CN101578933B - Apparatus and method for mounting electronic component - Google Patents

Apparatus and method for mounting electronic component Download PDF

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Publication number
CN101578933B
CN101578933B CN200880001513.7A CN200880001513A CN101578933B CN 101578933 B CN101578933 B CN 101578933B CN 200880001513 A CN200880001513 A CN 200880001513A CN 101578933 B CN101578933 B CN 101578933B
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electronic component
mentioned
substrate
head
doffer
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CN101578933A (en
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广濑圭刚
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Abstract

Provided is a mounting apparatus for mounting a plurality of TCPs on a side portion of a substrate. The mounting apparatus is provided with punching apparatuses (3A, 3B) for punching out the TCPs (2) from a carrier tape (1); receiving/transferring means (4A, 4B) for receiving the TCPs punched out by the punching apparatus and transferring them to a prescribed position; index means (5A, 5B) which have a plurality of first holding heads (6) for receiving and holding the TCPs transferred by the receiving/transferring means; buffer means (31A, 31B) having a second holding head (34) for receiving and holding the TCPs held by a first holding head of the index means; and mounting heads (36A, 36B) for receiving the TCPs stored in the buffer means and mounts them on the side portion of the substrate.

Description

The erecting device of electronic component and installation method
Technical field
The present invention relates to the erecting device and the installation method of electronic component, be used for the TCP (Tape Carrier Package: band carries encapsulation) as electronic component is installed in the display panels as substrate.
Background technology
For example, when the display panels of making as substrate, will be installed in as the TCP of electronic component on this display panels through erecting device.When being installed in above-mentioned TCP on the display panels, from the above-mentioned TCP of carrier band blanking, and receive this TCP through the body of accepting that constitutes connecting mechanism through doffer.
The above-mentioned body of accepting will be transported to assigned position by the TCP of blanking, and join to a plurality of maintenance heads in this position, and these a plurality of heads that keep are arranged at every turn with on the predetermined angular quilt circular dividing table that rotation drives off and on.Be handed off to the TCP on the maintenance head of circular dividing table, carried out the cleaning of above-mentioned TCP portion of terminal corresponding to the rotation at intermittence of this circular dividing table and keep the location of the holding position of head, and the arrival installation site.
After the side portion of TCP that has arrived the installation site and above-mentioned display floater was together by camera photography, above-mentioned display floater was positioned with respect to above-mentioned TCP based on this shooting.Then, through drive above-mentioned maintenance head to descent direction, the TCP that this maintenance head is kept is installed to the side portion of aforesaid substrate.Like this, with predetermined distance a plurality of TCP are installed successively in the side portion of aforesaid substrate.
Patent documentation 1 discloses these prior aries with patent documentation 2.
Patent documentation 1: TOHKEMY 2002-305398 number
Patent documentation 2: TOHKEMY 2006-120929 number
But; Be transported to the needed time till the installation site through above-mentioned doffer from above-mentioned carrier band blanking TCP and the maintenance head that body is handed off to circular dividing table with this TCP accepted through connecting mechanism; Locate with the side portion of the TCP that is transported to the installation site and display panels is made a video recording display panels, and this TCP is installed to the side portion of display panels till the needed time compare; The former activity duration was compared with the latter's activity duration, was approximately about 2 times.
That is, the former operation must be carried out: from carrier band blanking TCP, the TCP of conveying and blanking also is handed off to the maintenance head of circular dividing table, and off and on rotation drive that and meanwhile circular dividing table carries out the cleaning of TCP and with respect to the location that keeps head etc.
With respect to this, the latter's operation only is: TCP and a display panels to keeping head to be kept are made a video recording, and according to this camera positioning display panels, make above-mentioned maintenance head decline and TCP is installed on the display panels.
Therefore, the former operation quantity is more than the latter, and long mechanicalness operation of activity duration is more, and therefore to compare the activity duration elongated with the latter.This situation also is identified through measuring the actual activity duration.
Like this; Till will supplying to the installation site from the TCP of carrier band blanking needed the former activity duration, be installed to activity duration of the needed latter on the display panels when long than the TCP that will supply to the installation site; Even carry out the former operation continuously; In the latter's operation, also produce the stand-by period, therefore have the situation of the raising of the productivity ratio generation limit owing to waiting time.
Summary of the invention
The present invention provides a kind of erecting device and installation method of electronic component, can be to be installed to the mode that can not produce the stand-by period in the installation exercise on the substrate at the electronic component that will supply to the installation site, will to be supplied to the installation site by the electronic component of blanking.
In order to solve above-mentioned problem, the present invention provides a kind of erecting device of electronic component, a plurality of electronic components is installed to is maintained at the side portion that keeps the substrate on the platform upper surface, it is characterized in that possessing: doffer, from strip-shaped members blanking electronic component; Connecting mechanism receives by the electronic component of this doffer blanking and is transported to assigned position; Indexing mechanism has a plurality of the 1st and keeps head, and the electronic component that the 1st keeps head to receive is carried by this connecting mechanism also keeps; Buffer gear has the 2nd and keeps head, and the 2nd maintenance head receives the electronic component that keeps head to be kept by the 1st of this indexing mechanism and also keeps; And installing mechanism, can drive along X, Y, Z and θ direction, receive the stored above-mentioned electronic component of this buffer gear and be installed to the side portion of aforesaid substrate.
And the present invention provides a kind of erecting device of electronic component, a plurality of electronic components is installed to is maintained at the side portion that keeps the substrate on the platform upper surface, it is characterized in that possessing: doffer, from strip-shaped members blanking electronic component; A pair of connecting mechanism receives by the electronic component of this doffer blanking and is transported to assigned position; A pair of indexing mechanism has a plurality of the 1st and keeps head, and the electronic component that the 1st keeps head to receive is carried by each connecting mechanism also keeps; At least one buffer gear has the 2nd and keeps head, and the 2nd maintenance head receives the electronic component that keeps head to be kept by the 1st of each indexing mechanism and also keeps; And a pair of installing mechanism, can drive along X, Y, Z and θ direction, receive the stored above-mentioned electronic component of each buffer gear and be respectively installed to an end side and the other end side of length direction central authorities of the side portion of aforesaid substrate.
And the present invention provides a kind of installation method of electronic component, a plurality of electronic components is installed to is maintained at the side portion that keeps the substrate on the platform upper surface, it is characterized in that possessing: from the step of strip-shaped members blanking electronic component; The electronic component of institute's blanking is handed off to the step that a plurality of the 1st of indexing mechanism keeps head; Electronic component on the 1st maintenance head that is handed off to above-mentioned indexing mechanism is handed off to the steps that a plurality of the 2nd of buffer gear keeps head and storage; And through receiving the above-mentioned the 2nd and keep an above-mentioned electronic component that is kept and the step that is installed to the side portion of aforesaid substrate along the installing mechanism of X, Y, Z and the driving of θ direction.
Description of drawings
Fig. 1 is the vertical view of brief configuration of the erecting device of expression one embodiment of the present invention.
Fig. 2 is the end view of erecting device shown in Figure 1.
Fig. 3 is the front view of a pair of indexing mechanism of expression.
Fig. 4 is the front view of a pair of bearing unit of expression.
Fig. 5 A is a key diagram of scrubbing the terminal of TCP with indexing mechanism.
Fig. 5 B is the key diagram that the TCP that the 2nd of indexing mechanism keeps head to be kept is positioned.
Fig. 6 is used for figure that the order that at a sidepiece of substrate a plurality of TCP is divided into right portions and left part and installs is described.
Embodiment
Below, with reference to description of drawings an embodiment of the invention.
Fig. 1 is the vertical view of brief configuration of expression erecting device of the present invention, and this erecting device has and is used for from as carrier band 1 blanking of strip-shaped members the 1st doffer 3A and the 2nd doffer 3B as the TCP2 of electronic component.
Above-mentioned the 1st doffer 3A and the 2nd doffer 3B alternate run are received by the 1st connecting mechanism 4A and the 2nd connecting mechanism 4B by the TCP2 of a doffer 3A or 3B blanking.
That is, the 2nd doffer 3B standby by the 1st doffer 3A blanking TCP2 the time, when the carrier band 1 blanking TCP2 that supplies to the 1st doffer 3A finishes, the 2nd doffer 3B operation and supply with new carrier band 1 to the 1st doffer 3A.Thus, can alternately will supply to above-mentioned the 1st connecting mechanism 4A and the 2nd connecting mechanism 4B from the TCP2 of carrier band 1 blanking successively.
In addition, the 1st doffer 3A and the 2nd doffer 3B are moved simultaneously, will supply to above-mentioned the 1st connecting mechanism 4A, and will supply to above-mentioned the 2nd connecting mechanism 4B by the TCP2 of the 2nd doffer 3B blanking by the TCP2 of the 1st doffer 3A blanking.
The TCP2 that above-mentioned the 1st connecting mechanism 4A receives is transported to the 1st indexing mechanism 5A, and by the 1st maintenance that on the 1st indexing mechanism 5A, is provided with 6 reception.The TCP2 that the 2nd connecting mechanism 4B receives is transported to the 2nd indexing mechanism 5B, and by the 1st maintenance that on the 2nd indexing mechanism 5B, is provided with 6 reception.
As shown in Figure 2, above-mentioned the 1st, the 2nd indexing mechanism 5A, 5B have circular dividing table 9, and this circular dividing table 9 is rotated off and at interval with 90 degree in a circumferential direction by the 1st θ drive source 8 and drives.On the lower surface of each circular dividing table 9, be arranged at intervals with the above-mentioned the 1st with 90 degree in a circumferential direction and keep 6.
Thus, the TCP2 that is carried by above-mentioned the 1st, the 2nd connecting mechanism 4A, 4B is kept 6, adsorbs maintenance like the back saidly by the 1st of each indexing mechanism 5A, 5B.
As shown in Figure 2, above-mentioned the 1st, the 2nd doffer 3A, 3B have the mould 13 of the above-mentioned TCP2 of blanking from the above-mentioned carrier band 1.This mould 13 have the patrix 13a that on above-below direction, drives with this patrix 13a counterdie 13b of fixed configurations opposed to each other mutually.On patrix 13a, be provided with drift 14, on counterdie 13b, be provided with through hole 15, above-mentioned drift 14 gets into through hole 15 when patrix 13a descends.
Above-mentioned carrier band 1 is through between patrix 13a and the counterdie 13b, descends through patrix 13a and comes the above-mentioned TCP2 of blanking, and when rising, see prescribed distance off to the direction of arrow, become can the next TCP2 of blanking state.
By the TCP2 of above-mentioned the 1st, the 2nd doffer 3A, 3B blanking, alternately received by the 1st, the 2nd connecting mechanism 4A, 4B carriage 16 separately.As shown in Figures 2 and 3, this carriage 16 can be respectively driven to Z direction that becomes above-below direction and the θ direction that becomes direction of rotation by the Z θ drive source 18 that is located on the Y platform 17.
A pair of Y platform 17 is separately positioned on the Y guide body 20 and can be driven by not shown linear motor, and this Y guide body 20 is arranged on the X platform 19 along the Y direction.Above-mentioned a pair of X platform 19 is arranged on the X guide body 23 and can be driven by not shown linear motor, and this X guide body 23 is configured on the pedestal 22 of erecting device along directions X.Each X platform 19 is by above-mentioned linear motor drive.In addition, directions X and Y direction are represented by arrow in Fig. 3 at Fig. 1.
The carriage 16 of the 1st connecting mechanism 4A; When the 1st, the 2nd doffer 3A, 3B one receives TCP2; In Fig. 2 along the Y direction by being driven into the position that chain-dotted line is represented from the position that solid line is represented, and be positioned as mutually opposed with one the below that is arranged at interval in 4 the 1st maintenances 6 on the lower surface of the 1st indexing mechanism 5A with 90 degree in a circumferential direction.
Equally, the carriage 16 of the 2nd connecting mechanism 4B when receiving TCP2, is positioned as and is arranged at interval on the lower surface of the 2nd indexing mechanism 5B 4 the 1st with 90 degree in a circumferential direction and keeps a below of one in 6 mutually opposed.
As shown in Figure 3, each carriage 16 that is positioned is driven along ascent direction by Z θ drive source 18.Thus, what be provided with on the TCP2 that carriage 16 is kept and the above-mentioned circular dividing table 9 the 1st keeps a lower surface of 6 contact or be close to slight gap, and therefore the above-mentioned the 1st keeps 6 an absorption maintenance TCP2.
In addition, as shown in Figure 3, a pair of 1X platform 19 is set up in parallel, so that promptly driven along X guide body 23 on said base 22, on same rail with respect to directions X.For this reason; The driving Be Controlled of the pair of right and left 1X platform 19 among Fig. 3; So that receive by the TCP2 of any blanking among the 1st, the 2nd doffer 3A, the 3B, and be handed off to the 1st of the 1st, the 2nd indexing mechanism 5A, 5B respectively and keep 6 o'clock at their carriage 16, promptly when directions X drives, can not interfere each other.
When TCP2 be handed off on the circular dividing table 9 of the 1st, the 2nd indexing mechanism 5A, 5B be provided with the 1st when keeping 6, above-mentioned circular dividing table 9 is by above-mentioned the 1st θ drive source 8 each 90 degree, driven by rotation off and on.
The 1st keep 6 to be driven 90 when spending by rotation along the circumferential direction when what received TCP2 from carriage 16 with circular dividing table 9; Shown in Fig. 5 A; On this position, the above-mentioned the 1st keep the 6 above-mentioned TCP that kept, its terminal (not shown) is scrubbed by the brush 27 that is driven by motor 26 rotations.Thus, remove attached to the dirt on the terminal.In addition, when scrubbing, supply with volatile solvents such as ethanol, produce static when preventing to scrub.
Shown in Fig. 5 B, after having scrubbed terminal, the 1st keeps the TCP2 of 6 an adsorbed maintenance to be pushed by the position indicator 29 that is driven by cylinder 28.Thus, the end of TCP2 is positioned as with the 1st and keeps a side of 6 consistent.That is, TCP2 the 1st keeps 6 to be retained as roughly the same state with respect to each.
In addition, above-mentioned motor 26 and cylinder 28 are alternately located with respect to the 1st maintenance that is positioned at assigned position by not shown driving mechanism 6 quilt opposed to each other.Thus, the 1st keeps 6 TCP2 that kept, can on same position, carry out based on above-mentioned brush scrub and based on the location of above-mentioned position indicator.
The 1st of TCP2 after keeping being scrubbed and locating keeps 6 along the circumferential direction to be further rotated with circular dividing table 9 and to drive 90 when spending, and the 1st keeps 6 TCP2 that kept by respectively with respect to the 1st, the 2nd buffer gear 31A, 31B location.As shown in Figure 2, each buffer gear 31A, 31B have the rotary body 33 that is driven by 32 rotations of the 2nd θ drive source.
At the periphery of above-mentioned rotary body 33, be arranged at intervals with a pair of the 2nd with 180 degree in a circumferential direction and keep 34.That is, uprightly on above-mentioned rotary body 33 be provided with a pair of Z guide body 35, each Z guide body 35 be provided with the above-mentioned the 2nd keep 34, the 2 keep 34 can by not shown linear motor along the vertical direction (Z direction) drive.
When rotation drives above-mentioned circular dividing table 9 and the 1st when keeping the TCP2 that the lower surface kept of 6 to be positioned in keeping an opposed position, upper surface of in 34 one with a pair of the 2nd; Driving the above-mentioned the 2nd to ascent direction keeps 34, the 2 to keep a upper surface contact of 34 or keep 6 TCP2 that kept near the above-mentioned the 1st.
Then, through the 2nd keep 34 to produce attractions after, remove the 1st and keep an attraction of 6, above-mentioned thus TCP2 keeps 6 to be handed off to the 2nd and to keep 34 from the 1st.When the 2nd keeps 34 to receive TCP2, by the 2nd θ drive source 32 rotary body 33 along the circumferential direction rotate and to drive 90 angles spent.
When rotary body 33 along the circumferential direction being revolved when turning 90 degrees by above-mentioned the 2nd θ drive source 32, the 2nd of the 1st buffer gear 31A keep 34 TCP2 that kept be located in initial position carry out standby the 1st installation head 36A below.Equally, the 2nd of the 2nd buffer gear 31B the keep 34 TCP2 that kept be located in initial position carry out standby the 2nd installation head 36B below.
Though there is not detailed icon, the 1st installation head 36A and the 2nd installation head 36B are set to respectively and can drive along X, Y, Z and θ direction independently.Above-mentioned the 1st installation head 36A keeps 34 a reception TCP2 from the 2nd of the 1st buffer gear 31A; With a plurality of TCP2, in this execution mode be 7 TCP2 with the order shown in a~g, be installed in the O of Width Central Line with substrate W such as display panels shown in Figure 6 and be the sidepiece of area L in the left side in boundary line.
Above-mentioned the 2nd installation head 36B keeps 34 to receive TCP2 from the 2nd of the 2nd buffer gear 31B, and 7 TCP2 with the order shown in a~g, are installed in Width central authorities with aforesaid substrate W and are the sidepiece of region R on the right side in boundary line.
When a pair of installation head 36A, 36B are installed in TCP2 the upper surface of a sidepiece of substrate W; The lower surface of aforesaid substrate W is supported that by a pair of support tool 39 this a pair of support tool 39 is set at a pair of bearing unit 38A shown in Figure 4,38B is last and can go up adjustment in Z direction (highly).
Above-mentioned each bearing unit 38A, 38B have X driving body 40.A pair of X driving body 40 is set to and can moves along the X guide body 40a that is arranged on the said base 22, and is driven independently respectively by not shown linear motor.
The upright above-mentioned support tool 39 that drives along the Z direction by Z drive source 39a that is provided with on each X driving body 40; This support tool 39 is positioned with respect to directions X through above-mentioned X driving body 40; Thus, can support the lower surface of part of the installation TCP2 of aforesaid substrate W according to the order of above-mentioned a~g.
Be respectively equipped with a pair of video camera 41 in the Width both sides of each X driving body 40,41 pairs of a pair of alignment marks that on the part of the installation TCP2 of aforesaid substrate W, are provided with of this a pair of video camera and a pair of alignment mark (all not shown) that on above-mentioned TCP2, is provided with are made a video recording.
Promptly; Each video camera 41 is made a video recording to an alignment mark that on substrate W, is provided with and an alignment mark that on TCP2, is provided with respectively simultaneously; And this image pickup signal carried out image processing; Calculate the position offset of TCP2 thus, calculate along X, Y and θ direction according to this and drive the 1st, the 2nd installation head 36A, the 36B that keeps above-mentioned TCP2, and TCP2 is positioned on the installation site of substrate W with respect to the installation site of substrate W.
As installation head 36A, when 36B is positioned, drive this installation head 36A, 36B to descent direction, the TCP2 that its lower end kept is installed on the sidepiece of aforesaid substrate W according to above-mentioned a~g in proper order.
Making a video recording by 41 couples of TCP2 of above-mentioned video camera, and when the alignment mark of TCP2 being carried out image processing, be under the situation such as substandard product, can not carry out image processing to alignment mark sometimes, and can not carry out its location recognition at TCP2 according to its image pickup signal.In this case, this TCP2 is regarded as substandard product, before being installed on the substrate W, in the discarded case 42 in the outside, length direction both ends of a discarded sidepiece that is arranged on substrate W to that kind shown in Figure 1 by installation head 36A, 36B.
As shown in Figure 2, aforesaid substrate W is retained as, and on by the upper surface of the maintenance platform 44 that drives along X, Y, Z and θ direction, makes the sidepiece that above-mentioned TCP2 is installed in the periphery at least outstanding laterally from the lateral margin of above-mentioned maintenance platform 44.
When aforesaid substrate W was positioned on the assigned position by above-mentioned maintenance platform 44, moving substrate W ground did not drive above-mentioned installation head 36A, 36B and support tool 39 along the length direction of the sidepiece of aforesaid substrate W, and on the one of which sidepiece, a plurality of TCP2 was installed.
If a plurality of TCP2 are not installed on moving substrate W ground on the one of which sidepiece; Installation head 36A, 36B and support tool 39 are installed the prior art of TCP2 movably, and substrate W vibrates at above-below direction from keeping platform 44 outstanding sidepieces.
Under the situation of substrate W vibration, before its vibration static determinacy, next TCP2 can not be installed.Especially, when substrate W maximized, because vibration becomes big, so causes the time till the static determinacy elongated, productivity ratio reduced.
But, if by keeping platform 44 to locate substrate W, then as stated, owing to do not make substrate W that a plurality of TCP2 are installed movably, so substrate W can not vibrate.Thus, owing to need not arrive the stand-by period till the substrate static determinacy, therefore can productivity ratio be improved respective amount.
Then, the program that the erecting device through said structure is installed to a plurality of TCP2 on the sidepiece of substrate W describes.
By keeping platform 44 to keep and be located on the sidepiece of substrate W of installation site, according to the order shown in a~g among Fig. 6 TCP2 being installed in the O of Width Central Line with this substrate W is the left part boundary line, shown in the L and the right portions shown in the R.
Through driving bearing unit 38A, 38B, thus according to the lower surface of the order that above-mentioned TCP2 is installed by the sidepiece of support tool 39 support substrate W along directions X.Therefore, in this execution mode, when when keeping platform 44 that substrate W locate, the position of initial a pair of a by a pair of support tool 39 support substrate W is the lower surface of length direction one end and the other end.
When by the two ends of the length direction of the sidepiece of a pair of support tool 39 support substrate W, even, make this vibration static determinacy at short notice through a pair of support tool 39 producing vibration by substrate W after keeping platform 44 location.Thus, can after with substrate W location, begin the installation of TCP2 immediately, so can boost productivity.
The TCP2 that supplies with to the 1st, the 2nd installation head 36A, 36B, by the side of a pair of doffer 3A, 3B behind carrier band 1 blanking, be handed off at the 1st, the 2nd connecting mechanism 4A, the circular dividing table 5A of 4B, last the 1st maintenance that is provided with of 5B 6.
Then, TCP2 keeps 6 to be handed off to the 2nd of the 1st, the 2nd buffer gear 31A, 31B and to keep 34 from the above-mentioned the 1st, and keeps 34 to be handed off to the 1st, the 2nd installation head 36A, 36B from the 2nd, and is installed to the sidepiece of substrate W.
Side through a pair of doffer 3A, 3B comes blanking TCP2, and this TCP2 is supplied to the time till the position that can be handed off to the 1st, the 2nd installation head 36A, 36B; Be installed to time of the side portion of substrate W with the TCP2 that will supply to the position that can join through installation head 36A, 36B, such as stated the former time is longer.Especially, under the former situation, the time of cost blanking TCP2, and keep on 6 and spend the more time in order to receive, to carry TCP2 by carriage 16 and being handed off to the 1st.
But; Before beginning to substrate W installation TCP2; In the i.e. stand-by period when the substrate W that the TCP2 that will be through with installs is exchanged for new substrate W, can be in advance keep supplying with the TCP2 of blanking in 34 and storing to a pair of the 2nd of the 1st, the 2nd buffer gear 31A, 31B.
And, the TCP2 and the storage that also can keep the 6 and the 1st, the 2nd an installation head 36A, 36B to supply with blanking in advance to the 1st, the 2nd circular dividing table 5A, 5B each 4 the 1st.
That is, in the 1st circular dividing table 5A, the 1st buffer gear 31A and the 1st installation head 36A, 7 TCP2 can be stored in advance altogether, in the 2nd circular dividing table 5B, the 2nd buffer gear 31B and the 2nd installation head 36B, 7 TCP2 can be stored in advance altogether.
In addition, a needed time of TCP2 is installed and time that a stored TCP2 is supplied to till the installation head roughly the same.
Thus, on distolateral and the position shown in another the distolateral a~g shown in the R of the length direction shown in the L of the sidepiece of substrate W, 7 TCP2 that store in advance can be installed respectively.That is, can not use TCP2, and the TCP2 that blanking in advance such as only uses when exchange substrate W and store to keep the new substrate W of platform 44 to carry out the installation of TCP2 to being fed into by the 1st or the 2nd doffer 3A, 3B blanking.
Therefore; Owing to can omit the time that from the time of carrier band 1 blanking TCP2 with by the 1st, the 2nd connecting mechanism 4A, 4B the TCP2 of blanking is handed off to the 1st, the 2nd circular dividing table 5A, 5B by the 1st or the 2nd doffer 3A, 3B; Therefore can not produce stand-by period ground the 1st, the 2nd installation head 36A, 36B are supplied with TCP2, and be installed to the sidepiece of substrate W.
In addition; TCP2 is stored in a pair of the 2nd of the 1st, the 2nd buffer gear 31A, 31B keeps moment of 34; Stand-by period when being not limited in substrate W that the TCP2 that will be through with installs and being exchanged for new substrate W; So long as the 2nd when keeping not having TCP2 on 34 of each buffer gear 31A, 31B, any time can.
And; 1st, the 2nd buffer gear 31A, 31B are provided with a pair of the 2nd and keep 34 and constitute on rotary body 33; But though do not illustrate, the straight line movable body that each buffer gear 31A, 31B also can be used in linear drives on the Y direction replaces rotary body 33.In this case, on the straight line movable body, be provided with the 2nd to keep 34 quantity can be one or more, at least one is set in a word the 2nd keeps 34 to get final product.
By a pair of installation head 36A, 36B when the sidepiece of substrate W is installed TCP2, begin to carry out from the length direction two ends of this sidepiece.Therefore, supply with and remain on the substrate W that keeps on the platform 44, at first supported the both ends of the length direction of a sidepiece by a pair of support tool 39, the vibration that therefore to 44 supplies of maintenance platform the time, produces at this sidepiece is static determinacy at short notice.That is, under the situation that the vibration change is big even substrate W maximizes, also can shorten its static determinacy time.
Installation to the TCP2 of the L side sections of the sidepiece of substrate W and R side sections; Be that a end (the length direction two ends of substrate W) from L side sections and R side sections begins to carry out; If but these 3 TCP2 of a~c are installed and have come pars intermedia since an end in the L side sections, then the length direction central portion of such sidepiece from substrate W returns pars intermedia ground and carries out shown in d~g.
For this reason; Owing to the moment that the 1st installation head 36A installs the TCP2 of " d " of the other end of the L side sections of the sidepiece of substrate W, the moment that the TCP2 of " g " of the other end of R side sections installs is staggered with the 2nd installation head 36B; Therefore at the central portion of the length direction of the sidepiece of substrate W, can prevent that the 1st installation head 36A and the 2nd installation head 36B from interfering at the central portion of the length direction of substrate W.
Based on the TCP2 of the 1st, the 2nd installation head 36A, 36B installation to substrate W; Can be not do not begin from the length direction both ends of substrate W yet; And begin to carry out installation based on an installation head from the length direction central portion of substrate W; Begin to carry out the installation based on another installation head from the end of length direction, perhaps can begun to carry out by the central portion of a pair of installation head from length direction yet, the TCP2 based on a pair of installation head 36A, 36B have any qualification to the erection sequence of substrate W in a word.
In an above-mentioned execution mode, can store 4, store 2, store 1, store 7 TCP altogether at circular dividing table, but the quantity of TCP that is installed to L side sections and the R side sections of substrate sometimes not 7 in installation head at buffer gear.
In this case, according to the quantity of the TCP of L side sections that is installed to substrate and R side sections, change be arranged at that the 1st on the circular dividing table keep being provided with on the rotary body of head or buffer gear the 2nd keep head quantity.Thus, only just can satisfy the quantity of the TCP of a sidepiece that is installed to substrate, even so be not under 7 the situation, also can boost productivity reliably in the quantity of the TCP of a sidepiece that is installed to substrate through the TCP that stores in advance.
In addition; Even the quantity of the TCP that stores in advance is not that equal number also has no relations with the quantity of the TCP of L side that is installed to substrate and R side; As long as buffer gear is set in a word and keeps head to store TCP2 at a plurality of the 2nd of this buffer gear at least, then compare and to boost productivity when not storing.
And connecting mechanism, circular dividing table, buffer gear and installation head are provided with 2 groups respectively, but according to the size of the substrate that TCP is installed etc., also 1 group delivery mechanism, circular dividing table, buffer gear and installation head can be set.
Utilizability on the industry
According to the present invention; Will from the strip-shaped members blanking and be handed off to a plurality of the 1st of indexing mechanism keep electronic component on the head be handed off to a plurality of the 2nd keep head after; Be installed on the substrate, therefore can when beginning is installed, will remain on a plurality of the 2nd and keep the electronic component on the head to be installed on the substrate successively.
Therefore, the cushioning effect through a plurality of the 2nd maintenance electronic component that kept can improve the installation effectiveness of a plurality of electronic components to substrate.

Claims (12)

1. the erecting device of an electronic component is installed to the side portion that is maintained at the substrate on the maintenance platform upper surface with a plurality of electronic components, it is characterized in that possessing:
Doffer is from strip-shaped members blanking electronic component;
Connecting mechanism receives by the electronic component of this doffer blanking and is transported to assigned position;
Indexing mechanism has a plurality of the 1st and keeps head, and the electronic component that the 1st keeps head to receive is carried by this connecting mechanism also keeps;
Buffer gear has the 2nd and keeps head, and the 2nd keeps an electronic component and a maintenance that the 1st maintenance head that receives this indexing mechanism is kept; And
Installing mechanism can drive along X, Y, Z and θ direction, receives the stored above-mentioned electronic component of this buffer gear and is installed to the side portion of aforesaid substrate.
2. the erecting device of electronic component according to claim 1 is characterized in that:
Have the 1st doffer and the 2nd doffer, from the strip-shaped members blanking that supplies to a doffer electronic component and when being exchanged for new strip-shaped members, make another doffer operation.
3. the erecting device of electronic component according to claim 1 is characterized in that:
When being exchanged for new substrate, will being stored into the 2nd of above-mentioned buffer gear by the electronic component of above-mentioned doffer blanking in advance and keeping head in that electronic component is installed to aforesaid substrate.
4. the erecting device of an electronic component is installed to the side portion that is maintained at the substrate on the maintenance platform upper surface with a plurality of electronic components, it is characterized in that possessing:
Doffer is from strip-shaped members blanking electronic component;
A pair of connecting mechanism receives by the electronic component of this doffer blanking and is transported to assigned position;
A pair of indexing mechanism has a plurality of the 1st and keeps head, and the electronic component that the 1st keeps head to receive is carried by each connecting mechanism also keeps;
At least one buffer gear has the 2nd and keeps head, and the 2nd keeps an electronic component and a maintenance that the 1st maintenance head that receives each indexing mechanism is kept; And
A pair of installing mechanism can drive along X, Y, Z and θ direction, receives the stored above-mentioned electronic component of each buffer gear, and is respectively installed to a central end side and the other end side of length direction of the side portion of aforesaid substrate.
5. the erecting device of electronic component according to claim 4 is characterized in that:
Have the 1st doffer and the 2nd doffer, from the strip-shaped members blanking that supplies to a doffer electronic component and when being exchanged for new strip-shaped members, make another doffer operation.
6. the erecting device of electronic component according to claim 4 is characterized in that:
When being exchanged for new substrate, will being stored into the 2nd of above-mentioned buffer gear by the electronic component of above-mentioned doffer blanking in advance and keeping head in that electronic component is installed to aforesaid substrate.
7. the erecting device of electronic component according to claim 4 is characterized in that:
Have a pair of bearing unit, when through above-mentioned a pair of installing mechanism above-mentioned electronic component being installed to aforesaid substrate, this a pair of bearing unit supports the lower surface of the part of the above-mentioned electronic component of installation of aforesaid substrate,
Above-mentioned a pair of bearing unit is driven along the length direction of the side portion of the above-mentioned electronic component of installation of aforesaid substrate,
To the installation of the above-mentioned electronic component of the side portion of aforesaid substrate, be to begin to carry out from two ends by the length direction of the side portion of the initial aforesaid substrate of supporting of above-mentioned a pair of bearing unit.
8. the erecting device of electronic component according to claim 7 is characterized in that:
Above-mentioned bearing unit is provided with video camera, and when the electronic component that above-mentioned installing mechanism kept was installed to aforesaid substrate, this video camera was made a video recording to above-mentioned electronic component and aforesaid substrate and they are carried out contraposition,
In the time can not carrying out the location confirmation of above-mentioned electronic component, that this electronic component is discarded before being installed to aforesaid substrate by above-mentioned video camera.
9. the installation method of an electronic component is installed to the side portion that is maintained at the substrate on the maintenance platform upper surface with a plurality of electronic components, it is characterized in that possessing:
Step from strip-shaped members blanking electronic component;
The electronic component of institute's blanking is handed off to the step that a plurality of the 1st of indexing mechanism keeps head;
The electronic component of the 1st maintenance head that is handed off to above-mentioned indexing mechanism is handed off to the steps that a plurality of the 2nd of buffer gear keeps head and storage; And
Through receiving the above-mentioned the 2nd and keep an above-mentioned electronic component that is kept and the step that is installed to the side portion of aforesaid substrate along the installing mechanism of X, Y, Z and the driving of θ direction.
10. the installation method of electronic component according to claim 9 is characterized in that:
Electronic component is installed to aforesaid substrate and when being exchanged for new substrate, electronic component being stored into the above-mentioned the 2nd keeping head finishing.
11. the installation method of electronic component according to claim 9 is characterized in that:
Finishing that electronic component is installed to aforesaid substrate and when being exchanged for new substrate, electronic component is stored into the above-mentioned the 2nd keep head after, electronic component is stored into the above-mentioned the 1st keeps head.
12. the installation method of electronic component according to claim 9 is characterized in that:
Installation to a plurality of electronic components of the side portion of aforesaid substrate; Be that length direction two ends from the side portion of this substrate begin to carry out, and, the installation of the above-mentioned electronic component that begins from length direction one end of aforesaid substrate; Be that a end from length direction begins till central portion, to carry out successively; From the installation that the other end begins, be carried out till the pars intermedia before the other end from length direction begins to reach central portion after, carry out from the pars intermedia of central portion towards length direction.
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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317615B2 (en) * 2008-09-29 2013-10-16 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
JP5173708B2 (en) * 2008-09-29 2013-04-03 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
JP5173709B2 (en) * 2008-09-29 2013-04-03 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
JP2010272754A (en) * 2009-05-22 2010-12-02 Panasonic Corp Component-mounting device and method therefor
WO2011004544A1 (en) * 2009-07-09 2011-01-13 パナソニック株式会社 Component mounting apparatus and method thereof
JP2011040489A (en) * 2009-08-07 2011-02-24 Shibaura Mechatronics Corp Mounting apparatus and mounting method for electronic component
JP6767625B2 (en) * 2016-11-04 2020-10-14 パナソニックIpマネジメント株式会社 Parts mounting device
JP7192620B2 (en) * 2019-03-29 2022-12-20 新東工業株式会社 inspection equipment
JP7192621B2 (en) * 2019-03-29 2022-12-20 新東工業株式会社 inspection equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5501005A (en) * 1993-09-30 1996-03-26 Matsushita Electric Industrial Co., Ltd. Mounting device of electronic components and a mounting method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2929937B2 (en) * 1994-04-20 1999-08-03 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
TW417411B (en) * 1997-05-16 2001-01-01 Sony Corp Apparatus and method for mounting electronic parts
JP3176580B2 (en) * 1998-04-09 2001-06-18 太陽誘電株式会社 Electronic component mounting method and mounting device
JP4011843B2 (en) * 2000-09-18 2007-11-21 芝浦メカトロニクス株式会社 Component mounting apparatus and component delivery method used in the apparatus
JP4222741B2 (en) * 2001-04-06 2009-02-12 芝浦メカトロニクス株式会社 Component mounting apparatus and component mounting method
JP4262903B2 (en) * 2001-04-11 2009-05-13 芝浦メカトロニクス株式会社 Component mounting apparatus and method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5501005A (en) * 1993-09-30 1996-03-26 Matsushita Electric Industrial Co., Ltd. Mounting device of electronic components and a mounting method
US5501005C1 (en) * 1993-09-30 2002-05-28 Matsushita Electric Ind Co Ltd Mounting device of electronic components and a mounting method

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2002-305398A 2002.10.18
JP特开2002-314294A 2002.10.25
JP特开2002-93859A 2002.03.29

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JP5046253B2 (en) 2012-10-10
TWI451819B (en) 2014-09-01

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