CN101911846B - 电路形成方法 - Google Patents

电路形成方法 Download PDF

Info

Publication number
CN101911846B
CN101911846B CN200880123753.4A CN200880123753A CN101911846B CN 101911846 B CN101911846 B CN 101911846B CN 200880123753 A CN200880123753 A CN 200880123753A CN 101911846 B CN101911846 B CN 101911846B
Authority
CN
China
Prior art keywords
circuit
plating
forming
circuit pattern
insulating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200880123753.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN101911846A (zh
Inventor
桥本滋雄
堀田辉幸
石崎隆浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C Uyemura and Co Ltd
Original Assignee
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C Uyemura and Co Ltd filed Critical C Uyemura and Co Ltd
Publication of CN101911846A publication Critical patent/CN101911846A/zh
Application granted granted Critical
Publication of CN101911846B publication Critical patent/CN101911846B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
CN200880123753.4A 2007-11-01 2008-10-03 电路形成方法 Active CN101911846B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-285363 2007-11-01
JP2007285363A JP5209938B2 (ja) 2007-11-01 2007-11-01 回路形成方法
PCT/JP2008/068085 WO2009057419A1 (ja) 2007-11-01 2008-10-03 回路形成方法

Publications (2)

Publication Number Publication Date
CN101911846A CN101911846A (zh) 2010-12-08
CN101911846B true CN101911846B (zh) 2013-01-02

Family

ID=40590813

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880123753.4A Active CN101911846B (zh) 2007-11-01 2008-10-03 电路形成方法

Country Status (6)

Country Link
US (1) US8262831B2 (https=)
JP (1) JP5209938B2 (https=)
KR (1) KR101535126B1 (https=)
CN (1) CN101911846B (https=)
TW (1) TW200934325A (https=)
WO (1) WO2009057419A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011062252A1 (ja) * 2009-11-19 2011-05-26 株式会社村田製作所 部品内蔵モジュールの製造方法および部品内蔵モジュール
JP2011151172A (ja) * 2010-01-21 2011-08-04 Seiko Epson Corp 回路配線形成方法、回路基板、及び配線膜の膜厚が配線膜の幅より大きい回路配線膜
JP2011155035A (ja) * 2010-01-26 2011-08-11 Seiko Epson Corp 回路配線形成方法、回路基板、及び配線膜の膜厚が配線膜の幅より大きい回路配線膜
JP5676908B2 (ja) * 2010-04-21 2015-02-25 上村工業株式会社 プリント配線基板の表面処理方法及び表面処理剤
KR101284595B1 (ko) * 2011-12-23 2013-07-15 한국생산기술연구원 멀티 터치용 터치 스크린 패널 및 그 제조 방법
JP2013216731A (ja) * 2012-04-05 2013-10-24 Kyoritsu Kagaku Sangyo Kk カチオン硬化型樹脂組成物
US20140014401A1 (en) * 2012-07-12 2014-01-16 Taiwan Green Point Enterprises Co., Ltd. Circuit device and method for making the same
CN103547056A (zh) * 2012-07-12 2014-01-29 绿点高新科技股份有限公司 导电线路装置及其制造方法
US20140023430A1 (en) * 2012-07-19 2014-01-23 Apple Inc. Attachment Techniques
CN107949612A (zh) * 2015-03-20 2018-04-20 康宁股份有限公司 喷墨墨组合物、墨涂覆方法和经涂覆的制品
CN106049035B (zh) * 2016-09-06 2018-07-10 复旦大学 一种柔性织物表面导电线路的构建方法
CN116634667A (zh) * 2017-06-15 2023-08-22 捷普有限公司 用于在金属基底上利用表面安装技术的系统、装置和方法
US11259417B2 (en) * 2018-03-14 2022-02-22 Lg Chem, Ltd. Embedded-type transparent electrode substrate and method for manufacturing same
US11261529B2 (en) * 2020-03-31 2022-03-01 Futuretech Capital, Inc. Reduced visibility conductive micro mesh touch sensor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1448966A (zh) * 2002-03-29 2003-10-15 Uht株式会社 多层电子部件的制造装置
CN1993025A (zh) * 2005-12-31 2007-07-04 财团法人工业技术研究院 多层印刷电路板及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140742A (ja) * 1992-10-29 1994-05-20 Canon Inc プリント基板及びその製造方法
JP2001291957A (ja) * 2000-04-07 2001-10-19 Toppan Printing Co Ltd 配線基板及びその製造方法
JP4366632B2 (ja) * 2003-06-24 2009-11-18 日立化成工業株式会社 内層回路付金属張積層板、多層プリント配線板及びそれらの製造方法
JP2005142338A (ja) * 2003-11-06 2005-06-02 Hitachi Chem Co Ltd プリント配線板の製造方法およびプリント配線板
EP1622435A1 (en) * 2004-07-28 2006-02-01 ATOTECH Deutschland GmbH Method of manufacturing an electronic circuit assembly using direct write techniques

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1448966A (zh) * 2002-03-29 2003-10-15 Uht株式会社 多层电子部件的制造装置
CN1993025A (zh) * 2005-12-31 2007-07-04 财团法人工业技术研究院 多层印刷电路板及其制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2005-142338A 2005.06.02

Also Published As

Publication number Publication date
KR20100075589A (ko) 2010-07-02
JP5209938B2 (ja) 2013-06-12
CN101911846A (zh) 2010-12-08
KR101535126B1 (ko) 2015-07-08
JP2009117415A (ja) 2009-05-28
WO2009057419A1 (ja) 2009-05-07
US20100243149A1 (en) 2010-09-30
TW200934325A (en) 2009-08-01
TWI376173B (https=) 2012-11-01
US8262831B2 (en) 2012-09-11

Similar Documents

Publication Publication Date Title
CN101911846B (zh) 电路形成方法
KR20100024449A (ko) 배선 기판의 제조 방법
CN100521868C (zh) 多层印刷配线板及多层印刷配线板的制造方法
JP6068123B2 (ja) プリント配線基板の製造方法およびその方法により製造されたプリント配線基板
JP3541360B2 (ja) 多層回路構造の形成方法及び多層回路構造を有する基体
TW201223380A (en) Multilayer wiring board and manufacturing method thereof
US9232644B2 (en) Wiring substrate
JP4707273B2 (ja) 多層プリント配線板の製造方法
JP5623030B2 (ja) プリント配線基板の製造方法
CN116076159A (zh) 印刷电路板的制造方法
JP2013162007A (ja) 微細配線パターンの製造方法
JP2009212221A (ja) 回路基板の製造方法
JP6098118B2 (ja) 多層プリント配線板およびその製造方法
US20140138129A1 (en) Substrate having a low coefficient of thermal expansion (cte) copper composite material
JP2009239184A (ja) 多層印刷配線板
JP4370490B2 (ja) ビルドアップ多層プリント配線板及びその製造方法
KR101324225B1 (ko) 인쇄회로기판의 제조방법
JP4748889B2 (ja) 多層プリント配線板の製造方法
CN1909763B (zh) 多层印刷配线板
JP2010073986A (ja) 多層配線板の製造方法、多層配線板および半導体装置
JP2004111471A (ja) 配線基板
WO2025154773A1 (ja) 導電ビア付基板の製造方法及び導電ビア付基板、並びに、導電ビア付配線基板の製造方法及び導電ビア付配線基板
JP2003258400A (ja) 配線基板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant