CN101932224B - Electronic part mounting device - Google Patents
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- CN101932224B CN101932224B CN201010207877.XA CN201010207877A CN101932224B CN 101932224 B CN101932224 B CN 101932224B CN 201010207877 A CN201010207877 A CN 201010207877A CN 101932224 B CN101932224 B CN 101932224B
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Abstract
The invention provides an electronic part mounting device, capable of adsorbing an electronic part by a suction nozzle more reliably. The electronic part mounting device (100) has a substrate maintaining part for maintaining a substrate for mounting the electronic part, a part supplying part (104) for supplying a plurality of electronic parts to be mounted, a loading head (106) with the suction nozzle (105) for adsorbing the electronic parts loaded on the substrate, a loading head moving mechanism (107) arranged in the area including the part supplying part and the substrate maintaining part for moving and positioning the loading head freely, and a motion control unit (10) for controlling the mounting motion relative to the substrate, characterized in that the electronic part mounting device also has a reciprocating motion applying unit (30) for applying continuous reciprocating motion for one of electronic parts relative to the suction nozzle or the part supplying part.
Description
Technical field
The present invention relates to a kind of electronic component mounting apparatus, it utilizes adsorption mouth attract electrons parts and installs.
Background technology
Existing electronic component mounting apparatus, for example, described in patent documentation 1, on the boarded head that can move freely at X-Y plane, there is adsorption mouth, utilize absorption from supply tray, to take out electronic unit, make boarded head move to the parts installed position of substrate, at installed position, adsorption mouth discharges electronic unit, carries out the installation of electronic unit.But, in order to utilize adsorption mouth easily electronic unit to be taken out, conventionally the electronic component storing space of supply tray is made for component size and is compared greatly.Thus, in conveying supply tray process, electronic unit can move in electronic component storing space, may cause damage to electronic unit.Thus, as described in patent documentation 2, on the bottom surface in electronic component storing space, stickup has the retainer belt of adherence force and electronic unit is fixed, and utilizes heating that adherence force is reduced, and utilizes adsorption mouth to adsorb.
Patent documentation 1: the JP 2006-108292 of Japan communique
Patent documentation 2: the JP 2006-273335 of Japan communique
Summary of the invention
In the existing electronic component mounting apparatus of recording in above-mentioned patent documentation 2, as shown in Fig. 5 (A), its adherence force is adjusted to, can not hinder the absorption of electronic unit C, and can utilize the absorption affinity of adsorption mouth N easily to peel off, but in fact, exist the absorption affinity of each adsorption mouth N and the adherence force of each electronic unit to produce fluctuation, once in a while as shown in Fig. 5 (B), although described retainer belt is heated, but the adherence force of electronic unit can exceed the absorption affinity of adsorption mouth N, in the situation that making adsorption mouth N increase, sometimes electronic unit C is not stripped from.Its result,, there is the problem that operating efficiency declines that produces in the absorption error that produces electronic unit.In addition, although sometimes exist electronic unit to be stripped from, rise and be obstructed, the situation that electronic unit C falls from adsorption mouth N, in this case, electronic unit C is consumed, the problem that also exists rate of finished products to worsen.And, in the device of recording in patent documentation 2, owing to must thering is heating unit, so may produce harmful effect to electronic unit, or near Optical devices such as absorption position configuration identification cameras in the situation that, may produce harmful effect to Optical devices.
The object of the invention is to, can be more safely and reliably by adsorption mouth attract electrons parts.
The invention that technical scheme 1 is recorded is a kind of electronic component mounting apparatus, and it has: substrate maintaining part, and the substrate of electronic unit installation is carried out in its maintenance; Parts supply unit, multiple electronic units that its supply will be installed; Boarded head, it has adsorption mouth, and this adsorption mouth is adsorbed the described electronic unit that will be mounted on described substrate; Boarded head travel mechanism, it,, comprising described parts supply unit and described substrate maintaining part in interior region, at random carries out running fix to described boarded head; And action control unit, it carries out the installation action control with respect to described substrate, it is characterized in that, described electronic component mounting apparatus also has reciprocating motion applying unit, its some in the electronic unit of described adsorption mouth or described parts supply unit, applies continuous reciprocating motion.
The invention that technical scheme 2 is recorded, it is characterized in that, there is the identical structure of invention of recording with technical scheme 1, and, described action control unit is controlled, to make at least contacting and start the state of attract electrons parts until during rising, apply reciprocating motion by described reciprocating motion applying unit with the electronic unit remaining in described parts supply unit from described adsorption mouth.
The invention that technical scheme 3 is recorded, is characterized in that, have the identical structure of invention of recording with technical scheme 1 or 2, and described reciprocating motion applying unit has vibration bringing device, and this vibration bringing device applies vibration to described parts supply unit.
The invention that technical scheme 4 is recorded, it is characterized in that, there is the identical structure of invention of recording with technical scheme 1 or 2, and, on described boarded head, be equipped with and make the rotary driving source of described adsorption mouth around its center line rotation, use described rotary driving source as described reciprocating motion applying unit, apply reciprocating rotary action to described adsorption mouth on one side, adsorb described electronic unit on one side.
The invention that technical scheme 5 is recorded, it is characterized in that, there is the identical structure of invention of recording with technical scheme 1 or 2, and, on described boarded head, be equipped with and make the lifting drive source of described adsorption mouth along its center line lifting, use described lifting drive source as reciprocating motion applying unit, the reciprocating motion under being applied with to described adsorption mouth on one side, adsorbs described electronic unit on one side.
The invention that technical scheme 6 is recorded, it is characterized in that, there is the identical structure of invention of recording with technical scheme 1 or 2, and, use the mobile drive source of described boarded head travel mechanism as described reciprocating motion applying unit, apply along the reciprocating motion of boarded head moving direction to described adsorption mouth on one side, adsorb described electronic unit on one side.
The invention that technical scheme 7 is recorded, it is characterized in that, the specifically structure identical with the invention of technical scheme 1 or record, described parts supply unit has supply tray, this supply tray is pasted and is kept described each electronic unit, and described adsorption mouth makes described electronic unit peel off from described supply tray by absorption.
The invention that technical scheme 8 is recorded, is characterized in that, has the identical structure of invention of recording with technical scheme 7, and on described supply tray, described each electronic unit is with plane alignment arrangements.
The effect of invention
In the invention of recording in technical scheme 1, owing to thering is some with respect in the electronic unit of adsorption mouth or parts supply unit, apply continuous reciprocating reciprocating motion applying unit, even so in the case of the lower surface of electronic unit and parts supply unit side are close to, owing to utilizing adsorption mouth to apply tension force upward, and apply continuous reciprocating motion, so effectively impel peeling off of electronic unit, adsorption mouth can be adsorbed electronic unit more reliably.In addition, can effectively promote peeling off of electronic unit, and the device that needn't use heating unit etc. to exert an influence to electronic unit and peripheral device.Therefore, improved the reliability of the installation action of electronic component mounting apparatus, restrain adsorption error, improves operating efficiency, and can improve rate of finished products.
In addition, the reciprocating motion that reciprocating motion applying unit applies, the reciprocating motion that can be straight line is vibration action, can be also reciprocating rotary action.In addition, in this technical scheme 1, be not limited to electronic unit to stick on the situation on parts supply unit.; due to according to the difference of the material of the material of electronic unit and parts supply unit; even in the situation that not pasting etc., also there is situation about being seamlessly close to each other and be difficult to peel off, so also can effectively impel in these cases peeling off of electronic unit.
The invention that technical scheme 2 is recorded, owing at least starting at the state contacting with the electronic unit being present in parts supply unit from adsorption mouth until described electronic unit is mentioned by absorption, reciprocating motion applying unit applies reciprocating motion, so avoid applying the reciprocating motion that exceedes needs, can realize the Labor-saving in non-when absorption, in addition, the reciprocating motion when applying except absorption, can prevent peeling off of other electronic unit, position skew etc.
The invention that technical scheme 3 is recorded, because reciprocating motion applying unit applies vibration to parts supply unit, so needn't carry vibration bringing device in boarded head side, can realize miniaturization and the lightweight of boarded head.
The invention that technical scheme 4 is recorded, due to by the rotary driving source of the angle for adjusting the electronic unit that is adsorbed mouth absorption, also use as reciprocating motion applying unit, so can avoid the maximization of boarded head and weight to increase, and the minimizing of the components number of implement device entirety, realizes the reduction of production cost.
The invention that technical scheme 5 is recorded, due to by the lifting drive source of the lifting action for carrying out adsorption mouth, also use as reciprocating motion applying unit, so can avoid the maximization of boarded head and weight to increase, and the minimizing of the components number of implement device entirety, realizes the reduction of production cost.
The invention that technical scheme 6 is recorded, due to by the mobile drive source of the shift action for carrying out boarded head, is also used as reciprocating motion applying unit, so the minimizing of components number that can implement device entirety realizes the reduction of production cost.
The invention that technical scheme 7 and 8 is recorded, even paste the parts supply unit of the type of electronic unit on supply tray, also can peel off electronic unit effectively from parts supply unit, can improve operating efficiency and improve rate of finished products.
Brief description of the drawings
Fig. 1 is the overall vertical view that represents the related electronic component mounting apparatus of present embodiment.
Fig. 2 is the end view of vibration bringing device.
Fig. 3 is the block diagram that represents the control system of electronic component mounting apparatus.
Fig. 4 is the flow chart of the installation action control of electronic unit.
Fig. 5 is conventional example, and Fig. 5 (A) normally carries out the electronic unit key diagram in when absorption by adsorption mouth, and Fig. 5 (B) does not peel off electronic unit and key diagram while having produced absorption error.
Fig. 6 is the front view of substrate clamp system.
Embodiment
(working of an invention mode)
Based on Fig. 1 to Fig. 4, embodiments of the present invention are described.Fig. 1 is the vertical view that represents the schematic configuration of the related electronic component mounting apparatus of present embodiment 100, and Fig. 3 is the block diagram that represents the control system of electronic component mounting apparatus 10.Below, as shown in the figure, both direction orthogonal on horizontal plane is defined as respectively to X-direction and the Y direction along substrate throughput direction.In addition, will be defined as Z-direction with their orthogonal vertical above-below directions.Electronic component mounting apparatus 100 carries out the lift-launch of various electronic unit C to substrate K, as shown in Figure 1, have: first component supply unit 102, it keeps side by side multiple electronic component feeders 101 in X-direction, and this electronic component feeder 101 is supplied with the electronic unit C that becomes mounting object; Second component supply unit 104, it is provided with the pallet 103 of the multiple electronic unit C of mounting; As the vibration bringing device 30 of reciprocating motion applying unit, it applies vibration to this second component supply unit 104; Substrate supply unit 108, it is conveying substrate K in X-direction; Substrate maintaining part, its substrate transport path that is arranged on this substrate supply unit 108 midway, for carrying out the electro part carrying operation with respect to substrate K; Boarded head 106, it liftably keeps multiple (being in this example six) adsorption mouth 105, carries out the maintenance of electronic unit C; As the X-Y portal frame 107 of boarded head travel mechanism, it drives conveying by boarded head 106 comprising on two parts supply units 102,104 and the optional position of substrate maintaining part in interior operating area; Pedestal 114, it carries and supports above-mentioned each structure; And action control unit 10, it carries out the action control of above-mentioned each structure.
(substrate supply unit and substrate maintaining part)
Substrate supply unit 108 has conveyer belt 212A, the 212B shown in Fig. 6, utilizes this conveyer belt along X-direction conveying substrate K.
In addition, as mentioned above,, be provided with substrate maintaining part in the substrate transport path of substrate supply unit 108 midway, its job position when substrate K fixedly being remained on to substrate K lift-launch electronic unit C.Substrate supply unit 108 stops after substrate is delivered to substrate maintaining part, utilizes substrate clamp system 222A, the 222B shown in Fig. 6 to carry out the maintenance of substrate K., under the state that is kept substrate K by clamp system, carry out the lift-launch operation of stable electronic unit C.
(first component supply unit)
First component supply unit 102 is arranged on Y direction one end of pedestal 114, is the region along X-direction that can carry side by side multiple electronic component feeders 101.On the upper surface of the par of first component supply unit 102, arrange and load along X-direction multiple electronic component feeders 101 are installed.In addition, at each electronic component feeder, 101 places are provided with latching mechanism, by operated latch pin mechanism, can carry out the dismounting of first component supply unit.
Above-mentioned electronic component feeder 101, maintain retainer belt reel (not shown) in rearward end side, this retainer belt reel coiling is the retainer belt all uniformly-spaced to enclose by multiple electronic unit C, and near leading section, as mentioned above, there is the transport unit that electronic unit C transmits to boarded head 106.
In the time of the installation action of electronic unit C, boarded head 106 is positioned at adsorption mouth 105 as carrying on the acceptance division of electronic component feeder 101 of object, carries out the reception of electronic unit C.
(second component supply unit)
Second component supply unit 104 is arranged on pedestal 114, in Y direction, is arranged on a side contrary with first component supply unit 102 across substrate supply unit 108.
This second component supply unit 104 be can loading tray 103 flat board, supported by vibration bringing device 30 described later, can move along Y direction.
Pallet 103 is configured to electronic unit C with impartial interval rectangularly in X-direction and Y direction, electronic unit C is sticked on to everybody and be set up., each electronic unit C at the upper surface of pallet 103 with plane configuration.The stickup of electronic unit C, in order not make electronic unit C produce the temporary fixed of position skew, bond strength is roughly adjusted to, if being adsorbed mouth 105 adsorbs and is subject to tension force upward, electronic unit C peels off from recess, but for the bond strength of each electronic unit C, be difficult to realize exactly homogenization, can have some fluctuations.
And in the time of the installation action of electronic unit C, boarded head 106 is corresponding with each electronic unit C, in order adsorption mouth 105 is positioned, and carries out the transmission of electronic unit C.
(X-Y portal frame)
X-Y portal frame 107 has: X-axis guide rail 107a, and it is to the movement of X-direction guiding boarded head 106; Two Y-axis guide rail 107b, they guide boarded head 106 together with this X-axis guide rail 107a to Y direction; X-axis motor 109, it is the mobile drive source that boarded head 106 is moved along X-direction; And Y-axis motor 110, it is the mobile drive source that boarded head 106 is moved via X-axis guide rail 107a to Y direction.And, utilizing the driving of each motor 109,110, boarded head 106 can be between two Y-axis guide rail 107b be carried in the entirety in region.
In addition, each motor 109,110, utilizes action control unit 10 to be controlled to the rotation amount into expecting, carries out the location of adsorption mouth 105 via boarded head 106.In addition, in order to carry out electronic unit installation exercise, described first and second component supply unit 102,104 and substrate maintaining part are all configured in the region that can be carried boarded head 106 by X-Y portal frame 107.
(boarded head)
In boarded head 106, be provided with: six adsorption mouth 105, they utilize vacuum attraction to keep electronic unit C at leading section; As six Z axis motor 111 (with reference to Fig. 3) of lifting drive source, they make each adsorption mouth 105 respectively along Z-direction lifting; As the θ axle motor 112 (with reference to Fig. 3) of rotary driving source, they,, for each adsorption mouth 105 is rotated respectively, carry out angular adjustment around Z-direction to kept electronic unit C; Substrate identification camera 115, it identifies substrate position for taking the mark of substrate K; And component identification camera 113, its for detection of the electronic unit C being adsorbed by each adsorption mouth 105 with respect to the position of adsorption mouth leading section and around the angle of Z axis.In addition, in Fig. 3, only illustrate each motor 111,112 for an adsorption mouth 105, but in fact, for the each adsorption mouth 105 being mounted on boarded head 106, each motor 111,112 is set.
Above-mentioned each adsorption mouth 105 is supported by boarded head 106, can lifting and rotatable under the state along Z-direction, and reception or the installation of electronic unit C can be carried out by lifting, and the angular adjustment of electronic unit C can be carried out by rotation.
In addition, component identification camera 113 is taken the electronic unit C of adsorption mouth 105 front ends from the side, detect adsorption mouth front end have or not the electronic unit C of absorption and electronic unit C towards.
Substrate identification camera 115 towards vertical lower carried, take substrate K from top, carry out the specifically labelled shooting on substrate K, detect substrate position.
(vibration bringing device)
Fig. 2 is the end view of vibration bringing device 30.Vibration bringing device 30 has: two guide rails 31 (omitting in Fig. 2), and they are along the second component supply unit 104 of Y direction support plate shape, make it can reciprocating motion; Framework 32, its supporting guide 31; And pneumatic vibrator 33, it is arranged on the downside of second component supply unit 104, applies the reciprocating motion along Y direction to this second component supply unit 104.
Pneumatic vibrator 33 has the 33b of bar portion, and it is accepted the supply of air pressure and carries out reciprocal front and back action, and this 33b of bar portion and second component supply unit 104 link.In addition, the 33b of bar portion of this pneumatic vibrator 33 is arranged on framework 32 towards the state of Y direction with its direction of action.
In addition, as this pneumatic vibrator 33, if utilize electromagnetically operated valve 33a (with reference to Fig. 3) to accept the supply of air pressure, the 33b of bar portion moves back and forth, and utilizes action control unit 10 to control electromagnetically operated valve 33a air pressure is supplied with and stopped.Pneumatic vibrator 33 is supplied to the air pressure of authorized pressure, applies the reciprocating motion along Y direction with assigned frequency to second component supply unit 104.The calibration of this vibration is suitably selected in following ranges, that is, be suitable for promoting peeling off of electronic unit C in the time that adsorption mouth 105 is adsorbed and mentioned electronic unit C, and can not make electronic unit C produce damage.Be here for example 50[Hz].
(action control unit)
As shown in Figure 3, action control unit 10 has: described X-axis motor 109, Y-axis motor 110, Z axis motor 111 and θ axle motor 112 motor driver 109a～112a separately; Image of component handling part 113a, it carries out numerical data to the photographic images of component identification camera 113; Substrate image handling part 115a, its photographic images to substrate identification camera 115 carries out numerical data; And electromagnetically operated valve 33a, it is for controlling pneumatic vibrator 33.
And action control unit 10 has: CPU40, its control program according to the rules, carries out the installation action control of electronic unit C; Memory 41, it becomes the operating area of various processing by the various data processed of storage CPU40; Secondary storage device 42, its storage for carry out various processing and control program, be arranged on required installation data and other the set information etc. of installation action control such as receiving position of the list of the electronic unit C on substrate K and the installation site of each electronic unit C and electronic unit C; And I/F (interface) 43, it is for realizing the connection of CPU40 and various device (each motor driver 109a～112a, each image processing part 113a, 115a, electromagnetically operated valve 33a etc.).
Based on the flow chart of Fig. 4, the CPU40 that above-mentioned action control unit 10 is described is in the electronic unit installation action control from the pallet 103 attract electrons parts C of second component supply unit 104 and being arranged on substrate K.
CPU40 reads in installation data from secondary storage device 42, obtains and carries out as the position of the absorption of the electronic unit C of mounting object with respect to the actual position coordinate data of substrate K.
And, control X-axis motor 109 and Y-axis motor 110, the adsorption mouth on boarded head 106 105 is positioned on the absorption position of the electronic unit C in the pallet 103 of second component supply unit 104 (step S1).
Then,, by controlling Z axis motor 111, make adsorption mouth 105 drop to the reception height of electronic unit C, attract electrons parts C (step S2).And CPU40 controls electromagnetically operated valve 33a, starts pneumatic vibrator 33 to supply with air pressure, and pallet 103 and second component supply unit 104 are applied to reciprocating motion (step S3) along Y direction.Along Y direction, pallet 103 and second component supply unit 104 are applied reciprocating during, adsorption mouth 105 contacts with electronic unit C, starts attract electrons parts C.
And CPU40, after the predefined time, drives Z axis motor 111, make adsorption mouth 105 rise to delivery head (step S4).Now, owing to utilizing pneumatic vibrator 33 to apply vibration to pallet 103, easily depart from from pallet 103 so be adsorbed the electronic unit C that mouth 105 attracts, adsorb and keep electronic unit C by adsorption mouth 105 more reliably.
In addition, control the electromagnetically operated valve 33a of pneumatic vibrator 33, to start after the predefined time from the rising of adsorption mouth 105, stop the supply (step S5) of air pressure.
Then, start boarded head 106 to carry (step S6) to the substrate mounting position of electronic unit C.In the movement of this boarded head 106, utilize component identification camera 113 to take the electronic unit C of the leading section that is adsorbed on adsorption mouth 105, detect the position skew of the electronic unit C corresponding with the center of adsorption mouth 105 and the angle (step S7) around center line.
And the angle of the electronic unit C of CPU40 based on detecting, drives θ axle motor 112, correcting electronic parts C towards (step S8).
And, if boarded head 106 arrives the installation site of substrate K, utilize substrate identification camera 115 to take (step S9) to the mark on substrate K, correctly grasp the position of substrate K, and consider the electronic unit C that the detects position with respect to adsorption mouth 105 in above-mentioned steps S7, proofread and correct the stop position (step S10) in X-direction and the Y direction of boarded head 106.
And, drive Z axis motor 111, make adsorption mouth 105 drop to setting height(from bottom) (step S11), electronic unit C is positioned on installation site, after the stand-by time of regulation, utilize Z axis motor 111 to make adsorption mouth 105 increase (step S12), finish installation action control.
In addition, CPU40, for the whole electronic unit C as mounting object setting in installation data, carries out above-mentioned installation action control repeatedly.
In addition, be the electronic unit C supplying with from first component supply unit 102 at the electronic unit C as mounting object, the vibration by vibration bringing device 30 of not carrying out above-mentioned steps S3 and S5 applies.
(effect of execution mode)
As mentioned above, because electronic component mounting apparatus 100 has vibration bringing device 30, contact rear until during mentioning with electronic unit C in adsorption mouth 105, second component supply unit 104 and pallet 103 move back and forth, so can effectively impel peeling off of the electronic unit C that sticks on pallet 103, can effectively avoid the absorption such as the accidental error of the residual and electronic unit C of the electronic unit C on pallet 103, can improve the reliability of the installation action of electronic component mounting apparatus 100, slip up by restrain adsorption, realize the raising of operating efficiency, and realize improvement of rate of finished products etc.
In addition, due to the vibration of vibration bringing device 30 apply action and only contact with electronic unit C in adsorption mouth 105 after extremely by adsorb mentioned till during carry out, so vibration applies the Min. of moving as required, the Labor-saving in non-when absorption be can realize, the peeling off of other electronic unit C, position skew etc. also can be prevented.
In addition, utilize vibration to apply the effect that electronic unit C is peeled off, can obtain by adsorption mouth 105 is applied to relative periodicity reciprocating motion with electronic unit C, but in the electronic component mounting apparatus 100 of above-mentioned execution mode, owing to utilizing vibration bringing device 30, second component supply unit 104 and pallet 103 move back and forth, so situation about moving back and forth from adsorption mouth 105 is different, can avoid carrying vibration bringing device to boarded head 106, can realize miniaturization and the lightweight of boarded head 106.
(other)
Above-mentioned vibration bringing device 30 applies reciprocating motion along Y direction to second component supply unit 104, but is not limited to this direction, also can apply to the reciprocating motion of X-direction, Z-direction or to by the reciprocating motion of their synthetic directions.
In addition, the drive source of vibration bringing device 30 has used pneumatic vibrator, but also can be using motor, solenoid, piezoelectric element etc. as drive source.
In addition, vibration bringing device also can be mounted in adsorption mouth is applied to relative reciprocating boarded head 106 sides as reciprocating motion applying unit with electronic unit C.
And, also can replace vibration bringing device 30, by applying identical timing with the vibration of above-mentioned vibration bringing device 30, make to be mounted in θ axle motor 112 on boarded head 106 with described identical frequency, carry out reciprocating rotation with minute angle, between adsorption mouth 105 and electronic unit C, apply relative reciprocating motion, thereby impel peeling off of electronic unit C.In this case, θ axle motor 112 works as reciprocating motion applying unit, can utilize existing structure to obtain the effect same with vibrating bringing device 30, can also realize the reduction of component costs.
In addition, in the same manner, also can replace vibration bringing device 30, by the timing identical with vibration bringing device 30, make to be mounted in Z axis motor 111 on boarded head 105 with described identical frequency, with small amplitude reciprocating motion, between adsorption mouth 105 and electronic unit C, apply relative reciprocating motion, thereby impel peeling off of electronic unit C.In this case, after finishing, reciprocating motion carries out mentioning of adsorption mouth 105.And, also can replace vibration bringing device 30, by the timing identical with vibration bringing device 30, make X-axis motor 109 or Y-axis motor 110 with described identical frequency, move back and forth with small amplitude, between adsorption mouth 105 and electronic unit C, apply relative reciprocating motion, thereby impel peeling off of electronic unit C.
As mentioned above, in the situation that using each motor 109,110,111 as reciprocating motion applying unit, also can obtain the effect identical with the situation that uses θ axle motor 112.In addition, also can be by reciprocating a certain being used in combination by described vibration bringing device 30 and each motor 109～112.In combination in the situation that, preferably make some inconsistent in these directions of motion, phase place or frequency.
In addition, in above-mentioned electronic component mounting apparatus 100, only install second component supply unit 104 has been applied to reciprocating vibration bringing device 30, but easily produce absorption mutually etc. with electronic unit in the case of the retainer belt of electronic component feeder 101 is inner, also can arrange first component supply unit 102 is applied to reciprocating vibration bringing device, to apply vibration in the timing identical with vibration bringing device 30.
Or, also can for first component supply unit 102, vibration bringing device be set, but utilize certain motor 109～112, apply reciprocating motion in the timing identical with vibration bringing device 30.
Claims (8)
1. an electronic component mounting apparatus, it has:
Substrate maintaining part, the substrate of electronic unit installation is carried out in its maintenance;
Parts supply unit, multiple electronic units that its supply will be installed;
Boarded head, it has adsorption mouth, and this adsorption mouth is adsorbed the described electronic unit that will be mounted on described substrate;
Boarded head travel mechanism, it,, comprising described parts supply unit and described substrate maintaining part in interior region, at random carries out running fix to described boarded head; And
Action control unit, it carries out the installation action control with respect to described substrate,
It is characterized in that,
Described electronic component mounting apparatus also has reciprocating motion applying unit, and its some in the electronic unit of described adsorption mouth or described parts supply unit, applies continuous reciprocating motion.
2. electronic component mounting apparatus according to claim 1, is characterized in that,
Described action control unit is controlled, to make at least contacting and start the state of attract electrons parts until during rising, apply reciprocating motion by described reciprocating motion applying unit with the electronic unit remaining in described parts supply unit from described adsorption mouth.
3. according to the electronic component mounting apparatus described in claim 1 or 2, it is characterized in that,
Described reciprocating motion applying unit has vibration bringing device, and this vibration bringing device applies vibration to described parts supply unit.
4. according to the electronic component mounting apparatus described in claim 1 or 2, it is characterized in that,
On described boarded head, be equipped with and make the rotary driving source of described adsorption mouth around its center line rotation,
Use described rotary driving source as described reciprocating motion applying unit, apply reciprocating rotary action to described adsorption mouth on one side, adsorb described electronic unit on one side.
5. according to the electronic component mounting apparatus described in claim 1 or 2, it is characterized in that,
On described boarded head, be equipped with and make the lifting drive source of described adsorption mouth along its center line lifting,
Use described lifting drive source as reciprocating motion applying unit, the reciprocating motion under being applied with to described adsorption mouth on one side, adsorbs described electronic unit on one side.
6. according to the electronic component mounting apparatus described in claim 1 or 2, it is characterized in that,
Use the mobile drive source of described boarded head travel mechanism as described reciprocating motion applying unit, apply along the reciprocating motion of boarded head moving direction to described adsorption mouth on one side, adsorb described electronic unit on one side.
7. according to the electronic component mounting apparatus described in claim 1 or 2, it is characterized in that,
Described parts supply unit has supply tray, and this supply tray is pasted and kept described each electronic unit,
Described adsorption mouth makes described electronic unit peel off from described supply tray by absorption.
8. electronic component mounting apparatus according to claim 7, is characterized in that,
On described supply tray, described each electronic unit is with plane alignment arrangements.
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| JP2009-144437 | 2009-06-17 | ||
| JP2009144437A JP5457081B2 (en) | 2009-06-17 | 2009-06-17 | Electronic component mounting equipment |
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| CN101932224A CN101932224A (en) | 2010-12-29 |
| CN101932224B true CN101932224B (en) | 2014-12-10 |
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| JP5796162B2 (en) * | 2011-11-07 | 2015-10-21 | パナソニックＩｐマネジメント株式会社 | Tray feeder, pallet for tray setting and tray setting method |
| CN110383967B (en) * | 2017-03-22 | 2021-01-05 | 株式会社富士 | Belt feeder |
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|---|
| JP特开2005-169539A 2005.06.30 * |
| JP特开2008-108292A 2008.05.08 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011003659A (en) | 2011-01-06 |
| CN101932224A (en) | 2010-12-29 |
| JP5457081B2 (en) | 2014-04-02 |
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