JP2009278116A - ボール・バンプ結合リボン・ワイヤ配線及び電気部品を基板に接続する方法 - Google Patents
ボール・バンプ結合リボン・ワイヤ配線及び電気部品を基板に接続する方法 Download PDFInfo
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- JP2009278116A JP2009278116A JP2009120357A JP2009120357A JP2009278116A JP 2009278116 A JP2009278116 A JP 2009278116A JP 2009120357 A JP2009120357 A JP 2009120357A JP 2009120357 A JP2009120357 A JP 2009120357A JP 2009278116 A JP2009278116 A JP 2009278116A
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- Wire Bonding (AREA)
Abstract
【解決手段】ボール・バンプ結合リボン・ワイヤ配線10には、集積回路12の接合パッド14に取り付けられたボール・バンプ16がある。リボン・ワイヤ18は、一端がボール・バンプ16に取り付けられ、他端が基板20の金属化面22に取り付けられる。リボン・ワイヤ18は、ボール・バンプ16より広くても良く、また、ボール・バンプ16は、集積回路12の表面からリボン・ワイヤ18を空間的に隔てる。リボン・ワイヤ18は、複数の集積回路12を基板20の金属化面22に配線しても良く、これら集積回路12は、夫々ボール・バンプ16又は適当な広さの金属化面22を有している。本発明は、電気部品を基板に電気的に接続するのに用いても良い。
【選択図】図2
Description
12 集積回路
16 ボール・バンプ(突起電極)
18 リボン・ワイヤ配線
20 基板
22 金属化面(metallized surface)
24 ボール・バンプ接合
26 表面接合
100 ボール・バンプ結合リボン・ワイヤ配線(他の実施例)
112 第1集積回路
116 ボール・バンプ(突起電極)
118 リボン・ワイヤ配線
120 基板
122 金属化面(metallized surface)
124 ボール・バンプ接合
126 表面接合
128 第1基板
130 第2集積回路
132 第2基板
Claims (3)
- 上面に結合パッドを含み、基板に接続された第1電気部品と、
上記基板が有する上記結合パッド以外の第2電気コンタクトと、
所定バンプ幅を有し、上記結合パッドに取り付けられるボール・バンプと、
所定リボン幅を有するリボン・ワイヤとを具え、
上記リボン・ワイヤの第1部分が上記ボール・バンプに取り付けられ、上記リボン・ワイヤの第2部分が上記第2電気コンタクトに取り付けられたボール・バンプ結合リボン・ワイヤ配線。 - 結合パッドを含む上面を有し、第1金属化面を有する基板に接続された第1電気部品と、
所定バンプ幅を有し、上記第1電気部品の上記結合パッドに取り付けられるボール・バンプと、
所定リボン幅を有すると共に、対向する端部及び中間部分を有し、上記対向する端部の一方が上記第1電気部品の上記ボール・バンプに取り付けられるリボン・ワイヤと、
結合パッドを含む上面を有し、第2金属化面を有する上記基板に接続された第2電気部品と、
所定バンプ幅を有し、上記第2電気部品の上記結合パッドに取り付けられるボール・バンプとを具え、
上記リボン・ワイヤの上記中間部分が上記第2電気部品の上記ボール・バンプに取り付けられ、上記リボン・ワイヤの上記対向する端部の他方が上記第2金属化面に取り付けられることを特徴とするボール・バンプ結合リボン・ワイヤ配線。 - 自由端及び第2部分を有するリボン・ワイヤと、金属化面部分を有する基板と、結合パッドを含む上面を有し、上記基板に接続された電気部品とを用意するステップと、
ボール・バンプを上記結合パッドに取り付けるステップと、
上記リボン・ワイヤの上記自由端を上記ボール・バンプに取り付けるステップと、
上記リボン・ワイヤの上記第2部分を上記金属化面部分に取り付けるステップと
を具える電気部品を基板に接続する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/122,213 | 2008-05-16 | ||
US12/122,213 US7977804B2 (en) | 2008-05-16 | 2008-05-16 | Ball-bump bonded ribbon-wire interconnect |
Publications (2)
Publication Number | Publication Date |
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JP2009278116A true JP2009278116A (ja) | 2009-11-26 |
JP5971886B2 JP5971886B2 (ja) | 2016-08-17 |
Family
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JP2009120357A Expired - Fee Related JP5971886B2 (ja) | 2008-05-16 | 2009-05-18 | ボール・バンプ結合リボン・ワイヤ配線及び集積回路を基板に接続する方法 |
Country Status (4)
Country | Link |
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US (1) | US7977804B2 (ja) |
EP (1) | EP2120259A1 (ja) |
JP (1) | JP5971886B2 (ja) |
CN (1) | CN101582398B (ja) |
Families Citing this family (1)
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DE102012222791A1 (de) * | 2012-12-11 | 2014-06-12 | Robert Bosch Gmbh | Verfahren zur Kontaktierung eines Halbleiters und Halbleiterbauelement mit erhöhter Stabilität gegenüber thermomechanischen Einflüssen |
Citations (5)
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JPS61116850A (ja) * | 1984-11-12 | 1986-06-04 | Mitsubishi Electric Corp | 半導体装置 |
JP2001237263A (ja) * | 2000-02-24 | 2001-08-31 | Hitachi Ltd | 高周波回路装置及びその製造方法 |
US6500760B1 (en) * | 2001-08-02 | 2002-12-31 | Sandia Corporation | Gold-based electrical interconnections for microelectronic devices |
JP2005183495A (ja) * | 2003-12-17 | 2005-07-07 | Hitachi Ltd | 電力変換装置 |
JP2007288013A (ja) * | 2006-04-19 | 2007-11-01 | Nec Electronics Corp | 半導体装置の製造方法 |
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US5976964A (en) * | 1997-04-22 | 1999-11-02 | Micron Technology, Inc. | Method of improving interconnect of semiconductor device by utilizing a flattened ball bond |
JP3865055B2 (ja) * | 2001-12-28 | 2007-01-10 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JP2003303845A (ja) | 2002-04-10 | 2003-10-24 | Fuji Electric Co Ltd | 半導体装置およびワイヤボンディング方法 |
DE10223035A1 (de) | 2002-05-22 | 2003-12-04 | Infineon Technologies Ag | Elektronisches Bauteil mit Hohlraumgehäuse, insbesondere Hochfrequenz-Leistungsmodul |
JP2005259915A (ja) | 2004-03-10 | 2005-09-22 | Nec Electronics Corp | 半導体装置およびその製造方法 |
KR100604840B1 (ko) * | 2004-03-11 | 2006-07-28 | 삼성전자주식회사 | 미세 피치 범프에의 리버스 와이어 본딩 방법 및 이에의한 와이어 본드 구조체 |
WO2006018671A1 (en) | 2004-08-19 | 2006-02-23 | Infineon Technologies Ag | Mixed wire semiconductor lead frame package |
-
2008
- 2008-05-16 US US12/122,213 patent/US7977804B2/en not_active Expired - Fee Related
-
2009
- 2009-05-14 EP EP09251320A patent/EP2120259A1/en not_active Withdrawn
- 2009-05-15 CN CN2009101390935A patent/CN101582398B/zh not_active Expired - Fee Related
- 2009-05-18 JP JP2009120357A patent/JP5971886B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS61116850A (ja) * | 1984-11-12 | 1986-06-04 | Mitsubishi Electric Corp | 半導体装置 |
JP2001237263A (ja) * | 2000-02-24 | 2001-08-31 | Hitachi Ltd | 高周波回路装置及びその製造方法 |
US6500760B1 (en) * | 2001-08-02 | 2002-12-31 | Sandia Corporation | Gold-based electrical interconnections for microelectronic devices |
JP2005183495A (ja) * | 2003-12-17 | 2005-07-07 | Hitachi Ltd | 電力変換装置 |
JP2007288013A (ja) * | 2006-04-19 | 2007-11-01 | Nec Electronics Corp | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
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CN101582398A (zh) | 2009-11-18 |
CN101582398B (zh) | 2013-06-19 |
JP5971886B2 (ja) | 2016-08-17 |
US20090283920A1 (en) | 2009-11-19 |
EP2120259A1 (en) | 2009-11-18 |
US7977804B2 (en) | 2011-07-12 |
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