CN101874299B - 具有散热孔的陶瓷基板 - Google Patents

具有散热孔的陶瓷基板 Download PDF

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Publication number
CN101874299B
CN101874299B CN2008801186744A CN200880118674A CN101874299B CN 101874299 B CN101874299 B CN 101874299B CN 2008801186744 A CN2008801186744 A CN 2008801186744A CN 200880118674 A CN200880118674 A CN 200880118674A CN 101874299 B CN101874299 B CN 101874299B
Authority
CN
China
Prior art keywords
ceramic substrate
louvre
height
substrate
reinforcement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008801186744A
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English (en)
Chinese (zh)
Other versions
CN101874299A (zh
Inventor
成田季总
稻叶明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN101874299A publication Critical patent/CN101874299A/zh
Application granted granted Critical
Publication of CN101874299B publication Critical patent/CN101874299B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN2008801186744A 2007-12-11 2008-12-11 具有散热孔的陶瓷基板 Expired - Fee Related CN101874299B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/001,267 US20090146295A1 (en) 2007-12-11 2007-12-11 Ceramic substrate having thermal via
US12/001,267 2007-12-11
PCT/US2008/086338 WO2009076494A2 (en) 2007-12-11 2008-12-11 Ceramic substrate having thermal via

Publications (2)

Publication Number Publication Date
CN101874299A CN101874299A (zh) 2010-10-27
CN101874299B true CN101874299B (zh) 2012-04-04

Family

ID=40637680

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801186744A Expired - Fee Related CN101874299B (zh) 2007-12-11 2008-12-11 具有散热孔的陶瓷基板

Country Status (5)

Country Link
US (1) US20090146295A1 (enExample)
JP (1) JP2011507276A (enExample)
CN (1) CN101874299B (enExample)
TW (1) TW201023307A (enExample)
WO (1) WO2009076494A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101491138B1 (ko) * 2007-12-12 2015-02-09 엘지이노텍 주식회사 다층 기판 및 이를 구비한 발광 다이오드 모듈
US20100140790A1 (en) * 2008-12-05 2010-06-10 Seagate Technology Llc Chip having thermal vias and spreaders of cvd diamond
US8757874B2 (en) 2010-05-03 2014-06-24 National Instruments Corporation Temperature sensing system and method
WO2012055206A1 (zh) * 2010-10-26 2012-05-03 Yu Jianping 氧化铝/石墨复合陶瓷材料和采用该材料为基板的led光源
KR101289186B1 (ko) * 2011-04-15 2013-07-26 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US9006770B2 (en) * 2011-05-18 2015-04-14 Tsmc Solid State Lighting Ltd. Light emitting diode carrier
US8908383B1 (en) * 2012-05-21 2014-12-09 Triquint Semiconductor, Inc. Thermal via structures with surface features
US9318466B2 (en) * 2014-08-28 2016-04-19 Globalfoundries Inc. Method for electronic circuit assembly on a paper substrate
ES2959517T3 (es) * 2018-11-09 2024-02-26 Siemens Energy Global Gmbh & Co Kg Disposición para determinar la temperatura de una superficie
CN117769163B (zh) * 2023-12-26 2024-05-31 江苏富乐华半导体科技股份有限公司 一种铝薄膜电路基板制备方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59230741A (ja) * 1983-06-15 1984-12-25 株式会社日立製作所 形状記憶複合材料
US4894115A (en) * 1989-02-14 1990-01-16 General Electric Company Laser beam scanning method for forming via holes in polymer materials
JPH07221218A (ja) * 1994-02-03 1995-08-18 Toshiba Corp 半導体装置
US5802699A (en) * 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5558267A (en) * 1995-03-31 1996-09-24 Texas Instruments Incorporated Moat for die pad cavity in bond station heater block
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
US6247228B1 (en) * 1996-08-12 2001-06-19 Tessera, Inc. Electrical connection with inwardly deformable contacts
JP3650689B2 (ja) * 1997-05-28 2005-05-25 三菱電機株式会社 半導体装置
US6395998B1 (en) * 2000-09-13 2002-05-28 International Business Machines Corporation Electronic package having an adhesive retaining cavity
DE10051547A1 (de) * 2000-10-18 2002-04-25 Bosch Gmbh Robert Baugruppenträger für elektrische/elektronische Bauelemente
US6750516B2 (en) * 2001-10-18 2004-06-15 Hewlett-Packard Development Company, L.P. Systems and methods for electrically isolating portions of wafers
US6541712B1 (en) * 2001-12-04 2003-04-01 Teradyhe, Inc. High speed multi-layer printed circuit board via
US7152312B2 (en) * 2002-02-11 2006-12-26 Adc Dsl Systems, Inc. Method for transmitting current through a substrate
JP2003338577A (ja) * 2002-05-21 2003-11-28 Murata Mfg Co Ltd 回路基板装置
US6977346B2 (en) * 2002-06-10 2005-12-20 Visteon Global Technologies, Inc. Vented circuit board for cooling power components
US6958542B2 (en) * 2002-09-03 2005-10-25 Kabushiki Kaisha Toshiba Semiconductor device
JP2004165291A (ja) * 2002-11-11 2004-06-10 Tokuyama Corp ビアホール付きセラミック基板及びその製造方法
US7286359B2 (en) * 2004-05-11 2007-10-23 The U.S. Government As Represented By The National Security Agency Use of thermally conductive vias to extract heat from microelectronic chips and method of manufacturing
US7786567B2 (en) * 2004-11-10 2010-08-31 Chung-Cheng Wang Substrate for electrical device and methods for making the same
KR100849455B1 (ko) * 2005-04-19 2008-07-30 티디케이가부시기가이샤 다층 세라믹 기판 및 그 제조 방법
JP2007031229A (ja) * 2005-07-28 2007-02-08 Tdk Corp 窒化アルミニウム基板の製造方法及び窒化アルミニウム基板
US7554193B2 (en) * 2005-08-16 2009-06-30 Renesas Technology Corp. Semiconductor device
JP4331769B2 (ja) * 2007-02-28 2009-09-16 Ｔｄｋ株式会社 配線構造及びその形成方法並びにプリント配線板

Also Published As

Publication number Publication date
US20090146295A1 (en) 2009-06-11
TW201023307A (en) 2010-06-16
WO2009076494A3 (en) 2009-07-30
JP2011507276A (ja) 2011-03-03
WO2009076494A2 (en) 2009-06-18
CN101874299A (zh) 2010-10-27

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Granted publication date: 20120404

Termination date: 20131211