CN101578933B - 电子零件的安装装置及安装方法 - Google Patents

电子零件的安装装置及安装方法 Download PDF

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Publication number
CN101578933B
CN101578933B CN200880001513.7A CN200880001513A CN101578933B CN 101578933 B CN101578933 B CN 101578933B CN 200880001513 A CN200880001513 A CN 200880001513A CN 101578933 B CN101578933 B CN 101578933B
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China
Prior art keywords
electronic component
mentioned
substrate
head
doffer
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Active
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CN200880001513.7A
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English (en)
Chinese (zh)
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CN101578933A (zh
Inventor
广濑圭刚
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication of CN101578933A publication Critical patent/CN101578933A/zh
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Publication of CN101578933B publication Critical patent/CN101578933B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
CN200880001513.7A 2007-02-22 2008-01-22 电子零件的安装装置及安装方法 Active CN101578933B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP042332/2007 2007-02-22
JP2007042332 2007-02-22
PCT/JP2008/050787 WO2008102592A1 (fr) 2007-02-22 2008-01-22 Appareil et procédé pour le montage d'un composant électronique

Publications (2)

Publication Number Publication Date
CN101578933A CN101578933A (zh) 2009-11-11
CN101578933B true CN101578933B (zh) 2012-02-22

Family

ID=39709871

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880001513.7A Active CN101578933B (zh) 2007-02-22 2008-01-22 电子零件的安装装置及安装方法

Country Status (4)

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JP (1) JP5046253B2 (fr)
CN (1) CN101578933B (fr)
TW (1) TWI451819B (fr)
WO (1) WO2008102592A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317615B2 (ja) * 2008-09-29 2013-10-16 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5173708B2 (ja) * 2008-09-29 2013-04-03 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5173709B2 (ja) * 2008-09-29 2013-04-03 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP2010272754A (ja) * 2009-05-22 2010-12-02 Panasonic Corp 部品実装装置及びその方法
US20120110841A1 (en) * 2009-07-09 2012-05-10 Panasonic Corporation Component mounting apparatus and method thereof
JP2011040489A (ja) * 2009-08-07 2011-02-24 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP6767625B2 (ja) * 2016-11-04 2020-10-14 パナソニックＩｐマネジメント株式会社 部品搭載装置
JP7192620B2 (ja) * 2019-03-29 2022-12-20 新東工業株式会社 検査装置
JP7192621B2 (ja) * 2019-03-29 2022-12-20 新東工業株式会社 検査装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5501005A (en) * 1993-09-30 1996-03-26 Matsushita Electric Industrial Co., Ltd. Mounting device of electronic components and a mounting method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2929937B2 (ja) * 1994-04-20 1999-08-03 松下電器産業株式会社 電子部品実装装置及び電子部品の実装方法
TW417411B (en) * 1997-05-16 2001-01-01 Sony Corp Apparatus and method for mounting electronic parts
JP3176580B2 (ja) * 1998-04-09 2001-06-18 太陽誘電株式会社 電子部品の実装方法及び実装装置
JP4011843B2 (ja) * 2000-09-18 2007-11-21 芝浦メカトロニクス株式会社 部品実装装置およびその装置で用いられる部品受渡方法
JP4222741B2 (ja) * 2001-04-06 2009-02-12 芝浦メカトロニクス株式会社 部品実装装置および部品実装方法
JP4262903B2 (ja) * 2001-04-11 2009-05-13 芝浦メカトロニクス株式会社 部品実装装置およびその方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5501005A (en) * 1993-09-30 1996-03-26 Matsushita Electric Industrial Co., Ltd. Mounting device of electronic components and a mounting method
US5501005C1 (en) * 1993-09-30 2002-05-28 Matsushita Electric Ind Co Ltd Mounting device of electronic components and a mounting method

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2002-305398A 2002.10.18
JP特开2002-314294A 2002.10.25
JP特开2002-93859A 2002.03.29

Also Published As

Publication number Publication date
WO2008102592A1 (fr) 2008-08-28
JP5046253B2 (ja) 2012-10-10
TW200845840A (en) 2008-11-16
CN101578933A (zh) 2009-11-11
JPWO2008102592A1 (ja) 2010-05-27
TWI451819B (zh) 2014-09-01

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