CN101616566B - 散热装置 - Google Patents
散热装置 Download PDFInfo
- Publication number
- CN101616566B CN101616566B CN200810068101.7A CN200810068101A CN101616566B CN 101616566 B CN101616566 B CN 101616566B CN 200810068101 A CN200810068101 A CN 200810068101A CN 101616566 B CN101616566 B CN 101616566B
- Authority
- CN
- China
- Prior art keywords
- radiator
- fins group
- heat pipe
- fan
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005494 condensation Effects 0.000 claims description 33
- 238000009833 condensation Methods 0.000 claims description 33
- 230000008020 evaporation Effects 0.000 claims description 20
- 238000001704 evaporation Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 11
- 230000003321 amplification Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810068101.7A CN101616566B (zh) | 2008-06-25 | 2008-06-25 | 散热装置 |
US12/331,391 US7796387B2 (en) | 2008-05-25 | 2008-12-09 | Heat dissipation apparatus having a fan received therein |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810068101.7A CN101616566B (zh) | 2008-06-25 | 2008-06-25 | 散热装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101616566A CN101616566A (zh) | 2009-12-30 |
CN101616566B true CN101616566B (zh) | 2012-07-04 |
Family
ID=41447123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810068101.7A Expired - Fee Related CN101616566B (zh) | 2008-05-25 | 2008-06-25 | 散热装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7796387B2 (zh) |
CN (1) | CN101616566B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM341197U (en) * | 2008-04-01 | 2008-09-21 | Tai Sol Electronics Co Ltd | Structure of heat dissipation module |
CN101662918B (zh) * | 2008-08-27 | 2012-10-10 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101730445B (zh) * | 2008-10-20 | 2012-11-21 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101742890B (zh) * | 2008-11-14 | 2013-06-05 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN201438459U (zh) * | 2009-03-13 | 2010-04-14 | 鸿富锦精密工业(深圳)有限公司 | 散热装置组合 |
CN101990388A (zh) * | 2009-08-03 | 2011-03-23 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN102098901A (zh) * | 2009-12-15 | 2011-06-15 | 富准精密工业(深圳)有限公司 | 散热装置 |
US20130042998A1 (en) * | 2011-08-17 | 2013-02-21 | Bin Chen | Thermal module mounting holder |
US20130340987A1 (en) * | 2012-06-21 | 2013-12-26 | Asia Vital Components Co., Ltd. | Heat-dissipating base |
KR200473026Y1 (ko) * | 2012-07-25 | 2014-06-10 | 충-시엔 후앙 | 빌트인 팬을 구비하는 히트 싱크 |
GB2520108A (en) * | 2013-08-28 | 2015-05-13 | Hamilton Sundstrand Corp | Fin-diffuser heat sink with high conductivity heat spreader |
CN105517424B (zh) * | 2016-01-28 | 2019-01-18 | 浙江大学 | 双向互补电子器件基板防失效热管均温散热装置及其方法 |
CN108679876A (zh) * | 2018-08-31 | 2018-10-19 | 厦门帕尔帖电子科技有限公司 | 一种半导体制冷装置 |
CN110412543B (zh) * | 2019-08-23 | 2022-05-03 | 上海禾赛科技有限公司 | 激光雷达及其散热装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2373825Y (zh) * | 1998-12-30 | 2000-04-12 | 谢新茂 | 中央处理器散热器组合装置 |
CN2664189Y (zh) * | 2003-09-20 | 2004-12-15 | 鸿富锦精密工业(深圳)有限公司 | 热管散热装置 |
CN2864795Y (zh) * | 2005-07-21 | 2007-01-31 | 英业达股份有限公司 | 笔记本电脑之散热模块 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6109340A (en) * | 1997-04-30 | 2000-08-29 | Nidec Corporation | Heat sink fan |
US6650541B1 (en) * | 2002-06-25 | 2003-11-18 | Hewlett-Packard Development Company, L.P. | Fan-securing device for use with a heat transfer device |
US7164582B2 (en) * | 2004-10-29 | 2007-01-16 | Hewlett-Packard Development Company, L.P. | Cooling system with submerged fan |
US7142427B2 (en) * | 2004-12-30 | 2006-11-28 | Microsoft Corporation | Bottom side heat sink attachment for console |
USD561711S1 (en) * | 2006-12-08 | 2008-02-12 | Thermaltake Technology Co., Ltd. | Heat sink |
JP2008227181A (ja) * | 2007-03-13 | 2008-09-25 | Nippon Densan Corp | フィンユニットの製造方法、フィンユニットおよび冷却装置 |
USD581375S1 (en) * | 2007-12-26 | 2008-11-25 | Delta Electronics Inc. | Heat sink |
-
2008
- 2008-06-25 CN CN200810068101.7A patent/CN101616566B/zh not_active Expired - Fee Related
- 2008-12-09 US US12/331,391 patent/US7796387B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2373825Y (zh) * | 1998-12-30 | 2000-04-12 | 谢新茂 | 中央处理器散热器组合装置 |
CN2664189Y (zh) * | 2003-09-20 | 2004-12-15 | 鸿富锦精密工业(深圳)有限公司 | 热管散热装置 |
CN2864795Y (zh) * | 2005-07-21 | 2007-01-31 | 英业达股份有限公司 | 笔记本电脑之散热模块 |
Also Published As
Publication number | Publication date |
---|---|
CN101616566A (zh) | 2009-12-30 |
US20090323284A1 (en) | 2009-12-31 |
US7796387B2 (en) | 2010-09-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170420 Address after: Guangdong, Chancheng Province West Industrial Zone, 35 North Road, Warburg, No. Patentee after: Quanyida Technology (Foshan) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: Foxconn Precision Industry Co., Ltd. Patentee before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20200625 |