KR101535126B1 - 회로 형성 방법 - Google Patents

회로 형성 방법 Download PDF

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Publication number
KR101535126B1
KR101535126B1 KR1020107009592A KR20107009592A KR101535126B1 KR 101535126 B1 KR101535126 B1 KR 101535126B1 KR 1020107009592 A KR1020107009592 A KR 1020107009592A KR 20107009592 A KR20107009592 A KR 20107009592A KR 101535126 B1 KR101535126 B1 KR 101535126B1
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KR
South Korea
Prior art keywords
trench
circuit pattern
circuit
insulating resin
plating
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Active
Application number
KR1020107009592A
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English (en)
Korean (ko)
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KR20100075589A (ko
Inventor
시게오 하시모토
데루유키 홋타
다카히로 이시자키
Original Assignee
우에무라 고교 가부시키가이샤
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Publication of KR20100075589A publication Critical patent/KR20100075589A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
KR1020107009592A 2007-11-01 2008-10-03 회로 형성 방법 Active KR101535126B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2007-285363 2007-11-01
JP2007285363A JP5209938B2 (ja) 2007-11-01 2007-11-01 回路形成方法
PCT/JP2008/068085 WO2009057419A1 (ja) 2007-11-01 2008-10-03 回路形成方法

Publications (2)

Publication Number Publication Date
KR20100075589A KR20100075589A (ko) 2010-07-02
KR101535126B1 true KR101535126B1 (ko) 2015-07-08

Family

ID=40590813

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107009592A Active KR101535126B1 (ko) 2007-11-01 2008-10-03 회로 형성 방법

Country Status (6)

Country Link
US (1) US8262831B2 (https=)
JP (1) JP5209938B2 (https=)
KR (1) KR101535126B1 (https=)
CN (1) CN101911846B (https=)
TW (1) TW200934325A (https=)
WO (1) WO2009057419A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011062252A1 (ja) * 2009-11-19 2011-05-26 株式会社村田製作所 部品内蔵モジュールの製造方法および部品内蔵モジュール
JP2011151172A (ja) * 2010-01-21 2011-08-04 Seiko Epson Corp 回路配線形成方法、回路基板、及び配線膜の膜厚が配線膜の幅より大きい回路配線膜
JP2011155035A (ja) * 2010-01-26 2011-08-11 Seiko Epson Corp 回路配線形成方法、回路基板、及び配線膜の膜厚が配線膜の幅より大きい回路配線膜
JP5676908B2 (ja) * 2010-04-21 2015-02-25 上村工業株式会社 プリント配線基板の表面処理方法及び表面処理剤
KR101284595B1 (ko) * 2011-12-23 2013-07-15 한국생산기술연구원 멀티 터치용 터치 스크린 패널 및 그 제조 방법
JP2013216731A (ja) * 2012-04-05 2013-10-24 Kyoritsu Kagaku Sangyo Kk カチオン硬化型樹脂組成物
US20140014401A1 (en) * 2012-07-12 2014-01-16 Taiwan Green Point Enterprises Co., Ltd. Circuit device and method for making the same
CN103547056A (zh) * 2012-07-12 2014-01-29 绿点高新科技股份有限公司 导电线路装置及其制造方法
US20140023430A1 (en) * 2012-07-19 2014-01-23 Apple Inc. Attachment Techniques
CN107949612A (zh) * 2015-03-20 2018-04-20 康宁股份有限公司 喷墨墨组合物、墨涂覆方法和经涂覆的制品
CN106049035B (zh) * 2016-09-06 2018-07-10 复旦大学 一种柔性织物表面导电线路的构建方法
CN116634667A (zh) * 2017-06-15 2023-08-22 捷普有限公司 用于在金属基底上利用表面安装技术的系统、装置和方法
US11259417B2 (en) * 2018-03-14 2022-02-22 Lg Chem, Ltd. Embedded-type transparent electrode substrate and method for manufacturing same
US11261529B2 (en) * 2020-03-31 2022-03-01 Futuretech Capital, Inc. Reduced visibility conductive micro mesh touch sensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140742A (ja) * 1992-10-29 1994-05-20 Canon Inc プリント基板及びその製造方法
JP2001291957A (ja) * 2000-04-07 2001-10-19 Toppan Printing Co Ltd 配線基板及びその製造方法
JP2005019517A (ja) * 2003-06-24 2005-01-20 Hitachi Chem Co Ltd 内層回路付金属張積層板、多層プリント配線板及びそれらの製造方法
JP2005142338A (ja) * 2003-11-06 2005-06-02 Hitachi Chem Co Ltd プリント配線板の製造方法およびプリント配線板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3805273B2 (ja) * 2002-03-29 2006-08-02 Ｕｈｔ株式会社 積層型電子部品の製造装置
EP1622435A1 (en) * 2004-07-28 2006-02-01 ATOTECH Deutschland GmbH Method of manufacturing an electronic circuit assembly using direct write techniques
CN100574573C (zh) * 2005-12-31 2009-12-23 财团法人工业技术研究院 多层印刷电路板及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140742A (ja) * 1992-10-29 1994-05-20 Canon Inc プリント基板及びその製造方法
JP2001291957A (ja) * 2000-04-07 2001-10-19 Toppan Printing Co Ltd 配線基板及びその製造方法
JP2005019517A (ja) * 2003-06-24 2005-01-20 Hitachi Chem Co Ltd 内層回路付金属張積層板、多層プリント配線板及びそれらの製造方法
JP2005142338A (ja) * 2003-11-06 2005-06-02 Hitachi Chem Co Ltd プリント配線板の製造方法およびプリント配線板

Also Published As

Publication number Publication date
KR20100075589A (ko) 2010-07-02
JP5209938B2 (ja) 2013-06-12
CN101911846A (zh) 2010-12-08
CN101911846B (zh) 2013-01-02
JP2009117415A (ja) 2009-05-28
WO2009057419A1 (ja) 2009-05-07
US20100243149A1 (en) 2010-09-30
TW200934325A (en) 2009-08-01
TWI376173B (https=) 2012-11-01
US8262831B2 (en) 2012-09-11

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