Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
  • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70216—Mask projection systems
  • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
  • G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70216—Mask projection systems
  • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
  • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
  • G03F7/70891—Temperature

Definitions

• the imaging quality of an optical system is governed by imaging aberrations occurring in the optical system, such as e.g. areas resulting from aberrations.
• imaging aberrations can be thermally induced during the operation of the optical system by at least one optical element of the optical system being heated and altering the imaging properties of the optical system.
• This measure has the advantage that the thermal action can be optimally adapted to the temporally variable wavefront aberration profiles of the optical system.
• the imaging aberrations of the optical system can be corrected particularly well by this means.
• Fig. 1 shows a schematic illustration of an optical system during an exposure of a substrate
• an optical element 42 can be assigned at least one mechanical manipulator 62 and at least one thermal manipulator 66. Furthermore, it is possible for in each case at least one mechanical manipulator 64 or at least one thermal manipulator 68 to be assigned to a respective optical element 44, 46 and to act on the optical element 44, 46.
• the intended desired correction 84 of the at least one imaging aberration of the optical system 10 is obtained by a correction 86 and a correction 88.
• the correction 86 results from the positioning and/or deformation of the optical elements 42, 44 by means of the mechanical manipulators 62, 64.
• the correction 88 results from the deformation of the optical elements 42, 46 by means of the thermal manipulators 66, 68.
• the field- and diffraction-angle-dependent light distribution in the optical system 10 can be estimated on the basis of the mode of illumination of the structure 20 by the illumination source 24 and the illumination optical assembly 25.
• the intensity absorbed in the optical elements 42-48 that is to say the temperature distribution thereof, is determined by means of a knowledge of layer and volume absorption coefficients of the optical elements 42- 48.
• the resulting coefficients of thermal expansion or the resulting temperature- dependent change in refractive index of the optical elements 42-48 and the effects thereof on the overall wavefront of the optical system 10 can thus be calculated.
• the substep 114 for determining imaging aberrations is effected by means of a comparison of the field- and diffraction-angle-dependent light distribution in the optical system with a field- and diffraction-angle-dependent light distribution of reference measurements.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Health & Medical Sciences (AREA)
• Engineering & Computer Science (AREA)
• Optics & Photonics (AREA)
• Public Health (AREA)
• Toxicology (AREA)
• Atmospheric Sciences (AREA)
• Environmental & Geological Engineering (AREA)
• Epidemiology (AREA)
• Life Sciences & Earth Sciences (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Lenses (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Lens Barrels (AREA)
• Optical Elements Other Than Lenses (AREA)

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• 2008
  • 2008-01-22 JP JP2009546682A patent/JP5193227B2/ja active Active
  • 2008-01-22 EP EP20080707189 patent/EP2126635B1/en not_active Not-in-force
  • 2008-01-22 AT AT08707189T patent/ATE554427T1/de active
  • 2008-01-22 KR KR1020097014877A patent/KR101452534B1/ko active Active
  • 2008-01-22 WO PCT/EP2008/000459 patent/WO2008089953A1/en not_active Ceased
  • 2008-01-22 CN CNA2008800028512A patent/CN101589342A/zh active Pending
• 2009
  • 2009-04-30 US US12/432,921 patent/US8462315B2/en active Active
• 2013
  • 2013-05-13 US US13/893,322 patent/US8947633B2/en active Active
• 2015
  • 2015-01-15 US US14/597,497 patent/US9823579B2/en active Active

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