CN101589342A - 改善光学系统成像特性的方法以及光学系统 - Google Patents
改善光学系统成像特性的方法以及光学系统 Download PDFInfo
- Publication number
- CN101589342A CN101589342A CNA2008800028512A CN200880002851A CN101589342A CN 101589342 A CN101589342 A CN 101589342A CN A2008800028512 A CNA2008800028512 A CN A2008800028512A CN 200880002851 A CN200880002851 A CN 200880002851A CN 101589342 A CN101589342 A CN 101589342A
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- China
- Prior art keywords
- optical system
- thermal
- optical
- optical element
- mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
- G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lenses (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Lens Barrels (AREA)
- Optical Elements Other Than Lenses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007004723.3 | 2007-01-22 | ||
| DE102007004723 | 2007-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101589342A true CN101589342A (zh) | 2009-11-25 |
Family
ID=39496034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008800028512A Pending CN101589342A (zh) | 2007-01-22 | 2008-01-22 | 改善光学系统成像特性的方法以及光学系统 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US8462315B2 (enExample) |
| EP (1) | EP2126635B1 (enExample) |
| JP (1) | JP5193227B2 (enExample) |
| KR (1) | KR101452534B1 (enExample) |
| CN (1) | CN101589342A (enExample) |
| AT (1) | ATE554427T1 (enExample) |
| WO (1) | WO2008089953A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103620500A (zh) * | 2011-06-20 | 2014-03-05 | 卡尔蔡司Smt有限责任公司 | 投射设备 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5193227B2 (ja) | 2007-01-22 | 2013-05-08 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 半導体リソグラフィシステム及びその使用方法 |
| DE102008042356A1 (de) * | 2008-09-25 | 2010-04-08 | Carl Zeiss Smt Ag | Projektionsbelichtungsanlage mit optimierter Justagemöglichkeit |
| DE102010044969A1 (de) * | 2010-09-10 | 2012-03-15 | Carl Zeiss Smt Gmbh | Verfahren zum Betreiben einer Projektionsbelichtungsanlage sowie Steuervorrichtung |
| KR101529807B1 (ko) | 2011-01-20 | 2015-06-17 | 칼 짜이스 에스엠티 게엠베하 | 투영 노광 도구를 조작하는 방법 |
| DE102012212758A1 (de) * | 2012-07-20 | 2014-01-23 | Carl Zeiss Smt Gmbh | Systemkorrektur aus langen Zeitskalen |
| KR101668984B1 (ko) * | 2013-09-14 | 2016-10-24 | 칼 짜이스 에스엠티 게엠베하 | 마이크로리소그래피 투영 장치의 동작 방법 |
| KR101398934B1 (ko) * | 2014-01-23 | 2014-05-27 | 국방과학연구소 | 불균일 보정 기능이 제공되는 다 구간 시계 영상 확보 방식 적외선 광각 카메라 |
| DE102015220537A1 (de) * | 2015-10-21 | 2016-10-27 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit mindestens einem Manipulator |
| US10282822B2 (en) * | 2016-12-01 | 2019-05-07 | Almalence Inc. | Digital correction of optical system aberrations |
| WO2018233997A1 (de) * | 2017-06-23 | 2018-12-27 | Jenoptik Optical Systems Gmbh | Verfahren zur unterstützung einer justage eines strahlaufweiters, justageunterstützungsvorrichtung und strahlaufweiter |
| CN115494639B (zh) * | 2022-11-04 | 2023-02-17 | 中国航天三江集团有限公司 | 高功率激光光束合成系统内通道热效应仿真方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4540251A (en) * | 1983-12-01 | 1985-09-10 | International Business Machines Corporation | Thermo-mechanical overlay signature tuning for Perkin-Elmer mask aligner |
| JPH05291117A (ja) * | 1992-04-14 | 1993-11-05 | Hitachi Ltd | 投影露光方法およびその装置 |
| JP3291818B2 (ja) * | 1993-03-16 | 2002-06-17 | 株式会社ニコン | 投影露光装置、及び該装置を用いる半導体集積回路製造方法 |
| US5392119A (en) * | 1993-07-13 | 1995-02-21 | Litel Instruments | Plate correction of imaging systems |
| JP3368091B2 (ja) * | 1994-04-22 | 2003-01-20 | キヤノン株式会社 | 投影露光装置及びデバイスの製造方法 |
| JPH08241861A (ja) * | 1996-04-08 | 1996-09-17 | Nikon Corp | Lsi素子製造方法、及びlsi素子製造装置 |
| US5888675A (en) * | 1996-12-04 | 1999-03-30 | Advanced Micro Devices, Inc. | Reticle that compensates for radiation-induced lens error in a photolithographic system |
| US5828455A (en) * | 1997-03-07 | 1998-10-27 | Litel Instruments | Apparatus, method of measurement, and method of data analysis for correction of optical system |
| US5978085A (en) * | 1997-03-07 | 1999-11-02 | Litel Instruments | Apparatus method of measurement and method of data analysis for correction of optical system |
| DE19827602A1 (de) * | 1998-06-20 | 1999-12-23 | Zeiss Carl Fa | Verfahren zur Korrektur nicht-rotationssymmetrischer Bildfehler |
| DE19827603A1 (de) | 1998-06-20 | 1999-12-23 | Zeiss Carl Fa | Optisches System, insbesondere Projektions-Belichtungsanlage der Mikrolithographie |
| DE10000191B8 (de) * | 2000-01-05 | 2005-10-06 | Carl Zeiss Smt Ag | Projektbelichtungsanlage der Mikrolithographie |
| EP1231517A1 (en) | 2001-02-13 | 2002-08-14 | ASML Netherlands B.V. | Lithographic projection apparatus and method of measuring wave front aberrations |
| US20030235682A1 (en) * | 2002-06-21 | 2003-12-25 | Sogard Michael R. | Method and device for controlling thermal distortion in elements of a lithography system |
| WO2005022614A1 (ja) * | 2003-08-28 | 2005-03-10 | Nikon Corporation | 露光方法及び装置、並びにデバイス製造方法 |
| JP4692753B2 (ja) | 2004-02-13 | 2011-06-01 | 株式会社ニコン | 露光方法及び装置、並びにデバイス製造方法 |
| JP2005353968A (ja) * | 2004-06-14 | 2005-12-22 | Canon Inc | 閉ループ制御装置、光学素子駆動装置及び露光装置 |
| US7463367B2 (en) * | 2004-07-13 | 2008-12-09 | Micron Technology, Inc. | Estimating overlay error and optical aberrations |
| US7262831B2 (en) * | 2004-12-01 | 2007-08-28 | Asml Netherlands B.V. | Lithographic projection apparatus and device manufacturing method using such lithographic projection apparatus |
| JP2006189570A (ja) * | 2005-01-05 | 2006-07-20 | Canon Inc | 液浸光学系および光学装置 |
| TWI454731B (zh) * | 2005-05-27 | 2014-10-01 | Zeiss Carl Smt Gmbh | 用於改進投影物鏡的成像性質之方法以及該投影物鏡 |
| US20080204682A1 (en) * | 2005-06-28 | 2008-08-28 | Nikon Corporation | Exposure method and exposure apparatus, and device manufacturing method |
| US7671970B2 (en) * | 2005-07-13 | 2010-03-02 | Asml Netherlands B.V. | Stage apparatus with two patterning devices, lithographic apparatus and device manufacturing method skipping an exposure field pitch |
| WO2007017089A1 (en) * | 2005-07-25 | 2007-02-15 | Carl Zeiss Smt Ag | Projection objective of a microlithographic projection exposure apparatus |
| JP5193227B2 (ja) * | 2007-01-22 | 2013-05-08 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 半導体リソグラフィシステム及びその使用方法 |
| JP5114992B2 (ja) * | 2007-03-26 | 2013-01-09 | ヤマハ株式会社 | 電子楽器用の鍵盤装置 |
-
2008
- 2008-01-22 JP JP2009546682A patent/JP5193227B2/ja active Active
- 2008-01-22 EP EP20080707189 patent/EP2126635B1/en not_active Not-in-force
- 2008-01-22 AT AT08707189T patent/ATE554427T1/de active
- 2008-01-22 KR KR1020097014877A patent/KR101452534B1/ko active Active
- 2008-01-22 WO PCT/EP2008/000459 patent/WO2008089953A1/en not_active Ceased
- 2008-01-22 CN CNA2008800028512A patent/CN101589342A/zh active Pending
-
2009
- 2009-04-30 US US12/432,921 patent/US8462315B2/en active Active
-
2013
- 2013-05-13 US US13/893,322 patent/US8947633B2/en active Active
-
2015
- 2015-01-15 US US14/597,497 patent/US9823579B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103620500A (zh) * | 2011-06-20 | 2014-03-05 | 卡尔蔡司Smt有限责任公司 | 投射设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| ATE554427T1 (de) | 2012-05-15 |
| KR101452534B1 (ko) | 2014-10-21 |
| KR20090125042A (ko) | 2009-12-03 |
| US20090231565A1 (en) | 2009-09-17 |
| US20150125968A1 (en) | 2015-05-07 |
| JP5193227B2 (ja) | 2013-05-08 |
| EP2126635A1 (en) | 2009-12-02 |
| US9823579B2 (en) | 2017-11-21 |
| US8947633B2 (en) | 2015-02-03 |
| EP2126635B1 (en) | 2012-04-18 |
| US8462315B2 (en) | 2013-06-11 |
| US20130250261A1 (en) | 2013-09-26 |
| JP2010517279A (ja) | 2010-05-20 |
| WO2008089953A1 (en) | 2008-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20091125 |