EP2142488A1 - Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist - Google Patents

Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist

Info

Publication number
EP2142488A1
EP2142488A1 EP08736298A EP08736298A EP2142488A1 EP 2142488 A1 EP2142488 A1 EP 2142488A1 EP 08736298 A EP08736298 A EP 08736298A EP 08736298 A EP08736298 A EP 08736298A EP 2142488 A1 EP2142488 A1 EP 2142488A1
Authority
EP
European Patent Office
Prior art keywords
metallization
component according
ceramic body
component
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP08736298A
Other languages
German (de)
English (en)
French (fr)
Inventor
Claus Peter Kluge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Publication of EP2142488A1 publication Critical patent/EP2142488A1/de
Ceased legal-status Critical Current

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    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/121—Metallic interlayers based on aluminium
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/123—Metallic interlayers based on iron group metals, e.g. steel
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
    • C04B2237/348—Zirconia, hafnia, zirconates or hafnates
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    • C04B2237/366—Aluminium nitride
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    • C04B2237/36—Non-oxidic
    • C04B2237/368—Silicon nitride
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
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    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12576—Boride, carbide or nitride component
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    • Y10T428/12611—Oxide-containing component
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    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
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    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Definitions

  • the invention relates to a component with a ceramic body which is covered in at least a region on its surface with a metallization.
  • the insulation and partial discharge resistance depends, among other things, on the thickness, material and homogeneity of the floor insulation, the housing and filling material and possibly also the chip arrangement.
  • a plate-shaped metal-ceramic substrate which reliably maintains a partial discharge strength of ⁇ 10 pC.
  • the object of the invention is to present a component with a metallized on its surface ceramic body, which is not exclusively plate-shaped, flat, and has a high partial discharge resistance.
  • the object is achieved by means of the characterizing features of claim 1.
  • Advantageous embodiments of the invention are presented in the dependent claims.
  • the component according to the invention is spatially structured.
  • the ceramic body is a three-dimensional structure.
  • connect to a plate more parts so that a body arises in any form.
  • the whole body is in one piece, d. h., he is not composed of individual parts.
  • further plates are vertical on a plate, then for example an overall body can be produced which is E-shaped.
  • Such a form for example, heatsinks.
  • This partial discharge strength is achieved, depending on the predetermined same or different measuring method with the same or unequal or changing predetermined measuring voltage or the same or unequal or changing measuring conditions.
  • Measurement conditions can be, for example, pressure or temperature or air humidity or equal or unequal distances of the metallizations.
  • these defects may only have an edge profile, whose radius of curvature does not fall below 10 microns, so that the required partial discharge resistance of ⁇ 20 pC is not exceeded.
  • a metallization metals are preferred in the form of coatings or films or sheets cohesively or by mechanical positive connection over the entire surface or part of the surface connected to the ceramic body, which have the same or different thermal conductivity as the ceramic body.
  • the metallization can consist, for example, of tungsten, silver, gold, copper, platinum, palladium, nickel, aluminum or steel in pure or industrial quality or of mixtures of at least two different metals.
  • the metallization can also, for example, additionally or alone, from reaction solders, soft solders or brazing alloys.
  • the metals of the metallization in the form of coatings or foils or sheets may be added to adhesion promoting or other additives such as glasses or polymeric materials or they may be coated with it to increase the adhesion of the metallization on the ceramic body.
  • the layer (s) of metallization are formed using a DCB (Direct Copper Bonding) or AMB (Active Metal Brazing) or screen printing or electrolytic or chemical deposition or vapor deposition process or by adhesion or bonding or a combination of these processes applied to the surface of the body on opposite and / or adjacent surfaces.
  • the metallization on the ceramic body consists of at least one layer per metallized surface.
  • the metallization covers the surface of the ceramic body as a metal body over part of the surface or over the entire surface or partially or completely in a plane-parallel or nearly plane-parallel shape or any geometrically shaped or in a combination of the forms.
  • the layer thickness of a metallization should be less than 2 mm so that the required partial discharge strength of ⁇ 20 pC is not exceeded.
  • One or more metallizations on the ceramic body may consist exclusively of copper.
  • the connection with the ceramic body by means of the screen printing process followed by thermal treatment or the DCB process.
  • One or more metallizations on the ceramic body may consist exclusively of aluminum.
  • the connection with the ceramic body takes place by means of the screen printing process with subsequent thermal treatment or by means of the AMB process.
  • an intermediate layer for the adhesion promotion has preferably a thickness of ⁇ 20 microns. If, for example, a metallization of copper is to be applied to an aluminum nitride ceramic by means of the DCB method, it is advantageous if an intermediate layer of Al 2 O 3 is produced on the surface of the ceramic body. This increases the adhesive strength of the metallization with copper.
  • connection of the at least one metallization and / or a further metallization to the ceramic body is> 90%.
  • the at least one metallization is connected to the ceramic body with an adhesive strength of at least 12 N / cm. This ensures that, in particular due to the thermal stress, no detachment of the metallization from the ceramic body takes place.
  • the body of the component consists of a ceramic material, which can be matched in its composition to the required properties, such as insulation, partial discharge resistance and thermal stability.
  • the ceramic material contains as main component 50.1% by weight to 100% by weight ZrO 2 / HfO 2 or 50.1% by weight to 100% by weight Al 2 O 3 or 50.1% by weight to 100
  • the main components and the minor components with deduction of a content of impurities of ⁇ 3% by weight, can be combined in any combination with one another to give a total composition of 100% by weight.
  • the ceramic body of the component is formed as a heat sink.
  • a heatsink is understood to mean a body which carries electrical or electronic components or circuits and which is shaped in such a way that it can dissipate the heat generated in the components or circuits in such a way that no accumulation of heat occurs, which can damage the components or circuits.
  • the carrier body is a body made of a material that is electrically non-conductive or almost non-conductive and has good thermal conductivity. The ideal material for such a body is ceramic.
  • the body is integral and has heat dissipating or feeding elements for protecting the electronic components or circuits.
  • the body is integral and has heat dissipating or feeding elements for protecting the electronic components or circuits.
  • the body is integral and has heat dissipating or feeding elements for protecting the electronic components or circuits.
  • Carrier body a board and the elements are holes, channels, ribs and / or recesses, which can be acted upon by a heating or cooling medium.
  • the medium can be liquid or gaseous.
  • the carrier body and / or the cooling element preferably consist of at least one ceramic component or a composite of different ceramic materials.
  • a component 1 which has a ceramic body 2, which according to the invention is not plate-shaped. Not plate-shaped means that the top 3 and the bottom 4 of the ceramic body 2 are formed so that they each have a different surface area.
  • the body is spatially structured.
  • the upper side 3 of the component 1 has a flat surface in the present exemplary embodiment.
  • the top 3 is a circuit carrier.
  • On at least one metallization 5 on the upper side 3 of the ceramic body 2, at least one further metallization 6 is applied, which in the present case covers the surface of the first metallization 5 over part of the area.
  • the ceramic body 2 is E-shaped.
  • the body is a heatsink.
  • the underside 4 of the ceramic body 2 has cooling ribs 7. Also, the cooling fins 7 are provided with metallized areas 5, where, for example, electronic components can be soldered.
  • a chip 8 is fixed on a metallized region 5 by means of a solder connection 9. Via lines 10 it is connected to a metallized region 5.
  • This chip 8 represents a heat source whose heat is dissipated via the cooling fins 7.
  • Intermediate layer of Al 2 O 3 is located on the surface of the ceramic body.
  • Body 2 is made of aluminum nitride, an intermediate layer 12 of Al 2 O 3 has been produced between the metallization of copper 11 and the surface of the ceramic body 2. With the metallization of copper 11, an electronic component 14 is connected by means of a solder 13.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
EP08736298A 2007-04-24 2008-04-17 Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist Ceased EP2142488A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007019635 2007-04-24
PCT/EP2008/054625 WO2008128944A1 (de) 2007-04-24 2008-04-17 Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist

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US (1) US20100112372A1 (https=)
EP (1) EP2142488A1 (https=)
JP (1) JP5649957B2 (https=)
KR (1) KR101519813B1 (https=)
CN (1) CN101801886B (https=)
DE (1) DE102008001220A1 (https=)
WO (1) WO2008128944A1 (https=)

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KR102421016B1 (ko) * 2014-09-09 2022-07-13 세람테크 게엠베하 다중-층 냉각 엘리먼트
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Also Published As

Publication number Publication date
JP2010526008A (ja) 2010-07-29
US20100112372A1 (en) 2010-05-06
KR20100017259A (ko) 2010-02-16
WO2008128944A1 (de) 2008-10-30
CN101801886B (zh) 2014-07-16
KR101519813B1 (ko) 2015-05-14
DE102008001220A1 (de) 2008-10-30
JP5649957B2 (ja) 2015-01-07
CN101801886A (zh) 2010-08-11

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