CN101801886B - 具有其表面已金属化的陶瓷体的结构部件 - Google Patents
具有其表面已金属化的陶瓷体的结构部件 Download PDFInfo
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- CN101801886B CN101801886B CN200880021824.XA CN200880021824A CN101801886B CN 101801886 B CN101801886 B CN 101801886B CN 200880021824 A CN200880021824 A CN 200880021824A CN 101801886 B CN101801886 B CN 101801886B
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
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- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
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- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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- Y10T428/00—Stock material or miscellaneous articles
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- Y10T428/00—Stock material or miscellaneous articles
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
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- Y10T428/00—Stock material or miscellaneous articles
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007019635.2 | 2007-04-24 | ||
| DE102007019635 | 2007-04-24 | ||
| PCT/EP2008/054625 WO2008128944A1 (de) | 2007-04-24 | 2008-04-17 | Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101801886A CN101801886A (zh) | 2010-08-11 |
| CN101801886B true CN101801886B (zh) | 2014-07-16 |
Family
ID=39590241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880021824.XA Expired - Fee Related CN101801886B (zh) | 2007-04-24 | 2008-04-17 | 具有其表面已金属化的陶瓷体的结构部件 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100112372A1 (https=) |
| EP (1) | EP2142488A1 (https=) |
| JP (1) | JP5649957B2 (https=) |
| KR (1) | KR101519813B1 (https=) |
| CN (1) | CN101801886B (https=) |
| DE (1) | DE102008001220A1 (https=) |
| WO (1) | WO2008128944A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009025033A1 (de) | 2009-06-10 | 2010-12-16 | Behr Gmbh & Co. Kg | Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung |
| CN105246861A (zh) * | 2013-06-05 | 2016-01-13 | 陶瓷技术有限责任公司 | 在陶瓷基材上的金属层 |
| DE102015215374A1 (de) * | 2014-08-12 | 2016-02-18 | Ceramtec Gmbh | Keramischer Trägerkörper mit Solarzellen |
| KR102421016B1 (ko) * | 2014-09-09 | 2022-07-13 | 세람테크 게엠베하 | 다중-층 냉각 엘리먼트 |
| CN105758058B (zh) * | 2014-12-19 | 2020-09-15 | 中国电子科技集团公司第十八研究所 | 一种高电压密集型温差电致冷器及其制备方法 |
| CN104617204B (zh) * | 2015-01-16 | 2017-07-14 | 隆科电子(惠阳)有限公司 | 一种碳化硅基电路板及其制备方法 |
| CN106145952B (zh) * | 2015-03-23 | 2019-06-11 | 隆科电子(惠阳)有限公司 | 高绝缘碳化硅陶瓷基板与碳化硅基电路板及其制备方法 |
| JP6965768B2 (ja) * | 2017-02-28 | 2021-11-10 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、絶縁回路基板、及び、銅/セラミックス接合体の製造方法、絶縁回路基板の製造方法 |
| KR20190137086A (ko) * | 2017-04-06 | 2019-12-10 | 세람테크 게엠베하 | 2개의 측들 상에서 냉각되는 회로 |
| DE102018215224A1 (de) * | 2018-09-07 | 2019-12-19 | Continental Automotive Gmbh | Vorrichtung zur Energieübertragung mit kühlendem Keramikelement |
| KR102816899B1 (ko) * | 2022-09-16 | 2025-06-05 | 주식회사 아모그린텍 | 히트싱크 일체형 파워모듈용 기판 및 그 제조방법 |
| EP4428914A1 (en) * | 2023-03-09 | 2024-09-11 | Infineon Technologies AG | Power semiconductor module arrangement |
| EP4563550A1 (de) | 2023-11-30 | 2025-06-04 | Heraeus Electronics GmbH & Co. KG | Verfahren zur strukturierung eines metall-keramik-verbunds |
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- 2008-04-17 DE DE102008001220A patent/DE102008001220A1/de not_active Withdrawn
- 2008-04-17 US US12/596,880 patent/US20100112372A1/en not_active Abandoned
- 2008-04-17 KR KR1020097024346A patent/KR101519813B1/ko not_active Expired - Fee Related
- 2008-04-17 EP EP08736298A patent/EP2142488A1/de not_active Ceased
- 2008-04-17 WO PCT/EP2008/054625 patent/WO2008128944A1/de not_active Ceased
- 2008-04-17 JP JP2010504630A patent/JP5649957B2/ja not_active Expired - Fee Related
- 2008-04-17 CN CN200880021824.XA patent/CN101801886B/zh not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2010526008A (ja) | 2010-07-29 |
| US20100112372A1 (en) | 2010-05-06 |
| KR20100017259A (ko) | 2010-02-16 |
| WO2008128944A1 (de) | 2008-10-30 |
| EP2142488A1 (de) | 2010-01-13 |
| KR101519813B1 (ko) | 2015-05-14 |
| DE102008001220A1 (de) | 2008-10-30 |
| JP5649957B2 (ja) | 2015-01-07 |
| CN101801886A (zh) | 2010-08-11 |
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