CN101627482A - 发光元件阵列 - Google Patents

发光元件阵列 Download PDF

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Publication number
CN101627482A
CN101627482A CN200880007523A CN200880007523A CN101627482A CN 101627482 A CN101627482 A CN 101627482A CN 200880007523 A CN200880007523 A CN 200880007523A CN 200880007523 A CN200880007523 A CN 200880007523A CN 101627482 A CN101627482 A CN 101627482A
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CN
China
Prior art keywords
light
light emitting
wavelength
electroluminescent device
potential well
Prior art date
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Pending
Application number
CN200880007523A
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English (en)
Chinese (zh)
Inventor
迈克尔·A·哈斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN101627482A publication Critical patent/CN101627482A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/18—Combination of light sources of different types or shapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/40—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by screens, non-reflecting members, light-shielding members or fixed shades
    • F21S41/43—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by screens, non-reflecting members, light-shielding members or fixed shades characterised by the shape thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
    • F21S41/663—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/823—Materials of the light-emitting regions comprising only Group II-VI materials, e.g. ZnO
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/25—Projection lenses
    • F21S41/255—Lenses with a front view of circular or truncated circular outline
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/63—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on refractors, filters or transparent cover plates
    • F21S41/64—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on refractors, filters or transparent cover plates by changing their light transmissivity, e.g. by liquid crystal or electrochromic devices
    • F21S41/645—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on refractors, filters or transparent cover plates by changing their light transmissivity, e.g. by liquid crystal or electrochromic devices by electro-optic means, e.g. liquid crystal or electrochromic devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Control Of El Displays (AREA)
CN200880007523A 2007-03-08 2008-02-26 发光元件阵列 Pending CN101627482A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89380407P 2007-03-08 2007-03-08
US60/893,804 2007-03-08

Publications (1)

Publication Number Publication Date
CN101627482A true CN101627482A (zh) 2010-01-13

Family

ID=39738686

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880007523A Pending CN101627482A (zh) 2007-03-08 2008-02-26 发光元件阵列

Country Status (6)

Country Link
US (2) US8941566B2 (enExample)
EP (1) EP2122695A4 (enExample)
JP (1) JP2010525555A (enExample)
CN (1) CN101627482A (enExample)
TW (1) TWI521731B (enExample)
WO (1) WO2008109296A1 (enExample)

Cited By (12)

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CN102386200A (zh) * 2010-08-27 2012-03-21 财团法人工业技术研究院 发光单元阵列与投影系统
CN102460741A (zh) * 2009-05-05 2012-05-16 3M创新有限公司 具有增大的提取效率的再发光半导体构造
CN102914939A (zh) * 2011-10-21 2013-02-06 深圳市光峰光电技术有限公司 光源系统及相关投影系统
CN103109370A (zh) * 2010-04-26 2013-05-15 皇家飞利浦电子股份有限公司 包括与发光片段对准的准直器的照明系统
CN103155186A (zh) * 2010-09-29 2013-06-12 皇家飞利浦电子股份有限公司 波长转换的发光器件
CN104508822A (zh) * 2012-07-27 2015-04-08 欧司朗光电半导体有限公司 用于制造多色的led显示器的方法
CN104704634A (zh) * 2012-10-04 2015-06-10 欧司朗光电半导体有限公司 用于制造发光二极管显示器的方法和发光二极管显示器
CN107591431A (zh) * 2017-09-15 2018-01-16 深圳市华星光电半导体显示技术有限公司 一种彩膜基板及显示设备
CN107924964A (zh) * 2015-11-26 2018-04-17 原子能机构和替代性可再生资源署 发光面板及制备此类发光面板的方法
TWI626773B (zh) * 2015-06-30 2018-06-11 艾笛森光電股份有限公司 發光模組以及具有此發光模組的頭燈
WO2018121611A1 (zh) * 2016-12-30 2018-07-05 张希娟 基于iii-v族氮化物半导体的led全彩显示器件结构及制备方法
CN108253373A (zh) * 2018-01-05 2018-07-06 张轹冰 一种自适应照明的阵列式激光车灯

Families Citing this family (105)

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Publication number Priority date Publication date Assignee Title
JP4662183B2 (ja) * 2008-04-16 2011-03-30 カシオ計算機株式会社 光源装置及びプロジェクタ
KR20110019390A (ko) * 2008-06-05 2011-02-25 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접합형 반도체 파장 변환기를 갖는 발광 다이오드
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US20100214282A1 (en) 2009-02-24 2010-08-26 Dolby Laboratories Licensing Corporation Apparatus for providing light source modulation in dual modulator displays
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US10108079B2 (en) 2009-05-29 2018-10-23 Soraa Laser Diode, Inc. Laser light source for a vehicle
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TWI424251B (zh) * 2009-12-31 2014-01-21 Ind Tech Res Inst 發光單元陣列、用以製造其之方法及成像裝置
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JPWO2011145174A1 (ja) * 2010-05-18 2013-07-22 キヤノン株式会社 表示装置
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DE102010031534A1 (de) * 2010-07-19 2012-01-19 Infitec Gmbh Displayvorrichtung zur Darstellung stereoskopischer Bilder
GB2484713A (en) 2010-10-21 2012-04-25 Optovate Ltd Illumination apparatus
JP2012109137A (ja) * 2010-11-18 2012-06-07 Canon Inc 有機ｅｌ表示装置
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DE102012109594A1 (de) 2012-10-09 2014-04-10 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
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DE102016220915A1 (de) * 2016-10-25 2018-04-26 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil
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TWI760282B (zh) * 2017-01-09 2022-04-01 美商納諾西斯有限公司 用於直接視野顯示之具有集成反射器的發光二極體及其製造方式
FR3064338B1 (fr) * 2017-03-24 2019-04-05 Valeo Vision Source de lumiere monolithique pour un module lumineux de vehicule automobile
TWI627740B (zh) * 2017-06-09 2018-06-21 晶典有限公司 微發光二極體顯示模組及其製造方法
TWI689092B (zh) * 2017-06-09 2020-03-21 美商晶典有限公司 具有透光基材之微發光二極體顯示模組及其製造方法
CN111052418A (zh) * 2017-07-31 2020-04-21 耶鲁大学 纳米多孔微led器件及其制造方法
GB201718307D0 (en) 2017-11-05 2017-12-20 Optovate Ltd Display apparatus
US11527519B2 (en) 2017-11-27 2022-12-13 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US10892296B2 (en) 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting device having commonly connected LED sub-units
US12100696B2 (en) 2017-11-27 2024-09-24 Seoul Viosys Co., Ltd. Light emitting diode for display and display apparatus having the same
US10892297B2 (en) 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting diode (LED) stack for a display
US10748881B2 (en) 2017-12-05 2020-08-18 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
DE102018111021A1 (de) 2017-12-14 2019-06-19 Osram Opto Semiconductors Gmbh Lichtemittierendes halbleiterbauteil und verfahren zur herstellung eines licht emittierenden halbleiterbauteils
DE102017129981B4 (de) * 2017-12-14 2025-12-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anzeigevorrichtung
US10886327B2 (en) 2017-12-14 2021-01-05 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US11749790B2 (en) 2017-12-20 2023-09-05 Lumileds Llc Segmented LED with embedded transistors
US11552057B2 (en) 2017-12-20 2023-01-10 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US10957820B2 (en) * 2017-12-21 2021-03-23 Lumileds Llc Monolithic, segmented light emitting diode array
US11522006B2 (en) 2017-12-21 2022-12-06 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US10804429B2 (en) * 2017-12-22 2020-10-13 Lumileds Llc III-nitride multi-wavelength LED for visible light communication
US11552061B2 (en) 2017-12-22 2023-01-10 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US11114499B2 (en) 2018-01-02 2021-09-07 Seoul Viosys Co., Ltd. Display device having light emitting stacked structure
US10784240B2 (en) 2018-01-03 2020-09-22 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
GB201800574D0 (en) 2018-01-14 2018-02-28 Optovate Ltd Illumination apparatus
TWI642047B (zh) * 2018-01-26 2018-11-21 鼎展電子股份有限公司 可撓性微發光二極體顯示模組
US11100844B2 (en) 2018-04-25 2021-08-24 Raxium, Inc. Architecture for light emitting elements in a light field display
US12394360B2 (en) * 2018-04-25 2025-08-19 Google Llc Architecture for light emitting elements in a light field display
GB201807747D0 (en) 2018-05-13 2018-06-27 Optovate Ltd Colour micro-LED display apparatus
US10868213B2 (en) * 2018-06-26 2020-12-15 Lumileds Llc LED utilizing internal color conversion with light extraction enhancements
US10488762B1 (en) 2018-06-29 2019-11-26 Applied Materials, Inc. Method to reduce data stream for spatial light modulator
US11239637B2 (en) 2018-12-21 2022-02-01 Kyocera Sld Laser, Inc. Fiber delivered laser induced white light system
US11421843B2 (en) 2018-12-21 2022-08-23 Kyocera Sld Laser, Inc. Fiber-delivered laser-induced dynamic light system
KR102123018B1 (ko) * 2018-12-26 2020-06-16 (재)한국나노기술원 접합 기판 상에 led용 반도체층의 형성 방법 및 그에 의해 제조된 반도체 발광 소자
EP3891795A4 (en) * 2019-01-07 2022-08-31 Lumiode, Inc. Processes, articles and apparatus that incorporate semiconductor switches and drive circuitry on compound semiconductor chiplets
US12000552B2 (en) 2019-01-18 2024-06-04 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system for a vehicle
US11884202B2 (en) 2019-01-18 2024-01-30 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system
US12152742B2 (en) 2019-01-18 2024-11-26 Kyocera Sld Laser, Inc. Laser-based light guide-coupled wide-spectrum light system
DE102019101417A1 (de) * 2019-01-21 2020-07-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauteils und strahlungsemittierendes Halbleiterbauteil
TW202102883A (zh) 2019-07-02 2021-01-16 美商瑞爾Ｄ斯帕克有限責任公司 定向顯示設備
US11162661B2 (en) 2019-10-03 2021-11-02 Reald Spark, Llc Illumination apparatus comprising passive optical nanostructures
US11652195B2 (en) 2019-10-03 2023-05-16 Reald Spark, Llc Illumination apparatus comprising passive optical nanostructures
US12408481B2 (en) 2019-12-19 2025-09-02 Lumileds Llc Light emitting diode (LED) devices with nucleation layer
US11211527B2 (en) 2019-12-19 2021-12-28 Lumileds Llc Light emitting diode (LED) devices with high density textures
US11264530B2 (en) 2019-12-19 2022-03-01 Lumileds Llc Light emitting diode (LED) devices with nucleation layer
KR102884889B1 (ko) 2020-01-30 2025-11-11 삼성전자주식회사 발광 소자 패키지
WO2021168090A1 (en) 2020-02-20 2021-08-26 Reald Spark, Llc Illumination and display apparatus
CN111681598A (zh) * 2020-06-03 2020-09-18 深圳市华星光电半导体显示技术有限公司 显示面板及其制造方法
CN113346002B (zh) * 2020-06-05 2023-06-27 友达光电股份有限公司 显示面板
CN115148881A (zh) * 2021-03-31 2022-10-04 群创光电股份有限公司 制作显示装置的方法
US12158602B2 (en) 2021-06-22 2024-12-03 Reald Spark, Llc Illumination apparatus
KR20240125141A (ko) * 2023-02-10 2024-08-19 삼성전자주식회사 자발광 소자를 포함하는 디스플레이 모듈

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5483085A (en) * 1994-05-09 1996-01-09 Motorola, Inc. Electro-optic integrated circuit with diode decoder
US5936258A (en) * 1995-04-28 1999-08-10 Fujitsu Limited Optical semiconductor memory device and read/write method therefor
US5915193A (en) * 1995-05-18 1999-06-22 Tong; Qin-Yi Method for the cleaning and direct bonding of solids
DE19645035C1 (de) * 1996-10-31 1998-04-30 Siemens Ag Mehrfarbiges Licht abstrahlende Bildanzeigevorrichtung
US5898185A (en) * 1997-01-24 1999-04-27 International Business Machines Corporation Hybrid organic-inorganic semiconductor light emitting diodes
JPH10261818A (ja) * 1997-03-19 1998-09-29 Fujitsu Ltd 発光半導体装置
US6501091B1 (en) * 1998-04-01 2002-12-31 Massachusetts Institute Of Technology Quantum dot white and colored light emitting diodes
JP2000195672A (ja) * 1998-12-25 2000-07-14 Sony Corp 画像表示装置
US6212213B1 (en) * 1999-01-29 2001-04-03 Agilent Technologies, Inc. Projector light source utilizing a solid state green light source
US6737801B2 (en) * 2000-06-28 2004-05-18 The Fox Group, Inc. Integrated color LED chip
US6563133B1 (en) * 2000-08-09 2003-05-13 Ziptronix, Inc. Method of epitaxial-like wafer bonding at low temperature and bonded structure
JP2002222989A (ja) * 2001-01-26 2002-08-09 Toshiba Corp 半導体発光素子
FR2824228B1 (fr) * 2001-04-26 2003-08-01 Centre Nat Rech Scient Dispositif electroluminescent a extracteur de lumiere
KR100422944B1 (ko) 2001-05-31 2004-03-12 삼성전기주식회사 반도체 엘이디(ｌｅｄ) 소자
JP4997672B2 (ja) * 2001-08-14 2012-08-08 ソニー株式会社 半導体発光素子、半導体発光素子の製造方法、及び半導体発光装置
JPWO2003058726A1 (ja) 2001-12-28 2005-05-19 サンケン電気株式会社 半導体発光素子、発光表示体、半導体発光素子の製造方法及び発光表示体の製造方法
ES2217207T3 (es) * 2002-01-24 2004-11-01 Anton Steinecker Maschinenfabrik Gmbh Premacerador.
JP4060113B2 (ja) * 2002-04-05 2008-03-12 株式会社半導体エネルギー研究所 発光装置
US6870311B2 (en) * 2002-06-07 2005-03-22 Lumileds Lighting U.S., Llc Light-emitting devices utilizing nanoparticles
US7071905B1 (en) * 2003-07-09 2006-07-04 Fan Nong-Qiang Active matrix display with light emitting diodes
US7102152B2 (en) * 2004-10-14 2006-09-05 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Device and method for emitting output light using quantum dots and non-quantum fluorescent material
EP2113549B1 (en) * 2004-04-27 2011-12-28 Panasonic Corporation Phosphor composition and light-emitting device using the same
US7119377B2 (en) * 2004-06-18 2006-10-10 3M Innovative Properties Company II-VI/III-V layered construction on InP substrate
US7161188B2 (en) * 2004-06-28 2007-01-09 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting element, semiconductor light emitting device, and method for fabricating semiconductor light emitting element
US7471040B2 (en) * 2004-08-13 2008-12-30 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Mixed-color light emitting diode apparatus, and method for making same
US7404756B2 (en) * 2004-10-29 2008-07-29 3M Innovative Properties Company Process for manufacturing optical and semiconductor elements
US20060094322A1 (en) * 2004-10-29 2006-05-04 Ouderkirk Andrew J Process for manufacturing a light emitting array
US7745814B2 (en) * 2004-12-09 2010-06-29 3M Innovative Properties Company Polychromatic LED's and related semiconductor devices
US7402831B2 (en) * 2004-12-09 2008-07-22 3M Innovative Properties Company Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission
US7045375B1 (en) 2005-01-14 2006-05-16 Au Optronics Corporation White light emitting device and method of making same
JP5177953B2 (ja) * 2005-01-21 2013-04-10 株式会社半導体エネルギー研究所 半導体装置及び表示装置
US7646367B2 (en) 2005-01-21 2010-01-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device and electronic apparatus
US7521856B2 (en) * 2005-01-26 2009-04-21 Osram Opto Semiconductors Gmbh OLED device
JP5076282B2 (ja) * 2005-04-28 2012-11-21 三菱化学株式会社 表示装置
US7592637B2 (en) * 2005-06-17 2009-09-22 Goldeneye, Inc. Light emitting diodes with reflective electrode and side electrode
US7922352B2 (en) * 2005-07-21 2011-04-12 Avago Technologies General Ip (Singapore) Pte. Ltd. Device and method for emitting output light using multiple light sources with photoluminescent material
US20070116423A1 (en) * 2005-11-22 2007-05-24 3M Innovative Properties Company Arrays of optical elements and method of manufacturing same
US8141384B2 (en) * 2006-05-03 2012-03-27 3M Innovative Properties Company Methods of making LED extractor arrays
US7423297B2 (en) * 2006-05-03 2008-09-09 3M Innovative Properties Company LED extractor composed of high index glass
US7952110B2 (en) * 2006-06-12 2011-05-31 3M Innovative Properties Company LED device with re-emitting semiconductor construction and converging optical element
US20070284565A1 (en) * 2006-06-12 2007-12-13 3M Innovative Properties Company Led device with re-emitting semiconductor construction and optical element
US20100051970A1 (en) 2006-11-17 2010-03-04 Ouderkirk Andrew J Planarized led with optical extractor

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102460741A (zh) * 2009-05-05 2012-05-16 3M创新有限公司 具有增大的提取效率的再发光半导体构造
CN103109370A (zh) * 2010-04-26 2013-05-15 皇家飞利浦电子股份有限公司 包括与发光片段对准的准直器的照明系统
CN103109370B (zh) * 2010-04-26 2016-08-03 皇家飞利浦电子股份有限公司 包括与发光片段对准的准直器的照明系统
CN102386200A (zh) * 2010-08-27 2012-03-21 财团法人工业技术研究院 发光单元阵列与投影系统
CN102386200B (zh) * 2010-08-27 2014-12-31 财团法人工业技术研究院 发光单元阵列与投影系统
US8931906B2 (en) 2010-08-27 2015-01-13 Industrial Technology Research Institute Light emitting unit array and projection system
CN103155186A (zh) * 2010-09-29 2013-06-12 皇家飞利浦电子股份有限公司 波长转换的发光器件
US11171265B2 (en) 2010-09-29 2021-11-09 Lumileds Llc Light emitting device having an optically pumped semiconductor wavelength converting element
US10490708B2 (en) 2010-09-29 2019-11-26 Lumileds Llc Wavelength converted light emitting device including a semiconductor wavelength converting material and a ceramic phosphor
US9431585B2 (en) 2010-09-29 2016-08-30 Koninklijke Philips Electronics N.V. Wavelength converted light emitting device
CN102914939A (zh) * 2011-10-21 2013-02-06 深圳市光峰光电技术有限公司 光源系统及相关投影系统
CN102914939B (zh) * 2011-10-21 2016-03-16 深圳市光峰光电技术有限公司 光源系统及相关投影系统
CN104508822B (zh) * 2012-07-27 2017-06-09 欧司朗光电半导体有限公司 用于制造多色的led显示器的方法
CN104508822A (zh) * 2012-07-27 2015-04-08 欧司朗光电半导体有限公司 用于制造多色的led显示器的方法
US9859330B2 (en) 2012-10-04 2018-01-02 Osram Opto Semiconductor Gmbh Method for producing a light-emitting diode display and light-emitting diode display
CN104704634B (zh) * 2012-10-04 2018-09-11 欧司朗光电半导体有限公司 用于制造发光二极管显示器的方法和发光二极管显示器
CN104704634A (zh) * 2012-10-04 2015-06-10 欧司朗光电半导体有限公司 用于制造发光二极管显示器的方法和发光二极管显示器
US10770506B2 (en) 2012-10-04 2020-09-08 Osram Oled Gmbh Method for producing a light-emitting diode display and light-emitting diode display
TWI626773B (zh) * 2015-06-30 2018-06-11 艾笛森光電股份有限公司 發光模組以及具有此發光模組的頭燈
CN107924964A (zh) * 2015-11-26 2018-04-17 原子能机构和替代性可再生资源署 发光面板及制备此类发光面板的方法
CN107924964B (zh) * 2015-11-26 2020-09-25 原子能机构和替代性可再生资源署 发光面板及制备此类发光面板的方法
WO2018121611A1 (zh) * 2016-12-30 2018-07-05 张希娟 基于iii-v族氮化物半导体的led全彩显示器件结构及制备方法
CN107591431A (zh) * 2017-09-15 2018-01-16 深圳市华星光电半导体显示技术有限公司 一种彩膜基板及显示设备
CN108253373A (zh) * 2018-01-05 2018-07-06 张轹冰 一种自适应照明的阵列式激光车灯

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