | BR112016026911A2 (ja) |
CA (1) | CA2949027C (ja) |
MX (1) | MX2016015178A (ja) |
MY (1) | MY183324A (ja) |
PH (1) | PH12016502241A1 (ja) |
RU (1) | RU2659509C1 (ja) |
SG (1) | SG11201609549YA (ja) |
TW (1) | TWI642818B (ja) |
WO (1) | WO2015178156A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160344127A1 (en) * | 2015-05-20 | 2016-11-24 | Delphi Technologies, Inc. | Electroconductive material with an undulating surface, an electrical terminal formed of said material, and a method of producing said material |
US10605591B2 (en) * | 2016-05-23 | 2020-03-31 | Nippon Steel Corporation | Shape measurement apparatus and shape measurement method |
KR102549377B1 (ko) * | 2018-03-07 | 2023-06-28 | 스미토모덴키고교가부시키가이샤 | 도금막 및, 도금 피복 부재 |
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JPH04160200A (ja) * | 1990-10-24 | 1992-06-03 | Furukawa Electric Co Ltd:The | 電気接点材料の製造方法 |
JP4160200B2 (ja) * | 1998-04-10 | 2008-10-01 | 日機装株式会社 | 中空糸膜濾過装置 |
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JP2004300489A (ja) | 2003-03-31 | 2004-10-28 | Nisshin Steel Co Ltd | ステンレス鋼製電気接点 |
JP4024244B2 (ja) * | 2004-12-27 | 2007-12-19 | 株式会社神戸製鋼所 | 接続部品用導電材料及びその製造方法 |
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JP4771970B2 (ja) * | 2006-02-27 | 2011-09-14 | 株式会社神戸製鋼所 | 接続部品用導電材料 |
US7700883B2 (en) | 2007-04-20 | 2010-04-20 | (Kobe Steel, Ltd.) | Terminal for engaging type connector |
JP5464792B2 (ja) * | 2007-04-20 | 2014-04-09 | 株式会社神戸製鋼所 | 嵌合型コネクタ用端子の製造方法 |
JPWO2009123144A1 (ja) * | 2008-03-31 | 2011-07-28 | Jx日鉱日石金属株式会社 | 耐摩耗性、挿入性及び耐熱性に優れた銅合金すずめっき条 |
JP5419737B2 (ja) * | 2010-01-29 | 2014-02-19 | 株式会社神戸製鋼所 | 嵌合型端子用錫めっき付き銅合金板材及びその製造方法 |
JP5394963B2 (ja) * | 2010-03-26 | 2014-01-22 | 株式会社神戸製鋼所 | 接続用部品用銅合金及び導電材料 |
US8956735B2 (en) * | 2010-03-26 | 2015-02-17 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy and electrically conductive material for connecting parts, and mating-type connecting part and method for producing the same |
JP6103811B2 (ja) * | 2012-03-30 | 2017-03-29 | 株式会社神戸製鋼所 | 接続部品用導電材料 |
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PH12016502241B1 (en) | 2017-01-09 |
CA2949027C (en) | 2020-06-30 |
TW201612365A (en) | 2016-04-01 |
JP2015218363A (ja) | 2015-12-07 |
PH12016502241A1 (en) | 2017-01-09 |
KR20170008256A (ko) | 2017-01-23 |
AU2015262624B2 (en) | 2019-05-02 |
MY183324A (en) | 2021-02-18 |
EP3147391B1 (en) | 2019-11-20 |
EP3147391A1 (en) | 2017-03-29 |
SG11201609549YA (en) | 2016-12-29 |
US10230180B2 (en) | 2019-03-12 |
MX2016015178A (es) | 2017-03-23 |
US20170085014A1 (en) | 2017-03-23 |
CA2949027A1 (en) | 2015-11-26 |
RU2659509C1 (ru) | 2018-07-02 |
CN106414810A (zh) | 2017-02-15 |
EP3147391A4 (en) | 2018-01-10 |
TWI642818B (zh) | 2018-12-01 |
CN106414810B (zh) | 2017-09-12 |
KR102157062B1 (ko) | 2020-09-17 |
WO2015178156A1 (ja) | 2015-11-26 |
BR112016026911A2 (pt) | 2017-08-15 |
AU2015262624B9 (en) | 2019-05-30 |
AU2015262624A1 (en) | 2016-12-01 |
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