TWI528510B - 晶片組裝結構及晶片組裝方法 - Google Patents

晶片組裝結構及晶片組裝方法 Download PDF

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TWI528510B
TWI528510B TW101109246A TW101109246A TWI528510B TW I528510 B TWI528510 B TW I528510B TW 101109246 A TW101109246 A TW 101109246A TW 101109246 A TW101109246 A TW 101109246A TW I528510 B TWI528510 B TW I528510B
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solder ball
pad
wafer
circuit board
pads
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TW201340264A (zh
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吳開文
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鴻海精密工業股份有限公司
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Priority to US13/527,858 priority patent/US9048226B2/en
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    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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Description

晶片組裝結構及晶片組裝方法
本發明涉及一種晶片組裝結構及晶片組裝方法。
為實現特定功能，晶片之引腳需要電連接至電路板之特定連接點。先前技術中一般採用打線方式將所述晶片之引腳與電路板之連接點相連，當打線結構有高頻訊號通過時，該打線結構會產生較強電感，該電感會嚴重影響電路特性，使得電路阻抗難以匹配，同時使得訊號損失增加。
另外，隨著技術之發展，晶片之尺寸逾來逾小，相應地，晶片上之引腳尺寸也逾來逾小，引腳尺寸的減小必然造成打線難度增加。
有鑒於此，有必要提供一種能夠降低電感並且容易之晶片組裝結構以及晶片組裝方法。
一種晶片組裝結構，包括電路板、設置於所述電路板上之晶片以及電性連接所述電路板以及所述晶片之焊線。所述電路板上設置有複數第一焊墊，所述晶片上設置有複數對應於所述第一焊墊之第二焊墊。所述每一個第一焊墊上形成有兩個第一焊球，所述每一個第二焊墊上形成有一個第二焊球。所述第一焊墊上之兩個第一焊球分別藉由一條焊線連接對應所述第二焊墊上之第二焊球。
一種晶片組裝方法，包括如下步驟：提供一個電路板，所述電路板表面上設置有複數第一焊墊；提供一個晶片，所述晶片上設置有複數對應於所述第一焊墊之第二焊墊；將所述晶片固定於所述電路板表面；在所述晶片之一個第二焊墊上形成一個第二焊球；在所述電路板上對應形成所述第二焊球之第二焊墊之一個第一焊墊上形成一個第一焊球；提供一個焊線，將所述焊線一端固定於所述第一焊球上，另一端固定於所述第二焊球上；在所述電路板上對應形成所述第二焊球之第二焊墊之第一焊墊形成另一個第一焊球；提供另一個焊線，將所述焊線一端固定於所述第一焊球上，另一端固定於所述第二焊球上。
相較先前技術，所述晶片組裝結構以及所述晶片組裝方法，由於採用兩條焊線連接所述電路板上之第一焊墊以及所述晶片上對應之第二焊墊，並且所述兩條焊線之間構成並聯關係，因此可以使得所述第一焊墊以及第二焊墊之間連接線路電感降低，改善電路特性。同時，所述第二焊墊上以一個第二焊球連接兩條焊線，可以降低打線製作的難度，提升打線製程之效率。
100，200‧‧‧晶片組裝結構
10，10’‧‧‧電路板
11，11’‧‧‧承載面
12，12’‧‧‧第一焊墊
13，13’‧‧‧第一焊球
20，20’‧‧‧晶片
21，21’‧‧‧第二焊墊
22，22’‧‧‧第二焊球
30，30’‧‧‧焊線
圖1係本發明第一實施方式之晶片組裝結構之示意圖。
圖2係本發明第二實施方式之晶片組裝結構之示意圖。
圖3係本發明晶片組裝方法之流程圖。
下面將結合附圖對本發明作一具體介紹。
請參閱圖1，本發明第一實施方式之晶片組裝結構100包括電路板10、設置於所述電路板10上之晶片20以及電連接所述晶片以及所述電路板10之焊線30。
所述電路板10包括一個用於承載所述晶片20之承載面11。所述承載面11上設置有複數第一焊墊12，所述第一焊墊12與所述電路板10上之電路接線端(圖未示)相連，所述每一個第一焊墊12上形成有兩個第一焊球13。
所述晶片20固定設置於所述電路板10之承載面11上。所述晶片20表面設置有複數第二焊墊21，所述第二焊墊21與所述電路板10上之第一焊墊12相對應。所述每一個第二焊墊21上形成有一個第二焊球22。本實施方式中，所述第二焊球22以及所述兩個第一焊球13之間大致呈三角形排佈。
所述焊線30用於將所述第一焊墊12與對應之第二焊墊21電連接。其中，所述第一焊墊12與對應之第二焊墊21之間均由兩條焊線30連接，所述兩條焊線30形成並聯關係。所述第一焊墊12上的每一個第一焊球13分別固定連接所述一條焊線30之一端，對應的第二焊墊21上的焊接連接所述焊線30之另一端。本實施方式中，連接所述第一焊墊12以及對應之第二焊墊21之兩條焊線30沿大致平行於所述承載面11方向排佈。
所述第一焊球13、所述第二焊球22以及所述焊線30由高導電率之金屬材料構成，本實施方式中，所述第一焊球13、所述第二焊球22以及所述焊線30均由金(Au)構成。
所述晶片組裝結構100採用兩條焊線30連接所述電路板上之第一焊墊12以及晶片上對應之第二焊墊21，並且所述兩條焊線30之間構成並聯關係，因此可以使得所述第一焊墊12以及第二焊墊21之間連接線路電感降低，改善電路特性。同時，所述第二焊墊21上以一個第二焊球22連接兩條焊線30，可以降低打線製作的難度，提升打線製程之效率。
請參閱圖2，為本發明第二實施方式之晶片組裝結構200之示意圖。相較於第一實施方式，本實施方式中，所述電路板10’上每一個第一焊墊12’上之兩個第一焊球13’與所述晶片20’上對應第二焊墊21’之第二焊球22’大致沿一直線方向排佈，連接所述第一焊墊12’以及對應之第二焊墊21’之兩條焊線30’沿大致垂直於所述承載面11’之方向排佈，如此，可以有效避免所述焊線30’與相鄰之第一焊墊12’及對應第二焊墊21’之間之焊線30’接觸而短路。
請參閱圖3，本發明之晶片組裝方法包括如下步驟：提供一個電路板，所述電路板包括一個承載面，所述承載面上設置有複數第一焊墊，所述第一焊墊與所述分別電路板之電路接線端相連；提供一個晶片，所述晶片上設置有複數第二焊墊，所述第二焊墊分別與所述晶片之引腳相連，所述第一焊墊與所述第二焊墊一一 對應；將所述晶片固定於所述電路板之承載面上；在所述晶片之一個第二焊墊上形成一個第二焊球，較佳地，所述焊球之大小能夠覆蓋所述第二焊墊；在所述電路板上對應形成所述第二焊球之第二焊墊之一個第一焊墊上形成一個第一焊球；提供一個焊線，將所述焊線一端固定於所述第一焊球上，另一端固定於所述第二焊球上；在所述電路板上對應形成所述第二焊球之第二焊墊之第一焊墊形成另一個第一焊球，本步驟中，所述另一個第一焊球與之前形成之第一焊球以及所述第二焊球之間可以呈三角形排佈或者一條直線排佈；提供另一個焊線，將所述焊線一端固定於所述第一焊球上，另一端固定於所述第二焊球上，對應前一步驟所述第一焊球以及所述第二焊球之間之排佈情形，所述另一個焊線以及前一焊線可以沿大致平行或者垂直於所述電路板之承載面方向排佈。
以上所述僅詳細描述了所述晶片其中一個第二焊墊與所述電路板之對應第一焊墊之連接方法，可以理解，其他第二焊墊與對應之第一焊墊可以採用相同方法實現連接，此處不再一一贅述。
採用所述晶片組裝方法組裝完成之晶片組裝結構，由於採用兩條焊線連接所述電路板上之第一焊墊以及所述晶片上對應之第二焊墊，並且所述兩條焊線之間構成並聯關係，因此可以使得所述第 一焊墊以及第二焊墊之間連接線路電感降低，改善電路特性。同時，所述第二焊墊上以一個第二焊球連接兩條焊線，可以降低打線製作的難度，提升打線製程之效率。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
100‧‧‧晶片組裝結構
10‧‧‧電路板
11‧‧‧承載面
12‧‧‧第一焊墊
13‧‧‧第一焊球
20‧‧‧晶片
21‧‧‧第二焊墊
22‧‧‧第二焊球
30‧‧‧焊線

Claims (5)

  1. 一種晶片組裝結構，包括電路板、設置於所述電路板上之晶片以及電性連接所述電路板以及所述晶片之焊線，所述電路板上設置有複數第一焊墊，所述晶片上設置有複數對應於所述第一焊墊之第二焊墊，其改進在於：所述每一個第一焊墊上形成有兩個第一焊球，所述每一個第二焊墊上形成有一個第二焊球，所述第一焊墊上之兩個第一焊球分別藉由一條焊線連接對應所述第二焊墊上之第二焊球，所述每一個第二焊球與對應之兩個第一焊球之間呈直線排佈。
  2. 如申請專利範圍第1項所述之晶片組裝結構，其中，所述電路板包括一個承載面，所述第一焊墊以及所述晶片設置於所述承載面上。
  3. 如申請專利範圍第1項所述之晶片組裝結構，其中，連接所述第一焊墊以及對應之第二焊墊之兩條焊線沿垂直於所述承載面方向排佈。
  4. 如申請專利範圍第1項所述之晶片組裝結構，其中，所述第一焊球、所述第二焊球以及所述焊線之材料為金。
  5. 一種晶片組裝方法，包括如下步驟：提供一個電路板，所述電路板表面上設置有複數第一焊墊；提供一個晶片，所述晶片上設置有複數對應於所述第一焊墊之第二焊墊；將所述晶片固定於所述電路板表面；在所述晶片之一個第二焊墊上形成一個第二焊球；在所述電路板上對應形成所述第二焊球之第二焊墊之一個第一焊墊上形成一個第一焊球；提供一個焊線，將所述焊線一端固定於所述第一焊球上，另一端固定於 所述第二焊球上；在所述電路板上對應形成所述第二焊球之第二焊墊之第一焊墊形成另一個第一焊球，所述另一個第一焊球與之前形成之第一焊球以及所述第二焊球之間呈直線排布；提供另一個焊線，將所述焊線一端固定於所述第一焊球上，另一端固定於所述第二焊球上。
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