CN101641412A - 硅氧烷弹性体组合物和硅氧烷弹性体 - Google Patents

硅氧烷弹性体组合物和硅氧烷弹性体 Download PDF

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Publication number
CN101641412A
CN101641412A CN200880009709A CN200880009709A CN101641412A CN 101641412 A CN101641412 A CN 101641412A CN 200880009709 A CN200880009709 A CN 200880009709A CN 200880009709 A CN200880009709 A CN 200880009709A CN 101641412 A CN101641412 A CN 101641412A
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China
Prior art keywords
component
sio
silicone elastomer
weight
integer
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Pending
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CN200880009709A
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English (en)
Chinese (zh)
Inventor
关场一广
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Publication of CN101641412A publication Critical patent/CN101641412A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/014—Stabilisers against oxidation, heat, light or ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN200880009709A 2007-03-26 2008-03-14 硅氧烷弹性体组合物和硅氧烷弹性体 Pending CN101641412A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP080292/2007 2007-03-26
JP2007080292A JP2008239719A (ja) 2007-03-26 2007-03-26 シリコーンエラストマー組成物およびシリコーンエラストマー

Publications (1)

Publication Number Publication Date
CN101641412A true CN101641412A (zh) 2010-02-03

Family

ID=39642618

Family Applications (1)

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CN200880009709A Pending CN101641412A (zh) 2007-03-26 2008-03-14 硅氧烷弹性体组合物和硅氧烷弹性体

Country Status (7)

Country Link
US (1) US20100140538A1 (enExample)
EP (1) EP2139950A1 (enExample)
JP (1) JP2008239719A (enExample)
KR (1) KR20090130005A (enExample)
CN (1) CN101641412A (enExample)
TW (1) TW200902634A (enExample)
WO (1) WO2008126658A1 (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105164208A (zh) * 2013-05-07 2015-12-16 信越化学工业株式会社 导热性硅氧烷组合物及其固化物
CN108624060A (zh) * 2017-03-15 2018-10-09 信越化学工业株式会社 固晶用硅酮树脂组合物及固化物
CN110719939A (zh) * 2017-05-31 2020-01-21 迈图高新材料日本合同公司 导热性聚硅氧烷组合物
CN111051434A (zh) * 2017-07-24 2020-04-21 陶氏东丽株式会社 多成分硬化型导热性硅酮凝胶组合物、导热性部件及散热构造体
CN111094458A (zh) * 2017-07-24 2020-05-01 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
US11118056B2 (en) 2016-07-22 2021-09-14 Momentive Performance Materials Japan Llc Thermally conductive polysiloxane composition
WO2021184149A1 (en) * 2020-03-16 2021-09-23 Dow Silicones Corporation Thermal conductive silicone composition
US11254849B2 (en) 2015-11-05 2022-02-22 Momentive Performance Materials Japan Llc Method for producing a thermally conductive polysiloxane composition
US11286349B2 (en) 2016-07-22 2022-03-29 Momentive Performance Materials Japan Llc Surface treatment agent for thermally conductive polyorganosiloxane composition
US12503599B2 (en) 2020-03-16 2025-12-23 Dow Silicones Corporation Thermal conductive silicone composition

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JP5103364B2 (ja) * 2008-11-17 2012-12-19 日東電工株式会社 熱伝導性シートの製造方法
JP5154519B2 (ja) * 2009-07-24 2013-02-27 日東電工株式会社 光半導体素子封止材料
WO2010104534A1 (en) * 2009-03-12 2010-09-16 Dow Corning Corporation Thermal interface materials and mehtods for their preparation and use
JP5606104B2 (ja) * 2009-03-23 2014-10-15 株式会社アドマテックス 紫外線反射組成物及び紫外線反射成形品
JP5304588B2 (ja) * 2009-10-26 2013-10-02 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5418298B2 (ja) * 2010-02-26 2014-02-19 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5445415B2 (ja) * 2010-09-21 2014-03-19 信越化学工業株式会社 熱伝導性シリコーン接着剤組成物及び熱伝導性シリコーンエラストマー成形品
KR101305438B1 (ko) 2011-05-13 2013-09-06 현대자동차주식회사 폴리우레탄과 알루미늄의 접착을 위한 접착제
KR101413065B1 (ko) * 2013-03-04 2014-07-04 주식회사 에이치알에스 열전도성 액상 실리콘 점착제 조성물 및 이의 제조 방법
JP5853989B2 (ja) 2013-05-16 2016-02-09 信越化学工業株式会社 リアクトル用熱伝導性シリコーン接着剤組成物及びリアクトル
KR101598788B1 (ko) * 2014-03-31 2016-03-02 주식회사 에이치알에스 열전도성 액상 실리콘 점착제 조성물 및 이의 제조 방법
GB201603107D0 (en) 2016-02-23 2016-04-06 Dow Corning Low temperature cure silicone elastomer
CN111051433B (zh) 2017-07-24 2022-12-30 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
JP7033047B2 (ja) * 2018-10-26 2022-03-09 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
CN113166545B (zh) * 2018-12-29 2023-05-23 陶氏环球技术有限责任公司 包含mgo填料的导热组合物以及使用所述组合物的方法和装置
JP2021001239A (ja) * 2019-06-19 2021-01-07 信越化学工業株式会社 熱硬化型熱伝導性シリコーンゴム組成物
EP4025651A4 (en) * 2019-09-03 2023-07-05 Dow Silicones Corporation PROCESS FOR PRODUCTION OF ORGANOPOLYSILOXANE
US12441924B2 (en) * 2020-07-07 2025-10-14 Fuji Polymer Industries Co., Ltd. Thermally-conductive silicone gel composition, thermally-conductive silicone gel sheet, and method for producing same
EP4203012A4 (en) 2020-08-21 2024-10-09 Dow Toray Co., Ltd. CURABLE ORGANOPOLYSILOXANE COMPOSITION, THERMALLY CONDUCTIVE ELEMENT AND HEAT DISSIPATION STRUCTURE
CN114213851A (zh) * 2021-07-22 2022-03-22 苏州桐力光电股份有限公司 一种有机硅网络原位插层堆叠氧化铝材料及制备方法

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JP3846640B2 (ja) * 1994-01-20 2006-11-15 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JP4015722B2 (ja) * 1997-06-20 2007-11-28 東レ・ダウコーニング株式会社 熱伝導性ポリマー組成物
JP4255287B2 (ja) * 2001-05-14 2009-04-15 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP4588285B2 (ja) 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP4557136B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP5015436B2 (ja) * 2004-08-30 2012-08-29 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105164208B (zh) * 2013-05-07 2017-09-19 信越化学工业株式会社 导热性硅氧烷组合物及其固化物
CN105164208A (zh) * 2013-05-07 2015-12-16 信越化学工业株式会社 导热性硅氧烷组合物及其固化物
US11254849B2 (en) 2015-11-05 2022-02-22 Momentive Performance Materials Japan Llc Method for producing a thermally conductive polysiloxane composition
US11286349B2 (en) 2016-07-22 2022-03-29 Momentive Performance Materials Japan Llc Surface treatment agent for thermally conductive polyorganosiloxane composition
US11118056B2 (en) 2016-07-22 2021-09-14 Momentive Performance Materials Japan Llc Thermally conductive polysiloxane composition
CN108624060A (zh) * 2017-03-15 2018-10-09 信越化学工业株式会社 固晶用硅酮树脂组合物及固化物
CN108624060B (zh) * 2017-03-15 2021-03-19 信越化学工业株式会社 固晶用硅酮树脂组合物及固化物
CN110719939A (zh) * 2017-05-31 2020-01-21 迈图高新材料日本合同公司 导热性聚硅氧烷组合物
US11359124B2 (en) 2017-05-31 2022-06-14 Momentive Performance Materials Japan Llc Thermally conductive polysiloxane composition
CN110719939B (zh) * 2017-05-31 2022-02-18 迈图高新材料日本合同公司 导热性聚硅氧烷组合物
CN111094458B (zh) * 2017-07-24 2022-03-29 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
CN111051434B (zh) * 2017-07-24 2022-03-29 陶氏东丽株式会社 多成分硬化型导热性硅酮凝胶组合物、导热性部件及散热构造体
CN111094458A (zh) * 2017-07-24 2020-05-01 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
CN111051434A (zh) * 2017-07-24 2020-04-21 陶氏东丽株式会社 多成分硬化型导热性硅酮凝胶组合物、导热性部件及散热构造体
WO2021184149A1 (en) * 2020-03-16 2021-09-23 Dow Silicones Corporation Thermal conductive silicone composition
CN115210321A (zh) * 2020-03-16 2022-10-18 美国陶氏有机硅公司 导热有机硅组合物
US12503599B2 (en) 2020-03-16 2025-12-23 Dow Silicones Corporation Thermal conductive silicone composition

Also Published As

Publication number Publication date
KR20090130005A (ko) 2009-12-17
WO2008126658A1 (en) 2008-10-23
US20100140538A1 (en) 2010-06-10
JP2008239719A (ja) 2008-10-09
TW200902634A (en) 2009-01-16
EP2139950A1 (en) 2010-01-06

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