CN101916001B - Acf粘贴方法以及acf粘贴装置 - Google Patents

Acf粘贴方法以及acf粘贴装置 Download PDF

Info

Publication number
CN101916001B
CN101916001B CN2010102473622A CN201010247362A CN101916001B CN 101916001 B CN101916001 B CN 101916001B CN 2010102473622 A CN2010102473622 A CN 2010102473622A CN 201010247362 A CN201010247362 A CN 201010247362A CN 101916001 B CN101916001 B CN 101916001B
Authority
CN
China
Prior art keywords
acf
substrate
mentioned
sword
pressurization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010102473622A
Other languages
English (en)
Chinese (zh)
Other versions
CN101916001A (zh
Inventor
野本秀树
斧城淳
米泽仁志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN101916001A publication Critical patent/CN101916001A/zh
Application granted granted Critical
Publication of CN101916001B publication Critical patent/CN101916001B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
CN2010102473622A 2007-08-21 2008-08-21 Acf粘贴方法以及acf粘贴装置 Expired - Fee Related CN101916001B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007214893 2007-08-21
JP2007-214893 2007-08-21

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2008102142336A Division CN101393332B (zh) 2007-08-21 2008-08-21 Acf粘贴装置以及平板显示装置

Publications (2)

Publication Number Publication Date
CN101916001A CN101916001A (zh) 2010-12-15
CN101916001B true CN101916001B (zh) 2012-10-10

Family

ID=40493689

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2010102473622A Expired - Fee Related CN101916001B (zh) 2007-08-21 2008-08-21 Acf粘贴方法以及acf粘贴装置
CN2008102142336A Expired - Fee Related CN101393332B (zh) 2007-08-21 2008-08-21 Acf粘贴装置以及平板显示装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2008102142336A Expired - Fee Related CN101393332B (zh) 2007-08-21 2008-08-21 Acf粘贴装置以及平板显示装置

Country Status (4)

Country Link
JP (3) JP4392766B2 (enExample)
KR (1) KR101011178B1 (enExample)
CN (2) CN101916001B (enExample)
TW (1) TW200926324A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101714500B (zh) * 2009-09-30 2012-02-01 日东电子科技(深圳)有限公司 Cog芯片倒装键合装置
CN101710573B (zh) * 2009-09-30 2011-05-25 日东电子科技(深圳)有限公司 Cog芯片预校准夹持装置
KR101220316B1 (ko) * 2010-07-28 2013-01-09 현정 주식회사 필름 융착장치
WO2013183507A1 (ja) * 2012-06-06 2013-12-12 シャープ株式会社 部品圧着装置
KR102138746B1 (ko) * 2013-05-15 2020-07-29 삼성디스플레이 주식회사 필름 처리 장치 및 이를 이용한 필름 처리 방법
CN104914595B (zh) * 2014-03-10 2018-01-09 旭东机械工业股份有限公司 基板压制机构
KR101604069B1 (ko) * 2015-10-06 2016-03-16 주식회사 씨앤와이테크 다층 시트 부재용 프레스 가공 장치
CN105751270A (zh) * 2016-03-25 2016-07-13 深圳市华星光电技术有限公司 Acf贴附设备及其切割装置
JP6970869B2 (ja) * 2017-09-04 2021-11-24 パナソニックＩｐマネジメント株式会社 テープ貼着装置およびテープ貼着方法
WO2019175934A1 (ja) * 2018-03-12 2019-09-19 堺ディスプレイプロダクト株式会社 熱圧着装置
KR102122427B1 (ko) * 2019-01-09 2020-06-12 한국미쯔보시다이아몬드공업(주) 단재 제거 장치
CN112550876A (zh) * 2020-09-17 2021-03-26 深圳市联得自动化装备股份有限公司 自动贴膜装置及贴膜方法
CN113900291B (zh) 2021-08-17 2022-08-16 江苏特丽亮镀膜科技有限公司 一种用于acf胶膜联结结构的制作设备及其制作工艺
CN113795086B (zh) * 2021-10-19 2023-04-14 重庆新固兴科技有限公司 双面假贴机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1209886A (zh) * 1996-10-04 1999-03-03 精工爱普生株式会社 液晶屏的粘接用带的粘着方法及其装置
CN1779539A (zh) * 2004-11-26 2006-05-31 三星电子株式会社 Acf供给装置
JP2007057957A (ja) * 2005-08-25 2007-03-08 Hitachi High-Technologies Corp Ａｃｆ貼り付け方法及びａｃｆ貼り付け装置
JP2007123344A (ja) * 2005-10-25 2007-05-17 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3206331B2 (ja) * 1994-10-06 2001-09-10 松下電器産業株式会社 異方性導電テープの貼着装置及び異方性導電テープの貼着方法
JP3909816B2 (ja) * 2001-10-31 2007-04-25 オプトレックス株式会社 液晶表示パネルへの回路部品接続装置
JP4037649B2 (ja) 2001-12-28 2008-01-23 松下電器産業株式会社 加圧装置
JP2003057681A (ja) * 2002-07-22 2003-02-26 Seiko Epson Corp 液晶パネルの基板への接着用テープの貼付方法
CN2606369Y (zh) * 2003-04-07 2004-03-10 深圳深辉技术有限公司 液晶显示器模块
CN100452276C (zh) * 2005-03-14 2009-01-14 四川世纪双虹显示器件有限公司 等离子体显示器的制造方法
JP4632037B2 (ja) * 2005-04-01 2011-02-16 株式会社日立ハイテクノロジーズ 熱圧着装置及び半導体装置の搭載装置
JP4818008B2 (ja) * 2006-07-20 2011-11-16 株式会社東芝 異方導電性テープの貼着装置および電気機器の製造方法
JP2008153595A (ja) * 2006-12-20 2008-07-03 Shibaura Mechatronics Corp 配線基板の検査装置及び配線基板の検査方法、異方性導電体貼付装置及び異方性導電体貼付方法
JP4370341B2 (ja) * 2007-03-29 2009-11-25 株式会社日立ハイテクノロジーズ Ａｃｆ貼り付け装置
JP5096835B2 (ja) * 2007-08-21 2012-12-12 株式会社日立ハイテクノロジーズ Ａｃｆ貼付け装置及びフラットパネルディスプレイの製造装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1209886A (zh) * 1996-10-04 1999-03-03 精工爱普生株式会社 液晶屏的粘接用带的粘着方法及其装置
CN1779539A (zh) * 2004-11-26 2006-05-31 三星电子株式会社 Acf供给装置
JP2007057957A (ja) * 2005-08-25 2007-03-08 Hitachi High-Technologies Corp Ａｃｆ貼り付け方法及びａｃｆ貼り付け装置
JP2007123344A (ja) * 2005-10-25 2007-05-17 Toshiba Matsushita Display Technology Co Ltd 液晶表示装置

Also Published As

Publication number Publication date
JP4392766B2 (ja) 2010-01-06
CN101393332A (zh) 2009-03-25
CN101393332B (zh) 2010-09-15
TW200926324A (en) 2009-06-16
JP4501036B2 (ja) 2010-07-14
KR20090019738A (ko) 2009-02-25
JP2009071282A (ja) 2009-04-02
JP4453849B2 (ja) 2010-04-21
KR101011178B1 (ko) 2011-01-26
CN101916001A (zh) 2010-12-15
TWI373813B (enExample) 2012-10-01
JP2010004051A (ja) 2010-01-07
JP2009276775A (ja) 2009-11-26

Similar Documents

Publication Publication Date Title
CN101916001B (zh) Acf粘贴方法以及acf粘贴装置
CN100591196C (zh) Acf粘贴装置及平板显示器装置
TWI392037B (zh) An anisotropic conductive film attaching means, and a flat panel display manufacturing apparatus
WO2009122711A1 (ja) 部品実装装置および方法
JP4271056B2 (ja) 基板へのテープ貼り付け方法及び装置
JP5315273B2 (ja) Ｆｐｄモジュールの組立装置
CN100593227C (zh) 各向异性导电带的贴装装置以及电气设备的制造方法
CN101373285B (zh) Acf粘贴装置以及平板显示器的制造装置
TWI815370B (zh) 電子零件安裝裝置
TWI834137B (zh) 電子零件安裝裝置
JP5325669B2 (ja) Ａｃｆ貼着装置
CN102263043B (zh) Fpd组件的组装装置
JP2022158935A (ja) 電子部品実装装置
JP2012038747A (ja) Ｆｐｄモジュールのａｃｆ貼り付け装置
JP2022158937A (ja) 電子部品実装装置
JP2013197287A (ja) Ｆｐｄモジュール組立装置
JP2010067996A (ja) Ａｃｆ貼り付け装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121010

Termination date: 20140821

EXPY Termination of patent right or utility model