KR101519813B1 - 표면이 금속화된 세라믹 베이스를 구비하는 부품 - Google Patents
표면이 금속화된 세라믹 베이스를 구비하는 부품 Download PDFInfo
- Publication number
- KR101519813B1 KR101519813B1 KR1020097024346A KR20097024346A KR101519813B1 KR 101519813 B1 KR101519813 B1 KR 101519813B1 KR 1020097024346 A KR1020097024346 A KR 1020097024346A KR 20097024346 A KR20097024346 A KR 20097024346A KR 101519813 B1 KR101519813 B1 KR 101519813B1
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- Prior art keywords
- ceramic body
- electronic components
- metal
- coating
- metal coating
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007019635.2 | 2007-04-24 | ||
| DE102007019635 | 2007-04-24 | ||
| PCT/EP2008/054625 WO2008128944A1 (de) | 2007-04-24 | 2008-04-17 | Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100017259A KR20100017259A (ko) | 2010-02-16 |
| KR101519813B1 true KR101519813B1 (ko) | 2015-05-14 |
Family
ID=39590241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097024346A Expired - Fee Related KR101519813B1 (ko) | 2007-04-24 | 2008-04-17 | 표면이 금속화된 세라믹 베이스를 구비하는 부품 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100112372A1 (https=) |
| EP (1) | EP2142488A1 (https=) |
| JP (1) | JP5649957B2 (https=) |
| KR (1) | KR101519813B1 (https=) |
| CN (1) | CN101801886B (https=) |
| DE (1) | DE102008001220A1 (https=) |
| WO (1) | WO2008128944A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024058495A1 (ko) * | 2022-09-16 | 2024-03-21 | 주식회사 아모그린텍 | 히트싱크 일체형 파워모듈용 기판 및 그 제조방법 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009025033A1 (de) | 2009-06-10 | 2010-12-16 | Behr Gmbh & Co. Kg | Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung |
| CN105246861A (zh) * | 2013-06-05 | 2016-01-13 | 陶瓷技术有限责任公司 | 在陶瓷基材上的金属层 |
| DE102015215374A1 (de) * | 2014-08-12 | 2016-02-18 | Ceramtec Gmbh | Keramischer Trägerkörper mit Solarzellen |
| KR102421016B1 (ko) * | 2014-09-09 | 2022-07-13 | 세람테크 게엠베하 | 다중-층 냉각 엘리먼트 |
| CN105758058B (zh) * | 2014-12-19 | 2020-09-15 | 中国电子科技集团公司第十八研究所 | 一种高电压密集型温差电致冷器及其制备方法 |
| CN104617204B (zh) * | 2015-01-16 | 2017-07-14 | 隆科电子(惠阳)有限公司 | 一种碳化硅基电路板及其制备方法 |
| CN106145952B (zh) * | 2015-03-23 | 2019-06-11 | 隆科电子(惠阳)有限公司 | 高绝缘碳化硅陶瓷基板与碳化硅基电路板及其制备方法 |
| JP6965768B2 (ja) * | 2017-02-28 | 2021-11-10 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、絶縁回路基板、及び、銅/セラミックス接合体の製造方法、絶縁回路基板の製造方法 |
| KR20190137086A (ko) * | 2017-04-06 | 2019-12-10 | 세람테크 게엠베하 | 2개의 측들 상에서 냉각되는 회로 |
| DE102018215224A1 (de) * | 2018-09-07 | 2019-12-19 | Continental Automotive Gmbh | Vorrichtung zur Energieübertragung mit kühlendem Keramikelement |
| EP4428914A1 (en) * | 2023-03-09 | 2024-09-11 | Infineon Technologies AG | Power semiconductor module arrangement |
| EP4563550A1 (de) | 2023-11-30 | 2025-06-04 | Heraeus Electronics GmbH & Co. KG | Verfahren zur strukturierung eines metall-keramik-verbunds |
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| WO2006005280A1 (de) | 2004-07-08 | 2006-01-19 | Curamik Electronics Gmbh | Metall-keramic-substrat |
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| JPH0437662A (ja) * | 1990-06-01 | 1992-02-07 | Murata Mfg Co Ltd | セラミック基板と金属板の接合構造 |
| EP0544329A3 (en) * | 1991-11-28 | 1993-09-01 | Kabushiki Kaisha Toshiba | Semiconductor package |
| JP3208438B2 (ja) * | 1992-01-16 | 2001-09-10 | イビデン株式会社 | 金属層を備えたセラミックス基板とその製造方法 |
| JPH10284808A (ja) * | 1997-04-08 | 1998-10-23 | Denki Kagaku Kogyo Kk | 回路基板 |
| JP3339572B2 (ja) * | 1999-10-04 | 2002-10-28 | 日本電気株式会社 | 半導体装置及びその製造方法 |
| JP5038565B2 (ja) * | 2000-09-22 | 2012-10-03 | 株式会社東芝 | セラミックス回路基板およびその製造方法 |
| JP2004335877A (ja) * | 2003-05-09 | 2004-11-25 | Nissin Electric Co Ltd | 樹脂モールド型積層セラミックコンデンサ |
| CN1707886A (zh) * | 2004-06-11 | 2005-12-14 | 中国科学院半导体研究所 | 一种氮化铝交叠式单片集成微通道热沉 |
| DE102004033933B4 (de) * | 2004-07-08 | 2009-11-05 | Electrovac Ag | Verfahren zum Herstellen eines Metall-Keramik-Substrates |
| JP2005101624A (ja) * | 2004-10-15 | 2005-04-14 | Kyocera Corp | パワーモジュール用配線基板 |
| TWI449137B (zh) * | 2006-03-23 | 2014-08-11 | 製陶技術創新製陶工程股份公司 | 構件或電路用的攜帶體 |
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2008
- 2008-04-17 DE DE102008001220A patent/DE102008001220A1/de not_active Withdrawn
- 2008-04-17 US US12/596,880 patent/US20100112372A1/en not_active Abandoned
- 2008-04-17 KR KR1020097024346A patent/KR101519813B1/ko not_active Expired - Fee Related
- 2008-04-17 EP EP08736298A patent/EP2142488A1/de not_active Ceased
- 2008-04-17 WO PCT/EP2008/054625 patent/WO2008128944A1/de not_active Ceased
- 2008-04-17 JP JP2010504630A patent/JP5649957B2/ja not_active Expired - Fee Related
- 2008-04-17 CN CN200880021824.XA patent/CN101801886B/zh not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2006005280A1 (de) | 2004-07-08 | 2006-01-19 | Curamik Electronics Gmbh | Metall-keramic-substrat |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024058495A1 (ko) * | 2022-09-16 | 2024-03-21 | 주식회사 아모그린텍 | 히트싱크 일체형 파워모듈용 기판 및 그 제조방법 |
| KR20240038268A (ko) * | 2022-09-16 | 2024-03-25 | 주식회사 아모그린텍 | 히트싱크 일체형 파워모듈용 기판 및 그 제조방법 |
| KR102816899B1 (ko) * | 2022-09-16 | 2025-06-05 | 주식회사 아모그린텍 | 히트싱크 일체형 파워모듈용 기판 및 그 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010526008A (ja) | 2010-07-29 |
| US20100112372A1 (en) | 2010-05-06 |
| KR20100017259A (ko) | 2010-02-16 |
| WO2008128944A1 (de) | 2008-10-30 |
| CN101801886B (zh) | 2014-07-16 |
| EP2142488A1 (de) | 2010-01-13 |
| DE102008001220A1 (de) | 2008-10-30 |
| JP5649957B2 (ja) | 2015-01-07 |
| CN101801886A (zh) | 2010-08-11 |
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