CN101582398A - 球凸块焊接带状导线互连 - Google Patents

球凸块焊接带状导线互连 Download PDF

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Publication number
CN101582398A
CN101582398A CNA2009101390935A CN200910139093A CN101582398A CN 101582398 A CN101582398 A CN 101582398A CN A2009101390935 A CNA2009101390935 A CN A2009101390935A CN 200910139093 A CN200910139093 A CN 200910139093A CN 101582398 A CN101582398 A CN 101582398A
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ball
ribbon
electronic component
ribbon conductor
substrate
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CNA2009101390935A
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CN101582398B (zh
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D·E·克里斯滕森
C·J·米勒
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Tektronix Inc
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Tektronix Inc
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Abstract

球凸块焊接带状导线互连具有附接到集成电路的焊盘上的球凸块。带状导线的一端附接到球凸块，其相对端附接到衬底的金属化表面。带状导线可宽于球凸块，球凸块可将带状导线从集成电路表面分离。带状导线可互连多个集成电路(其每个都具有球凸块或适当宽度的金属化表面)到衬底的金属化表面。本发明还包括将电子元件电连接到衬底的方法。

Description

球凸块焊接带状导线互连
技术领域
[0001]本发明涉及用于集成电路和分立电子元件的球凸块焊接带状导线互连。球凸块焊接带状导线互连尤其适用于使带状导线焊接到比带状导线窄的集成电路的焊盘。
背景技术
[0002]人们希望球凸块焊接带状导线互连能够将带状导线焊接到比带状导线窄的集成电路的焊盘。当需要宽信号路径限制高频信号的信号损失或避免其他不利性能效果时使用带状导线。现有的热超声波导线焊接设备可放置带状导线互连，不过现有技术受到限制，因为它们需要尺寸等于或大于带状导线宽度的焊盘。带状导线被固定在焊接工具脚和焊盘之间以此来应用超声波能量和力来形成带状导线和焊盘金属喷镀之间的焊接部。形成的焊接部建立了带状导线和焊盘金属喷镀之间的电连接。
[0003]因此，焊接工具必须能够向下接触到每个焊接区上以形成焊接部，每个焊盘的接触面积必须等于或大于焊接工具的接触面积以适当地形成焊接部。在较窄焊盘上使用宽带状导线的问题在于接触面积不相同。当焊盘较小时以给定能量输送到较小的区域，可发生不利的后果，包括焊接由于过度能量集中而失效。因此，在这种情况下必须控制超声波能量，力和时间的组合来限制传递到焊接的能量。
[0004]而且，焊盘通常在与集成电路自身相同的平面上或可甚至凹下，其防止焊接工具接触焊盘而不会首先造成与集成电路表面的潜在破坏性接触。另外，带状导线是不透明的，不能透过带状导线可视地放置焊盘而确定何时焊接工具适当地就位来形成焊接。
[0005]导线网互连的使用在现有技术中是已知的。导线网以带状或条状形式使用。然而，需要金制导线网的手切块，并手动放置金制导线网以将其连接到宽度小于导线网宽度的焊盘。导线网使焊接位置透过导线网可视，其便于手动对齐到焊盘，在这种方式下不透明带状导线是不可行的。然而，此现有方法需要大量的人力以在放置的每个互连的导线网交点上产生多个焊接。而且，当导线网焊接到较窄焊盘上时，在一些情况下伸出的网必须折叠起来以防短路，这需要额外的人力。
[0006]因此，需要新的改进的球凸块焊接带状导线互连，其可用于使带状导线能够焊接到比带状导线窄的集成电路的焊盘。在这点上，本发明的各种实施例实质上实现了这些要求中的至少一部分。在这方面，根据本发明的球凸块焊接带状导线互连实质上脱离了现有技术的传统构思与设计，这样提供了一种装置，其主要为了使带状导线能够焊接到比带状导线窄的集成电路的焊盘上的目的而开发。
发明内容
[0007]本发明提供了一种改进的球凸块焊接带状导线互连，并克服了现有技术中的上述缺点和不足。这样，本发明的总体目的(其将在接下来更详细地描述)是提供一种改进的球凸块焊接带状导线互连，其具有优于上述现有技术的所有优点。
[0008]为此目的，本发明的优选实施例本质上包括附接到集成电路的焊盘上的球凸块。带状导线的一端附接到球凸块，其相对端附接到衬底的金属化表面。带状导线可宽于球凸块，球凸块可将带状导线从集成电路表面分离。带状导线可互连多个集成电路(其中每个集成电路都具有球凸块或适当宽度的金属化表面)到衬底的金属化表面。本发明还包括将电子元件电连接到衬底的方法。本发明当然具有额外的特征，其将在后面描述并将形成所附权利要求的主题。
[0009]为了更好地理解随后对本发明的详细描述并为了更好地认识到本发明对技术领域的贡献，十分广泛地描述了本发明的更重要特征。
附图说明
[0010]图1是根据本发明原理构造的球凸块焊接带状导线互连的现有实施例的俯视图。
[0011]图2是本发明的球凸块焊接带状导线互连的现有实施例的侧面剖视图。
[0012]图3是本发明的球凸块焊接带状导线互连的可替换实施例的俯视透视图。为了示出的目的，带状导线为半透明的。
[0013]在各图中，相同的附图标记表示相同的部件。
具体实施方式
[0014]本发明的球凸块焊接带状导线互连的一个优选实施例被示出并总体上由附图标记10所标示。
[0015]图1和2示出了本发明的改进球凸块焊接带状导线互连10。更具体地，球凸块焊接带状导线互连10描绘了将集成电路12连接到衬底20的带状导线互连18。金制球凸块16置于集成电路12的焊盘14(其比带状导线要窄)上来提高焊盘14的表面。这使带式焊接工具能够接触球凸块16以通过如图2所示部分压扁(flattening)球凸块16形成球凸块焊接24。
[0016]带状导线延伸超过球凸块16的部分不会引起例如与邻近接地焊盘短路和高寄生电容之类的电问题，因为其大致平行于集成电路12表面并与集成电路12的表面隔开一定距离。然后带状导线互连18可在正常方式下端接衬底20的金属化表面22上的表面焊接26。衬底20的金属化表面22至少与带状导线一样宽。在表面焊接26上，带状导线在其整个宽度上被可靠地焊接并充分地变形使得其可通过撕裂与互连的带状导线18分离。在现有实施例中，优选的是集成电路12与衬底20等高或高于衬底20，以避免由带式焊接工具造成的间隙问题。只要焊接工具可接触集成电路表面而不受衬底表面干涉，集成电路12的上表面也可稍微低于邻近的衬底焊接表面。然而，这不应被视为限制，因为设备可使用切线钳且带式焊接工具技术的进步在未来可消除这种限制。
[0017]图3示出了本发明的改进球凸块焊接带状导线互连100的可替换实施例。更具体地，球凸块焊接带状导线互连100的可替换实施例描绘了使用球凸块焊接124和表面焊接126的组合连接多个集成电路的带状导线互连118。带状导线互连118由球凸块焊接124连接到第一集成电路112，由表面焊接126连接到第一衬底128，由球凸块焊接124连接到第二集成电路130，由表面焊接126连接到第二衬底132。只要最终焊接是表面焊接或是在足够大以接触焊接工具脚整个宽度来端接带状导线互连118的焊盘上进行，球凸块焊接和表面焊接的任意组合可用作第一焊接或中间焊接。然而，这不应被视为限制，因为带式焊接工具技术的进步在未来可消除这种限制。
[0018]为了将电子元件通过球凸块焊接带状导线互连连接到衬底，导线球焊机器将球凸块放置在每个工件的焊盘上，其中在所述焊盘上进行所公开类型的焊接(例如比所用带状导线窄的焊盘)。球凸块在作为工件一部分的集成电路的平面的上方具有上部分。
[0019]放置球凸块之后，工件被移动到带式焊接机器或工作站。在那里，焊接工具使用楔焊通过热超声波将带状导线的自由端焊接到第一位置。第一位置可在等于或宽于带状导线宽度的金属化表面或焊盘上或者球凸块上。然后如果需要的话，在等于或宽于带状导线宽度的金属化表面或焊盘上端接带状导线互连之前，带式焊接工具将带状导线焊接到额外的位置，该位置可为等于或宽于带状导线宽度的金属化表面或焊盘或者球凸块的任意组合。在焊盘具有多个球凸块的情况下，其中多个球凸块邻近或隔开小于带状导线宽度的距离，带状导线可通过热超声波同时焊接到所有紧邻的球凸块。尽管一般认为通过两个不同的机器使用分离的焊道是低效率的，然而本发明与已知手动方法(其迄今为止不能自动化)相比在效率方面提供了巨大改进。
[0020]尽管详细描述了球凸块焊接带状导线互连的现有实施例，但明显的是所有落入本发明的真实精神和范围内的修改和变化也是可行的。关于上述描述，很容易地认识到本发明的各部件的优化量纲关系(包括尺寸，材料，形状，形式，功能和操作方式，组装和使用的变化)对于本领域的一个技术人员是显而易见且明显的，附图所示及说明书所述关系的所有等同关系应包含在本发明之内。例如，任意适合的导电及耐腐蚀材料可用来代替金制球凸块。而且，尽管描述了由导线球焊机器放置球凸块，然而球凸块放置也可由可替换方法实现。另外，可采用超声波压焊(其随时间应用超声波能量和力而不加热工件)代替所述的热超声波焊接。并且尽管描述了使带状导线能够焊接到比带状导线窄的集成电路的焊盘，但应当认识到的是本文所描述的球凸块焊接带状导线互连还适用于分立元件(例如二极管、晶体管和衰减器)。而且，导线网可用于代替带状导线。
[0021]因此，前面被认为是仅示出本发明的原理。而且，因为本领域的技术人员将很容易做出大量的修改和改变，所以不需要将本发明限制于所述和所示的精确的构造和操作，并且因此可采取所有落入本发明范围内的适合修改和等同物。

Claims (29)

1、一种球凸块焊接带状导线互连，包括：
连接到衬底的第一电子元件；
所述电子元件具有上表面，所述上表面包括焊盘；
所述衬底除了所述焊盘之外还包括第二电触点；
球凸块，具有球凸块宽度；
所述球凸块附接到所述焊盘；
带状导线，具有带宽度；
所述带状导线的第一部分附接到所述球凸块；和
所述带状导线的第二部分附接到所述第二电触点。
2、根据权利要求1所述的球凸块焊接带状导线互连，其特征在于，所述带状导线具有相对的端且所述第一部分是所述带状导线的第一端。
3、根据权利要求1所述的球凸块焊接带状导线互连，其特征在于，所述第二电触点是在所述衬底表面上的金属化触点。
4、根据权利要求3所述的球凸块焊接带状导线互连，其特征在于，所述带状导线通过热超声波焊接到所述金属化触点
5、根据权利要求1所述的球凸块焊接带状导线互连，其特征在于，所述第二电触点是附接到所述衬底的第二电子元件的焊盘。
6、根据权利要求5所述的球凸块焊接带状导线互连，其特征在于，所述带状导线通过热超声波焊接到所述焊盘。
7、根据权利要求1所述的球凸块焊接带状导线互连，其特征在于，所述第二电触点包括球凸块，所述带状导线连接到所述球凸块。
8、根据权利要求7所述的球凸块焊接带状导线互连，其特征在于，所述带状导线通过热超声波焊接到所述第二电触点的球凸块。
9、根据权利要求1所述的球凸块焊接带状导线互连，其特征在于，所述球凸块具有在所述电子元件的上表面的上方延伸的上部分。
10、根据权利要求1所述的球凸块焊接带状导线互连，其特征在于，所述带宽度大于所述球凸块宽度。
11、根据权利要求1所述的球凸块焊接带状导线互连，其特征在于，所述球凸块具有在所述焊盘的上方延伸的上部分。
12、根据权利要求1所述的球凸块焊接带状导线互连，其特征在于，所述带状导线由所述球凸块与所述电子元件的上表面分离。
13、根据权利要求1所述的球凸块焊接带状导线互连，其特征在于，所述带状导线通过热超声波焊接到所述球凸块。
14、一种球凸块焊接带状导线互连，包括：
连接到具有金属化表面部分的衬底的第一电子元件；
所述第一电子元件具有上表面，所述上表面包括焊盘；
球凸块，具有球凸块宽度，所述球凸块附接到所述第一电子元件的焊盘；
带状导线，具有带宽度；
所述带状导线具有相对的端；
所述带状导线具有中间部；
所述相对的端中的一个附接到所述第一电子元件的球凸块；
连接到具有金属化表面部分的所述衬底的第二电子元件；
所述第二电子元件具有上表面，所述上表面包括焊盘；
球凸块，具有球凸块宽度，所述球凸块附接到所述第二电子元件的焊盘；
所述带状导线的中间部附接到所述第二电子元件的球凸块；和
所述带状导线的所述相对的端中的另一个附接到所述金属化表面部分。
15、根据权利要求14所述的球凸块焊接带状导线互连，其特征在于，所述球凸块具有在所述电子元件的上表面的上方延伸的上部分。
16、根据权利要求14所述的球凸块焊接带状导线互连，其特征在于，所述带宽度宽于所述球凸块宽度。
17、根据权利要求14所述的球凸块焊接带状导线互连，其特征在于，所述球凸块在所述焊盘的上方延伸。
18、根据权利要求14所述的球凸块焊接带状导线互连，其特征在于，所述带状导线由所述球凸块与所述电子元件的上表面分离。
19、根据权利要求14所述的球凸块焊接带状导线互连，其特征在于，所述带状导线通过热超声波焊接到所述球凸块。
20、根据权利要求14所述的球凸块焊接带状导线互连，其特征在于，所述带状导线通过热超声波焊接到所述金属化表面。
21、一种将电子元件电连接到衬底的方法，包括以下步骤：
提供：具有自由端和第二部分的带状导线，具有金属化表面部分的衬底；和连接到所述衬底并具有上表面的元件，所述上表面包括焊盘；
将球凸块附接到所述焊盘；
将所述带状导线的自由端附接到所述球凸块；和
将所述带状导线的第二部分附接到所述金属化表面部分。
22、根据权利要求21所述的将电子元件电连接到衬底的方法，其特征在于，所述球凸块由导线球焊设备附接到所述焊盘。
23、根据权利要求21所述的将电子元件电连接到衬底的方法，其特征在于，所述带状导线由带状导线焊接设备附接到所述球凸块和所述金属化表面。
24、根据权利要求23所述的将电子元件电连接到衬底的方法，其特征在于，进一步包括使用所述带状导线焊接设备将邻近所述第二部分的所述带状导线从所述第二部分分离的步骤。
25、根据权利要求21所述的将电子元件电连接到衬底的方法，其特征在于，所述球凸块具有在所述元件的上表面的上方延伸的上部分。
26、根据权利要求21所述的将电子元件电连接到衬底的方法，其特征在于，所述带状导线宽于所述球凸块。
27、根据权利要求21所述的将电子元件电连接到衬底的方法，其特征在于，所述球凸块具有在所述焊盘的上方延伸的上部分。
28、根据权利要求21所述的将电子元件电连接到衬底的方法，其特征在于，所述带状导线由所述球凸块与所述电子元件的表面分离
29、根据权利要求21所述的将电子元件电连接到衬底的方法，其特征在于，所述带状导线通过热超声波焊接到所述球凸块和所述金属化表面。
CN2009101390935A 2008-05-16 2009-05-15 球凸块焊接带状导线互连 Expired - Fee Related CN101582398B (zh)

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