CN101606446B - 多层电路基板和电动机驱动电路基板 - Google Patents

多层电路基板和电动机驱动电路基板 Download PDF

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Publication number
CN101606446B
CN101606446B CN2007800483965A CN200780048396A CN101606446B CN 101606446 B CN101606446 B CN 101606446B CN 2007800483965 A CN2007800483965 A CN 2007800483965A CN 200780048396 A CN200780048396 A CN 200780048396A CN 101606446 B CN101606446 B CN 101606446B
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CN
China
Prior art keywords
conductor layer
insulating barrier
range
layer
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800483965A
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English (en)
Chinese (zh)
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CN101606446A (zh
Inventor
中井基生
长濑茂树
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JTEKT Corp
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JTEKT Corp
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Publication of CN101606446A publication Critical patent/CN101606446A/zh
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Power Steering Mechanism (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
CN2007800483965A 2006-12-26 2007-12-25 多层电路基板和电动机驱动电路基板 Expired - Fee Related CN101606446B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP348738/2006 2006-12-26
JP2006348738 2006-12-26
JP227937/2007 2007-09-03
JP2007227937A JP4962228B2 (ja) 2006-12-26 2007-09-03 多層回路基板およびモータ駆動回路基板
PCT/JP2007/074828 WO2008078739A1 (ja) 2006-12-26 2007-12-25 多層回路基板およびモータ駆動回路基板

Publications (2)

Publication Number Publication Date
CN101606446A CN101606446A (zh) 2009-12-16
CN101606446B true CN101606446B (zh) 2012-03-07

Family

ID=39562528

Family Applications (1)

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CN2007800483965A Expired - Fee Related CN101606446B (zh) 2006-12-26 2007-12-25 多层电路基板和电动机驱动电路基板

Country Status (6)

Country Link
US (1) US20090260858A1 (cg-RX-API-DMAC10.html)
EP (1) EP2104408B1 (cg-RX-API-DMAC10.html)
JP (1) JP4962228B2 (cg-RX-API-DMAC10.html)
CN (1) CN101606446B (cg-RX-API-DMAC10.html)
AT (1) ATE546034T1 (cg-RX-API-DMAC10.html)
WO (1) WO2008078739A1 (cg-RX-API-DMAC10.html)

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JP4764393B2 (ja) * 2007-09-06 2011-08-31 三菱重工業株式会社 インバータ一体型電動圧縮機
JP5444619B2 (ja) * 2008-02-07 2014-03-19 株式会社ジェイテクト 多層回路基板およびモータ駆動回路基板
JP2010073767A (ja) 2008-09-17 2010-04-02 Jtekt Corp 多層回路基板
JP5417804B2 (ja) * 2008-11-06 2014-02-19 株式会社ジェイテクト 気泡率演算方法及び気泡率演算装置
JP5262619B2 (ja) * 2008-11-25 2013-08-14 株式会社ジェイテクト モータ駆動用の複合回路基板
US8248803B2 (en) * 2010-03-31 2012-08-21 Hong Kong Applied Science and Technology Research Institute Company Limited Semiconductor package and method of manufacturing the same
CN101853822B (zh) * 2010-04-14 2012-01-25 星弧涂层科技(苏州工业园区)有限公司 散热器件及其制造方法
JP2012009828A (ja) 2010-05-26 2012-01-12 Jtekt Corp 多層回路基板
JP2011253890A (ja) * 2010-06-01 2011-12-15 Jtekt Corp 多層回路基板の製造方法
US20120241810A1 (en) * 2010-11-30 2012-09-27 Zheng Wang Printing circuit board with micro-radiators
CN102026496A (zh) * 2010-12-24 2011-04-20 乐健线路板（珠海）有限公司 带有绝缘微散热器的印刷电路板的制备方法
US10433414B2 (en) * 2010-12-24 2019-10-01 Rayben Technologies (HK) Limited Manufacturing method of printing circuit board with micro-radiators
CN102811554A (zh) * 2011-06-02 2012-12-05 熊大曦 大功率电子器件模组用基板及其制备方法
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JP5408377B2 (ja) * 2013-04-01 2014-02-05 株式会社ジェイテクト 気泡率演算方法及び気泡率演算装置
JP5408376B2 (ja) * 2013-04-01 2014-02-05 株式会社ジェイテクト 気泡率演算方法及び気泡率演算装置
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JP2015211204A (ja) * 2014-04-30 2015-11-24 イビデン株式会社 回路基板及びその製造方法
JP6469435B2 (ja) * 2014-10-30 2019-02-13 太陽誘電ケミカルテクノロジー株式会社 構造体及び構造体製造方法
FR3036917B1 (fr) * 2015-05-28 2018-11-02 IFP Energies Nouvelles Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore.
CN105163485A (zh) * 2015-09-25 2015-12-16 湖南三一电控科技有限公司 发热装置和发热器件的导热基板及其制作方法
CN108293293B (zh) * 2015-11-30 2020-07-14 日本精工株式会社 控制单元及电动助力转向装置
WO2017154075A1 (ja) 2016-03-07 2017-09-14 三菱電機株式会社 電子制御装置
JP6707634B2 (ja) * 2016-06-01 2020-06-10 三菱電機株式会社 半導体装置
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JPWO2019194200A1 (ja) * 2018-04-04 2021-04-01 太陽誘電株式会社 部品内蔵基板
CN108617079A (zh) * 2018-05-02 2018-10-02 皆利士多层线路版(中山)有限公司 厚铜线路板及其制备方法
CN109764264B (zh) * 2019-01-14 2020-03-13 上海大学 一种深海照明led光源装置及制备方法
CN113438801A (zh) * 2021-07-06 2021-09-24 上海应用技术大学 便于散热的pcb板电路
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Also Published As

Publication number Publication date
JP2008182184A (ja) 2008-08-07
EP2104408B1 (en) 2012-02-15
ATE546034T1 (de) 2012-03-15
US20090260858A1 (en) 2009-10-22
WO2008078739A1 (ja) 2008-07-03
CN101606446A (zh) 2009-12-16
JP4962228B2 (ja) 2012-06-27
EP2104408A4 (en) 2010-05-19
EP2104408A1 (en) 2009-09-23

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