KR20090130005A - 실리콘 엘라스토머 조성물 및 실리콘 엘라스토머 - Google Patents

실리콘 엘라스토머 조성물 및 실리콘 엘라스토머 Download PDF

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Publication number
KR20090130005A
KR20090130005A KR1020097020110A KR20097020110A KR20090130005A KR 20090130005 A KR20090130005 A KR 20090130005A KR 1020097020110 A KR1020097020110 A KR 1020097020110A KR 20097020110 A KR20097020110 A KR 20097020110A KR 20090130005 A KR20090130005 A KR 20090130005A
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KR
South Korea
Prior art keywords
component
group
weight
sio
silicone elastomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020097020110A
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English (en)
Korean (ko)
Inventor
가즈히로 세키바
Original Assignee
다우 코닝 도레이 캄파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 다우 코닝 도레이 캄파니 리미티드 filed Critical 다우 코닝 도레이 캄파니 리미티드
Publication of KR20090130005A publication Critical patent/KR20090130005A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/014—Stabilisers against oxidation, heat, light or ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020097020110A 2007-03-26 2008-03-14 실리콘 엘라스토머 조성물 및 실리콘 엘라스토머 Withdrawn KR20090130005A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-080292 2007-03-26
JP2007080292A JP2008239719A (ja) 2007-03-26 2007-03-26 シリコーンエラストマー組成物およびシリコーンエラストマー

Publications (1)

Publication Number Publication Date
KR20090130005A true KR20090130005A (ko) 2009-12-17

Family

ID=39642618

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097020110A Withdrawn KR20090130005A (ko) 2007-03-26 2008-03-14 실리콘 엘라스토머 조성물 및 실리콘 엘라스토머

Country Status (7)

Country Link
US (1) US20100140538A1 (enExample)
EP (1) EP2139950A1 (enExample)
JP (1) JP2008239719A (enExample)
KR (1) KR20090130005A (enExample)
CN (1) CN101641412A (enExample)
TW (1) TW200902634A (enExample)
WO (1) WO2008126658A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8586187B2 (en) 2011-05-13 2013-11-19 Hyundai Motor Company Adhesives for bonding polyurethane and aluminum
KR101413065B1 (ko) * 2013-03-04 2014-07-04 주식회사 에이치알에스 열전도성 액상 실리콘 점착제 조성물 및 이의 제조 방법
KR20150113506A (ko) * 2014-03-31 2015-10-08 주식회사 에이치알에스 열전도성 액상 실리콘 점착제 조성물 및 이의 제조 방법

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5103364B2 (ja) * 2008-11-17 2012-12-19 日東電工株式会社 熱伝導性シートの製造方法
JP5154519B2 (ja) * 2009-07-24 2013-02-27 日東電工株式会社 光半導体素子封止材料
WO2010104534A1 (en) * 2009-03-12 2010-09-16 Dow Corning Corporation Thermal interface materials and mehtods for their preparation and use
JP5606104B2 (ja) * 2009-03-23 2014-10-15 株式会社アドマテックス 紫外線反射組成物及び紫外線反射成形品
JP5304588B2 (ja) * 2009-10-26 2013-10-02 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5418298B2 (ja) * 2010-02-26 2014-02-19 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5445415B2 (ja) * 2010-09-21 2014-03-19 信越化学工業株式会社 熱伝導性シリコーン接着剤組成物及び熱伝導性シリコーンエラストマー成形品
JP5843368B2 (ja) * 2013-05-07 2016-01-13 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5853989B2 (ja) 2013-05-16 2016-02-09 信越化学工業株式会社 リアクトル用熱伝導性シリコーン接着剤組成物及びリアクトル
US11254849B2 (en) 2015-11-05 2022-02-22 Momentive Performance Materials Japan Llc Method for producing a thermally conductive polysiloxane composition
GB201603107D0 (en) 2016-02-23 2016-04-06 Dow Corning Low temperature cure silicone elastomer
EP3489280B1 (en) 2016-07-22 2022-02-16 Momentive Performance Materials Japan LLC Surface treatment agent for thermally conductive polyorganosiloxane composition
TWI744361B (zh) 2016-07-22 2021-11-01 日商邁圖高新材料日本合同公司 熱傳導性聚矽氧烷組成物
JP6654593B2 (ja) * 2017-03-15 2020-02-26 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物及び硬化物
TWI746856B (zh) * 2017-05-31 2021-11-21 日商邁圖高新材料日本合同公司 熱傳導性聚矽氧烷組成物
CN111051433B (zh) 2017-07-24 2022-12-30 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
JP7094960B2 (ja) * 2017-07-24 2022-07-04 ダウ・東レ株式会社 多成分硬化型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
KR20200033274A (ko) * 2017-07-24 2020-03-27 다우 도레이 캄파니 리미티드 열전도성 실리콘 겔 조성물 열전도성 부재 및 방열 구조체
JP7033047B2 (ja) * 2018-10-26 2022-03-09 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
CN113166545B (zh) * 2018-12-29 2023-05-23 陶氏环球技术有限责任公司 包含mgo填料的导热组合物以及使用所述组合物的方法和装置
JP2021001239A (ja) * 2019-06-19 2021-01-07 信越化学工業株式会社 熱硬化型熱伝導性シリコーンゴム組成物
EP4025651A4 (en) * 2019-09-03 2023-07-05 Dow Silicones Corporation PROCESS FOR PRODUCTION OF ORGANOPOLYSILOXANE
WO2021184149A1 (en) * 2020-03-16 2021-09-23 Dow Silicones Corporation Thermal conductive silicone composition
US12441924B2 (en) * 2020-07-07 2025-10-14 Fuji Polymer Industries Co., Ltd. Thermally-conductive silicone gel composition, thermally-conductive silicone gel sheet, and method for producing same
EP4203012A4 (en) 2020-08-21 2024-10-09 Dow Toray Co., Ltd. CURABLE ORGANOPOLYSILOXANE COMPOSITION, THERMALLY CONDUCTIVE ELEMENT AND HEAT DISSIPATION STRUCTURE
CN114213851A (zh) * 2021-07-22 2022-03-22 苏州桐力光电股份有限公司 一种有机硅网络原位插层堆叠氧化铝材料及制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3846640B2 (ja) * 1994-01-20 2006-11-15 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JP4015722B2 (ja) * 1997-06-20 2007-11-28 東レ・ダウコーニング株式会社 熱伝導性ポリマー組成物
JP4255287B2 (ja) * 2001-05-14 2009-04-15 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP4588285B2 (ja) 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP4557136B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP5015436B2 (ja) * 2004-08-30 2012-08-29 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8586187B2 (en) 2011-05-13 2013-11-19 Hyundai Motor Company Adhesives for bonding polyurethane and aluminum
KR101413065B1 (ko) * 2013-03-04 2014-07-04 주식회사 에이치알에스 열전도성 액상 실리콘 점착제 조성물 및 이의 제조 방법
KR20150113506A (ko) * 2014-03-31 2015-10-08 주식회사 에이치알에스 열전도성 액상 실리콘 점착제 조성물 및 이의 제조 방법

Also Published As

Publication number Publication date
WO2008126658A1 (en) 2008-10-23
US20100140538A1 (en) 2010-06-10
JP2008239719A (ja) 2008-10-09
TW200902634A (en) 2009-01-16
CN101641412A (zh) 2010-02-03
EP2139950A1 (en) 2010-01-06

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20090925

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid