CN101630646B - 基板间的连接方法、倒装芯片安装体及基板间连接结构 - Google Patents

基板间的连接方法、倒装芯片安装体及基板间连接结构 Download PDF

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CN101630646B
CN101630646B CN200910142581.1A CN200910142581A CN101630646B CN 101630646 B CN101630646 B CN 101630646B CN 200910142581 A CN200910142581 A CN 200910142581A CN 101630646 B CN101630646 B CN 101630646B
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substrate
electrode
resin
stage portion
attachment
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CN101630646A (zh
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北江孝史
辛岛靖治
泽田享
中谷诚一
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

本发明公开了一种基板间的连接方法、倒装芯片安装体及基板间连接结构。将含有导电性粒子和气泡产生剂的树脂提供到分别有多个电极的基板之间后，对树脂加热，来使含在树脂中的导电性粒子熔化，并使气泡产生剂产生气泡。在至少一个基板上形成有台阶部，通过使气泡在对树脂加热的工序中成长，树脂就挤压到气泡外面，树脂中已熔化的导电性粒子由此诱导到电极间，形成接合体，而树脂诱导到基板间的台阶部之间的部位，通过树脂的固化固定基板。因此能够提供能实现可靠性高的安装体的基板间的连接方法。

Description

基板间的连接方法、倒装芯片安装体及基板间连接结构
技术领域
本发明涉及一种形成有多个电极的基板间的连接方法、以及利用该连接方法形成的倒装芯片安装体及基板间连接结构。
背景技术
近年来，随着用于电子设备的半导体集成电路(LSI)、电路基板及电子部件等的高密度化，所述半导体集成电路、电路基板及电子部件等的电极的多管脚(pin)化和间距狭窄化正在急剧发展。在安装这些电子部件的工序中，要求适应于很窄的间距、实现很短的节拍时间(tact time)、以及一并形成接合体等等。
针对所述要求，本申请发明者们提案过一种使用含有导电性粒子及气泡产生剂的树脂的倒装芯片安装方法，作为下一代安装方法(专利文献1)。
图13(a)到图13(d)是剖视图，显示在专利文献1中公开的倒装芯片安装方法的基本工序。
如图13(a)所示，在向具有多个连接端子102的电路基板101与具有多个电极端子104的半导体芯片103之间提供含有导电性粒子106及气泡产生剂(未图示)的树脂105后，如图13(b)所示，对树脂105加热，使树脂105中的气泡产生剂产生气泡110。此时，树脂105被成长的气泡110挤压到气泡的外面，由此自集合到连接端子102与电极端子104之间，如图13(c)所示。之后，如图13(d)所示，通过对树脂105进一步加热，来使自集合到端子102、104之间的树脂105中的导电性粒子106熔化，在端子102、104之间形成接合体107。这样，就能够得到端子102、104经由接合体107互相电连接的倒装芯片安装体。补充说明一下，该方法也能够应用于安装有电子部件的基板相互间的连接等。
(专利文献1)国际公开公报第2006/103948号手册
-发明要解决的技术问题-
所述方法利用气泡产生剂所产生的气泡110的成长给树脂105提供向端子102、104之间移动的移动力，因而该方法适于间隔较窄的端子间的连接。此外，诱导到端子间的树脂105由于表面张力而能够稳定地留在端子间，而且，自集合到端子间的树脂105中的导电性粒子106能够通过熔化而润湿扩散到端子间。因此，能够在端子间形成稳定的接合体107。
在此，在所述方法中，未自集合到端子间的树脂105优选挤压到未形成端子的电路基板101及半导体芯片103(以下，将该电路基板101及该半导体芯片103简称为“基板”)的边缘部分，然而在有些情况下会残存于基板之间的端子间以外的区域。在这种情况下，根据树脂105残存于基板间的哪个部位而有影响到倒装芯片安装体(或电子部件安装体)的可靠性之虞。
例如，若树脂105残存于形成有接合体107的端子间部位的附近，就根据树脂105的组成有出现下述情况之虞，即：由于存在于树脂105中的杂质，在接合体107的相互间造成电化学迁移所导致的绝缘不良。
此外，如图13(d)所示，即使树脂105挤压到基板边缘部分，该树脂105也会起到好像是密封部件一样的作用从而在基板之间形成封闭空间，在这种情况下，在树脂105中产生的气泡110会留在封闭空间内。在这种状况下，有出现下述情况之虞，即：例如当倒装芯片安装体二次安装在其它电路基板等上时，积存在气泡110中的湿气会由于再加热而造成蒸汽爆破等，结果导致连接不良。
然而，在所述方法中未考虑过下述问题，即：当使树脂105自集合到端子间时，挤压到端子间以外的部位的树脂105残存于基板间的哪个部位。
发明内容
本发明正是为解决上述问题而研究开发出来的。其主要目的在于：在使含于树脂中的导电性粒子自集合到端子间而在端子间形成接合体从而在基板间进行电连接的方法中，提供一种能够诱导并控制挤压到端子间以外的部位的树脂，使该树脂到达规定的区域，由此实现可靠性很高的安装体的基板间的连接方法。
-用以解决技术问题的技术方案-
为达成上述目的，本发明所涉及的基板间的连接方法采用了下述方法，即：通过在形成于基板上的电极以外的规定部位设台阶部，对提供到基板间并含有导电性粒子和气泡产生剂的树脂加热而使该树脂的温度成为导电性粒子熔化的温度，来在电极间自集合性地形成接合体。
根据所述方法，通过对树脂加热，使含在树脂中的气泡产生剂产生气泡，树脂就挤压到气泡的外面。由此，树脂向电极间或形成有台阶部的基板间部位(狭窄缝隙区)被诱导。含在诱导到电极间的树脂中的已熔化的导电性粒子在电极表面上润湿扩散，结果接合体形成在电极间。另一方面，在树脂中产生的气泡被诱导到除了基板间的电极间或形成有台阶部的部位以外的部位(宽阔缝隙区)。此外，诱导到电极间的树脂随着在电极间形成接合体而从电极间被驱赶，结果该树脂更多地诱导向形成有台阶部的基板间部位。
也就是说，树脂虽然利用毛细现象诱导向间隔较窄的电极间或形成有台阶部的基板间部位，但是在电极间利用可湿性(wettability)优选地诱导导电性粒子，其结果是，树脂与上述诱导相反地诱导向形成有台阶部的基板间部位。另一方面，气泡利用表面张力优选地诱导向除了基板间的电极间和台阶部以外的间隔较宽的部位。能够利用所述性质对树脂、导电性粒子及气泡进行诱导及控制，来使该树脂、该导电性粒子及该气泡分别到达基板间的各自的规定区域。
本发明所涉及的基板间的连接方法是下述基板间的连接方法，即：与具有多个第一电极的第一基板相向地配置具有多个第二电极的第二基板，使第一电极及第二电极经由接合体电连接。所述基板间的连接方法包括工序(a)、工序(b)及工序(c)，在该工序(a)中向第一基板与第二基板之间提供含有导电性粒子和气泡产生剂的树脂，在该工序(b)中对树脂加热，来使含在该树脂中的导电性粒子熔化，并使含在树脂中的气泡产生剂产生气泡，在该工序(c)中使树脂固化。在第一基板及第二基板中的至少一个基板上形成有台阶部；在工序(b)中，树脂通过气泡的成长被挤压到该气泡的外面，由此树脂中的已熔化的导电性粒子被诱导到第一电极与第二电极之间，在该第一电极与该第二电极之间形成由已熔化的导电性粒子形成的接合体，树脂被诱导到位于台阶部的第一基板与第二基板之间的部位；在所述工序(c)中，使树脂固化，由此将第一基板及第二基板固定在一起。
在一优选实施方式中，在所述工序(b)中，第一基板与第二基板之间的至少电极间以外的区域成为树脂被气泡挤出而形成的第一空洞部。
在一优选实施方式中，所述多个第一电极及所述多个第二电极呈阵列状地形成在第一基板及第二基板上；所述台阶部形成为包围呈阵列状的电极区域的环状。
在一优选实施方式中，在形成为所述环状的所述台阶部的一部分设有缝隙，第一基板与第二基板之间的形成有该缝隙的部位上的区域成为树脂被气泡挤出而形成的第二空洞部；第一空洞部经过第二空洞部与外部连通。
在一优选实施方式中，所述多个第一电极及所述多个第二电极形成为相互平行的线状；所述台阶部，与所述多个第一电极及所述多个第二电极平行地形成在呈线状的电极区域的外边。
在一优选实施方式中，所述多个第一电极及所述多个第二电极形成为相互平行的线状；所述台阶部形成为与呈线状的多个第一电极及多个第二电极垂直。
在一优选实施方式中，所述台阶部由与第一电极及第二电极的材料相比被已熔化的导电性粒子润湿时的可湿性更低的材料形成。
在一优选实施方式中，位于所述台阶部的第一基板与所述第二基板之间的距离小于导电性粒子的平均粒径。
在一优选实施方式中，位于所述台阶部的第一基板与第二基板之间的距离在位于未形成台阶部的部位的第一基板与第二基板之间的距离的二分之一以下。
在一优选实施方式中，第一基板及第二基板中的至少一个基板包括产生气泡的气泡产生源，来代替使所述树脂含有气泡产生剂；在所述工序(b)中，气泡产生源产生气泡。
在一优选实施方式中，所述第一基板及所述第二基板由电路基板或半导体芯片构成。
本发明所涉及的倒装芯片安装体是在电路基板上安装有半导体芯片的倒装芯片安装体。在电路基板及半导体芯片中，形成在该电路基板及该半导体芯片上的电极利用所述本发明所涉及的基板间的连接方法经由接合体互相电连接。
本发明所涉及的基板间连接结构，是具有多个电极的电路基板互相电连接而成的基板间连接结构。电路基板利用所述本发明所涉及的基板间的连接方法经由形成在多个电极之间的接合体互相电连接。
本发明所涉及的其它基板间连接结构是下述基板间连接结构，即：与具有多个第一电极的第一基板相向地配置具有多个第二电极的第二基板，并使所述第一及第二电极经由由金属形成的接合体互相电连接而成。在第一基板及第二基板中的至少一个基板上形成有台阶部，在该台阶部上，第一基板及第二基板由树脂粘结在一起；第一基板与第二基板之间的第一及第二电极之间以外的区域成为空洞部。
在一优选实施方式中，所述空洞部的至少一部分与外部连通。
在一优选实施方式中，形成在所述第一基板及所述第二基板中的至少一个基板上的台阶部形成在该至少一个基板的边缘部分。
在一优选实施方式中，与台阶部的表面相比，所述第一及第二电极的表面被金属润湿时的可湿性更高，而被树脂润湿时的可湿性更低。
在一优选实施方式中，位于所述台阶部的第一基板与第二基板之间的距离短于位于第一及第二电极的第一基板与第二基板之间的距离。
本发明所涉及的其它倒装芯片安装体是下述倒装芯片安装体，即：与具有多个第一电极的半导体芯片相向地配置具有多个第二电极的基板，并使第一及第二电极经由接合体互相电连接而成。在半导体芯片及基板中的至少一个部件上形成有台阶部，在该台阶部上，半导体芯片和基板由树脂粘结在一起；半导体芯片与基板之间的第一及第二电极之间以外的区域成为空洞部。
在一优选实施方式中，所述空洞部的至少一部分与外部连通。
在一优选实施方式中，所述多个第一电极和所述多个第二电极呈阵列状地形成在半导体芯片和基板上；台阶部形成为包围呈阵列状的电极区域的环状；在形成为该环状的台阶部的一部分设有缝隙。
-发明的效果-
根据本发明，在基板的电极以外的部位上设台阶部，对提供到基板间的含有导电性粒子和气泡产生剂的树脂加热，来使该树脂的温度成为导电性粒子熔化的温度。这样，就能够使基板经由形成在电极间的接合体互相电连接，并利用形成在基板间的电极间以外的部位的空洞部使接合体相互之间电绝缘，并且，使基板通过形成在台阶部上的树脂互相固定在一起。这样，即使电极间的间距狭窄，就也能够实现可靠性很高的基板间连接。
附图说明
图1(a)到图1(d)是剖视图，显示本发明的第一实施方式中的基板间的连接方法的工序。
图2(a)到图2(c)是显示本发明的第一实施方式中的基板间的连接方法的图，图2(a)是其俯视图；图2(b)是图2(a)在IIb-IIb线上的剖视图；图2(c)是图2(a)在IIc-IIc线上的剖视图。
图3是剖视图，显示本发明的第一实施方式的变形例中的基板间连接结构的构成。
图4(a)到图4(c)是显示本发明的第一实施方式的变形例中的基板间的连接方法的图，图4(a)是其俯视图；图4(b)是图4(a)在IVb-IVb线上的剖视图；图4(c)是图4(a)在IVc-IVc线上的剖视图。
图5(a)到图5(c)是显示本发明的第二实施方式中的基板间的连接方法的图，图5(a)是其立体图；图5(b)是图5(a)在Vb-Vb线上的剖视图；图5(c)是图5(a)在Vc-Vc线上的剖视图。
图6(a)到图6(c)是显示本发明的第二实施方式的变形例中的基板间的连接方法的图，图6(a)是其立体图；图6(b)是图6(a)在VIb-VIb线上的剖视图；图6(c)是图6(a)在VIc-VIc线上的剖视图。
图7(a)到图7(c)是显示本发明的第二实施方式的变形例中的基板间的连接方法的图，图7(a)是其立体图；图7(b)是图7(a)在VIIb-VIIb线上的剖视图；图7(c)是图7(a)在VIIc-VIIc线上的剖视图。
图8(a)和图8(b)是剖视图，显示本发明的第二实施方式的变形例中的基板间的连接方法。
图9(a)和图9(b)是显示本发明的第三实施方式中的基板间的连接方法的图，图9(a)是其俯视图；图9(b)是图9(a)在IXb-IXb线上的剖视图。
图10是俯视图，显示本发明的第六实施例中的基板间的连接方法。
图11是显示本发明的各个实施例及各个比较例中的安装体的主要构成条件的图。
图12(a)到图12(c)是显示观察第四实施例的安装体的剖面而得到的结果的图，图12(a)是安装体的剖视图，图12(b)是安装体在图12(a)的箭头A所示的区域中的剖面X光照片；图12(c)是安装体在图12(a)的箭头B所示的区域中的剖面X光照片。
图13(a)到图13(d)是剖视图，显示现有倒装芯片安装方法的基本工序。
-符号说明-
10-第一基板；11-第一电极；12-第二基板；13-第二电极；14-树脂；15-导电性粒子；16、17-台阶部；20-气泡；20a、20b-空洞部；21-接合体。
具体实施方式
下面，参照附图对本发明的实施方式加以说明。在以下附图中，用同一参照符号表示本质上具有同一功能的构成因素，以简化说明。补充说明一下，本发明并不限于下列实施方式。
(第一实施方式)
图1(a)到图1(d)是剖视图，显示发明的第一实施方式中的基板间的连接方法的工序。
如图1(a)所示，向形成有多个第一电极11的第一基板10提供含有导电性粒子15和气泡产生剂(未图示)的树脂14，再对形成有多个第二电极13的第二基板12定位并进行配置。在此，将未形成电极11、13的部位上的第一基板10与第二基板12之间的基板间距离设为L1。
在第一基板10及第二基板12的相向的位置上分别设有台阶部16、17，该台阶部16、17之间的基板间距离L2窄于L1。补充说明一下，台阶部16、17只要设在第一基板10及第二基板12中的一个基板上就可以。此外，不需要将树脂14在电极11上涂成图案状，而只要均匀地涂在第一基板10上就可以。
接着，如图1(b)所示，对树脂14加热，来使含在树脂14中的导电性粒子15熔化，并使气泡产生剂产生气泡20。补充说明一下，例如也可以采用在基板中设气泡产生源而使该气泡产生源产生气泡20的方法，来代替使树脂14包含气泡产生剂。可以事先使加热后产生气泡的成分含在基板中，来作为气泡产生源，所述加热后产生气泡的成分例如有水分以及丁基卡必醇(Butyl Carbitol)等蒸发型气体产生剂等等。此外，也可以使加热后分解从而产生气泡的分解型气体产生剂(氢氧化铝或铝酸钙等)含在基板中。
产生的气泡20由于表面张力而集合到间隙较宽的部位。也就是说，气泡20要集合到基板间距离为L1的区域(宽阔缝隙区)。此外，由于气泡20的产生，含有已熔化的导电性粒子15的树脂14诱导向电极11、13之间(狭窄缝隙区)，进行自集合。当导电性粒子为焊锡粉等金属粒子时，已熔化的导电性粒子15在电极11、13的表面上进行润湿扩散。
如图1(c)所示，在润湿扩散发展的情况下，第一电极11和第二电极13连接，形成电连接起来的接合体21。另一方面，随着接合体21的形成，树脂14逐渐从电极11、13之间被驱赶。
反复进行所述步骤，逐渐进行气泡20的产生和接合体21的形成。在此，如图1(d)所示，在从电极11、13之间被驱赶后的树脂14受气泡20的力量而移动的过程中，该树脂14中的大部分由于毛细现象而诱导向窄于基板间距离L1的基板间距离为L2的区域即台阶部16、17之间。最后，通过使诱导到台阶部16、17之间的树脂14固化，来使基板10、12互相固定在一起。
通过以上工序，在电极11、13之间选择性地形成接合体21，在台阶部16、17之间选择性地形成树脂14，并在基板10、12之间的电极11、13之间以外的部位选择性地形成气泡20，完成基板10、12之间的连接。
在利用所述方法构成的基板间连接结构下，基板10、12之间的电极11、13之间以外的区域成为空洞部，树脂14不会残存于接合体21的附近。因此，能够防止接合体21之间造成电化学迁移所导致的绝缘不良。反过来说，能够以比绝缘可靠性还优选粘结强度或其它特性的立场选择树脂14，可供选择的材料种类增多。此外，在台阶部16、17上，基板10、12由树脂14粘结在一起，因此能够确实地进行基板10、12之间的粘结。
补充说明一下，在本发明中，“基板间的电极间以外的区域”不一定是指基板间的所有区域，而也包括下述情况，即：在不失去防止造成电化学迁移所导致的绝缘不良的效果的范围内，树脂14残存于局部区域的情况。
此外，在本发明中，不一定需要树脂14在所有台阶部16、17上介于基板10、12之间。此外，也可以树脂14不存在于台阶部16、17的整个面上。
此外，因为使基板10、12互相粘结起来的树脂14诱导到基板间距离L2较窄的台阶部16、17之间，所以能够将树脂14形成得薄(例如厚度在50μm以下)。因此，与未设台阶部16、17的情况相比，更不易造成树脂14中的内聚破坏(cohesion failure)(不是树脂14在界面剥离，而是树脂14中的局部造成破损)，因而能够增高粘结强度。反过来说，能够以比粘结强度还优选绝缘可靠性或其它特性的立场选择树脂14的成分，可供选择的材料种类增多。
补充说明一下，台阶部16、17上的第一基板10与第二基板12之间的距离(即，树脂14的厚度)优选小于第一及第二电极11、13之间的第一基板10与第二基板12之间的距离(即，接合体21的厚度)。这样，就能够进一步增高树脂14的粘结强度。
此外，能够预测到下述事情，即：一般来讲，若使树脂14含有填料等其它固体成分，粘结强度会下降。但是，即使在这种形态下，也能够确保树脂14的粘结强度。因此，能够添加填料。补充说明一下，当添加填料时，填料的平均粒径优选在台阶部16、17之间的基板间距离L2以下。这样，就能够将添加有填料的树脂14诱导向台阶部16、17之间。例如可以添加下列填料，即：为抑制线膨张系数所添加的氧化铝等无机填料，以及为电磁兼容(EMC)用屏蔽(shield)所添加的铜、镍或碳等金属填料。补充说明一下，在采用金属填料时，优选采用熔点高于导电性粒子15的熔点的材料。这样，就能够使导电性粒子15自集合到电极11、13之间，并将添加有金属填料的树脂14诱导向台阶部16、17之间。补充说明一下，即使金属填料混入电极11、13之间也没有问题。
此外，根据本发明的方法，在用聚酰亚胺基板作为基板的情况下，即使安装由与聚酰亚胺基板粘结时的粘结性低的材料构成的电子部件的情况下，也能够确保粘结强度。也就是说，通过选出与聚酰亚胺基板粘结时的粘结性高的材料并用该材料作为台阶部16、17，则即使不选出提高与聚酰亚胺粘结时的粘结性的材料并用该材料作为树脂14，也能够确保足够的粘结强度。反过来说，能够以比粘结强度还优选其它特性的立场选择树脂14，可供选择的材料种类增多。
图2(a)到图2(c)是显示多个电极11、13形成为阵列状的情况下的基板间的连接方法的图，图2(a)是其俯视图；图2(b)是图2(a)在IIb-IIb线上的剖视图；图2(c)是图2(a)在IIc-IIc线上的剖视图。
如图2(a)所示，形成有包围阵列状电极11、13的环状台阶部16、17，在该台阶部16、17中的一部分设有缝隙。这样，形成有缝隙的部位上的基板10、12之间就成为树脂14被气泡20挤出而成的空洞部20b。形成在基板10、12之间的电极11、13之间以外的部位的空洞部20a经过空洞部20b与外部连通。
在上述结构下，在吸湿回流(moisture/reflow sensitivity)可靠性方面也能够确保优良的质量。也就是说，因为形成在基板10、12之间的空洞部20a与外部连通，所以湿气不易残留在该空洞部20a内，此外，也能够使在急剧加热时蒸发的水分向外部散去。因此，气压的上升程度很小，能够防止连接不良。
补充说明一下，形成在基板10、12之间的空洞部20a不需要一定连续不断地连接在一起，而只要一部分空洞部20a经过空洞部20b与外部连通就可以。此外，在吸湿回流可靠性方面是否适宜是根据与外部连续地连接的空洞部20a的比例、树脂14的透湿度及粘结强度等因素而有很大的差异的。能够根据应用形态和试验条件等适宜地决定该比例。特别是，从吸湿回流可靠性的角度来看，更优选的是所有空洞部20a与外部连通。这时，从绝缘可靠性的角度来看，也能够在形成于基板10、12之间的空洞部20a中降低露水凝结量和水分吸附量，因此湿气不易残存于该空洞部20a内，能够提高绝缘可靠性。
如图3所示，在本发明中，也可以仅在第一基板10及第二基板12中的一个基板上设台阶部(在图3中示出的是在第一基板10上设有台阶部16的例子)。此外，即使树脂14残存于形成在基板10、12之间的电极11、13之间以外的部位的空洞部20的一部分，也不会失去防止造成电化学迁移所导致的绝缘不良的效果。
此外，因为台阶部16、17形成在基板10、12的边缘部分，所以诱导到台阶部16、17之间的树脂14也起到缓冲件的作用。因此，即使冲击施加在基板间连接结构上，存在于基板10、12的边缘部分的树脂14也使冲击缓和，因而能够得到可靠性很高的基板间连接结构。
此外，在本发明中，第一基板10和第二基板12的尺寸并不限于如图2(a)到图2(c)中所示的大小相同的尺寸，而该尺寸也可以是这样的，即：如图4(a)到图4(c)所示，第一基板10的尺寸大于第二基板12的尺寸。在此，图4(a)是基板间连接结构的俯视图；图4(b)是图4(a)的IVb-IVb线上的剖视图；图4(c)是图4(a)的IVc-IVc线上的剖视图。补充说明一下，在本例中，台阶部16仅形成在第一基板10上，如图4(b)所示。
补充说明一下，在两个基板10、12上设台阶部16、17时，不一定需要使台阶部16、17的高度相同。能够例如通过在基板10、12上的规定区域上事先形成抗蚀图案或覆盖层等，来设台阶部16、17。或者，也可以在安装时设置薄膜状树脂(处于B阶(B-stage)等的树脂或已固化的树脂薄膜)、液状树脂(热固性树脂等)或板状无机材料(陶瓷或金属材料)等等。在这种情况下，也可以选出台阶部16、17本身随着对树脂14的加热与第一基板10或第二基板12粘结的材料。此外，不一定需要台阶部16、17的材料相同。
台阶部16、17上的基板间距离L2优选在未形成电极11、13的部位上的基板间距离L1的二分之一以下。这样，树脂14就更容易诱导向台阶部16、17之间。此外，基板间距离L2优选在导电性粒子15的平均粒径以下。这样，导电性粒子15就不易进入台阶部16、17之间，结果容易向电极11、13之间自集合。补充说明一下，一部分导电性粒子15混入诱导到台阶部16、17之间的树脂14中也无妨。
此外，能够采用的在维持规定的基板间距离L1和L2的状态下保持第一基板10和第二基板12的方法例如有：机械性地吸附或抓住基板10、12的方法，以及使具有均匀的规定粒径的粒子或线状物夹在基板10、12之间的一部分的方法等等。
在此，例如可以用焊锡粉作为本发明中的导电性粒子15。不问焊锡粉的种类，例如可以采用SnPb等现有含铅焊锡，以及SnAgCu、SnAg、SnAgBiIn、SnSb或SnBi等无铅焊锡等等。此外，也不问焊锡粉的大小，优选采用平均粒径在1μm到50μm左右的范围内的焊锡粉。补充说明一下，第一电极11及第二电极13被导电性粒子15润湿时的可湿性高于第一基板10及第二基板12被导电性粒子15润湿时的可湿性。
能够用作本发明中的树脂14的例如有：环氧树脂、酚醛树脂、硅树脂(silicone resin)或三聚氰胺树脂等热固性树脂，以及聚酰胺、聚碳酸酯、聚对苯二甲酸乙二醇酯或聚苯硫醚等热塑性树脂等等。此外，在有清洗工序的情况下，还可以使用硅油、甘油类、以及碳化氢系列的油等等。
本发明中的第一基板10和第二基板12只要由电路基板、半导体芯片、模块部件或无效部件等大致平坦的基板构成就不受限制。例如，能够通过使电路基板及半导体芯片接合起来而形成倒装芯片安装体。此外，能够通过使电路基板及电路基板接合起来而制成基板间连接结构。
本发明中的第一电极11及第二电极13的形状并不受限制，例如可以用圆形电极或线状电极作为该第一电极11和该第二电极13。此外，电极11、13的材料并不受限制，例如可以采用金、银、铜、焊锡及钯等等。因为这些材料被导电性粒子15润湿时的可湿性很良好，所以促进导电性粒子15向电极11、13之间自集合。
补充说明一下，本实施方式中所述的导电性粒子15的“自集合”是指：将均匀地分散有导电性粒子15的树脂14均匀地涂在包括多个电极11、13在内的基板10、12之间，再通过对树脂14的加热在树脂14中产生气泡20，利用气泡20将导电性粒子15诱导向电极11、13之间，来形成接合体21。
(第二实施方式)
图5(a)到图5(c)是显示本发明的第二实施方式中的基板间的连接方法的图，图5(a)是其立体图；图5(b)是图5(a)的Vb-Vb线上的剖视图；图5(c)是图5(a)的Vc-Vc线上的剖视图。补充说明一下，在本实施方式中，用相同的符号表示与第一实施方式的构成因素相同的构成因素。此外，不特别说明的部分就与第一实施方式一样，省略该部分的详细说明。
如图5(a)所示，在第一基板10上形成有多个线状第一电极11，在该多个线状第一电极11的外边形成有与第一电极11平行的台阶部16。同样，在第二基板12上形成有多个线状第二电极13，在该多个线状第二电极13的外边形成有与第二电极13平行的台阶部17。
如图5(b)所示，在本实施方式中，第一基板10和第二基板12经由形成在线状电极11、13之间的接合体21电连接起来，并且由诱导到形成为线状的台阶部16、17之间的树脂14机械粘结在一起。
本实施方式例如可以应用于电路基板互相电连接的基板间连接结构，如图5(b)所示，形成在电极11、13之间的接合体21由于形成在基板10、12之间的电极11、13之间以外的部位的空洞部20而互相绝缘，因而在绝缘可靠性方面很优良。此外，如图5(c)所示，因为空洞部20与外部连通，所以湿气不易残留在空洞部20内，此外还能够使急剧加热时蒸发的水分向外部散去。因此，气压上升得少，能够防止连接不良。
补充说明一下，在本实施方式中，第一基板10和第二基板12并不限于如图5(a)到图5(c)所示的具有大小相同的尺寸的基板，例如也可以使第一基板10的尺寸比第二基板12的尺寸大，如图6(a)到图6(c)所示。在此，图6(a)是基板间连接结构的立体图；图6(b)是图6(a)的VIb-VIb线上的剖视图；图6(c)是图6(a)的VIc-VIc线上的剖视图。
此外，如图7(a)到图7(c)所示，在本实施方式中也可以将台阶部16、17形成为与线状第一及第二电极11、13垂直。
此外，如图8(a)和图8(b)所示，即使树脂14残存于形成在基板10、12之间的电极11、13之间以外的区域的空洞部20的一部分，也不会失去防止造成电化学迁移所导致的绝缘不良的效果。
(第三实施方式)
图9(a)和图9(b)是显示本发明的第三实施方式中的基板间的连接方法的图，图9(a)是其俯视图；图9(b)是图9(a)的IXb-IXb线上的剖视图。补充说明一下，在本实施方式中，用相同的符号表示与第一实施方式的构成因素相同的构成因素。此外，不特别说明的部分就与第一实施方式一样，省略该部分的详细说明。
如图9(a)所示，在第一基板10上形成有呈阵列状的多个第一电极11，在相邻的第一电极11之间形成有呈阵列状的多个台阶部16。同样，在第二基板12上形成有呈阵列状的多个第二电极13，在相邻的第二电极13之间形成有呈阵列状的多个台阶部17。
如图9(b)所示，在本实施方式中，第一基板10和第二基板12经由形成在阵列状电极11、13之间的接合体21电连接起来，并且由诱导到形成为阵列状的台阶部16、17之间的树脂14机械粘结在一起。
在本实施方式中，基板10、12之间在基板10、12的内边也由诱导到形成为阵列状的台阶部16、17之间的树脂14粘结在一起。因此，能够实现机械可靠性很高的基板间的连接。
<实施例>
下面，举出本发明的实施例进一步说明本发明的结构和效果，本发明并不限于这些实施例。
(第一实施例)
用电路基板作为第一基板10，用半导体芯片作为第二基板12，并利用图1(a)到图1(d)中所示的基板间的连接方法制作了电路基板及半导体芯片的倒装芯片安装体。
补充说明一下，使用了下述电路基板，即：该电路基板的大小为10mm×10mm、电极有100μmφ、间距为200μm并且电极数为3×3＝9个的积层(build-up)基板。此外，使用了下述半导体芯片，即：电极有100μmφ、间距为200μm并且电极数为3×3＝9个的测试单元组(TEG：test element group)芯片。
在电路基板上设了具有图2(a)中所示的图案的台阶部16。利用阻焊剂形成台阶部16，该台阶部16的尺寸是宽度为4.6mm且厚度为20μm，阻焊剂端部与电极之间的距离为150μm。另一方面，在半导体芯片上未设高低差。
用下述物质作为树脂14，即：将重量百分比为49％的含有咪唑(imidazole)系列固化剂(四国化成工业株式会社(Shikoku ChemicalsCorporation)制)及羟酸系列助焊剂的双酚F型环氧系列树脂(Epicoat806：日本环氧树脂株式会社(Japan Epoxy Resins Co.，Ltd.)制)、重量百分比为50％的作为导电性粒子15的焊锡粉(SnAgCu：平均粒径为30μm)以及重量百分比为1％的作为气泡产生剂的二乙二醇二甲醚(diethyleneglycol dimethyl ether)(和光纯药工业株式会社(WakoPure ChemicalIndustries，Ltd.)制)混合而成的物质。
将该树脂涂在电路基板上，再以电路基板的电极和半导体芯片的电极相向的方式将半导体芯片定位并安装在该电路基板上。此时，以来形成电极的部位上的基板间距离L1为70μm且位于台阶部的基板间距离L2为50μm的方式对电路基板及半导体芯片进行了固定。
在该状态下，对树脂加热而使该树脂的温度成为250℃，来使焊锡粉熔化，并使气泡产生剂产生气泡。这样来使焊锡粉自集合到电极间，形成接合体，并将树脂诱导到台阶部。
最后，使树脂固化，使电路基板及半导体芯片由诱导到台阶部上的树脂粘结在一起。
(第二实施例)
利用与第一实施例一样的部件和方法，制作了电路基板及半导体芯片的倒装芯片安装体。
在电路基板上设了具有图2(a)中所示的图案的台阶部16。利用阻焊剂形成台阶部16，该台阶部16的尺寸是宽度为4.4mm且厚度为30μm，阻焊剂端部与电极之间的距离为150μm。另一方面，在半导体芯片上也设了具有图2(a)中所示的图案的台阶部17。利用印刷法用酸酐系列环氧树脂形成了台阶部17。该台阶部17的尺寸是宽度为4.3mm且厚度为15μm，台阶部17与电极之间的距离为450μm。以未形成电极的部位上的基板间距离L1为65μm且位于台阶部的基板间距离L2为20μm的方式将电路基板及半导体芯片固定在一起，来进行了基板间的连接。
(第三实施例)
用电路基板作为第一基板10及第二基板12，并利用图1(a)到图1(d)中所示的基板间的连接方法制作了电路基板互相连接的基板间连接结构。
使用了下述电路基板，即：该电路基板的大小为10mm×20mm，具有宽度为50μm的线状电极，间距为100μm并且电极数为30根的柔性(flexible)基板。
此外，在电路基板上设了具有图5(a)中所示的图案的台阶部16、17。以覆盖层用薄膜形成台阶部16、17，该台阶部16、17的尺寸是2.5mm(与电极垂直的方向)×1.5mm(与电极平行的方向)且厚度为10μm。此外，覆盖层用薄膜端部与电极之间的距离大约为1mm。
用下述物质作为树脂，即：将重量百分比为44％的含有咪唑系列固化剂(四国化成工业株式会社制)及羟酸系列助焊剂的双酚F型环氧系列树脂(Epicoat 806：日本环氧树脂株式会社制)、重量百分比为55％的作为导电性粒子的焊锡粉(SnAgCu：粒径为20μm)以及重量百分比为1％的作为气泡产生剂的二乙二醇二甲醚(和光纯药工业株式会社制)混合而成的物质。
以未形成电极的部位上的基板间距离L1为25μm且位于台阶部的基板间距离L2为5μm的方式使电路基板互相固定在一起，再在该状态下对树脂加热而使该树脂的温度成为250℃，由此使电路基板互相接合起来。
(第四实施例)
除了下述事项以外，都利用与第三实施例相同的部件和方法，构成了电路基板互相连接起来的基板间连接结构，该事项是：第一及第二电路基板的台阶厚度为15μm，未形成电极的部位上的基板间距离L1为50μm，位于台阶部的基板间距离L2为20μm并且焊锡粉的粒径为25μm。
(第五实施例)
用电路基板作为第一基板10及第二基板12，并利用图1(a)到图1(d)中所示的基板间的连接方法构成了电路基板互相连接的基板间连接结构。
使用了下述电路基板，即：该电路基板的大小为10mm×20mm，具有宽度为100μm的线状电极，间距为200μm并且电极数为20根的柔性基板。
此外，在电路基板上设了具有图7(a)中所示的图案的台阶部16、17。以覆盖层用薄膜形成台阶部，该台阶部的尺寸是10mm(与电极垂直的方向)×10mm(与电极平行的方向)且厚度为15μm。
用下述物质作为树脂，即：将重量百分比为44％的含有咪唑系列固化剂(四国化成工业株式会社制)及羟酸系列助焊剂的双酚F型环氧系列树脂(Epicoat 806：日本环氧树脂株式会社制)、重量百分比为55％的作为导电性粒子的焊锡粉(SnAgCu：粒径为20μm)以及重量百分比为1％的作为气泡产生剂的二乙二醇二甲醚(和光纯药工业株式会社制)混合而成的物质。
以未形成电极的部位上的基板间距离L1为40μm且位于台阶部的基板间距离L2为10μm的方式使电路基板互相固定在一起，再在该状态下对树脂加热而使该树脂的温度成为250℃，由此使电路基板互相接合起来。
(第六实施例)
除了下述事项以外，都利用与第一实施例相同的部件和方法，制作了电路基板及半导体芯片的倒装芯片安装体，该事项是：采用具有图10中所示的图案的台阶部，来代替具有图2(a)中所示的图案的台阶部16。
(第一比较例)
除了下述事项以外，都利用与第一实施例相同的部件和方法，制作了电路基板及半导体芯片的倒装芯片安装体，该事项是：在第一基板10和第二基板12上不设台阶部16、17。补充说明一下，未形成电极的部位上的基板间距离L1为60μm。
(第二比较例)
除了下述事项以外，都利用与第三实施例相同的部件和方法，构成了电路基板互相连接的基板间连接结构，该事项是：在第一基板10和第二基板12上不设台阶部16、17。补充说明一下，未形成电极的部位上的基板间距离L1为60μm。
图11中表示在所述第一到第六实施例以及第一及第二比较例中制作出的倒装芯片安装体或基板间连接结构(以下，将这些倒装芯片安装体及基板间连接结构简称为“安装体”)的主要构成条件。
<接合体的剖面观察等>
首先，用X射线对形成于在所述第一到第六实施例以及第一及第二比较例中制作出的安装体的电极间的接合体进行了剖面观察。
其结果是，在制作出的所有安装体中确认到了电极间形成有焊锡粉熔化而形成的接合体。
此外，在形成了台阶部的第一到第六实施例的安装体中，确认到了树脂诱导到台阶部分，使得电路基板及半导体芯片或者电路基板及电路基板由树脂粘结在一起。
然而，虽然在第二到第五安装体中，焊锡粉几乎不存在于诱导到台阶部上的树脂中，但是在第一及第六安装体中，确认到了焊锡粉存在于诱导到台阶部上的树脂中。可以认为，其原因在于：在第一及第六实施例中，位于台阶部的基板间距离(L2＝50μm)大于焊锡粉的平均粒径(30μm)，因而焊锡粉也进入位于台阶部的基板间的部位。
此外，在第二到第五实施例中的安装体中，确认到了在基板间的接合体以外的区域形成有空洞部。可以认为其原因在于：在第二到第五实施例中，位于台阶部的基板间距离L2在未形成电极的部位上的基板间距离L1的二分之一以下，因而树脂以很高的效率诱导到台阶部上。补充说明一下，虽然在第一及第六实施例中的安装体中，在基板间的接合体以外的区域也形成有空洞部，但是确认到了也有在基板间的接合体以外的区域的一部分残存有树脂的安装体。与此相对，在第一及第二比较例中的安装体中确认到了树脂残存于基板间的接合体以外的区域。
图12(a)到图12(c)是显示对第四实施例的安装体进行剖面观察而得到的结果的图，图12(a)是安装体的剖视图；图12(b)是图12(a)中的箭头A所示的区域中的安装体剖面X光照片；图12(c)是图12(a)的箭头B所示的区域中的安装体剖面X光照片。
如图12(b)所示，能够确认到在所有电极11、13之间形成有焊锡粉熔化而成的接合体21。此外，能够确认到电路基板10、12之间的电极11、13之间以外的区域都成为空洞部20。而且，如图12(c)所示，能够确认到树脂14诱导到台阶部16、17之间，电路基板10、12由树脂互相粘结在一起。
<可靠性的试验>
对在第一到第六实施例以及第一及第二比较例中制作出的安装体进行了吸湿回流试验和绝缘可靠性试验。补充说明一下，在吸湿回流试验和绝缘可靠性试验中采用了互不相同的布线布置，以在吸湿回流试验中调查连接电阻并在绝缘可靠性试验中调查绝缘电阻。
在吸湿回流试验中，先以85℃且相对湿度为85％的条件进行168个小时的吸湿，然后以240℃进行了三次回流。其结果是，第一到第五实施例以及第一及第二比较例的安装体在进行试验后的电阻值变化在±10％以内，而且在进行试验后的外观上观测不到问题。与此相对，第六实施例中的安装体在进行试验后已造成断路(open)不良，而且在外观检查时观测到安装体的电路基板一侧已膨胀。可以认为其原因在于：第六实施例中的台阶部形成在基板边缘并形成为包围电极，因而诱导到台阶部上的树脂使形成在基板间的接合体以外的区域的空洞部成为密封状态。
以压力锅试验(PCT)的试验条件(120℃、相对湿度为85％、以15V的电压施加96个小时)进行了绝缘可靠性试验。其结果是，第一及第二比较例中的安装体的电阻值下降到105Ω左右，在接合体相互间已造成电化学迁移所导致的绝缘不良。可以认为，这是因为在第一及第二比较例中的安装体中，树脂残存于基板间的接合体以外的区域。与此相对，在第一到第六实施例中的安装体中，在进行试验后还示出1010Ω以上的电阻值，没观测到电化学迁移所导致的绝缘不良。
由以上结果可知，在基板之间的电极以外的部位上设台阶部，并对提供到基板间的含有导电性粒子及气泡产生剂的树脂加热而使该树脂的温度成为导电性粒子熔化的温度，由此能够用形成在电极间的接合体进行基板间的电连接，用形成在基板间的电极间以外的区域的空洞部进行接合体间的电绝缘，并且，用形成在台阶部上的树脂进行基板间的固定。由此，即使电极间的间距很窄，也能够实现可靠性很高的基板间连接。
-产业实用性-
本发明对薄型化及高密度安装化发展的下一代电子设备中的倒装芯片安装及基板间连接很有用。

Claims (21)

1.一种基板间的连接方法，与具有多个第一电极的第一基板相向地配置具有多个第二电极的第二基板，使所述第一电极及所述第二电极经由接合体电连接，所述基板间的连接方法包括工序a、工序b及工序c，在该工序a中向所述第一基板与所述第二基板之间提供含有导电性粒子和气泡产生剂的树脂，在该工序b中对所述树脂加热，来使含在该树脂中的所述导电性粒子熔化，并使含在所述树脂中的气泡产生剂产生气泡，在该工序c中使所述树脂固化，其特征在于：
在所述第一基板及所述第二基板中的至少一个基板上形成有台阶部；
在所述工序b中，所述树脂通过所述气泡的成长被挤压到该气泡的外面，由此所述树脂中的已熔化的导电性粒子被诱导到所述第一电极与所述第二电极之间，在该第一电极与该第二电极之间形成由所述已熔化的导电性粒子形成的所述接合体，所述树脂被诱导到位于所述台阶部的所述第一基板与所述第二基板之间的部位；
在所述工序c中，使所述树脂固化，由此将所述第一基板及所述第二基板固定在一起。
2.根据权利要求1所述的基板间的连接方法，其特征在于：
在所述工序b中，所述第一基板与所述第二基板之间的至少所述电极间以外的区域成为所述树脂被所述气泡挤出而形成的第一空洞部。
3.根据权利要求1或2所述的基板间的连接方法，其特征在于：
所述多个第一电极及所述多个第二电极呈阵列状地形成在所述第一基板及所述第二基板上；
所述台阶部形成为包围呈所述阵列状的电极区域的环状。
4.根据权利要求3所述的基板间的连接方法，其特征在于：
在形成为所述环状的所述台阶部的一部分设有缝隙，所述第一基板与所述第二基板之间的形成有该缝隙的部位上的区域成为所述树脂被所述气泡挤出而形成的第二空洞部；
所述第一空洞部经过所述第二空洞部与外部连通。
5.根据权利要求1所述的基板间的连接方法，其特征在于：
所述多个第一电极及所述多个第二电极形成为相互平行的线状；
所述台阶部，与所述多个第一电极及所述多个第二电极平行地形成在呈所述线状的电极区域的外边。
6.根据权利要求1所述的基板间的连接方法，其特征在于：
所述多个第一电极及所述多个第二电极形成为相互平行的线状；
所述台阶部形成为与呈所述线状的所述多个第一电极及所述多个第二电极垂直。
7.根据权利要求1所述的基板间的连接方法，其特征在于：
所述台阶部由与所述第一电极及所述第二电极的材料相比被所述已熔化的导电性粒子润湿时的可湿性更低的材料形成。
8.根据权利要求1所述的基板间的连接方法，其特征在于：
位于所述台阶部的所述第一基板与所述第二基板之间的距离小于所述导电性粒子的平均粒径。
9.根据权利要求1所述的基板间的连接方法，其特征在于：
位于所述台阶部的所述第一基板与所述第二基板之间的距离在位于未形成所述台阶部的部位的所述第一基板与所述第二基板之间的距离的二分之一以下。
10.根据权利要求1所述的基板间的连接方法，其特征在于：
所述第一基板及所述第二基板中的至少一个基板包括产生气泡的气泡产生源，来代替使所述树脂含有所述气泡产生剂；
在所述工序b中，所述气泡产生源产生所述气泡。
11.根据权利要求1所述的基板间的连接方法，其特征在于：
所述第一基板及所述第二基板由电路基板或半导体芯片构成。
12.一种倒装芯片安装体，在电路基板上安装有半导体芯片，其特征在于：
在所述电路基板及所述半导体芯片中，形成在所述电路基板及所述半导体芯片上的电极利用权利要求1所述的基板间的连接方法经由接合体互相电连接。
13.一种基板间连接结构，具有多个电极的电路基板互相电连接而成，其特征在于：
所述电路基板利用权利要求1所述的基板间的连接方法经由形成在所述多个电极之间的接合体互相电连接。
14.一种基板间连接结构，与具有多个第一电极的第一基板相向地配置具有多个第二电极的第二基板，并使所述第一及第二电极经由由金属形成的接合体互相电连接而成，其特征在于：
在所述第一基板及所述第二基板中的至少一个基板上形成有台阶部，在该台阶部上，所述第一基板及所述第二基板由树脂粘结在一起；
所述第一基板与所述第二基板之间的所述第一及第二电极之间以外的区域成为空洞部。
15.根据权利要求14所述的基板间连接结构，其特征在于：
所述空洞部的至少一部分与外部连通。
16.根据权利要求14所述的基板间连接结构，其特征在于：
形成在所述第一基板及所述第二基板中的至少一个基板上的所述台阶部形成在该至少一个基板的边缘部分。
17.根据权利要求14所述的基板间连接结构，其特征在于：
与所述台阶部的表面相比，所述第一及第二电极的表面被金属润湿时的可湿性更高，而被树脂润湿时的可湿性更低。
18.根据权利要求14所述的基板间连接结构，其特征在于：
位于所述台阶部的所述第一基板与所述第二基板之间的距离短于位于所述第一及第二电极的所述第一基板与所述第二基板之间的距离。
19.一种倒装芯片安装体，与具有多个第一电极的半导体芯片相向地配置具有多个第二电极的基板，并使所述第一及第二电极经由接合体互相电连接而成，其特征在于：
在所述半导体芯片及所述基板中的至少一个部件上形成有台阶部，在该台阶部上，所述半导体芯片和所述基板由树脂粘结在一起；
所述半导体芯片与所述基板之间的所述第一及第二电极之间以外的区域成为空洞部。
20.根据权利要求19所述的倒装芯片安装体，其特征在于：
所述空洞部的至少一部分与外部连通。
21.根据权利要求19所述的倒装芯片安装体，其特征在于：
所述多个第一电极和所述多个第二电极呈阵列状地形成在所述半导体芯片和所述基板上；
所述台阶部形成为包围呈所述阵列状的电极区域的环状；
在形成为该环状的所述台阶部的一部分设有缝隙。
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