CN112005368A - 散热组件和电子设备 - Google Patents

散热组件和电子设备 Download PDF

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Publication number
CN112005368A
CN112005368A CN201980017587.8A CN201980017587A CN112005368A CN 112005368 A CN112005368 A CN 112005368A CN 201980017587 A CN201980017587 A CN 201980017587A CN 112005368 A CN112005368 A CN 112005368A
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CN
China
Prior art keywords
chip
heat dissipation
heat
hole
circuit board
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Pending
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CN201980017587.8A
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English (en)
Inventor
黄伦学
郭鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN112005368A publication Critical patent/CN112005368A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热组件(200)和电子设备，散热组件(200)包括印制电路板(240)、散热装置(220)和设置在所述印制电路板(240)的表面的芯片(230)，其中，在所述表面的被所述芯片(230)覆盖的区域，设置有贯穿所述印制电路板(240)的通孔(241)，所述通孔(241)自所述表面直达所述印制电路板(240)的与所述表面相对的另一表面，所述散热装置(220)通过所述通孔(241)对所述芯片(230)进行散热。上述技术方案中的印制电路板(240)在设置有芯片(230)的位置具有通孔(241)，这样可以将芯片(230)的下表面露出来，从而可以通过散热装置(220)在芯片(230)下方对芯片(230)进行散热，而不需要在芯片(230)的上表面或上方设置散热材料。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN201980017587.8A 2019-03-27 2019-03-27 散热组件和电子设备 Pending CN112005368A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/079843 WO2020191650A1 (zh) 2019-03-27 2019-03-27 散热组件和电子设备

Publications (1)

Publication Number Publication Date
CN112005368A true CN112005368A (zh) 2020-11-27

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ID=72608786

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980017587.8A Pending CN112005368A (zh) 2019-03-27 2019-03-27 散热组件和电子设备

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CN (1) CN112005368A (zh)
WO (1) WO2020191650A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2494524Y (zh) * 2001-07-11 2002-06-05 神基科技股份有限公司 球网格阵列型的cpu的散热结构
US20030063247A1 (en) * 2001-08-03 2003-04-03 Satyan Kalyandurg Heat sink attachment
CN201273486Y (zh) * 2008-08-22 2009-07-15 深圳市幻景光电科技有限公司 大功率的led光条
CN101601131A (zh) * 2007-02-15 2009-12-09 日本电气株式会社 用于安装半导体封装的结构
CN106129024A (zh) * 2016-08-16 2016-11-16 中山大象动力科技有限公司 一种基于散热设计的功率半导体器件模块
CN205900524U (zh) * 2016-08-16 2017-01-18 中山大象动力科技有限公司 一种基于散热设计的功率半导体器件模块

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2494524Y (zh) * 2001-07-11 2002-06-05 神基科技股份有限公司 球网格阵列型的cpu的散热结构
US20030063247A1 (en) * 2001-08-03 2003-04-03 Satyan Kalyandurg Heat sink attachment
CN101601131A (zh) * 2007-02-15 2009-12-09 日本电气株式会社 用于安装半导体封装的结构
CN201273486Y (zh) * 2008-08-22 2009-07-15 深圳市幻景光电科技有限公司 大功率的led光条
CN106129024A (zh) * 2016-08-16 2016-11-16 中山大象动力科技有限公司 一种基于散热设计的功率半导体器件模块
CN205900524U (zh) * 2016-08-16 2017-01-18 中山大象动力科技有限公司 一种基于散热设计的功率半导体器件模块

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Publication number Publication date
WO2020191650A1 (zh) 2020-10-01

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Application publication date: 20201127