CN101959796B - 二氧化硅和环氧树脂 - Google Patents

二氧化硅和环氧树脂 Download PDF

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Publication number
CN101959796B
CN101959796B CN2009801073736A CN200980107373A CN101959796B CN 101959796 B CN101959796 B CN 101959796B CN 2009801073736 A CN2009801073736 A CN 2009801073736A CN 200980107373 A CN200980107373 A CN 200980107373A CN 101959796 B CN101959796 B CN 101959796B
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CN
China
Prior art keywords
adhesives
adhesive
reaction
silica
fumed silica
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CN2009801073736A
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English (en)
Chinese (zh)
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CN101959796A (zh
Inventor
J·迈尔
M·肖尔茨
P·布克尔
A·希勒
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Evonik Operations GmbH
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Evonik Degussa GmbH
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Priority to CN201310331814.9A priority Critical patent/CN103435056B/zh
Publication of CN101959796A publication Critical patent/CN101959796A/zh
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/181—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process
    • C01B33/183—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process by oxidation or hydrolysis in the vapour phase of silicon compounds such as halides, trichlorosilane, monosilane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3081—Treatment with organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/11—Powder tap density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/10—Process efficiency
    • Y02P20/129—Energy recovery, e.g. by cogeneration, H2recovery or pressure recovery turbines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y10T428/2995—Silane, siloxane or silicone coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
CN2009801073736A 2008-03-04 2009-02-10 二氧化硅和环氧树脂 Active CN101959796B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310331814.9A CN103435056B (zh) 2008-03-04 2009-02-10 二氧化硅

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008000499A DE102008000499A1 (de) 2008-03-04 2008-03-04 Kieselsäure sowie Epoxidharze
DE102008000499.5 2008-03-04
PCT/EP2009/051475 WO2009109442A2 (en) 2008-03-04 2009-02-10 Silica and also epoxy resins

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201310331814.9A Division CN103435056B (zh) 2008-03-04 2009-02-10 二氧化硅

Publications (2)

Publication Number Publication Date
CN101959796A CN101959796A (zh) 2011-01-26
CN101959796B true CN101959796B (zh) 2013-09-04

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN2009801073736A Active CN101959796B (zh) 2008-03-04 2009-02-10 二氧化硅和环氧树脂
CN201310331814.9A Active CN103435056B (zh) 2008-03-04 2009-02-10 二氧化硅

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201310331814.9A Active CN103435056B (zh) 2008-03-04 2009-02-10 二氧化硅

Country Status (7)

Country Link
US (1) US8480846B2 (enExample)
EP (2) EP2268575B1 (enExample)
JP (1) JP5583032B2 (enExample)
CN (2) CN101959796B (enExample)
DE (1) DE102008000499A1 (enExample)
TW (1) TWI455883B (enExample)
WO (1) WO2009109442A2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102040804B (zh) * 2010-11-19 2013-02-13 明基材料有限公司 环氧树脂组成物
JP5643623B2 (ja) * 2010-12-02 2014-12-17 デクセリアルズ株式会社 異方性導電材料及びその製造方法
JP6443041B2 (ja) * 2014-12-26 2018-12-26 三菱マテリアル株式会社 シリカゾル分散液及びシリカ多孔質膜形成用組成物
CN104830259B (zh) * 2015-04-21 2018-05-15 长兴铁鹰电气有限公司 一种铅酸蓄电池极柱密封胶及其制备方法
JP6796253B2 (ja) * 2016-04-04 2020-12-09 日立金属株式会社 接着フィルム及びフラット配線材
DE102017203998A1 (de) 2017-03-10 2017-06-01 Wacker Chemie Ag Verfahren zur Herstellung von pyrogener Kieselsäure
CN106978103A (zh) 2017-04-07 2017-07-25 德山化工（浙江）有限公司 硅油处理热解法二氧化硅、其制备方法及应用
WO2019144910A1 (en) * 2018-01-25 2019-08-01 Cabot Corporation Aqueous hydrophobic silica dispersions
CN112638490B (zh) 2018-06-15 2023-01-03 格雷斯公司 消泡剂活性物质、其制造方法和消泡制剂
JP7527770B2 (ja) * 2018-11-29 2024-08-05 キヤノン株式会社 硬化性シリコーンゴム混合物、電子写真用部材、および電子写真画像形成装置
WO2021035383A1 (en) * 2019-08-23 2021-03-04 Evonik Specialty Chemicals (Shanghai) Co., Ltd. Thermal conductive filler and preparation method thereof
WO2021079791A1 (ja) * 2019-10-21 2021-04-29 Ｊｆｅスチール株式会社 絶縁被膜付き電磁鋼板
EP3954743A1 (de) 2020-08-12 2022-02-16 Evonik Operations GmbH Verwendung von siliziumdioxid zur verbesserung der leitfähigkeit von beschichtungen
JP2022185978A (ja) * 2021-06-03 2022-12-15 日本アエロジル株式会社 表面改質無機酸化物粉末及びその製造方法
JP2022185980A (ja) * 2021-06-03 2022-12-15 日本アエロジル株式会社 表面改質無機酸化物粉末及びその製造方法
CN116285475A (zh) * 2023-02-13 2023-06-23 青岛中邦新材料科技有限公司 一种疏水二氧化硅及其制备方法
CN115974089B (zh) * 2023-02-17 2023-10-20 江苏海格新材料有限公司 一种活性硅微粉的生产方法
WO2024236144A1 (en) * 2023-05-18 2024-11-21 Ams-Osram International Gmbh Modified siloxanes, method for modifying siloxanes and their use

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1302444A1 (de) * 2001-09-13 2003-04-16 Wacker-Chemie GmbH Kieselsäure mit geringem Gehalt an Kieselsäure-Silanolgruppen
US6645341B1 (en) * 2002-08-06 2003-11-11 National Starch And Chemical Investment Holding Corporation Two part epoxide adhesive with improved strength
CN1513857A (zh) * 2002-12-20 2004-07-21 �Ϻ���ͨ��ѧ 水可润湿的甲硅烷基化金属氧化物
EP1681266A2 (de) * 2005-01-12 2006-07-19 Degussa AG Pyrogen hergestellte Siliciumdioxidpulver und dieses Pulver enthaltende Silikondichtmasse

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GB932753A (en) * 1959-10-12 1963-07-31 Ici Ltd Improvements in or relating to fillers and pigments by treatment with dihydrocarbyl polysiloxane
DE1567454A1 (de) * 1966-03-10 1970-08-06 Degussa Verfahren zur Herstellung stabiler hochprozentiger Dispersionen von pyrogen gewonnener Kieselsaeure
US3592679A (en) * 1969-05-29 1971-07-13 Cabot Corp Surface treatment of polymeric materials
JPS6136338A (ja) * 1984-07-27 1986-02-21 Mitsubishi Chem Ind Ltd 疎水性の酸化物微粉体及び該酸化物から成る揺変付与剤
US4852965A (en) * 1987-02-27 1989-08-01 American Telephone And Telegraph Company At&T Bell Laboratories Composite service and distribution communications media
US5285513A (en) * 1992-11-30 1994-02-08 At&T Bell Laboratories Optical fiber cable provided with stabilized waterblocking material
US5543487A (en) * 1994-01-19 1996-08-06 The United States Of America As Represented By The Secretary Of Agriculture Hydroxymethylated resorcinol coupling agent and method for bonding wood
DE4402370A1 (de) 1994-01-27 1995-08-03 Degussa Silanisierte Kieselsäuren
DE10138490A1 (de) 2001-08-04 2003-02-13 Degussa Hydrophobe Fällungskieselsäure mit hohem Weißgrad und extrem niedriger Feuchtigkeitsaufnahme
DE10222153B4 (de) * 2002-05-17 2018-11-22 Evonik Degussa Gmbh 2-Komponenten-Mischsysteme
DE10239424A1 (de) 2002-08-28 2004-03-11 Degussa Ag Kieselsäuren
CN1320045C (zh) * 2002-12-18 2007-06-06 德古萨公司 结构－涂覆的二氧化硅和其制备方法、涂料体系及其用途以及塑料体
WO2004055120A1 (en) * 2002-12-18 2004-07-01 Degussa Ag Structurally modified silica
US7507389B2 (en) * 2003-05-06 2009-03-24 Tokuyama Corporation Hydrophobic fumed silica
DE10326049A1 (de) * 2003-06-10 2004-12-30 Degussa Ag Flammenhydrolytisch hergestelltes Siliciumdioxid, Verfahren zu seiner Herstellung und Verwendung
JP2005154222A (ja) * 2003-11-27 2005-06-16 Tokuyama Corp 微粒子状シリカ
DE102005001408A1 (de) * 2005-01-12 2006-07-20 Degussa Ag Pyrogen hergestelltes Siliciumdioxidpulver
US7824644B2 (en) * 2005-05-19 2010-11-02 Tokuyama Corporation Particulate silica
DE102005035442A1 (de) * 2005-07-28 2007-05-16 Wacker Chemie Ag Stabilisierte HDK-Suspensionen zur Verstärkung von Reaktivharzen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1302444A1 (de) * 2001-09-13 2003-04-16 Wacker-Chemie GmbH Kieselsäure mit geringem Gehalt an Kieselsäure-Silanolgruppen
US6645341B1 (en) * 2002-08-06 2003-11-11 National Starch And Chemical Investment Holding Corporation Two part epoxide adhesive with improved strength
CN1513857A (zh) * 2002-12-20 2004-07-21 �Ϻ���ͨ��ѧ 水可润湿的甲硅烷基化金属氧化物
EP1681266A2 (de) * 2005-01-12 2006-07-19 Degussa AG Pyrogen hergestellte Siliciumdioxidpulver und dieses Pulver enthaltende Silikondichtmasse

Also Published As

Publication number Publication date
CN103435056B (zh) 2015-12-02
US20100286311A1 (en) 2010-11-11
CN101959796A (zh) 2011-01-26
EP2433905A2 (en) 2012-03-28
DE102008000499A1 (de) 2009-09-10
US8480846B2 (en) 2013-07-09
JP5583032B2 (ja) 2014-09-03
TWI455883B (zh) 2014-10-11
WO2009109442A2 (en) 2009-09-11
EP2268575B1 (en) 2013-04-03
JP2011516373A (ja) 2011-05-26
TW201000400A (en) 2010-01-01
EP2433905A3 (en) 2012-05-30
EP2268575A2 (en) 2011-01-05
EP2433905B1 (en) 2016-08-17
WO2009109442A3 (en) 2010-08-05
CN103435056A (zh) 2013-12-11

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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
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Address after: Essen, Germany

Patentee after: Evonik Operations Limited

Address before: Essen, Germany

Patentee before: EVONIK DEGUSSA GmbH

CP01 Change in the name or title of a patent holder