TWI528516B - 晶片組裝結構及晶片組裝方法 - Google Patents

晶片組裝結構及晶片組裝方法 Download PDF

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TWI528516B
TWI528516B TW101114620A TW101114620A TWI528516B TW I528516 B TWI528516 B TW I528516B TW 101114620 A TW101114620 A TW 101114620A TW 101114620 A TW101114620 A TW 101114620A TW I528516 B TWI528516 B TW I528516B
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bonding
pad
wafer
pads
circuit board
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TW101114620A
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TW201344864A (zh
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吳開文
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鴻海精密工業股份有限公司
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Priority to TW101114620A priority Critical patent/TWI528516B/zh
Priority to US13/559,621 priority patent/US8860219B2/en
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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Description

晶片組裝結構及晶片組裝方法
本發明涉及一種晶片組裝結構及晶片組裝方法。
為實現預定之功能，電子產品中一般包括電路板以及複數設置於所述電路板上之晶片，所述晶片之間以及所述晶片與所述電路板藉由打線方式電連接。
在有高頻訊號通過時，所述晶片與基板間的打線結構會產生較強電感，該電感會嚴重影響電路特性，使得電路阻抗難以匹配，同時使得訊號損失增加。
另外，隨著技術之發展，晶片之尺寸逾來逾小，相應地，晶片上之引腳尺寸也逾來逾小，引腳尺寸的減小必然造成打線難度增加。
有鑒於此，有必要提供一種能夠降低電感並且容易之晶片組裝結構以及晶片組裝方法。
一種晶片組裝結構，包括一個電路板以及一個位於所述電路板上之晶片。所述電路板上形成有複數第一焊墊，所述晶片上形成複數分別對應於所述第一焊墊之第二焊墊。所述每一個第一焊墊上形成有兩個第一焊球。每一個所述第二焊墊藉由兩條焊線與對應 之第一焊墊相連。所述兩條焊線之一端分別與所述兩個第一焊球相連，另一端與所述第二焊墊藉由熱壓焊方式相連。
一種晶片組裝方法，其包括如下步驟：提供一個電路板，所述電路板上形成有複數第一焊墊；提供一個晶片，所述晶片上形成有複數與所述第一焊墊相對應之第二焊墊；將所述晶片固定設置於所述電路板表面；於每一個所述第一焊墊上形成兩個第二焊球；提供兩個焊線，將所述兩個焊線之一端分別與所述第二焊球相焊接；將所述兩個焊線由所述第一焊球牽拉至所述第二焊墊，將所述焊線之另一端以熱壓焊方式焊接至所述第二焊墊上。
與先前技術相比，所述之晶片組裝結構以及晶片組裝方法，由於採用兩條焊線連接所述電路板上之第一焊墊以及所述晶片上對應之第二焊墊，並且所述兩條焊線之間構成並聯關係，因此可以使得所述第一焊墊以及第二焊墊之間連接線路電感降低，改善電路特性。另外，所述焊線藉由熱壓焊方式焊接至所述第二焊墊上，可以將低打線之難度，同時能夠增加增加所述第二焊墊與所述焊線連接部分的橫截面積，進一步降低電感。
100‧‧‧晶片組裝結構
10‧‧‧電路板
11‧‧‧承載面
12‧‧‧第一焊墊
13‧‧‧第一焊球
20‧‧‧晶片
21‧‧‧第二焊墊
30‧‧‧焊線
31‧‧‧起始端
32‧‧‧終止端
33‧‧‧楔形部
圖1係本發明之晶片組裝結構之示意圖。
圖2係本發明晶片組裝方法之流程圖。
下面將結合附圖對本發明作一具體介紹。
請參閱圖1，本發明之晶片組裝結構100包括一個電路板10、一個設置於所述電路板10上之晶片20以及連接所述電路板10以及所述晶片20之焊線30。
所述電路板10包括一個用於承載所述晶片20之承載面11。所述承載面11上設置有複數第一焊墊12，所述第一焊墊12與所述電路板10上之電路接線端(圖未示)相連，所述每一個第一焊墊12上形成有兩個第一焊球13。本事方式中，所述兩個第一焊球13與所述晶片20之間距離相同，當然，所述第一焊球13與所述晶片20之間距離也可以不同。
所述晶片20固定設置於所述電路板10之承載面11上。所述晶片20表面設置有複數第二焊墊21，所述第二焊墊21與所述電路板10上之第一焊墊12相對應。
本實施方式中，所述第一焊墊12及所述第二焊墊21之數量均為兩個，可以理解，所述第一焊墊12與所述第二焊墊21之數量可以依據不同需求而有所變化。
所述焊線30用於將所述第一焊墊12與對應之第二焊墊21電連接。每一對第一焊墊12與第二焊墊21之間由兩條焊線30相連。所述每一條焊線30包括一個與所述第一焊球13相連之起始端31、一個與所述第二焊墊21相連之終止端32。所述起始端31為所述焊線30在焊接時首先固定之一端，所述終止端32為所述焊線30在焊接時最後固定之一端。所述終止端32採用熱壓焊接方式與所述第二焊墊 21，所述每一個第二焊墊21上兩條焊線30的焊接位置相互重合。所述兩條焊線30於所述第二焊墊21焊接位置處形成一個楔形部33。
所述第一焊球13以及所述焊線30由高導電率之金屬材料構成，本實施方式中，所述第一焊球13以及所述焊線30均由金(Au)構成。
本實施方式中，所述電路板10上之所述晶片20之數量為一個。應當指出，所述晶片20之數量也可以為多個，且多個晶片20之厚度可以不同。
請參閱圖2，本發明之晶片組裝方法包括如下步驟：提供一個電路板，所述電路板上形成有複數第一焊墊；提供一個晶片，所述晶片上形成有複數與所述第一焊墊相對應之第二焊墊；將所述晶片固定設置於所述電路板表面；於一個所述第一焊墊上形成兩個第一焊球；提供兩個焊線，將所述兩個焊線之一端分別與所述第一焊球相焊接；將所述兩個焊線由所述第一焊球牽拉至所述第二焊墊，將所述焊線之另一端以熱壓焊方式焊接至所述第二焊墊上。
上述步驟中，所述焊線之另一端相互重疊焊接至所述第二焊墊上。
以上所述僅詳細描述了所述晶片其中一個第二焊墊與所述電路板之對應第一焊墊之連接方法，可以理解，其他第二焊墊與對應之第一焊墊可以採用相同方法實現連接，此處不再一一贅述。
所述之晶片組裝結構以及晶片組裝方法，由於採用兩條焊線連接所述電路板上之第一焊墊以及所述晶片上對應之第二焊墊，並且所述兩條焊線之間構成並聯關係，因此可以使得所述第一焊墊以及第二焊墊之間連接線路電感降低，改善電路特性。另外，所述焊線藉由熱壓焊方式焊接至所述第二焊墊上，可以將低打線之難度，同時能夠增加增加所述第二焊墊與所述焊線連接部分的橫截面積，進一步降低電感。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式及所列之數據為作試驗及參考之所用，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
100‧‧‧晶片組裝結構
10‧‧‧電路板
11‧‧‧承載面
12‧‧‧第一焊墊
13‧‧‧第一焊球
20‧‧‧晶片
21‧‧‧第二焊墊
30‧‧‧焊線
31‧‧‧起始端
32‧‧‧終止端
33‧‧‧楔形部

Claims (10)

  1. 一種晶片組裝結構，包括一個電路板和一個位於所述電路板上且與所述電路板電性相連之晶片，所述電路板上形成有複數第一焊墊，所述晶片上形成複數分別對應於所述第一焊墊之第二焊墊，其改進在於：所述每一個第一焊墊上形成有兩個第一焊球，每一個所述第二焊墊藉由兩條焊線與對應之第一焊墊相連，所述兩條焊線之一端分別與所述兩個第一焊球相連，另一端與所述第二焊墊藉由熱壓焊方式相連。
  2. 如申請專利範圍第1項所述之晶片組裝結構，其中，所述兩個第一焊球與所述晶片之間距離相同。
  3. 如申請專利範圍第1項所述之晶片組裝結構，其中，所述每一個第二焊墊上兩條焊線之焊接位置相互重合。
  4. 如申請專利範圍第1項所述之晶片組裝結構，其中，所述兩條焊線於所述第二焊墊焊接位置處形成一個楔形部。
  5. 如申請專利範圍第1項所述之晶片組裝結構，其中，所述第一焊球以及所述焊線之材料為金。
  6. 一種晶片組裝方法，包括如下步驟：提供一個電路板，所述電路板上形成有複數第一焊墊；提供一個晶片，所述晶片上形成有複數與所述第一焊墊相對應之第二焊墊；將所述晶片固定設置於所述電路板表面；於每一個所述第一焊墊上形成兩個第一焊球；提供兩個焊線，將所述兩個焊線之一端分別與所述第一焊球相焊接；將所述兩個焊線由所述第一焊球牽拉至所述第二焊墊，將所述焊線之另 一端以熱壓焊方式焊接至所述第二焊墊上。
  7. 如申請專利範圍第6項所述之晶片組裝方法，其中，所述第一焊墊上形成之兩個第一焊球與所述晶片之間間隔相同距離。
  8. 如申請專利範圍第6項所述之晶片組裝方法，其中，以熱壓焊將所述焊線之另一端焊接至所述第二焊墊上步驟中，所述第二焊墊上兩條焊線之焊接位置相互重合。
  9. 如申請專利範圍第6項所述之晶片組裝方法，其中，所述兩條焊線於所述第二焊墊焊接位置處形成一個楔形部。
  10. 如申請專利範圍第6項所述之晶片組裝方法，其中，所述第一焊球以及所述焊線之材料為金。
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