CN101845201B - 耐灼热丝的聚酯 - Google Patents

耐灼热丝的聚酯 Download PDF

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Publication number
CN101845201B
CN101845201B CN201010140122.2A CN201010140122A CN101845201B CN 101845201 B CN101845201 B CN 101845201B CN 201010140122 A CN201010140122 A CN 201010140122A CN 101845201 B CN101845201 B CN 101845201B
Authority
CN
China
Prior art keywords
molding composition
polyester molding
resistant polyester
glow wire
glow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010140122.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN101845201A (zh
Inventor
马库斯·舍费尔
约亨·恩特尔
马蒂亚斯·比恩米勒
拉尔夫·扬茨
亚历山大·拉德克
Original Assignee
Lanxess Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lanxess Deutschland GmbH filed Critical Lanxess Deutschland GmbH
Publication of CN101845201A publication Critical patent/CN101845201A/zh
Application granted granted Critical
Publication of CN101845201B publication Critical patent/CN101845201B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/02Halogenated hydrocarbons
    • C08K5/03Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/06Ethers; Acetals; Ketals; Ortho-esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
    • C08K5/3417Five-membered rings condensed with carbocyclic rings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/012Flame-retardant; Preventing of inflammation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0236Plating catalyst as filler in insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Resistance Heating (AREA)
  • Organic Insulating Materials (AREA)
CN201010140122.2A 2009-03-27 2010-03-23 耐灼热丝的聚酯 Expired - Fee Related CN101845201B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EM09156428.6 2009-03-27
EP09156428.6 2009-03-27
EP09156428A EP2233519B1 (de) 2009-03-27 2009-03-27 Glühdrahtbeständige Polyester

Publications (2)

Publication Number Publication Date
CN101845201A CN101845201A (zh) 2010-09-29
CN101845201B true CN101845201B (zh) 2014-04-09

Family

ID=40910871

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010140122.2A Expired - Fee Related CN101845201B (zh) 2009-03-27 2010-03-23 耐灼热丝的聚酯

Country Status (5)

Country Link
EP (1) EP2233519B1 (enExample)
JP (1) JP5465056B2 (enExample)
CN (1) CN101845201B (enExample)
AT (1) ATE522568T1 (enExample)
PL (1) PL2233519T3 (enExample)

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US8933161B2 (en) 2011-03-18 2015-01-13 Mitsubishi Chemical Europe Gmbh Thermoplastic resin composition, resin molded article, and method of manufacturing resin molded article with plated layer
CN103154135B (zh) * 2011-03-18 2014-10-15 三菱化学欧洲合资公司 生产电路载体的方法
CN104126034B (zh) * 2011-12-22 2018-07-06 3M创新有限公司 熔喷方法、低收缩率熔喷聚合物纤维和纤维结构体、以及可熔喷聚合物组合物
JP5937855B2 (ja) * 2012-03-14 2016-06-22 ナミックス株式会社 樹脂組成物
EP2639262A1 (en) * 2012-03-16 2013-09-18 Mitsubishi Chemical Europe GmbH Thermoplastic composition
EP2711399B1 (en) * 2012-03-23 2014-12-31 Mitsubishi Engineering-Plastics Corporation Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer
US20140142571A1 (en) * 2012-11-21 2014-05-22 Ticona Llc Liquid Crystalline Polymer Composition for Melt-Extruded Substrates
KR101339640B1 (ko) * 2013-04-02 2013-12-09 김한주 레이저 직접 구조화 방법
JP6196478B2 (ja) * 2013-06-11 2017-09-13 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
EP2886605B2 (de) * 2013-12-20 2021-09-01 Ems-Chemie Ag Kunststoffformmasse und deren Verwendung
EP2942367B1 (de) * 2014-05-05 2018-07-11 LANXESS Deutschland GmbH Polyester Zusammensetzungen
KR101770350B1 (ko) * 2014-08-29 2017-08-22 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
WO2017038409A1 (ja) * 2015-09-03 2017-03-09 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング用ポリエステル系樹脂組成物
JP6667953B2 (ja) * 2016-03-11 2020-03-18 三菱エンジニアリングプラスチックス株式会社 樹脂成形品の製造方法
CN107417977B (zh) * 2017-07-19 2019-07-12 广州铂钡信息科技有限公司 一种用于聚合物的添加剂及其制备方法
WO2022044947A1 (ja) * 2020-08-25 2022-03-03 ポリプラスチックス株式会社 難燃性樹脂組成物及びその成形品
CN115989276A (zh) * 2020-08-25 2023-04-18 宝理塑料株式会社 阻燃性树脂组合物和其成型品

Citations (1)

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Publication number Priority date Publication date Assignee Title
CN1823124A (zh) * 2003-05-21 2006-08-23 韦尔曼公司 慢结晶聚酯树脂

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Also Published As

Publication number Publication date
CN101845201A (zh) 2010-09-29
JP5465056B2 (ja) 2014-04-09
PL2233519T3 (pl) 2012-01-31
ATE522568T1 (de) 2011-09-15
EP2233519B1 (de) 2011-08-31
EP2233519A1 (de) 2010-09-29
JP2010229410A (ja) 2010-10-14

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C06 Publication
PB01 Publication
ASS Succession or assignment of patent right

Owner name: SAISHENG PHARMACEUTICAL CO.,LTD.

Free format text: FORMER OWNER: SCICLONE PHARMACEUTICALS INC.

Effective date: 20101029

CI01 Publication of corrected invention patent application

Correction item: Priority countries

Correct: EP

False: EM

Number: 39

Volume: 26

CI02 Correction of invention patent application

Correction item: Priority countries

Correct: EP

False: EM

Number: 39

Page: The title page

Volume: 26

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140409

CF01 Termination of patent right due to non-payment of annual fee