JP5465056B2 - 耐グローワイヤ性ポリエステル - Google Patents

耐グローワイヤ性ポリエステル Download PDF

Info

Publication number
JP5465056B2
JP5465056B2 JP2010072467A JP2010072467A JP5465056B2 JP 5465056 B2 JP5465056 B2 JP 5465056B2 JP 2010072467 A JP2010072467 A JP 2010072467A JP 2010072467 A JP2010072467 A JP 2010072467A JP 5465056 B2 JP5465056 B2 JP 5465056B2
Authority
JP
Japan
Prior art keywords
weight
composition
glow
component
polyester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010072467A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010229410A (ja
JP2010229410A5 (enExample
Inventor
マルクス・シェーファー
ヨヒェン・エントナー
マティアス・ビーンミュラー
ラルフ・ヤンツ
アレクサンダー・ラデック
Original Assignee
ランクセス・ドイチュランド・ゲーエムベーハー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ランクセス・ドイチュランド・ゲーエムベーハー filed Critical ランクセス・ドイチュランド・ゲーエムベーハー
Publication of JP2010229410A publication Critical patent/JP2010229410A/ja
Publication of JP2010229410A5 publication Critical patent/JP2010229410A5/ja
Application granted granted Critical
Publication of JP5465056B2 publication Critical patent/JP5465056B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Resistance Heating (AREA)
  • Organic Insulating Materials (AREA)
JP2010072467A 2009-03-27 2010-03-26 耐グローワイヤ性ポリエステル Expired - Fee Related JP5465056B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09156428.6 2009-03-27
EP09156428A EP2233519B1 (de) 2009-03-27 2009-03-27 Glühdrahtbeständige Polyester

Publications (3)

Publication Number Publication Date
JP2010229410A JP2010229410A (ja) 2010-10-14
JP2010229410A5 JP2010229410A5 (enExample) 2013-03-14
JP5465056B2 true JP5465056B2 (ja) 2014-04-09

Family

ID=40910871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010072467A Expired - Fee Related JP5465056B2 (ja) 2009-03-27 2010-03-26 耐グローワイヤ性ポリエステル

Country Status (5)

Country Link
EP (1) EP2233519B1 (enExample)
JP (1) JP5465056B2 (enExample)
CN (1) CN101845201B (enExample)
AT (1) ATE522568T1 (enExample)
PL (1) PL2233519T3 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2676799B1 (en) 2011-03-18 2014-06-11 Mitsubishi Chemical Europe GmbH Thermoplastic resin composition, resin molded article, and method of manufactoring resin molded article with plated layer
CN103154135B (zh) * 2011-03-18 2014-10-15 三菱化学欧洲合资公司 生产电路载体的方法
EP2794967A1 (en) * 2011-12-22 2014-10-29 3M Innovative Properties Company Melt blowing process, low shrinkage melt blown polymer fibers and fibrous structures, and melt blowable polymer compositions
JP5937855B2 (ja) * 2012-03-14 2016-06-22 ナミックス株式会社 樹脂組成物
EP2639262A1 (en) * 2012-03-16 2013-09-18 Mitsubishi Chemical Europe GmbH Thermoplastic composition
JP5340513B1 (ja) * 2012-03-23 2013-11-13 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
WO2014081650A1 (en) * 2012-11-21 2014-05-30 Ticona Llc Liquid crystalline polymer composition for melt-extruded substrates
KR101339640B1 (ko) * 2013-04-02 2013-12-09 김한주 레이저 직접 구조화 방법
JP6196478B2 (ja) * 2013-06-11 2017-09-13 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
EP2886605B2 (de) * 2013-12-20 2021-09-01 Ems-Chemie Ag Kunststoffformmasse und deren Verwendung
HUE039596T2 (hu) * 2014-05-05 2019-01-28 Lanxess Deutschland Gmbh Poliészter vegyületek
KR101770350B1 (ko) * 2014-08-29 2017-08-22 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
WO2017038409A1 (ja) * 2015-09-03 2017-03-09 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング用ポリエステル系樹脂組成物
JP6667953B2 (ja) * 2016-03-11 2020-03-18 三菱エンジニアリングプラスチックス株式会社 樹脂成形品の製造方法
CN107417977B (zh) * 2017-07-19 2019-07-12 广州铂钡信息科技有限公司 一种用于聚合物的添加剂及其制备方法
CN115989276A (zh) * 2020-08-25 2023-04-18 宝理塑料株式会社 阻燃性树脂组合物和其成型品

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1580834A (enExample) 1968-01-04 1969-09-12
US3644574A (en) 1969-07-17 1972-02-22 Eastman Kodak Co Shaped articles of blends of polyesters and polyvinyls
US4013613A (en) 1971-10-01 1977-03-22 General Electric Company Reinforced intercrystalline thermoplastic polyester compositions
US4035958A (en) 1973-03-30 1977-07-19 Tokyo Kosei Kaken Co. Ltd. Mobile floor cleaning and polishing device
JPS5039599B2 (enExample) 1973-03-30 1975-12-18
DE2407776A1 (de) 1974-02-19 1975-09-04 Licentia Gmbh Schaltung zur regelung der betriebsspannung fuer die transistor-zeilenendstufe eines fernsehempfaengers
DE2715932A1 (de) 1977-04-09 1978-10-19 Bayer Ag Schnellkristallisierende poly(aethylen/alkylen)-terephthalate
DE3631539A1 (de) 1986-09-17 1988-03-24 Bayer Ag Alterungsbestaendige thermoplastische formmassen mit guter zaehigkeit
DE3631540A1 (de) 1986-09-17 1988-03-24 Bayer Ag Thermoplastische formmassen mit hoher alterungsbestaendigkeit und guter tieftemperaturzaehigkeit
DE3704655A1 (de) 1987-02-14 1988-08-25 Bayer Ag Teilchenfoermige mehrphasenpolymerisate
DE3704657A1 (de) 1987-02-14 1988-08-25 Bayer Ag Teilchenfoermige mehrphasenpolymerisate
DE3738143A1 (de) 1987-11-10 1989-05-18 Bayer Ag Verwendung von redoxpfropfpolymerisaten zur verbesserung der benzinbestaendigkeit von thermoplastischen, aromatischen polycarbonat- und/oder polyestercarbonat-formmassen
DE4236122A1 (de) 1992-10-27 1994-04-28 Bayer Ag Flammgeschützte, mineralgefüllte, thermoplastische Formmassen mit hoher Kriechstromfestigkeit
DE19643280A1 (de) 1996-10-21 1998-04-23 Basf Ag Flammgeschützte Formmassen
DE19723734C2 (de) 1997-06-06 2002-02-07 Gerhard Naundorf Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung
DE19731346C2 (de) 1997-06-06 2003-09-25 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und ein Verfahren zu deren Herstellung
JP2002532620A (ja) 1998-12-10 2002-10-02 ナウンドルフ・ゲルハルト 印刷導体構造物の製造方法
JP2002536409A (ja) 1999-02-09 2002-10-29 ユニバーシティ オブ バージニア パテント ファウンデーション フェルバメートから誘導される化合物
DE10132092A1 (de) 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
CN1326435C (zh) 2001-07-05 2007-07-11 Lpkf激光和电子股份公司 导体轨道结构的制造方法
EP1288260A1 (en) * 2001-08-29 2003-03-05 Albemarle Corporation Flame retardant compositions
CN1823124A (zh) * 2003-05-21 2006-08-23 韦尔曼公司 慢结晶聚酯树脂
DE102004003891A1 (de) 2004-01-27 2005-08-11 Mitsubishi Polyester Film Gmbh Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester, Verfahren zu ihrer Herstellung und ihre Verwendung
JP4732457B2 (ja) * 2004-06-08 2011-07-27 ランクセス・ドイチュランド・ゲーエムベーハー 熱可塑性ポリエステルをベースとする改良された流動性を有する成形用組成物
JP4692108B2 (ja) * 2004-07-07 2011-06-01 三菱エンジニアリングプラスチックス株式会社 絶縁材料部品
DE102004039148A1 (de) 2004-08-12 2006-02-23 Clariant Gmbh Glühdrahtbeständige flammwidrige Polymere
DE102004048876A1 (de) 2004-09-13 2006-03-30 Bayer Ag Halogenfreie flammgeschützte thermoplastische Formmassen auf Basis von Polyamid mit erhöhter Glühdrahtbeständigkeit
US7547849B2 (en) * 2005-06-15 2009-06-16 E.I. Du Pont De Nemours And Company Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
JP2008019400A (ja) * 2006-07-14 2008-01-31 Wintech Polymer Ltd 難燃性ポリブチレンテレフタレート樹脂組成物
JP2008140972A (ja) * 2006-12-01 2008-06-19 Auto Network Gijutsu Kenkyusho:Kk 導電回路を有する成形品及びその製造方法

Also Published As

Publication number Publication date
CN101845201B (zh) 2014-04-09
CN101845201A (zh) 2010-09-29
JP2010229410A (ja) 2010-10-14
EP2233519A1 (de) 2010-09-29
ATE522568T1 (de) 2011-09-15
PL2233519T3 (pl) 2012-01-31
EP2233519B1 (de) 2011-08-31

Similar Documents

Publication Publication Date Title
JP2010229410A (ja) 耐グローワイヤ性ポリエステル
JP4732457B2 (ja) 熱可塑性ポリエステルをベースとする改良された流動性を有する成形用組成物
CN104508041B (zh) 阻燃性热塑性聚酯树脂组合物及成型品
EP3568433B1 (en) Laser platable thermoplastic compositions with a laser activatable metal compound and shaped articles therefrom
JP7013439B2 (ja) ポリエステル組成物
JP6181793B2 (ja) 熱可塑性プラスチック成形コンパウンド物
JP4620734B2 (ja) 改良された流動性を有するポリアミド成形用組成物
JP5723022B2 (ja) ポリエステル組成物
KR102225418B1 (ko) 폴리에스테르 조성물
JP6531647B2 (ja) 難燃性ポリエステル樹脂組成物
JP6592034B2 (ja) 熱可塑性プラスチック成形コンパウンド物
JP6239960B2 (ja) レーザーダイレクトストラクチャリング用熱可塑性樹脂組成物、樹脂成形品、および樹脂成形品の製造方法
CN105209661A (zh) 激光直接成型用树脂组合物、树脂成型品、以及具有镀层的树脂成型品的制造方法
CN102083908A (zh) 具有改进的流动性的热塑性塑料
KR20070044782A (ko) 유동성이 개선된 열가소성 폴리에스테르 기재의 성형조성물
JP6421058B2 (ja) ポリエステル樹脂組成物及び成形体
JP5599929B1 (ja) 樹脂組成物、樹脂成形品、および樹脂成形品の製造方法
KR20230009912A (ko) 난연성 폴리에스테르 블렌드
JP7536052B2 (ja) ポリアミド組成物
KR20250011130A (ko) 크리프-저항성 폴리에스테르 조성물
KR101005512B1 (ko) 내충격성이 향상된 열가소성 수지 조성물

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130125

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130125

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130830

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130903

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131203

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131224

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140121

R150 Certificate of patent or registration of utility model

Ref document number: 5465056

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees