JP5465056B2 - 耐グローワイヤ性ポリエステル - Google Patents

耐グローワイヤ性ポリエステル Download PDF

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Publication number
JP5465056B2
JP5465056B2 JP2010072467A JP2010072467A JP5465056B2 JP 5465056 B2 JP5465056 B2 JP 5465056B2 JP 2010072467 A JP2010072467 A JP 2010072467A JP 2010072467 A JP2010072467 A JP 2010072467A JP 5465056 B2 JP5465056 B2 JP 5465056B2
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JP
Japan
Prior art keywords
weight
composition
glow
component
polyester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010072467A
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English (en)
Japanese (ja)
Other versions
JP2010229410A5 (enExample
JP2010229410A (ja
Inventor
マルクス・シェーファー
ヨヒェン・エントナー
マティアス・ビーンミュラー
ラルフ・ヤンツ
アレクサンダー・ラデック
Original Assignee
ランクセス・ドイチュランド・ゲーエムベーハー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by ランクセス・ドイチュランド・ゲーエムベーハー filed Critical ランクセス・ドイチュランド・ゲーエムベーハー
Publication of JP2010229410A publication Critical patent/JP2010229410A/ja
Publication of JP2010229410A5 publication Critical patent/JP2010229410A5/ja
Application granted granted Critical
Publication of JP5465056B2 publication Critical patent/JP5465056B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Resistance Heating (AREA)
  • Organic Insulating Materials (AREA)
JP2010072467A 2009-03-27 2010-03-26 耐グローワイヤ性ポリエステル Expired - Fee Related JP5465056B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09156428.6 2009-03-27
EP09156428A EP2233519B1 (de) 2009-03-27 2009-03-27 Glühdrahtbeständige Polyester

Publications (3)

Publication Number Publication Date
JP2010229410A JP2010229410A (ja) 2010-10-14
JP2010229410A5 JP2010229410A5 (enExample) 2013-03-14
JP5465056B2 true JP5465056B2 (ja) 2014-04-09

Family

ID=40910871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010072467A Expired - Fee Related JP5465056B2 (ja) 2009-03-27 2010-03-26 耐グローワイヤ性ポリエステル

Country Status (5)

Country Link
EP (1) EP2233519B1 (enExample)
JP (1) JP5465056B2 (enExample)
CN (1) CN101845201B (enExample)
AT (1) ATE522568T1 (enExample)
PL (1) PL2233519T3 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
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JP5912704B2 (ja) * 2011-03-18 2016-04-27 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
JP5437539B2 (ja) * 2011-03-18 2014-03-12 ミツビシ ケミカル ヨーロッパ ゲーエムベーハー 回路基板の製造方法
WO2013096529A1 (en) * 2011-12-22 2013-06-27 3M Innovative Properties Company Melt blowing process, low shrinkage melt blown polymer fibers and fibrous structures, and melt blowable polymer compositions
JP5937855B2 (ja) * 2012-03-14 2016-06-22 ナミックス株式会社 樹脂組成物
EP2639262A1 (en) * 2012-03-16 2013-09-18 Mitsubishi Chemical Europe GmbH Thermoplastic composition
EP2711399B1 (en) * 2012-03-23 2014-12-31 Mitsubishi Engineering-Plastics Corporation Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer
WO2014081650A1 (en) * 2012-11-21 2014-05-30 Ticona Llc Liquid crystalline polymer composition for melt-extruded substrates
KR101339640B1 (ko) * 2013-04-02 2013-12-09 김한주 레이저 직접 구조화 방법
JP6196478B2 (ja) * 2013-06-11 2017-09-13 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
EP2886605B2 (de) * 2013-12-20 2021-09-01 Ems-Chemie Ag Kunststoffformmasse und deren Verwendung
EP2942367B1 (de) * 2014-05-05 2018-07-11 LANXESS Deutschland GmbH Polyester Zusammensetzungen
KR101770350B1 (ko) * 2014-08-29 2017-08-22 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
US10604649B2 (en) 2015-09-03 2020-03-31 Mitsubishi Engineering-Plastics Corporation Polyester resin composition for laser direct structuring
JP6667953B2 (ja) * 2016-03-11 2020-03-18 三菱エンジニアリングプラスチックス株式会社 樹脂成形品の製造方法
CN107417977B (zh) * 2017-07-19 2019-07-12 广州铂钡信息科技有限公司 一种用于聚合物的添加剂及其制备方法
CN115989276A (zh) * 2020-08-25 2023-04-18 宝理塑料株式会社 阻燃性树脂组合物和其成型品
WO2022044947A1 (ja) * 2020-08-25 2022-03-03 ポリプラスチックス株式会社 難燃性樹脂組成物及びその成形品

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US3644574A (en) 1969-07-17 1972-02-22 Eastman Kodak Co Shaped articles of blends of polyesters and polyvinyls
US4013613A (en) 1971-10-01 1977-03-22 General Electric Company Reinforced intercrystalline thermoplastic polyester compositions
JPS5039599B2 (enExample) 1973-03-30 1975-12-18
US4035958A (en) 1973-03-30 1977-07-19 Tokyo Kosei Kaken Co. Ltd. Mobile floor cleaning and polishing device
DE2407776A1 (de) 1974-02-19 1975-09-04 Licentia Gmbh Schaltung zur regelung der betriebsspannung fuer die transistor-zeilenendstufe eines fernsehempfaengers
DE2715932A1 (de) 1977-04-09 1978-10-19 Bayer Ag Schnellkristallisierende poly(aethylen/alkylen)-terephthalate
DE3631540A1 (de) 1986-09-17 1988-03-24 Bayer Ag Thermoplastische formmassen mit hoher alterungsbestaendigkeit und guter tieftemperaturzaehigkeit
DE3631539A1 (de) 1986-09-17 1988-03-24 Bayer Ag Alterungsbestaendige thermoplastische formmassen mit guter zaehigkeit
DE3704655A1 (de) 1987-02-14 1988-08-25 Bayer Ag Teilchenfoermige mehrphasenpolymerisate
DE3704657A1 (de) 1987-02-14 1988-08-25 Bayer Ag Teilchenfoermige mehrphasenpolymerisate
DE3738143A1 (de) 1987-11-10 1989-05-18 Bayer Ag Verwendung von redoxpfropfpolymerisaten zur verbesserung der benzinbestaendigkeit von thermoplastischen, aromatischen polycarbonat- und/oder polyestercarbonat-formmassen
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JP4692108B2 (ja) * 2004-07-07 2011-06-01 三菱エンジニアリングプラスチックス株式会社 絶縁材料部品
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US7547849B2 (en) * 2005-06-15 2009-06-16 E.I. Du Pont De Nemours And Company Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
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Also Published As

Publication number Publication date
CN101845201B (zh) 2014-04-09
EP2233519A1 (de) 2010-09-29
PL2233519T3 (pl) 2012-01-31
CN101845201A (zh) 2010-09-29
JP2010229410A (ja) 2010-10-14
EP2233519B1 (de) 2011-08-31
ATE522568T1 (de) 2011-09-15

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