CN101742890B - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN101742890B
CN101742890B CN2008103055621A CN200810305562A CN101742890B CN 101742890 B CN101742890 B CN 101742890B CN 2008103055621 A CN2008103055621 A CN 2008103055621A CN 200810305562 A CN200810305562 A CN 200810305562A CN 101742890 B CN101742890 B CN 101742890B
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heat
heating column
radiating fin
conducting substrate
fin group
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CN101742890A (zh
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郭青磊
朱寿礼
杨明
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to CN2008103055621A priority Critical patent/CN101742890B/zh
Priority to US12/430,843 priority patent/US7969737B2/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种电子元件用散热装置，包括导热基板、散热鳍片组、将该导热基板与所述散热鳍片组相连的热管及导热连接在所述导热基板上横断面呈椭圆形的导热柱，所述散热鳍片组结合于该导热柱的侧壁。本发明可以借助横断面呈椭圆形的导热柱提高散热效率。

Description

散热装置
技术领域
本发明涉及一种散热装置，特别涉及电子元件用散热装置。
背景技术
电脑CPU等电子元件在运行时会释放出大量的热，这些热量若不能得到有效散发，将导致电子元件温度上升，进而对电子元件带来不可挽回的损坏。
典型的散热装置包括吸热基板及若干设置在吸热基板上的散热鳍片，吸热基板从电子元件吸收热量，再将热量传递给散热鳍片，由散热鳍片将热量散发到空气中，从而达到电子元件散热的效果。然而，随着电子元件运行频率的提升，其释放的热量也相应增加，上述典型的散热装置的散热效率就有所不足。
发明内容
有鉴于此，有必要提供一种散热效率高的散热装置。
一种散热装置，包括导热基板、散热鳍片组、将该导热基板与所述散热鳍片组相连的热管及导热连接在所述导热基板上横断面呈椭圆形的导热柱和一扣具，所述导热柱竖立在所述导热基板上，该导热柱的顶面开设有凹槽，该导热柱的下端面与所述导热基板的顶面接触，所述散热鳍片组结合于该导热柱的侧壁，该扣具具有一抵压部，该抵压部嵌置在该导热柱的顶面上的凹槽中。
通过采用上述技术方案，可以借助横断面呈椭圆形的导热柱提高散热效率。
下面参照附图，结合具体实施例对本发明作进一步的描述。
附图说明
图1是本发明一个优选实施例中的散热装置的立体组合图。
图2是图1所示散热装置的立体分解图。
具体实施方式
图1及2示出了本发明一个优选实施例中的散热装置，该散热装置可以用来给电子元件（例如，电脑CPU）进行散热，其主要包括导热基板10、导热柱20、两散热鳍片组30、两热管40、扣具50以及固定模组60。
导热基板10用来与发热电子元件（未图示）接触吸热，其采用导热性能良好的材料制成，例如铜、铝等。导热基板10在本实施例中呈但不局限于矩形板状，其大小尺寸与发热电子元件的大小相适应。导热基板10的底面光滑平整，以与发热电子元件接触，在使用中，通常在导热基板10的底面与电子元件之间填充适量的导热介质，以降低两者之间的热阻。导热基板10的顶面设有凹槽11，以与上述热管40配合。
导热柱20也采用诸如铜、铝等导热性能良好的材料制成，其竖立在导热基板10的顶面，且其下端面与导热基板10的顶面接触，用以将导热基板10从发热电子元件吸收的热量垂直向上传递，从而增加蓄热量及散热面积。导热柱20横断面呈椭圆形，其侧壁包括两相对第一弧面21、23及两相对第二弧面22、24，其中，第一弧面21、23分别位于导热柱20横断面长轴的两相对侧部，第二弧面22、24分别位于导热柱20横断面长轴的两相对端部，第一弧面21、23的曲率小于第二弧面22、24的曲率。另外，在导热柱20的第二弧面22、24上还呈放射状设置有若干散热鳍片221、241，导热柱20的顶面开设有凹槽25，以与扣具50配合。
上述两散热鳍片组30采用铜、铝等导热性能良好的材料制成，其大体呈扇形，并分别通过焊接、导热胶粘结等方式设置在导热柱20的第一弧面21、23上，以将导热柱20吸收的热量散发出去，散热鳍片组30中每一散热鳍片的上侧均开设有圆形通孔31，这些圆形通孔31组合形成一圆弧形管道，用以与热管40配合。
上述热管40的基本结构是在密封管材内衬以易吸收工作液体的多孔质毛细结构层，而其中央的空间则为空洞状态，并在抽真空的密闭管材内注入适量相当于毛细结构层细孔总容积的工作液体。热管40以吸热及放热相关位置，可包括吸热部41、传热部42以及放热部43，其中，吸热部41被扁平化处理后容置在导热基板10顶面的凹槽11中，并通过焊接或导热胶粘接等方式与导热基板10结合。热管40的吸热部41顶面与导热基板10的顶面齐平，以便能与设置在导热基板10上的上述导热柱20紧密结合。放热部43被弯曲成弧形，并穿设在上述散热鳍片组30由圆形通孔31组成的圆弧形管道中，以将导热基板10吸收的热量传递给散热鳍片组30。本实施例中，放热部43与同侧的导热柱20的第一弧面21，23为同心圆弧，以使放热段43与导热柱20之间的间距恒定，从而便于散热鳍片组30的安装。另，上述两热管40的吸热部41及放热部43分别呈相向设置。
上述扣具50包括一抵压部51及分别设置在该抵压部两端的扣臂52、53，抵压部51呈片状，并可嵌置在上述导热柱20上端面的凹槽25中。上述固定模组60呈矩形框状，其可安装在电子装置的电路板（未图示）上并环绕发热电子元件。固定模组60的一相对侧分别设有与上述扣具50的两扣臂配合的突起61、62。

Claims (5)

1.一种散热装置，包括导热基板、散热鳍片组以及将该导热基板与所述散热鳍片组相连的热管，其特征在于：还包括导热连接在所述导热基板上横断面呈椭圆形的导热柱和一扣具，所述导热柱竖立在所述导热基板上，该导热柱的顶面开设有凹槽，该导热柱的下端面与所述导热基板的顶面接触，所述散热鳍片组结合于该导热柱的侧壁，该扣具具有一抵压部，该抵压部嵌置在该导热柱的顶面上的凹槽中，所述导热柱的侧壁包括位于导热柱横断面长轴侧部的第一弧面及位于导热柱横断面长轴端部且曲率大于第一弧面的第二弧面，所述散热鳍片组结合于第一弧面上。
2.根据权利要求1所述的散热装置，其特征在于：所述第二弧面上设有若干放射状散热鳍片。
3.根据权利要求1所述的散热装置，其特征在于：所述散热鳍片组呈扇形。
4.根据权利要求3所述的散热装置，其特征在于：所述热管包括与所述导热基板相连的吸热部及穿设在所述散热鳍片组中的放热部。
5.根据权利要求4所述的散热装置，其特征在于：所述热管的放热部呈弧形，并与导热柱相应的第一弧面为同心圆弧。
CN2008103055621A 2008-11-14 2008-11-14 散热装置 Expired - Fee Related CN101742890B (zh)

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US12/430,843 US7969737B2 (en) 2008-11-14 2009-04-27 Heat dissipation apparatus

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US20110094723A1 (en) * 2009-10-26 2011-04-28 Meyer Iv George Anthony Combination of fastener and thermal-conducting member
US20110290450A1 (en) * 2010-05-31 2011-12-01 Asia Vital Components Co., Ltd. Heat Dissipation Module
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CN109168304B (zh) * 2018-10-25 2023-10-27 海鹰企业集团有限责任公司 一种水下筒形电子舱用散热装置
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CN101742890A (zh) 2010-06-16
US7969737B2 (en) 2011-06-28

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