CN101601131A - 用于安装半导体封装的结构 - Google Patents

用于安装半导体封装的结构 Download PDF

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CN101601131A
CN101601131A CNA2007800509471A CN200780050947A CN101601131A CN 101601131 A CN101601131 A CN 101601131A CN A2007800509471 A CNA2007800509471 A CN A2007800509471A CN 200780050947 A CN200780050947 A CN 200780050947A CN 101601131 A CN101601131 A CN 101601131A
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semiconductor packages
mounting panel
heat sink
rear surface
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佐佐木纯一
樋野智之
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NEC Corp
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Abstract

一种安装结构，其中半导体封装(1)和用于散发从半导体封装(1)生成的热量的热沉(8)被安装在安装板(3)上。半导体封装(1)的后表面接合到安装板(3)的面向该后表面的前表面上。使热沉(8)经由安装板(3)上形成的通孔(5)与半导体封装(1)的后表面接触。半导体封装(1)和热沉(8)被夹(6)的弹性力互相压着。

Description

用于安装半导体封装的结构
技术领域
本发明涉及用于安装半导体封装的结构。在本申请中，术语“半导体封装”应理解为包括含有诸如大规模集成(LSI)器件之类的半导体器件的电模块、含有诸如半导体激光器之类的光学半导体器件的光模块、结合了LSI和光学半导体的光电子模块。
背景技术
在诸如中央处理单元(CPU)和光电子模块之类的、消耗大量电力的半导体封装被安装在要用在计算机中的板等上的情况下，一般需要用于从半导体封装散热的装置。
日本专利申请特开第H09-321188号公报公开了一种用于安装半导体封装的结构，如图1所示。图1所示的半导体封装安装在板51上。热沉(heat sink)54置于安装在板51上的半导体封装52之上。由于板弹簧55的弹性力，热沉54与半导体封装52的顶部表面紧密接触。用在该安装结构中的热沉由热导率极好的材料制成，并且被成形为高效地将吸收的热量散发到空气中。
然而，在一些情况下，根据半导体封装的形状，不可能或者难以将热沉安装在半导体封装之上。例如，图2所示的半导体封装60是光电子模块，光输入/输出部分61设在其顶部部分上。此结构使得不可能将热沉安装在此半导体封装之上。因此，在图2所示的示例中，使用了用于从半导体封装60的下侧通过焊球63向安装板62散热的结构。图2所示的安装结构公开在OPTRONICS(2005)，No.1，第184页。
然而，大多安装板是由树脂制成的，并且具有大的热阻。因此，此结构不能从生成大量热的光电子模块充分散热。作为用于克服该问题的安装结构，日本专利申请特开第H07-283349号公报的说明书公开了图3所示的安装结构。具体地，半导体封装72安装在安装板71的前表面上，在安装板71中形成通孔70，并且热沉73安装在安装板71的后表面上。在图3所示的安装结构中，从半导体封装72生成的热量通过通孔70等传递到热沉73，热沉73转而将热量从表面散发到空气中。在图3所示的安装结构中，因为电荷耦合器件(CCD)图像传感器安装在半导体封装72的顶部表面上，所以来自半导体封装72的热量通过相反的表面散发。
发明内容
技术问题
根据公开了图3所示的安装结构的日本专利申请特开第H07-283349号公报的说明书，螺丝固定(screwing)、基于凸起(protrusion)和相配的凹处(recess)的嵌合(fitting)、以及接合被公开为用于将热沉73固定到安装结构71的方法。然而，如果安装板和热沉是彼此刚性固定的，则施加于热沉的外力可直接传递到半导体封装和安装板之间的耦合部分，从而损坏耦合部分。例如当人手或工具接触热沉时，外力被施加给热沉。
为了降低这样的危险，通过组合图1所示的安装结构和图3所示的安装结构，可引出如图4所示的安装结构。具体地，半导体封装82安装在安装板81的前表面上，安装板81中形成通孔80，热沉83布置在安装板81的后表面上，并且使半导体封装82和热沉83经由通孔80彼此紧密接触。此外，经由固定在安装板81的后表面的板弹簧84，将热沉83按压到半导体封装82的后表面上。
然而，如图4所示，半导体封装82经由焊球85接合到安装板81上。板弹簧84的弹性力(即，将热沉83压到半导体封装82上的力)从纸面的下侧向上侧起作用。结果，拉伸应力f1被不断地施加给焊球85。这引起了如下的新问题：导致了对于半导体封装82和安装板81之间的连接可靠性的破坏。
技术方案
本发明提供了一种用于安装半导体封装的结构，其中半导体封装和散发从半导体封装生成的热量的散热构件被安装在安装板上。半导体封装的后表面接合到安装板的面向半导体封装后表面的表面上。使散热构件通过安装板中形成的开口与半导体封装的后表面接触。此外，半导体封装和散热构件被弹性构件的弹性力互相压着。
本发明的一个目的是提供一种用于安装半导体封装的结构，该结构在不破坏耦合部分的可靠性的情况下具有极好的散热性能。
从结合附图的以下描述中，本发明的以上和其他目的、特征和优点将会更加清楚，这些附图示出了本发明的某些示例性实施例。
附图说明
图1是示出日本专利申请特开第H09-321188号公报中公开的安装结构的视图；
图2是示出光电子模块安装结构的示例的示意性截面图；
图3是示出日本专利申请特开第H07-283349号公报中公开的安装结构的截面图；
图4是示出通过组合现有技术的一些示例而得出的安装结构的示例的截面图；
图5是示出根据本发明的一个示例性实施例的用于安装半导体封装的结构的截面图；并且
图6是示出根据本发明的另一个示例性实施例的用于安装半导体封装的结构的截面图。
具体实施方式
实施例1
现在将参考附图在下文中更充分地描述本发明的一个示例性实施例。图5是示出根据此实施例的用于安装半导体封装的结构的示意性截面图。如此图所示，半导体封装1的后表面经由焊球2接合至安装板3的表面。此接合结构可例如如下实现：首先，在半导体封装1的后表面上形成多个焊球2。然后，在安装板3的表面上，具体地，在安装板3的与焊球的位置相对应的特定位置上形成焊盘4。之后，利用例如芯片架(chip mount)来将半导体封装1和安装板3彼此对准，以使得焊球2和焊盘彼此对准。接下来，半导体封装1和安装板3被放入例如回流炉中，然后被加热，从而熔融焊球2。
在安装板3的封装安装区域(即与半导体封装1重叠的区域)中形成通孔5。此外，在封装安装区域周围形成缝(slit)7，使弹性构件(稍后描述)能通过。
作为散发构件的热沉8布置在安装板3的后表面上。热沉8具有插进通孔5的凸状膨胀部分8a。膨胀部分8a的顶部表面与半导体封装1的后表面接触。此外，用于提高热传递效率的散热材料10被夹在膨胀部分8a的顶部表面和半导体封装1的后表面之间。通过将金属粉末或金属氧化物粉末混进诸如有机硅树脂之类的基材中，以凝胶、糊或片的形式来提供散热材料10。然而应当理解，半导体封装1和热沉8不是彼此刚性固定的。换言之，它们不是通过诸如粘合剂、焊料和螺丝之类的固定方法来固定的。因此，施加到热沉8的任何外力都不直接传递到焊球2。
从半导体封装1生成的热量通过散热材料10传递到热沉8，然后从热沉8的表面散发进空气。此外，在热沉8的膨胀部分8a的相反侧形成多个散热鳍(fin)8b。
热沉8和半导体封装1被贯穿(extend through)安装板3的缝7的至少两个弹性构件(例如金属夹6)夹持。具体地，在每个夹6的两个纵向端形成锁定部分6a。夹6的一端上的锁定部分6a锁定到半导体封装1的表面上，并且夹6的另一端上的锁定部分6a锁定到热沉8的后表面上。此外，两个锁定部分6a是通过弯曲夹6的两个纵向端而形成的。
夹6的相对的锁定部分6a之间的间隔等于或稍微小于从热沉8的后表面到半导体封装1的前表面的高度(h)。因此，夹6通过弹性地变形至少一个锁定部分6a来夹持热沉8和半导体封装1。因此，插在相对的锁定部分6a之间的热沉8和半导体封装1被夹6(具体地，锁定部分6a)的弹性力互相压着。因为将热沉8压到半导体封装1上的力被将半导体封装1压到热沉8上的力平衡，所以没有将拉伸应力施加到焊球2的危险。结果，焊球2不破坏连接可靠性。相反，连接可靠性由于作用到焊球2上的压缩应力而可得到改善。
实施例2
图6示出了根据本发明的另一示例性实施例的用于安装半导体封装的结构。同样在此实施例中，半导体封装1的后表面经由焊球2接合到安装板3的表面。此外，热沉8的膨胀部分8a的顶部表面经由散热材料10与半导体封装1的后表面接触。
半导体封装1被固定到安装板3的表面的至少两个弹性构件(例如板弹簧20)压到热沉8上。更具体地，每个板弹簧20的一端固定到安装板3的表面上，在每个板弹簧20的另一端形成的锁定部分20a锁定到半导体封装1的表面上。结果，半导体封装被板弹簧20(即锁定部分20a)的弹性力压到热沉8上。此外，锁定部分20a是通过弯曲板弹簧20的一端而形成的。
热沉8被固定到安装板3的后表面的至少两个弹性构件(例如板弹簧21)的弹性力压到半导体封装1上。更具体地，每个板弹簧21的一端固定到安装板3的后表面上，在板弹簧21的另一端形成的锁定部分21a锁定到热沉8的后表面上。结果，热沉8被板弹簧21(即锁定部分21a)的弹性力压到半导体封装1上。此外，锁定部分21a是通过弯曲板弹簧21的一端而形成的。
在此配置中，根据以下关系来设置板弹簧20和21的弹性力：f1≤f，其中f1是由板弹簧21将热沉8压到半导体封装1上所引起的作用在焊球2上的拉伸力，并且f2是由板弹簧20将半导体封装1压到热沉8上所引起的作用在焊球2上的拉伸力。结果，超过压缩应力的拉伸应力没有作用在焊球2上，并且因此没有焊球2可能破坏连接可靠性的危险。相反，连接可靠性由于作用到焊球2上的压缩应力而可得到改善。
根据本发明的用于安装半导体封装的结构，在不破坏半导体封装和安装板之间耦合部分的可靠性的情况下，可使散热构件与半导体封装紧密接触。
本申请要求2007年2月15日递交的日本专利申请2007-35101的优先权，该日本专利申请的公开内容通过引用而被全部并入于此。
权利要求书(按照条约第19条的修改)
根据专利合作条约第19条修改时的声明
权利要求第1项明确了通过焊球将半导体封装的后表面和与该后表面相对的安装板的表面接合在一起。
对比文件1、2中对保护焊球不受拉伸应力的影响这样的技术思想没有公开以及启示。
本发明通过将半导体封装与散热构件彼此向对方推压，能够获得保护焊球不受拉伸应力影响的效果。
1.一种用于安装半导体封装的结构，其中所述半导体封装和散发从所述半导体封装生成的热量的散热构件被安装在安装板上，其中：
所述半导体封装的后表面经由焊球接合到所述安装板的面向所述后表面的表面上，
使所述散热构件通过所述安装板中形成的开口与所述半导体封装的后表面接触，并且
所述半导体封装和所述散热构件被弹性构件的弹性力互相压着。
2.根据权利要求1所述的用于安装半导体封装的结构，其中贯穿所述安装板的所述弹性构件的一端锁定到所述半导体封装上，并且另一端锁定到所述散热构件上。
3.根据权利要求1所述的用于安装半导体封装的结构包括：
将所述半导体封装压到所述散热构件上的第一弹性构件，以及
将所述散热构件压到所述半导体封装上的第二弹性构件。
4.根据权利要求3所述的用于安装半导体封装的结构，其中所述第一弹性构件将所述半导体封装压到所述散热构件上的力大于所述第二弹性构件将所述散热构件压到所述半导体封装上的力。

Claims (4)

1.一种用于安装半导体封装的结构，其中所述半导体封装和散发从所述半导体封装生成的热量的散热构件被安装在安装板上，其中：
所述半导体封装的后表面接合到所述安装板的面向所述后表面的表面上，
使所述散热构件通过所述安装板中形成的开口与所述半导体封装的后表面接触，并且
所述半导体封装和所述散热构件被弹性构件的弹性力互相压着。
2.根据权利要求1所述的用于安装半导体封装的结构，其中贯穿所述安装板的所述弹性构件的一端锁定到所述半导体封装上，并且另一端锁定到所述散热构件上。
3.根据权利要求1所述的用于安装半导体封装的结构包括：
将所述半导体封装压到所述散热构件上的第一弹性构件，以及
将所述散热构件压到所述半导体封装上的第二弹性构件。
4.根据权利要求3所述的用于安装半导体封装的结构，其中所述第一弹性构件将所述半导体封装压到所述散热构件上的力大于所述第二弹性构件将所述散热构件压到所述半导体封装上的力。
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