CN101937856B - 半导体装置及半导体装置的制造方法 - Google Patents

半导体装置及半导体装置的制造方法 Download PDF

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Publication number
CN101937856B
CN101937856B CN201010263194.6A CN201010263194A CN101937856B CN 101937856 B CN101937856 B CN 101937856B CN 201010263194 A CN201010263194 A CN 201010263194A CN 101937856 B CN101937856 B CN 101937856B
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CN
China
Prior art keywords
semiconductor device
lead frame
recess
wire
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010263194.6A
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English (en)
Chinese (zh)
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CN101937856A (zh
Inventor
田中茂树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
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Renesas Electronics Corp
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Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of CN101937856A publication Critical patent/CN101937856A/zh
Application granted granted Critical
Publication of CN101937856B publication Critical patent/CN101937856B/zh
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Measuring Magnetic Variables (AREA)
CN201010263194.6A 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法 Expired - Fee Related CN101937856B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006298433A JP2008117875A (ja) 2006-11-02 2006-11-02 半導体装置および半導体装置の製造方法
JP2006-298433 2006-11-02

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101653344A Division CN101174603A (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法

Publications (2)

Publication Number Publication Date
CN101937856A CN101937856A (zh) 2011-01-05
CN101937856B true CN101937856B (zh) 2014-04-16

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN201010263194.6A Expired - Fee Related CN101937856B (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法
CNA2007101653344A Pending CN101174603A (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNA2007101653344A Pending CN101174603A (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法

Country Status (5)

Country Link
US (1) US8193041B2 (https=)
JP (1) JP2008117875A (https=)
KR (1) KR20080040582A (https=)
CN (2) CN101937856B (https=)
TW (1) TWI446502B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5334239B2 (ja) * 2008-06-24 2013-11-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5380244B2 (ja) * 2009-10-22 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN105023905B (zh) * 2015-07-31 2018-01-16 日月光封装测试(上海)有限公司 导线框架和使用该导线框架的功率集成电路封装件
JP7048573B2 (ja) * 2016-08-01 2022-04-07 ▲寧▼波舜宇光▲電▼信息有限公司 カメラモジュールおよびそのモールド回路基板組立体とモールド感光組立体並びに製造方法
JP7043225B2 (ja) * 2017-11-08 2022-03-29 株式会社東芝 半導体装置
US11227810B2 (en) * 2017-11-10 2022-01-18 Shindengen Electric Manufacturing Co., Ltd. Electronic module with a groove and press hole on the surface of a conductor
JP7192688B2 (ja) 2019-07-16 2022-12-20 Tdk株式会社 電子部品パッケージ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1832158A (zh) * 2005-02-22 2006-09-13 雅马哈株式会社 引线框架、传感器、树脂合成物和包含树脂模型的传感器
CN1841806A (zh) * 2002-07-29 2006-10-04 雅马哈株式会社 磁性传感器及传感器器件

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1387146A3 (en) * 2002-07-29 2006-05-31 Yamaha Corporation Manufacturing method for magnetic sensor and lead frame therefor
JP2006100348A (ja) 2004-09-28 2006-04-13 Yamaha Corp 物理量センサの製造方法
JP2006269859A (ja) * 2005-03-25 2006-10-05 Yamaha Corp 物理量センサ、およびこれに使用するリードフレーム
JP4314580B2 (ja) * 2004-10-01 2009-08-19 ヤマハ株式会社 物理量センサ、およびこれに使用するリードフレーム
US7791180B2 (en) * 2004-10-01 2010-09-07 Yamaha Corporation Physical quantity sensor and lead frame used for same
TWI280399B (en) * 2004-10-01 2007-05-01 Yamaha Corp Physical amount sensor and lead frame used therein
US7595548B2 (en) * 2004-10-08 2009-09-29 Yamaha Corporation Physical quantity sensor and manufacturing method therefor
US20060185452A1 (en) * 2005-02-22 2006-08-24 Yamaha Corporation Lead frame, sensor including lead frame, resin composition to be used for resin mold in the sensor, and sensor including the resin mold
KR100740358B1 (ko) * 2005-02-25 2007-07-16 야마하 가부시키가이샤 센서 및 센서 형성 방법
JP4652281B2 (ja) * 2006-05-29 2011-03-16 パナソニック株式会社 樹脂封止型半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1841806A (zh) * 2002-07-29 2006-10-04 雅马哈株式会社 磁性传感器及传感器器件
CN1832158A (zh) * 2005-02-22 2006-09-13 雅马哈株式会社 引线框架、传感器、树脂合成物和包含树脂模型的传感器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2006-269859A 2006.10.05

Also Published As

Publication number Publication date
CN101174603A (zh) 2008-05-07
TW200834858A (en) 2008-08-16
KR20080040582A (ko) 2008-05-08
TWI446502B (zh) 2014-07-21
US8193041B2 (en) 2012-06-05
CN101937856A (zh) 2011-01-05
US20080105959A1 (en) 2008-05-08
JP2008117875A (ja) 2008-05-22

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Granted publication date: 20140416

Termination date: 20161026