CN110192444B

CN110192444B - Component mounting apparatus and method for holding substrate

Info

Publication number: CN110192444B
Application number: CN201780083019.9A
Authority: CN
Inventors: 小木曾武
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2017-03-07
Filing date: 2017-03-07
Publication date: 2021-05-11
Anticipated expiration: 2037-03-07
Also published as: CN110192444A; JP6840223B2; KR102208102B1; WO2018163284A1; JPWO2018163284A1; KR20190087578A

Abstract

The component mounting device disclosed by the specification is a surface mounting machine (10) provided with a support unit (50) and a mounting head (32), wherein the support unit (50) is provided with a support plate (51) for sucking and holding a printed substrate (P) on which an electronic component (E) is mounted, the mounting head (32) is provided with a suction nozzle (34) for loading the electronic component (E) on the printed substrate (P), and the suction nozzle (34) can press the printed substrate (P) against the support plate (51) in the process of sucking and holding the printed substrate (P) by the support plate (51).

Description

Component mounting apparatus and method for holding substrate

Technical Field

The technology disclosed in the present specification relates to a component mounting apparatus and a substrate holding method.

Background

For example, as a component mounting apparatus including a receiving member for sucking and holding a substrate on which a component is mounted, a structure described in japanese patent application laid-open No. 2004-296632 (patent document 1) is known. The component mounting apparatus includes a deformation correcting head having a pressing member capable of pressing the entire component mounting portion of the substrate, and the substrate is sucked by the receiving member by correcting the deformation by pressing the substrate against the receiving member by the pressing member.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2004-296632

Disclosure of Invention

Problems to be solved by the invention

However, according to such a component mounting apparatus, in order to suck the substrate by the receiving member, the deformation correcting head is provided on the side surface of the mounting head together with the driving mechanism separately from the mounting head for mounting the component on the substrate. Therefore, as the number of components increases, a space for disposing the strain correction head and the drive mechanism is required, and the component mounting apparatus becomes larger. Further, the strain correction head and the driving mechanism are provided on the side surface of the mounting head, and therefore become obstacles for moving the mounting head at high speed.

In the present specification, a technique of appropriately holding a substrate while suppressing an increase in the number of elements is disclosed.

Means for solving the problems

The technology disclosed in the present specification relates to a component mounting device including: a holding plate for sucking and holding a substrate on which a component is mounted; and a mounting head that mounts the component on the substrate, wherein the mounting head is capable of pressing the substrate against the holding plate in a process in which the holding plate sucks and holds the substrate.

The technology disclosed in the present specification relates to a method for holding a substrate in a component mounting apparatus including a holding plate for sucking and holding a substrate on which a component is mounted and a mounting head for mounting the component on the substrate, wherein the substrate is pressed against the holding plate by the mounting head while the holding plate sucks and holds the substrate.

According to the component mounting device having such a configuration, when the substrate is warped, the substrate can be pressed against the holding plate by the mounting head, and therefore the substrate can be appropriately held by the holding plate. Further, since the mounting head for mounting the components on the substrate presses the substrate against the holding plate, a pressing mechanism for pressing the substrate separately from the mounting head is not required as in the prior art, and an increase in the number of components can be prevented. Further, since a space for disposing the pressing mechanism is not required, the component mounting apparatus can be prevented from being enlarged.

The component mounting apparatus disclosed in the present specification may have the following configuration.

The mounting head may include a suction nozzle capable of pressing a predetermined position of the substrate.

According to such a configuration, the substrate can be pressed against the holding plate by pressing the predetermined position of the substrate with the suction nozzle.

The component mounting apparatus may further include a control unit that performs a primary correction process of pressing the mounting head against the substrate when a suction error in which the suction of the substrate is insufficient is detected in the holding plate.

According to such a configuration, when a suction error is detected in the holding plate, the mounting head presses the substrate, and therefore, the work efficiency of the mounting work can be improved as compared with a case where the mounting head presses the substrate regardless of the presence or absence of the suction error, for example.

The control section may detect a suction error caused by warpage of the substrate by comparing a pressure when the holding plate sucks the substrate with a pressure when the holding plate properly sucks the substrate.

According to such a configuration, by comparing the pressure at the time of suction with the pressure at the time when the holding plate properly sucks the substrate, it is possible to detect a suction error due to warpage of the substrate. Thus, the number of components can be reduced compared to a case where a suction error of a substrate is determined by image recognition or the like, and the suction error can be confirmed with a simple configuration.

The controller may intermittently press a plurality of portions of the outer edge portion of the substrate by the mounting head in the primary leveling process.

In general, since the substrate is likely to warp at the outer edge portion, the mounting head can appropriately hold the substrate by the holding plate only by intermittently pressing the outer edge portion of the substrate as in the above-described configuration.

The control unit may terminate the pressing of the mounting head against the substrate when the elimination of the suction error is detected in the primary correction processing.

According to such a configuration, when the suction error is detected to be eliminated, the pressing of the mounting head against the substrate is terminated, and therefore, the work efficiency of the mounting work can be improved as compared with a case where, for example, a plurality of portions of the outer edge of the substrate are pressed by the mounting head.

The control unit may include a storage unit that stores a pressing position at which the suction error is detected to be eliminated by pressing the substrate by the mounting head, and the control unit may perform the substrate fixation releasing process when releasing the suction holding of the substrate by the holding plate as follows: pressing the pressing position stored in the storage part by the mounting head, and slowly pulling the mounting head away from the substrate.

According to such a configuration, when the suction holding of the substrate is released, the mounting head is gradually pulled away from the substrate, whereby a sudden spring back caused by warpage of the substrate can be suppressed. Thus, when the holding of the substrate is released, the positional deviation of the element mounted on the substrate can be suppressed.

The control unit may include a storage unit that stores a mounting position of the component mounted on the board, and may stop the mounting head from pressing the component at a predetermined pressing position that overlaps with the mounting position when the predetermined pressing position at which the mounting head is intended to press the board overlaps with the mounting position.

With this configuration, the element can be prevented from being pressed by the mounting head, and damage to the mounted element can be suppressed.

The control unit may determine a position adjacent to the planned pressing position and the mounting position as an alternative position that can be pressed by the mounting head when the planned pressing position and the mounting position overlap.

According to such a configuration, the mounting head presses the substitute position, thereby suppressing the element from being damaged by the mounting head and appropriately holding the substrate by the holding plate.

Effects of the invention

According to the technology disclosed in the present specification, the substrate can be appropriately held while suppressing an increase in the number of elements.

Drawings

Fig. 1 is a plan view of a surface mounting apparatus according to embodiment 1.

Fig. 2 is a front view of the surface mounting machine.

Fig. 3 is a block diagram showing an electrical configuration of the surface mounting apparatus.

Fig. 4 is a plan view of the support unit.

Fig. 5 is a side view of a state in which the head unit is disposed on the support unit.

Fig. 6 is a diagram schematically showing the support unit and the pressure sensor.

Fig. 7 is a flowchart of the substrate fixing process.

Fig. 8 is a flowchart of a primary correction process.

Fig. 9 is a flowchart of the substrate fixing release process.

Fig. 10 is a diagram showing a positional relationship between the printed circuit board and the supporting unit.

Fig. 11 is a perspective view showing a state in which a printed circuit board having warpage is disposed on a supporting unit.

Fig. 12 is a side view showing a state in which a printed circuit board having warpage is disposed on a supporting unit.

Fig. 13 is a side view showing a state in which a portion of the printed board where warpage has occurred is pressed by the suction nozzle.

Fig. 14 is a flowchart of the primary correction processing of embodiment 2.

Fig. 15 is a diagram showing a state where an electronic component is mounted at a predetermined pressing position of a printed board.

Detailed Description

< embodiment 1>

Embodiment 1 illustrates a surface mounting machine (an example of a "component mounting apparatus") 10 that mounts an electronic component (an example of a "component") E on a printed circuit board (an example of a "board") P. As shown in fig. 1, the surface mounting machine 10 includes a base 11 having a substantially rectangular shape in plan view, a conveying conveyor 12 for conveying a printed board P onto the base 11, a component mounting unit 20 for mounting an electronic component E onto the printed board P, a supporting unit 50 for supporting the printed board P at a mounting position, and a component supply device 13 for supplying the electronic component E to the component mounting unit 20.

In the following description, the left-right direction is based on the left-right direction in fig. 1 (the longitudinal direction of the base 11 and the conveying direction of the conveying conveyor 12) and the left-right direction in fig. 3. The front-rear direction is based on the vertical direction in fig. 1 (the short side direction of the base 11) and the horizontal direction in fig. 4, and in fig. 1, the lower side in the figure is the front side, the upper side in the figure is the rear side, and in fig. 3, the left side in the figure is the front side, and the right side in the figure is the rear side.

As shown in fig. 1, the base 11 has a substantially rectangular shape in a plan view laterally elongated in the left-right direction, and a pair of conveying conveyors 12 arranged on both left and right sides, a support unit 50 arranged between the pair of conveying conveyors 12, a component mounting unit 20, and the like are arranged on the base 11.

The pair of left and right transport conveyors 12 and the support unit 50 are in a state of being continuous without height difference, and can transport the printed board P to be mounted in the left and right direction. As shown in fig. 1, each of the transport conveyors 12 includes a pair of conveyor belts 14 that are driven to circulate in the left-right direction, and the printed circuit board P is mounted on the pair of conveyor belts 14 so as to be stretched. The printed board P is carried into the mounting position on the support unit 50 along the conveyor belt 14 from the right side in the left-right direction, and after the mounting work of the electronic component E is performed at the mounting position, carried out to the left side in the left-right direction along the conveyor belt 14.

The support unit 50 is configured to hold and fix the printed board P when the electronic component E is mounted on the printed board P, and has a block shape laterally long in the left-right direction as shown in fig. 2 and 4 to 6. The support unit 50 includes a support plate (an example of a "holding plate") 51 on which the printed circuit board P is placed, a negative pressure supply member 52 provided below the support plate 51, a support member 53 provided further below the negative pressure supply member 52, and a pair of side plates 54 provided on both sides in the front-rear direction.

The support plate 51 is made of metal, and the flatness of the upper surface 51A of the support plate 51 is set high. A plurality of small suction holes 55 through which air can pass are provided in the upper surface 51A of the support plate 51 in a front-rear left-right direction in a state where the support plate 51 penetrates in the vertical direction.

The negative pressure supply member 52 is a flat plate having a plate thickness slightly larger than that of the support plate 51, and is provided to have substantially the same size as the support plate 51 in the front-rear and left-right directions. As shown in fig. 6, a negative pressure supply passage 56 corresponding to the suction hole 55 of the support plate 51 is provided inside the negative pressure supply member 52, and negative pressure is supplied from the air supply device 60 to the negative pressure supply passage 56. When negative pressure is supplied to the negative pressure supply path 56, negative pressure is supplied to each suction hole 55, and the printed circuit board P placed on the upper surface 51A of the support plate 51 is sucked by the support plate 51 and held by the negative pressure.

The support member 53 is provided in a block shape having substantially the same size as the negative pressure supply member 52 in the front-rear and left-right directions. The support member 53 is fixed to the base 11 by a fixing mechanism, not shown, to fix the support unit 50 to the base 11.

The pair of side plates 54 is provided to cover the support plate 51, the negative pressure supply member 52, and the support member 53 from the front and rear to both sides, and the pair of side plates 54 fixes 3 members in a state of being positioned from the front and rear to both sides. A conveying belt 54A that is circularly driven in the left-right direction is provided on the inner surface of each side plate 54. Each of the transport belts 54A transports the printed circuit board P in the left-right direction on the support unit 50.

As shown in fig. 1, the component supply device 13 is of a feeder type, and is arranged at 4 locations in total by arranging 2 components in the left-right direction on both sides in the up-down direction of the transport conveyor 12. A plurality of feeders 16 are mounted on the component supply device 13 in a state aligned in the left-right direction. Each feeder 16 includes an electric feeder, not shown, which draws out a component supply tape containing a plurality of electronic components E from a reel, and each feeder 16 supplies the electronic components E one by one from an end portion on the side of the conveying conveyor 12.

The component mounting unit 20 is configured to take out the electronic component E supplied from the component supplying device 13 onto the base 11 and mount the electronic component E on the printed board P, and includes, as shown in fig. 1, a pair of Y-axis frames 21 disposed on both sides of the base 11 in the left-right direction, an X-axis frame 26 bridged over the pair of Y-axis frames 21, and a head unit 30 movably attached to the X-axis frame 26.

The pair of Y-axis frames 21 are provided with Y-axis guide rails 24 and Y-axis servomotors 25 arranged along the Y-axis frames 21, and when the Y-axis servomotors 25 are controlled by energization, the X-axis frame 26 and the head unit 30 attached to the X-axis frame 26 move in the front-rear direction along the Y-axis guide rails 24.

The X-axis frame 26 extends in the left-right direction, the X-axis frame 26 is provided with an X-axis guide rail 27 and an X-axis servomotor 28 arranged along the X-axis frame 26, and the head unit 30 moves in the left-right direction along the X-axis guide rail 27 when the X-axis servomotor 28 is controlled by energization.

As shown in fig. 1 and 2, the head unit 30 includes a box-shaped head unit main body 31 and a plurality of mounting heads (an example of "mounting heads") 32 that perform mounting operations of the electronic components E.

As shown in fig. 2 and 5, the plurality of mounting heads 32 are arranged side by side in the left-right direction so as to protrude downward from the head unit body 31, and each mounting head 32 has a rotating shaft 33 extending in the up-down direction, and a suction nozzle (an example of a "mounting head") 34 that is detachable from a lower end portion, which is a front end of the rotating shaft 33.

A Z-axis servomotor 31A and an R-axis servomotor 31B provided in the head unit main body 31 are attached to the rotary shaft 33. As shown in fig. 13, the rotary shaft 33 is vertically movable by a Z-axis servo motor 31A, and is axially rotatable by an R-axis servo motor 31B.

As shown in fig. 5 and 6, the suction nozzle 34 has a substantially cylindrical shape extending in the vertical direction. The suction nozzle 34 is held at the lower end of the rotary shaft 33 by holding the upper end by a holding portion, not shown, provided at the lower end of the rotary shaft 33.

As shown in fig. 6, the lower end opening edge of the suction nozzle 34 is horizontally parallel to the upper surface of the base 11, and an unillustrated air passage communicating with an unillustrated supply passage provided in the rotary shaft 33 is provided inside the suction nozzle 34.

Negative pressure or positive pressure is supplied to the air passage from an air supply device 60 connected to the supply passage of the rotary shaft 33. The suction nozzle 34 sucks and holds the electronic component E by the negative pressure supplied to the air passage, and releases the electronic component E by the positive pressure supplied to the air passage. The lower end opening edge of the suction nozzle 34 can press the electronic component E, and when the electronic component E is released by the suction nozzle 34, the suction nozzle 34 holding the electronic component E is slightly pressed and opened with respect to the printed board P, whereby the electronic component E can be mounted at an appropriate position on the printed board P.

Therefore, the component mounting unit 20 can move the head unit 30 in the front-rear-left-right direction on the base 11 by driving the Y-axis servomotor 25 and the X-axis servomotor 28, and can take out the electronic component E from the component supply device 13 by driving the Z-axis servomotor 31A to lower the suction nozzle 34, or can mount the electronic component E on the printed board P held and fixed by the support unit 50.

As shown in fig. 2, the head unit 30 is provided with a board recognition camera 20A on a side surface of the head unit main body 31, and the board recognition camera 20A images the printed board P to recognize an image of the printed board P. As shown in fig. 1, a pair of component recognition cameras 15 are provided on both sides in the front-rear direction of the support unit 50 on the base 11, and each component recognition camera 15 images the electronic component E sucked and held by the mounting head 32 of the head unit 30.

Next, an electrical structure of the surface mounting apparatus 10 will be described with reference to fig. 3.

The surface mounting apparatus 10 collectively controls the whole apparatus by a control unit 110, and the control unit 110 includes an arithmetic processing unit (an example of a "control unit") 111 including a CPU or the like. The operation processing unit 111 is connected to a motor control unit 112, a storage unit 113, an image processing unit 114, an external input/output unit 115, a component supply device communication unit 116, a management device communication unit 117, an operation unit 118, and the like.

The motor control unit 112 controls the Y-axis servo motor 25, the X-axis servo motor 28, the Z-axis servo motor 31A, R, the axis servo motor 31B, the transport conveyor 12, and the like in accordance with the instructions of the arithmetic processing unit 111 and based on the mounting program stored in the storage unit 113, and mounts the electronic component E.

The storage unit 113 stores various programs such as a mounting program for mounting the electronic component E on the printed board P, a board fixing program for holding and fixing the printed board P, and various data. The various data include substrate information on the number of printed substrates P to be produced and the type thereof, information on the holding reference pressure when the supporting unit 50 holds and fixes the printed substrates P, and the like.

The image processing unit 114 reads the image signals output from the substrate recognition camera 20A and the component recognition camera 15, and generates an image based on the read image signals.

The external input/output unit 115 is a so-called interface. The arithmetic processing unit 111 reads detection signals output from various sensors 62 such as the pressure sensor 63 of the air supply device 60 through the external input/output unit 115, and outputs control signals to the air supply device 60 through the external input/output unit 115.

The component feeder communication unit 116 is connected to the component feeder 13, and performs overall control of the component feeder 13.

The management device communication unit 117 is communicably connected to the management device 90, and the management device 90 executes an optimization program based on the type of the printed circuit board P scheduled for production, and determines the order of mounting the electronic components E in advance.

The operation unit 118 includes a display device not shown such as a liquid crystal monitor, an input device not shown such as a keyboard and a mouse, and receives input from and outputs to an operator.

The arithmetic processing unit 111 executes the substrate fixing program stored in the storage unit 113, thereby controlling the air supply device 60 by the external input/output unit 115 to perform the substrate fixing process of holding and fixing the printed substrate P on the support unit 50.

The substrate fixing process will be described below with reference to a flowchart shown in fig. 7.

In the substrate fixing process, when the printed substrate P is transported to the mounting position on the support unit 50, the arithmetic processing unit 111 controls the air supply device 60 through the external input/output unit 115 to supply the negative pressure to the negative pressure supply member 52 of the support unit 50 (S11). Thus, negative pressure is supplied to the suction holes 55 of the support plate 51, and the printed circuit board P disposed at the mounting position is sucked by the support plate 51 of the support unit 50.

Next, the arithmetic processing unit 111 reads the detection signal from the pressure sensor 63 of the air supply device 60 via the external input/output unit 115, and determines whether the pressure of the pressure sensor 63 is higher than the holding reference pressure stored in the storage unit 113 (S12). Here, the holding reference pressure is set to a value slightly lower than the pressure generated when the printed circuit board P is properly adsorbed by the support plate 51.

When the pressure of the pressure sensor 63 is higher than the holding reference pressure (yes in S12), the arithmetic processing unit 111 determines that all the suction holes 55 of the support plate 51 are blocked by the printed circuit board P.

That is, it is considered that the printed board P is appropriately held and fixed at the mounting position of the support unit 50, and the board fixing process is ended.

On the other hand, when the pressure of the pressure sensor 63 is lower than the holding reference pressure (no in S12), the arithmetic processing unit 111 determines that any suction hole 55 of the support plate 51 is not blocked by the printed circuit board P and the suction of the printed circuit board P is insufficient, and a suction error occurs in which the printed circuit board P is not held and fixed properly. Thereby, a suction error of the printed substrate P is detected.

Specifically, for example, the portion P1 of the printed circuit board P where warpage occurs is in a floating state with respect to the support plate 51 due to warpage of the printed circuit board P or the like (see fig. 11 and 12), and it is determined that the printed circuit board P is not properly held and fixed because all the suction holes 55 in the support plate 51 are not blocked by the printed circuit board P, and a suction error is detected (S20).

Therefore, when a suction error is detected in which the printed circuit board P is not held and fixed properly, the arithmetic processing unit 111 performs a primary correction process for temporarily correcting the printed circuit board P (S20), and the storage unit 113 stores the case where the primary correction process is performed. During the substrate fixing process and the primary leveling process, the negative pressure is continuously supplied from the air supply device 60 to the support unit 50.

The primary correction processing will be described below with reference to a flowchart shown in fig. 8.

In the primary correction processing, first, the motor control unit 112 drives the Y-axis servomotor 25 and the X-axis servomotor 28 in accordance with the instruction of the arithmetic processing unit 111, and arranges the mounting head 32 in the head unit 30 on the printed circuit board P (S21).

Next, the motor control unit 112 drives the Z-axis servo motor 31A in the head unit 30, thereby lowering the suction nozzle 34 in the mounting head 32 and pressing the predetermined pressing position PP set on the printed board P.

Specifically, as shown in fig. 10 and 11, a plurality of the planned pressing positions PP are intermittently set at the outer peripheral edge portion P2 of the printed board P (in the present embodiment, at the four corners of the printed board P), and the nozzle 34 presses the first planned pressing position PP of the plurality of planned pressing positions PP to press the printed board P against the support plate 51 in one correction process (S22). In fig. 10, the number of the suction holes 55 on the upper surface 1 of the support plate is reduced for easy understanding, and the holes are enlarged.

Next, the descending nozzle 34 is raised, and it is determined whether or not the pressure of the pressure sensor 63 is higher than the holding reference pressure (S23).

When the pressure of the pressure sensor 63 is higher than the holding reference pressure (yes in S23), the arithmetic processing unit 111 temporarily corrects the portion P1 of the printed circuit board P where the warp occurs, and stores the pressing position (the predetermined pressing position PP) PF in the storage unit 113, assuming that the printed circuit board P is held and fixed properly, and ends the primary correction processing.

Specifically, as shown in fig. 13, the portion P1 of the printed board P where the warpage occurs is temporarily corrected by pressing the predetermined pressing position PP of the printed board P against the support plate 51. Then, the portion P1 of the printed circuit board P where the warp occurs is brought into close contact with the support plate 51 by the negative pressure, and the printed circuit board P is held in a state after primary correction. Therefore, all the suction holes 55 of the support plate 51 are blocked by the printed circuit board P, and the printed circuit board P is appropriately held and fixed, so that the pressure of the pressure sensor 63 is higher than the holding reference pressure.

On the other hand, when the pressure of the pressure sensor 63 is lower than the holding reference pressure (no in S23), the arithmetic processing unit 111 determines that all the suction holes 55 of the support plate 51 are not blocked by the printed circuit board P and that the printed circuit board P is not held and fixed properly, and presses the next predetermined pressing position PP among the plurality of predetermined pressing positions PP (S24).

Then, the processing of S23 and S24 is repeated until the pressure of the pressure sensor 63 increases from the holding reference pressure, and the plurality of predetermined pressing positions PP are sequentially pressed. When the pressure of the pressure sensor 63 is higher than the holding reference pressure, the arithmetic processing unit 111 stores the pressing position PF in the storage unit 113, and ends the primary correction processing.

That is, when the plurality of planned pressing positions PP set on the printed board P are sequentially pressed by the nozzle 34 and the arithmetic processing unit 111 detects that the suction error is eliminated by the pressure of the pressure sensor 63 being higher than the holding reference pressure, the pressing of the planned pressing positions PP by the nozzle 34 is terminated.

Further, when the pressing position PF is the last planned pressing position PP while the processes of S23 and S24 are repeated, the arithmetic processing unit 111 determines whether or not the pressure of the pressure sensor 63 pressed by the last planned pressing position PP is lower than the holding reference pressure (S25). When the pressure of the pressure sensor 63 is still lower than the holding reference pressure (yes in S25), the arithmetic processing unit 111 determines that the printed circuit board P cannot be corrected once by the one-time correction processing, and the printed circuit board P cannot be held and fixed properly by the support unit 50. Then, information such as an error message is displayed on the display device of the operation unit 118 (S26), and the primary correction processing is ended in response to the error.

In the primary correction process, when the printed circuit board P is appropriately held and fixed by the support unit 50, the motor control unit 112 mounts the electronic component E on the printed circuit board P based on the mounting program in accordance with the instruction of the arithmetic processing unit 111.

After the electronic component E is mounted, the arithmetic processing unit 111 stops the supply of the negative pressure from the air supply device 60, and releases the fixation of the printed circuit board P in the support unit 50. Then, the printed board P is carried out by the carrying conveyor 12.

Here, in the case where the printed board P is temporarily corrected by the primary correction process and held fixed, if the supply of the negative pressure is stopped to the supporting unit 50, the temporarily corrected portion of the printed board P (the portion P1 where the warp occurs in the printed board P) may be sprung back with a large force. If the temporarily corrected portion of the printed circuit board P rebounds with a large force, the electronic component E mounted on the printed circuit board P is misaligned.

Therefore, in the present embodiment, when releasing the fixation of the printed board P, the substrate fixation releasing process for suppressing the springback of the printed board P is performed.

The substrate fixation releasing process will be described below with reference to a flowchart shown in fig. 9.

In the substrate fixation release process, first, the arithmetic processing unit 111 refers to the storage unit 113 to determine whether or not the primary correction process has been performed in the substrate fixation process (S31). If the correction process is not performed once as a result of the determination (no in S31), the arithmetic processing unit 111 stops the supply of the negative pressure from the air supply device 60. Then, the fixing of the printed board P is released in the supporting unit 50 (S32), and the board fixing release process is ended.

On the other hand, when the correction process is performed once during the substrate fixing process (yes in S31), the arithmetic processing unit 111 calls the pressing position PF from the storage unit 113 (S33), and drives the Y-axis servomotor 25, the X-axis servomotor 28, and the Z-axis servomotor 31A via the motor control unit 112, thereby pressing the called pressing position PF by the nozzle 34 (S34).

Next, the supply of the negative pressure from the air supply device 60 is stopped, and the fixing of the printed circuit board P is released in the support unit 50 (S35).

Here, when the negative pressure is stopped, although the suction by the negative pressure of the portion P1 where the warp occurs in the printed circuit board P is released, the pressing position PF is pressed by the suction nozzle 34, and therefore, the rebound of the portion P1 where the warp occurs in the printed circuit board P can be prevented.

Next, the arithmetic processing unit 111 drives the Z-axis servomotor 31A via the motor control unit 112, and raises the nozzle 34 that has pressed the pressing position PF so as to be gradually separated from the printed circuit board P in order to avoid the portion P1 that has warped in the printed circuit board P from springing back suddenly (S36). Then, the portion P1 of the printed circuit board P where the warp occurs does not rebound and the fixation of the printed circuit board P is completely released, and the board fixation releasing process ends.

That is, it is possible to suppress the occurrence of positional deviation of the electronic component E mounted on the printed board P in the supporting unit 50 due to the release of the holding and fixing of the printed board P.

As described above, according to the present embodiment, even when the printed circuit board P is in a state in which a part of the printed circuit board P is floating with respect to the supporting plate 51 due to warping or the like of the printed circuit board P, the suction nozzle 34 in the mounting head 32 of the head unit 30 sequentially presses the plurality of predetermined pressing positions PP intermittently provided on the outer peripheral edge portion P2 of the printed circuit board P against the supporting plate 51, and the printed circuit board P can be temporarily corrected and held by the supporting plate 51. This prevents the electronic component E from being mounted due to warpage of the printed board P.

In addition, according to the present embodiment, the printed board P is pressed against the support plate 51 by the suction nozzle 34 for mounting the electronic component E on the printed board P. That is, since it is not necessary to separately provide a pressing mechanism for pressing the printed circuit board P against the support plate 51 as in the conventional case, the number of components of the surface mounting apparatus 10 can be prevented from increasing, and the surface mounting apparatus 10 can be prevented from becoming larger due to the space in which the pressing mechanism is provided.

Further, according to the present embodiment, in the substrate fixing process, when the pressure of the pressure sensor 63 is not higher than the holding reference pressure, it is determined that an adsorption error in which the printed circuit board P is not appropriately held occurs due to warpage of the printed circuit board P or the like, and the correction process is performed only once when the adsorption error occurs. That is, for example, the work efficiency of the mounting work can be improved compared to a case where all the planned pressing positions PP of the printed circuit board P are pressed by the suction nozzle 34 regardless of the suction error.

Further, according to the present embodiment, since the occurrence of the suction error due to the printed circuit board P floating on the support plate 51 is detected by comparing the pressure of the negative pressure when the printed circuit board P is held with the holding reference pressure stored in the storage unit 113, it is possible to prevent an increase in the number of components of the device for acquiring an image and the like and to suppress the surface mounting apparatus 10 from having a complicated configuration, compared to a case where the suction error is determined from an image of the printed circuit board P, for example.

Further, according to the present embodiment, in the primary correction processing, when it is detected that the plurality of planned pressing positions PP set on the printed board P are sequentially pressed by the suction nozzle 34 and the suction error is eliminated, the pressing of the planned pressing positions PP by the suction nozzle 34 is ended, so that the work efficiency of the mounting work can be improved as compared with a case where all of the plurality of planned pressing positions PP set on the printed board P are pressed by the suction nozzle 34.

In addition, when a suction error of the printed circuit board P occurs, a method of holding and fixing the printed circuit board P by the support plate 51 by pressing the central portion of the printed circuit board P or the entire printed circuit board P including the central portion by the suction nozzle 34 may be considered.

However, in general, the warpage of the printed substrate P tends to occur in the outer peripheral edge portion P2 of the printed substrate P. That is, as in the present embodiment, since the printed circuit board P can be held and fixed only by sequentially pressing the plurality of predetermined pressing positions PP intermittently set on the outer peripheral edge portion P2 of the printed circuit board P, the number of portions pressed by the suction nozzle 34 can be reduced as compared with, for example, a case where the central portion of the printed circuit board P or the entire printed circuit board P including the central portion is pressed by the suction nozzle 34, and the work efficiency of the mounting work can be further improved.

If all of the plurality of planned pressing positions PP of the printed circuit board P are pressed but the printed circuit board P cannot be held by the support unit 50, an error can be displayed on the display device of the operation unit 118 and a failure of the printed circuit board P can be notified to the operator, so that the reduction in the work efficiency of the mounting work can be minimized.

Further, according to the present embodiment, when the printed board P is once corrected by the one-time correction process due to the suction error of the printed board P, the pressing position PF at which the printed board P is pressed by the one-time correction process is stored. In the substrate fixing release process, the suction nozzle 34 presses the pressing position PF stored in the substrate fixing process, and after the holding and fixing of the printed substrate P by the negative pressure is released, the suction nozzle 34 is gradually raised, so that the portion P1 where the warp occurs in the printed substrate P can be prevented from springing back violently. This can suppress the occurrence of positional deviation of the electronic component E mounted on the printed board P.

< embodiment 2>

Next, embodiment 2 will be described with reference to fig. 14 and 15.

Embodiment 2 is a configuration in which a part of the primary correction processing of embodiment 1 is changed so as to be able to cope with a printed board P on which an electronic component E is partially mounted, and the configuration, operation, and effect common to embodiment 1 are repeated, and therefore, the description thereof is omitted. The same reference numerals are used for the same components as those in embodiment 1. The mounting position PM of the electronic component E already mounted on the printed board P is stored in the storage unit 113 in advance by storing information on the position where the electronic component E is mounted in embodiment 1 in the storage unit 113 or storing information such as a mounting position in the storage unit 113.

As shown in the flowchart of fig. 14, the primary correction processing of embodiment 2 differs from the processing after S21 (processing after the mounting heads 32 of the head unit 30 are arranged on the printed circuit board P) in the primary correction processing of embodiment 1, and after S21, the arithmetic processing unit 111 checks the presence or absence of information on the mounting positions PM of the electronic components E in the storage unit 113 (S31).

If the information on the mounting position PM of the electronic component E does not exist (if the electronic component E is not mounted on the printed circuit board P) (no at S31), the same processing as that from S22 and thereafter in the primary correction processing of embodiment 1 is executed.

On the other hand, when the information on the mounting position PM of the electronic component E is present (when the electronic component E is mounted on the printed circuit board P) (yes in S31), the arithmetic processing unit 111 retrieves the mounting position PM of the electronic component E on the printed circuit board P from the storage unit 113 (S32), and determines whether or not there is a overlap between the planned pressing position PP pressed by the nozzle 34 and the mounting position PM (S33).

When the pressed position PP does not overlap the mounting position PM (no in S33), the same processing as that from S22 and thereafter in the primary correction processing of embodiment 1 is executed.

On the other hand, as shown in fig. 15, when the planned pressing position PP overlaps the mounting position PM (yes in S33), the arithmetic processing unit 111 determines whether or not a position adjacent to both the planned pressing position PP and the mounting position PM can be pressed by the nozzle 34 (S34).

When the adjacent position can be pressed by the nozzle 34 (yes in S34), as shown in fig. 15, the arithmetic processing unit 111 determines the adjacent position as the substitute position PN (S34), and executes the same processing as that after S22 in the primary correction processing of embodiment 1 with the substitute position PN as the new predetermined pressing position PP.

When the position adjacent to the planned pressing position PP and the mounting position PM is not pressed by the suction nozzle 34 although the planned pressing position PP and the mounting position PM overlap (no in S34), the arithmetic processing unit 111 cannot correct the printed circuit board P once by the one-time correction processing, cannot hold and fix the printed circuit board P properly by the supporting unit 50, displays information such as an error message on the display device of the operation unit 118 (S35), and ends the error of the one-time correction processing.

As described above, according to the present embodiment, even when the electronic component E is mounted on a part of the printed board P by the surface mounting apparatus 10 or the like described in embodiment 1, and then the electronic component E of a different type is mounted, for example, the electronic component E can be prevented from being pressed by the suction nozzle 34, and damage to the already mounted electronic component E can be avoided.

Further, according to the present embodiment, not only is damage to the electronic component E already mounted avoided, but also the substitute position PN adjacent to the predetermined pressing position PP is determined, and the substitute position PN is pressed by the suction nozzle 34, whereby the printed board P can be appropriately held and fixed by the supporting unit 50.

< other embodiment >

The technology disclosed in the present specification is not limited to the embodiments described above and illustrated in the drawings, and includes various embodiments as follows, for example.

(1) In the above embodiment, the printed board P is used as an example of the board. However, the present invention is not limited to this, and the technique disclosed in the present specification can be applied to a thin metal plate such as a lead frame.

(2) In the above embodiment, when the pressure of the pressure sensor 63 is not higher than the holding reference pressure stored in the storage unit 113, it is determined that the suction error of the printed circuit board P is present in the support plate 51. However, the present invention is not limited to this, and a configuration may be adopted in which the suction error is determined by another detection means such as image processing.

(3) In the above embodiment, the predetermined pressing positions PP are set at the intermittent four corners in the outer peripheral edge portion of the printed board P. However, the present invention is not limited to this, and the center of each side and the center of the printed circuit board may be set to a predetermined pressing position in addition to the four corners of the printed circuit board.

(4) In the above embodiment, the pressing of the predetermined pressing position PP by the nozzle 34 is terminated when the pressure of the pressure sensor 63 is higher than the holding reference pressure and the suction error is eliminated in the primary correction process. However, the present invention is not limited to this, and the nozzle may be configured to press all the predetermined pressing positions in one correction process.

(5) In the above embodiment, when the planned pressing position PP and the mounting position PM overlap each other in the substrate fixation/release process, a position adjacent to the planned pressing position PP and the mounting position PM is determined as the substitute position PN. However, the present invention is not limited to this, and the printed circuit board may not be held and fixed by the support unit and error display may be performed when the predetermined pressing position and the mounting position overlap.

Description of the reference numerals

10: surface mounting machine (an example of a component mounting device)

32: mounting head (an example of a "head for carrying")

34: suction nozzle (an example of a carrying head)

51: supporting board (an example of a "holding board")

110: control unit

111: arithmetic processing unit (an example of the "control unit")

113: storage unit

E: electronic component (an example of a "component")

P: printed circuit board (an example of a "substrate")

P2: outer edge part of substrate

PF: pressing position

PM: carrying position

PN: alternative location

PP: pressing a predetermined location

Claims

1. A component mounting apparatus includes:

a holding plate for sucking and holding a substrate on which a component is mounted; and

a mounting head for mounting the element on the substrate,

the mounting head can press the substrate against the holding plate in a process of sucking and holding the substrate by the holding plate,

the component mounting apparatus further includes a control unit that performs a primary correction process of pressing the mounting head against the substrate when a suction error in which the suction of the substrate is insufficient is detected in the holding plate.

2. The component mounting apparatus according to claim 1,

the mounting head includes a suction nozzle capable of pressing a predetermined position of the substrate.

3. The component mounting apparatus according to claim 1,

the control unit detects a suction error caused by warpage of the substrate by comparing a pressure when the holding plate sucks the substrate with a pressure when the holding plate properly sucks the substrate.

4. The component mounting apparatus according to claim 1 or 3,

the control unit intermittently presses a plurality of portions of the outer edge portion of the substrate by the mounting head in the primary leveling process.

5. The component mounting apparatus according to claim 4,

when the elimination of the suction error is detected in the primary correction processing, the control unit terminates the pressing of the mounting head against the substrate.

6. The component mounting apparatus according to claim 5,

the control section includes a storage section that stores a pressing position at which it is detected that the suction error is eliminated by pressing the substrate by the mounting head,

when releasing the suction holding of the holding plate with respect to the substrate, the control unit performs a substrate fixation releasing process of: pressing the pressing position stored in the storage part by the mounting head, and slowly pulling the mounting head away from the substrate.

7. The component mounting apparatus according to any one of claims 1, 3, 5, and 6,

the control unit includes a storage unit that stores mounting positions of the components mounted on the board,

when a predetermined pressing position where the mounting head is intended to press the substrate overlaps with a mounting position of the component, the mounting head stops pressing the predetermined pressing position overlapping with the mounting position.

8. The component mounting apparatus according to claim 4,

9. The component mounting apparatus according to claim 7,

when the predetermined pressing position and the mounting position overlap, the control unit determines a position adjacent to the predetermined pressing position and the mounting position as an alternative position that can be pressed by the mounting head.

10. The component mounting apparatus according to claim 8,

11. A method for holding a substrate in a component mounting apparatus including a holding plate for sucking and holding a substrate on which a component is mounted and a mounting head for mounting the component on the substrate,

pressing the substrate against the holding plate by the mounting head in a process in which the holding plate sucks and holds the substrate,

when an adsorption error that the substrate is insufficiently adsorbed is detected in the holding plate, a correction process of pressing the mounting head against the substrate is performed.