CN101827955B - 工件承载器装置 - Google Patents

工件承载器装置 Download PDF

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Publication number
CN101827955B
CN101827955B CN2008801106260A CN200880110626A CN101827955B CN 101827955 B CN101827955 B CN 101827955B CN 2008801106260 A CN2008801106260 A CN 2008801106260A CN 200880110626 A CN200880110626 A CN 200880110626A CN 101827955 B CN101827955 B CN 101827955B
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CN
China
Prior art keywords
workpiece
workpiece carrier
drive
axis
carrier arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2008801106260A
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English (en)
Chinese (zh)
Other versions
CN101827955A (zh
Inventor
S·埃泽
M·扎克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oerlikon Surface Solutions AG Pfaeffikon
Original Assignee
Oerlikon Trading AG Truebbach
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Trading AG Truebbach filed Critical Oerlikon Trading AG Truebbach
Publication of CN101827955A publication Critical patent/CN101827955A/zh
Application granted granted Critical
Publication of CN101827955B publication Critical patent/CN101827955B/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/64—Movable or adjustable work or tool supports characterised by the purpose of the movement
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H21/00—Gearings comprising primarily only links or levers, with or without slides
    • F16H21/10—Gearings comprising primarily only links or levers, with or without slides all movement being in, or parallel to, a single plane
    • F16H21/12—Gearings comprising primarily only links or levers, with or without slides all movement being in, or parallel to, a single plane for conveying rotary motion
    • F16H21/14—Gearings comprising primarily only links or levers, with or without slides all movement being in, or parallel to, a single plane for conveying rotary motion by means of cranks, eccentrics, or like members fixed to one rotary member and guided along tracks on the other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Retarders (AREA)
  • Gear Transmission (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physical Vapour Deposition (AREA)
  • Specific Conveyance Elements (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Agricultural Machines (AREA)
  • Soil Working Implements (AREA)
CN2008801106260A 2007-10-08 2008-10-02 工件承载器装置 Active CN101827955B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07405302.6 2007-10-08
EP07405302A EP2048263B1 (de) 2007-10-08 2007-10-08 Werkstückträgereinrichtung
PCT/EP2008/008349 WO2009046928A1 (en) 2007-10-08 2008-10-02 Workpiece carrier device

Publications (2)

Publication Number Publication Date
CN101827955A CN101827955A (zh) 2010-09-08
CN101827955B true CN101827955B (zh) 2012-11-07

Family

ID=38982780

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801106260A Active CN101827955B (zh) 2007-10-08 2008-10-02 工件承载器装置

Country Status (14)

Country Link
US (2) US8596626B2 (enExample)
EP (2) EP2048263B1 (enExample)
JP (1) JP5497647B2 (enExample)
KR (1) KR20100071057A (enExample)
CN (1) CN101827955B (enExample)
AT (1) ATE503858T1 (enExample)
BR (1) BRPI0818592A2 (enExample)
DE (1) DE502007006849D1 (enExample)
ES (1) ES2362016T3 (enExample)
MX (1) MX2010003727A (enExample)
PL (2) PL2336387T3 (enExample)
RU (1) RU2485211C2 (enExample)
TW (1) TWI481448B (enExample)
WO (1) WO2009046928A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2048263B1 (de) * 2007-10-08 2011-03-30 Oerlikon Trading AG, Trübbach Werkstückträgereinrichtung
DE102010001218A1 (de) 2010-01-26 2011-07-28 Esser, Stefan, Dr.-Ing., 52072 Substratteller und Beschichtungsanlage zum Beschichten von Substraten
SG184626A1 (en) * 2011-03-17 2012-10-30 Sulzer Metco Ag Component manipulator for the dynamic positioning of a substrate, coating method, as well as use of a component manipulator
US9381537B2 (en) 2011-12-08 2016-07-05 Praxair Technology, Inc. Multifunction tooling fixture assembly for use in a coating related operations
RU2625698C1 (ru) * 2016-08-29 2017-07-18 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Способ нанесения защитных покрытий и устройство для его осуществления
CN107740063B (zh) * 2017-11-16 2024-07-23 东莞市赢心科技有限公司 真空镀铝设备用工件承载结构
KR101869401B1 (ko) * 2018-01-04 2018-07-20 홍성신 초정밀 선반의 공작물 자동 교환장치
RU2688353C1 (ru) * 2018-08-09 2019-05-21 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") Устройство перемещения и вращения подложкодержателя
DE102018126862A1 (de) 2018-10-26 2020-04-30 Oerlikon Surface Solutions Ag, Pfäffikon Werkstückträgereinrichtung und Beschichtungsanordnung
DE102019110158A1 (de) 2019-04-17 2020-10-22 Oerlikon Surface Solutions Ag, Pfäffikon Werkstückträgereinrichtung
US12024769B2 (en) 2019-05-07 2024-07-02 Oerlikon Surface Solutions Ag, Pfäffikon Movable work piece carrier device for holding work pieces to be treated
CN114144543B (zh) 2019-07-26 2024-08-13 欧瑞康表面处理解决方案股份公司普费菲孔 在pvd工艺中用于圆柱、长形基材的夹具
CN114271649B (zh) * 2021-12-27 2022-11-25 西南民族大学 一种艺术作品展示设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10308471A1 (de) * 2003-02-20 2004-09-16 Hensoldt Ag Beschichtungsanlage zum Beschichten von Substraten für optische Komponenten
CN1865495A (zh) * 2005-05-20 2006-11-22 中国科学院半导体研究所 金属有机物化学气相淀积设备反应室中的公转自转机构

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU370279A1 (ru) * 1969-08-21 1973-02-15 УСТРОЙСТВО дл ТРАНСПОРТИРОВКИ и СМЕНЫ ПОДЛОЖЕК в ВАКУУМНЫХ УСТАНОВКАХ
JPH01288652A (ja) * 1988-05-17 1989-11-20 Komatsu Ltd 減速機
SU1828669A3 (ru) * 1990-11-13 1995-05-27 Владимир Васильевич Кульпинов Устройство для обработки изделий в вакууме
DE19803278C2 (de) 1998-01-29 2001-02-01 Bosch Gmbh Robert Werkstückträger und dessen Verwendung zur Behandlung und Beschichtung von Werkstücken
WO2000036178A1 (de) * 1998-12-15 2000-06-22 Unaxis Balzers Aktiengesellschaft Planetensystem-werkstückträger und verfahren zur oberflächenbehandlung von werkstücken
US6749764B1 (en) * 2000-11-14 2004-06-15 Tru-Si Technologies, Inc. Plasma processing comprising three rotational motions of an article being processed
PT1917380E (pt) 2005-08-29 2009-06-25 Oerlikon Trading Ag Dispositivo de suporte para peças a trabalhar
US7988787B2 (en) * 2007-08-27 2011-08-02 Caterpillar Inc. Workpiece support system and method
EP2048263B1 (de) * 2007-10-08 2011-03-30 Oerlikon Trading AG, Trübbach Werkstückträgereinrichtung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10308471A1 (de) * 2003-02-20 2004-09-16 Hensoldt Ag Beschichtungsanlage zum Beschichten von Substraten für optische Komponenten
CN1865495A (zh) * 2005-05-20 2006-11-22 中国科学院半导体研究所 金属有机物化学气相淀积设备反应室中的公转自转机构

Also Published As

Publication number Publication date
EP2048263A1 (de) 2009-04-15
RU2010113596A (ru) 2011-11-20
US8783673B2 (en) 2014-07-22
TWI481448B (zh) 2015-04-21
JP5497647B2 (ja) 2014-05-21
JP2011502211A (ja) 2011-01-20
ATE503858T1 (de) 2011-04-15
PL2336387T3 (pl) 2014-01-31
EP2336387A1 (de) 2011-06-22
CN101827955A (zh) 2010-09-08
DE502007006849D1 (de) 2011-05-12
MX2010003727A (es) 2010-04-21
EP2048263B1 (de) 2011-03-30
TW200936249A (en) 2009-09-01
US20140008857A1 (en) 2014-01-09
WO2009046928A1 (en) 2009-04-16
KR20100071057A (ko) 2010-06-28
ES2362016T3 (es) 2011-06-27
US8596626B2 (en) 2013-12-03
EP2336387B1 (de) 2013-09-04
RU2485211C2 (ru) 2013-06-20
BRPI0818592A2 (pt) 2017-06-13
PL2048263T3 (pl) 2011-09-30
US20100270722A1 (en) 2010-10-28

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Swiss Teru Bach

Patentee after: OERLIKON TRADING AG, TRuBBACH

Address before: Swiss Teru Bach

Patentee before: OERLIKON TRADING AG, TRuBBACH

Address after: Swiss Teru Bach

Patentee after: OERLIKON SURFACE SOLUTIONS AG, PFAFFIKON

Address before: Swiss Teru Bach

Patentee before: OERLIKON TRADING AG, TRuBBACH

CP01 Change in the name or title of a patent holder
CP02 Change in the address of a patent holder

Address after: Swiss hole

Patentee after: OERLIKON SURFACE SOLUTIONS AG, PFAFFIKON

Address before: Swiss Teru Bach

Patentee before: OERLIKON SURFACE SOLUTIONS AG, PFAFFIKON

CP02 Change in the address of a patent holder