CN104663016A - Recognition device for substrate processing machine - Google Patents

Recognition device for substrate processing machine Download PDF

Info

Publication number
CN104663016A
CN104663016A CN201280075981.5A CN201280075981A CN104663016A CN 104663016 A CN104663016 A CN 104663016A CN 201280075981 A CN201280075981 A CN 201280075981A CN 104663016 A CN104663016 A CN 104663016A
Authority
CN
China
Prior art keywords
mark
request signal
recognition device
threshold value
rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201280075981.5A
Other languages
Chinese (zh)
Other versions
CN104663016B (en
Inventor
胜见裕司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Publication of CN104663016A publication Critical patent/CN104663016A/en
Application granted granted Critical
Publication of CN104663016B publication Critical patent/CN104663016B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/0895Maintenance systems or processes, e.g. indicating need for maintenance

Abstract

A recognition device for substrate processing machine comprises: a reading device for reading an object; a feature parameter preparation device for preparing a feature parameter from the read object; a first memory for storing a reference parameter associated with the feature parameter; and a signal output device for outputting a maintenance request signal on the basis of the hit rate representing the correlation between the feature parameter and the reference parameter. The signal output device outputs the maintenance request signal when the hit rate reaches a maintenance threshold different from an error threshold in a stage where the hit rate does not reach the error threshold.

Description

The recognition device of substrate operation machine
Technical field
Disclosed in this manual technology relates to the recognition device of substrate operation machine.Recognition device disclosed in this specification, except being directly arranged at except substrate operation machine, also comprises and that the use equipment relevant to substrate operation machine of being arranged at.Substrate operation machine described herein is equipment circuit substrate being carried out to predetermined operation, the board inspecting machine etc. such as comprising the solder printing machine to circuit substrate Printing Paste, electronic component is installed on the fitting machine of circuit substrate (also referred to as surface mounting apparatus or chip mounter), checks the circuit substrate being provided with electronic component.
Background technology
In order to improve homework precision, in the various situations of substrate operation machine in flow chart, identification object being identified, utilizing this recognition result, carry out FEEDBACK CONTROL.Such as, on the fitting machine of the example as substrate operation machine, in order to improve the lift-launch homework precision of electronic component, be provided with the recognition device with mark camera or part camera.Mark camera identifies the mark be located on each composed component and the mark be located on the next circuit substrate of carrying, carries out the confirmation of position.Part camera identifies the electronic component by suction, carries out the identification of electronic component and the confirmation of absorption posture.An example of these technology is disclosed in Japanese Unexamined Patent Publication 2005-116869 publication and Japanese Unexamined Patent Publication 2010-199630 publication.
Summary of the invention
Such as, when causing due to stained, damaged etc. the mark be located on composed component to occur aging, mark cannot be identified by recognition device, can identification error be produced.In addition, when the stream time of substrate operation machine is elongated, cause suction nozzle to be deteriorated to the absorption posture of electronic component due to various factors, None-identified goes out electronic component, produces identification error.In existing substrate operation machine, when producing this identification error, forcibly stop operation, operator safeguards cause portion.So, carry out in the method for the maintenance of cause portion after the identification error that generation recognition device causes, frequently cannot occur according to predetermined situation of carrying out the production schedule.In this manual, object is to provide a kind of recognition device, can avoid the unfavorable condition that this identification error causes.
An execution mode of the recognition device of the substrate operation machine disclosed in this specification possesses: reading device, reading object; Characteristic parameter generating apparatus, according to read object generating feature parameter; First memory, stores the canonical parameter relevant to characteristic parameter; And signal output apparatus, the accuracy rate based on the correlation of representation feature parameter and canonical parameter exports maintenance request signal.Do not reach the stage of error thresholds in accuracy rate, when rate of accuracy reached is to the maintenance threshold value different from error thresholds, signal output apparatus exports maintenance request signal.
The signal output apparatus of above-mentioned recognition device is configured to, before producing the identification error identifying object, export maintenance request signal.Therefore, if such as after maintenance request signal is output, according to during the inoperative of substrate operation machine, identification object is keeped in repair, then can avoid producing the identification error identifying object, substrate operation machine can be avoided by the problem stopped forcibly.
Accompanying drawing explanation
Fig. 1 represents the stereogram of fitting machine.
Fig. 2 schematically shows the structure of loader.
Fig. 3 schematically shows the vertical view of carrier band.
Fig. 4 schematically shows the vertical view near the element absorption position of loader.
Fig. 5 schematically shows the cutaway view of part camera head.
Fig. 6 schematically shows the vertical view of suction nozzle box.
Fig. 7 schematically shows the stereogram of a part for substrate transfer apparatus.
Fig. 8 schematically shows the summary of boarded head and mark camera head.
Fig. 9 A schematically shows the stereogram of an example of boarded head.
Fig. 9 B schematically shows the stereogram of another example of boarded head.
Figure 10 schematically shows the vertical view of the ledge near the front end of suction nozzle.
Figure 11 represents the system configuration of fitting machine.
Figure 12 represents the key diagram employing the image procossing searching line.
Figure 13 represents the key diagram (situation of a part of defect of reference mark) employing the image procossing searching line.
Figure 14 represents an example of the situation of change of the accuracy rate along with time process.
Figure 15 represents another example of the situation of change of the accuracy rate along with time process.
Figure 16 represents the another example of the situation of change of the accuracy rate along with time process.
Figure 17 represents the flow process of reference mark recognizer.
Figure 18 represents the another example of the situation of change of the accuracy rate along with time process.
Figure 19 represents the flow process of the program of the reason that the accuracy rate determined in reference mark recognizer reduces.
Embodiment
Below, technical characteristic disclosed in this specification is arranged.In addition, the item of the following stated separately has serviceability technically.
An execution mode of disclosed in this manual recognition device possesses reading device, characteristic parameter generating apparatus, first memory, signal output apparatus.Reading device reads reading object, typical case, also can be the device read mark and/or electronic component.Mark pattern, bar code, Quick Response Code, magnetic code or the IC tag etc. that comprise the specific trait with image recognition.These marks also can be located in substrate operation machine or be located at relevant to substrate operation machine and in the inscape of equipment that uses.When mark is the pattern of the specific trait with image recognition, reading device preferably uses the camera head of the still image transducers such as camera, scanner, laser scanner or CCD.Characteristic parameter generating apparatus is according to read object generating feature parameter.When read to as if there is the pattern of given shape of image recognition, typical case, also can generate the characteristic parameter relevant to the edge of the pattern with this given shape.First memory stores the canonical parameter relevant to characteristic parameter.Such as, when there is multiple reading object, first memory also can store the canonical parameter relevant to the characteristic parameter of each reading object.Thereby, it is possible to identify specific reading object from multiple reading object.Signal output apparatus exports maintenance request signal based on the accuracy rate (hit rate) of the correlation of representation feature parameter and canonical parameter.At this, accuracy rate can be the index that the higher then accuracy rate of the similar degree of characteristic parameter and canonical parameter is higher, and on the contrary, accuracy rate also can be the index that the higher then accuracy rate of non-similar degree of characteristic parameter and canonical parameter is higher.In either case, accuracy rate is all the index of the correlation of representation feature parameter and canonical parameter.In known image processing techniques, can accuracy rate calculate as the index for judging to identify reading object.Do not reach the stage of error thresholds in accuracy rate, when rate of accuracy reached is to the maintenance threshold value different from error thresholds, signal output apparatus exports maintenance request signal.At this, maintenance request signal also can comprise various information.Such as, maintenance request signal is not limited only to the situation of maintenance of asking reading object, can also comprise the situation of to ask the situation of the maintenance of the inscape relevant with reading object to the maintenance of reading object in the lump, only asking the maintenance of other inscapes being different from reading object.
In recognition device disclosed in this specification, the second memory of the time series data storing accuracy rate can also be possessed.Thus, by utilizing the time series data of accuracy rate, various useful process can be carried out.Such as, can be configured to, by utilizing the time series data of accuracy rate, when the rate of change of accuracy rate is greater than exceptional value, signal output apparatus exports maintenance request signal.The possibility of the sharply change generation abnormal situation of the rate of change of accuracy rate is high.Therefore, above-mentioned signal output apparatus is useful for the early detection of this abnormal situation.In addition, can be configured to, by utilizing the time series data of accuracy rate, in the rate of accuracy reached of an object to when safeguarding threshold value, signal output apparatus exports maintenance request signal with reference to the accuracy rate of other objects.So, by referring to the time series data of other accuracys rate, the analysis of causes of accuracy rate deterioration can be carried out.Above-mentioned signal output apparatus is useful when determining the reason that accuracy rate is deteriorated.
In disclosed in this manual recognition device, reading device also can be camera head.In addition, camera head also can have the determinator that the light source of irradiation object and mensuration are irradiated to the illumination of object.In this case, also can be, rate of accuracy reached to safeguard threshold value and illumination reaches illumination threshold time, signal output apparatus output packet containing light source maintenance request signal at interior maintenance request signal.The reason that accuracy rate is deteriorated is varied, but when reading device is camera head, the sometimes illumination existing problems of light source.In the above-described embodiment, the illumination of the light source determined and illumination threshold are compared, thus the reason that is deteriorated of judging nicety rate whether can be the illumination of light source.
Disclosed in this manual recognition device also can be arranged at the fitting machine be installed to by electronic component on circuit substrate.Fitting machine has the camera head used as reading device.Camera head also can have to be located at form fitting machine composed component on the first mark and be located at second on circuit substrate that electronic component installs and mark the mark camera taken.In this case, that safeguards that threshold value also can comprise that first of the first mark safeguards threshold value and the second mark second safeguards threshold value.When the rate of accuracy reached of the first mark safeguards threshold value to first, signal output apparatus output packet contains the first request signal at interior maintenance request signal.And then when the rate of accuracy reached of the second mark safeguards threshold value to second, signal output apparatus output packet contains the second request signal at interior maintenance request signal.In the above-described embodiment, mark camera to be configured to take the not isolabeling of the first mark being located at composed component and the second mark being located at circuit substrate.In the above-described embodiment, the maintenance request signal that the rate of accuracy reached of the maintenance request signal that the rate of accuracy reached of the first mark exports when safeguarding threshold value to first and the second mark exports when safeguarding threshold value to second is come by difference, therefore, it is possible to difference to export maintenance request signal at which mark.In addition, in the above-described embodiment, the first mark also can be located at multiple composed component.In addition, in this case, the kind of the first mark also can be different according to the kind of multiple composed component.And then, also can be, multiple composed component is divided into many groups, and when the rate of accuracy reached being located at the on a composed component first mark safeguards threshold value to first, signal generating apparatus output packet is containing belonging to the information of other composed components of same group at interior maintenance request signal.Such as, be there is homophylic composed component packetizing in the aging speed of mark, thus the aging of other composed components belonging to same group can be inferred according to the aging of the mark of a composed component.
Disclosed in this manual recognition device also can be arranged at the fitting machine be installed to by electronic component on circuit substrate.Fitting machine has the camera head used as reading device.Camera head also can have the part camera taken electronic component.In this case, also can be that part camera also can be taken the first mark on the composed component in the shooting visual field be located at when being present in shooting electronic component.Safeguard that the third dimension that threshold value also can comprise electronic component is protected first of threshold value and the first mark and safeguarded threshold value.Also can be that, when the rate of accuracy reached of electronic component protects threshold value to the third dimension, signal output apparatus output packet contains the 3rd request signal at interior maintenance request signal.And then when the rate of accuracy reached of the first mark safeguards threshold value to first, signal output apparatus output packet contains the first request signal at interior maintenance request signal.In the above-described embodiment, part camera is configured to take the first mark and electronic component being located at composed component.In the above-described embodiment, the maintenance request signal that the rate of accuracy reached of the maintenance request signal that the rate of accuracy reached of the first mark exports when safeguarding threshold value to first and electronic component exports to the third dimension protects threshold value time is come by difference, and can distinguish is which output maintenance request signal to the first mark and electronic component.In addition, in the above-described embodiment, also possess correction request signal output apparatus, above-mentioned correction request signal output apparatus exports the correction request signal of the canonical parameter of electronic component based on the accuracy rate of electronic component.The canonical parameter of electronic component pre-determines according to the kind of electronic component.But, such as, when wanting to utilize identical canonical parameter identification to manufacture batch different electronic component, the situation that the accuracy rate that there is electronic component is different according to manufacture batch.In this case, by calibration standard parameter, the accuracy of identification of electronic component can be suppressed to be deteriorated.
According to disclosed in this manual technology, can build a kind of management system with the 3rd memory, above-mentioned 3rd memory stores the time series data obtained in above-mentioned recognition device.Such as, the 3rd memory also can store the time series data of the accuracy rate collected from the recognition device at least two that are arranged in substrate operation machine, suction nozzle washer, suction nozzle inspection machine and loader maintenance unit.When utilizing this management system, can gather the specific time series data identifying the accuracy rate of object from multiple equipment, therefore the time series data of accuracy rate can not interrupt and continuously, can carry out more effective management.
Above-mentioned management system also can possess prediction unit, and above-mentioned prediction unit carrys out predictablity rate based on the time series data of the accuracy rate being stored in the 3rd memory and reaches the above-mentioned time of safeguarding at least one party in threshold value and error thresholds.In this management system, the tendency of the variation speed of accuracy rate can be grasped, information useful when generating the production schedule can be provided.Such as, above-mentioned management system also can possess the 4th memory, and above-mentioned 4th memory stores the production schedule data during the duration of work and inoperative describing substrate operation machine.In this case, still can possess plan making device, above-mentioned plan making device generates Maintenance Planning Data based on the predicted time doped by prediction unit and the production schedule data being stored in the 4th memory.Plan making device also can be configured to when predicted time is contained in duration of work plan making device by during the inoperative before the enforcement period planning safeguarded to this duration of work.
Embodiment
Referring to accompanying drawing, the fitting machine used when forming integrated circuit on circuit substrate is described.Integrated circuit on circuit substrate is handled upside down according to the order of solder printing machine, fitting machine and reflow ovens and is formed.Printing Paste on the loading position of the electronic component of solder printing machine on circuit substrate.The loading position of fitting machine on the circuit substrate being printed with soldering paste carries electronic component.Reflow ovens is passed through circuit substrate enforcement heat treatment by welding electronic elements on circuit substrate.
As shown in Figure 1, fitting machine 1 possesses multiple modules 2 of adjacent configuration on workbench 3.Modules 2 possesses common structure, in the framework 4 played a role as framework, possess multiple device.Fig. 1 represents the example that two modules 2 are adjacent, represents with the state of the exterior plate through a module 2 in two modules 2.Module 2 possesses: component supplying apparatus 10, the part camera head 20 with part camera, suction nozzle box 30, substrate transfer apparatus 40, component moving and loading device 50, boarded head 60 and have mark camera mark camera head 70.In addition, modules 2 possesses on the surface of exterior plate and is configured to carry out with control device described later the input/output unit 6 that communicates.Input/output unit 6 is configured to accept the input from operator, and can the state information of display module 2 and the various instruction to operator described later.
(formation of component supplying apparatus 10)
As shown in Figure 1, component supplying apparatus 10 is the devices multiple electronic component being equipped on circuit substrate 5 being supplied to element absorption position, is arranged side by side by the loader 11 of multiple boxlike and forms.The loader main body 12 of loader 11 is configured to load and unload relative to framework 4.As shown in Figure 2, loader 11 possesses: be wound with the tep reel 13 of carrier band 14, the band guiding piece 15 that the carrier band 14 pulled out from tep reel 13 is guided to element absorption position, by carrier band 14 to the sprocket 16 of element absorption position spacing feeding and the motor (omit diagram) that drives sprocket 16 to rotate.And then, the front end face of loader 11 is provided with: the alignment pin 18,19 of the communications connector 17 be connected with the connector (omit and illustrate) of the main body being located at fitting machine 1 and the installation site that determines the main body relative to fitting machine 1.
As shown in Figure 3, on carrier band 14, be formed with the cavity 14a of housing electronic components P with certain intervals.The upper opening of cavity 14a is covered by cover tape 14b, carries out band envelope by carrier band 14 and cover tape 14b to electronic component P.Cover tape 14b peels off from carrier band 14 at the nearby place of element absorption position.In the guide hole 14c being formed at carrier band 14, engaging has sprocket 16.Thus, carrier band 14 is sent every preset space length, and the electronic component P be accommodated in cavity 14a is supplied to element absorption position successively.As shown in Figure 4, on the top of loader main body 12, the position corresponding with element absorption position is formed with peristome 12a.Be fed into the electronic component P of element absorption position by the suction being inserted in peristome 12a, and be removed from cavity 14a.At the upper surface of loader main body 12, near element absorption position, be provided with reference mark M1.Reference mark M1 is taken by mark camera described later.Fitting machine 1 utilizes the view data of the reference mark M1 photographed by mark camera to carry out criterion of identification and marks M1, and obtains its positional information.Fitting machine 1 utilizes the positional information of reference mark M1, calculates the position deviation of the ideal position apart from element absorption position, based on this position deviation, suction nozzle is moved, stick electronic components P.
(structure of part camera head 20)
As shown in Figure 1, part camera head 20 is fixed on framework 4, is configured between component supplying apparatus 10 and substrate transfer apparatus 40.As shown in Figure 5, part camera head 20 has: part camera 21, brace table 22, connecting member 23, upper part 24, side penetrate light source 25 and cloche 26.Part camera 21 is fixed on framework 4 via brace table 22.Part camera 21 such as uses CCD camera.Brace table 22 and upper part 24 are fixed via connecting member 23.Upper part 24 has upper surface and bottom surface opening and the form of lateral curvature.Be provided with multiple side at the internal face of upper part 24 and penetrate light source 25, the upper opening of upper part 24 is covered by cloche 26.Side is penetrated light source 25 and is such as used LED.
After electronic component P is adsorbed on the element absorption position of loader 11, before being equipped on the circuit substrate 5 being positioned at substrate transfer apparatus 40, being configured in the top of part camera head 20, being taken by part camera 21.Fitting machine 1 utilizes the view data of the electronic component P photographed by part camera head 20, identifies electronic component P and confirms the absorption posture of electronic component P.Determine whether required electronic component P by the view data of electronic component P being compared with the part data obtained in advance, thus carry out the identification of electronic component P.Utilize the view data of electronic component P, detected electrons element P apart from angular deviation around the central shaft of suction nozzle of the position deviation of central shaft of suction nozzle and electronic component P, thus carries out the confirmation of the absorption posture of electronic component P.Before electronic component P is equipped on circuit substrate 5, by making suction nozzle from the absorption posture transferring correcting electronic element P.
In addition, part camera head 20 also can as required, be taken the reference mark (such as コ ー ナ ー De ッ グ (corner dock): footmark) on the composed component (such as boarded head 60) in the shooting visual field be located at when being present in shooting electronic component P simultaneously.Fitting machine 1 also can utilize the positional information of this reference mark to estimate the position of the central shaft of the suction nozzle of stick electronic components P, and detected electrons element P is apart from the position deviation of the central shaft of suction nozzle.In addition, part camera head 20 also can be taken specific reference mark before shooting electronic component P.The position of central shaft of suction nozzle when fitting machine 1 also can utilize the positional information of this reference mark to carry out correcting captured electronic component P.
In addition, part camera head 20 possesses the illumination photometry device (omitting diagram) measured the illumination being irradiated to shooting object.Illumination photometry device is such as configured to measure because the output reduction of light source 25, the stained of cloche 26 and the illumination that reduces are penetrated in side.
(formation of suction nozzle box 30)
As shown in Figure 1, suction nozzle box 30 is arranged near part camera head 20, is accommodated with multiple suction nozzle (aftermentioned).As shown in Figure 6, suction nozzle box 30 possesses the multiple suction nozzle reception holes 31 for receiving suction nozzle.Such as, be accommodated with in suction nozzle box 30 with use in the qualified product suction nozzle of suction nozzle identical type, when suction nozzle in use becomes defective item, the qualified product suction nozzle and defective item suction nozzle that are accommodated in suction nozzle box 30 are exchanged.Or, in suction nozzle box 30, be accommodated with multiple suction nozzle, corresponding to the kind of the electronic component be mounted on circuit substrate 5 to select predetermined suction nozzle.
As shown in Figure 6, the upper surface of suction nozzle box 30 is provided with reference mark M2 and Quick Response Code C1.The information that the kind of the suction nozzle received to some extent and suction nozzle reception hole 31 establish corresponding relation is stored in Quick Response Code C2.Reference mark M2 and Quick Response Code C1 is taken by mark camera described later.Fitting machine 1 utilizes the view data of the reference mark M2 photographed by mark camera to carry out criterion of identification and marks M2, and obtains its positional information.Fitting machine 1 utilizes the positional information of reference mark M2, calculates the position deviation of ideal position of the suction nozzle reception hole 31 apart from suction nozzle box 30, takes out suction nozzle and receive to suction nozzle based on this position deviation from suction nozzle reception hole 31.Fitting machine 1 utilizes the information recorded in the Quick Response Code C2 photographed by mark camera, from the multiple suction nozzles being accommodated in suction nozzle box 30, select required suction nozzle.
(structure of substrate transfer apparatus 40)
As shown in Figure 1, substrate transfer apparatus 40 is fixed on framework 4, carries circuit substrate 5, and position circuit substrate 5 in predetermined operation position along carrying direction (X-direction).Substrate transfer apparatus 40 is the Dual-conveying tall types the first Handling device 41 and the second Handling device 41 being set up in parallel two row.First Handling device 41 has a pair carrying guide rail 41a, 41b configuring in opposite directions abreast.Second Handling device 42 has a pair carrying guide rail 42a, 42b configuring in opposite directions abreast similarly.
As shown in Figure 7, a pair carrying guide rail 41a, 41b of the first Handling device 41 are formed with its upper end pressing plate portion 43a, the 43b outstanding towards inner side respectively.In addition, the respective internal face of carrying guide rail 41a, 41b is provided with conveyer belt 44a, 44b.Circuit substrate 5 is carried along carrying direction on a pair conveyer belt 44a, 44b, and predetermined operation position stops.In addition, the first Handling device 41 is provided with clamping device (omitting diagram).Clamping device has: supporting bracket, is configured to be elevated by lowering or hoisting gear; And supporting pin, be arranged at the precalculated position in this supporting bracket in the mode that can change.Clamping device makes circuit substrate 5 rise by making supporting bracket rise via supporting pin.Circuit substrate 5 is clamped between the back side of supporting pin and pressing plate portion 43a, 44b, and predetermined operation position is located.
The distance D1 in opposite directions of a pair carrying guide rail 41a, 41b of the first Handling device 41 is configured to change according to the width of carried circuit substrate 5.In this example embodiment, the carrying guide rail 41a in diagram left side is fixed guide, and the carrying guide rail 41b on diagram right side is movable guiding rail.Movable guiding rail 41b is connected with drive unit (omit and illustrate), and the distance D1 be in opposite directions configured between movable guiding rail 41b and fixed guide 41a can change.Reference mark M3 is provided with at the upper surface of movable guiding rail 41b.Reference mark M3 is taken by mark camera described later.Fitting machine 1 utilizes the view data of the reference mark M3 photographed by mark camera to carry out criterion of identification and marks M3, and obtains its positional information.Fitting machine 1 utilizes the positional information of reference mark M3, detects the position of movable guiding rail 41b relative to fixed guide 41a.In addition, the structure of above-mentioned first Handling device 41 is also same in the second Handling device 42.
As shown in Figure 7, each diagonal position on the surface of circuit substrate 5 is provided with reference mark M4.This reference mark M4 is taken by mark camera described later.Fitting machine 1 utilizes the view data of the reference mark M4 photographed by mark camera to carry out criterion of identification and marks M4, and obtains its positional information.Fitting machine 1 utilizes the positional information of reference mark M4, and the loading position of the electronic component P1 on the surface of counting circuit substrate 5, apart from the position deviation of ideal position, makes suction nozzle move based on this position deviation, carries electronic component P.
(formation of component moving and loading device 50, boarded head 60, mark camera head 70)
As shown in Figure 1, component moving and loading device 50 is fixed on framework 4, is that XY machinery is human-like.Component moving and loading device 50 possesses Y-axis slide mechanism and X-axis slide mechanism.Y-axis moving mechanism is configured to utilize Y-axis servo motor 51 that Y-axis sliding part 52 is moved along Y direction.
Fig. 8 represents the outline of X-axis slide mechanism, boarded head 60 and mark camera head 70.X-axis slide mechanism is configured to be arranged at Y-axis sliding part 52, can utilize X-axis servo motor (omitting diagram) that X-axis sliding part 53 is moved along X-direction.Boarded head 60 and mark camera head 70 are fixed on X-axis sliding part 53, utilize Y-axis slide mechanism and X-axis slide mechanism, can move in XY plane above component supplying apparatus 10, part camera head 20, suction nozzle box 30 and substrate transfer apparatus 40.Mark camera head 70 has mark camera 71 and light source (omitting diagram).Mark camera 71 such as uses CCD camera.Light source such as uses LED.In addition, mark camera head 70 and possess the illumination photometry device (omitting diagram) that the illumination being irradiated to shooting object is measured.Illumination photometry device is such as configured to measure due to the output reduction of light source, the cover of light source stained and the illumination that reduces.
Boarded head 60 is configured to load and unload relative to X-axis sliding part 53.In fitting machine 1, select required boarded head 60 from multiple boarded head 60 and use.In Fig. 9 A and Fig. 9 B, example has two kinds of boarded heads 60a, 60b.
Boarded head 60a shown in Fig. 9 A is many types, has multiple suction nozzle seat 61.Each suction nozzle seat 61 maintains identical type or different types of suction nozzle 62 respectively.Multiple suction nozzle seat 61 configures at certain intervals around central shaft, is configured to rotate by calibration.And then each suction nozzle seat 61 is configured to can rotation, and can be elevated on an indexing position.Thus, being configured to the suction nozzle 62 that kept by suction nozzle seat 61 also can rotation, and can be elevated on an indexing position.Many type boarded head 60a are such as keeping the suction nozzle 62 corresponding with small-sized electronic component.Suction nozzle 62 is provided with ledge 62a outstanding diametrically, the upper surface of this ledge 62a is provided with Quick Response Code C2 (with reference to Figure 10).The kind of suction nozzle 62 is recorded in Quick Response Code C2.When selecting required suction nozzle 62 from the multiple suction nozzles 62 being accommodated in suction nozzle box 30, by mark camera, Quick Response Code C2 is made a video recording.Fitting machine 1 utilizes the information of Quick Response Code C2, carries out the solid identification of suction nozzle 62.
Boarded head 60b shown in Fig. 9 B is single seat type, has a suction nozzle seat 63.Suction nozzle seat 63 is configured to can rotation, and the suction nozzle 64 kept by suction nozzle seat 63 thus also can rotation.Suction nozzle 64 is also provided with ledge 64a outstanding diametrically, the upper surface of this ledge 64a is provided with Quick Response Code (omitting diagram).The kind of suction nozzle 64 is recorded in Quick Response Code.When selecting required suction nozzle 64 from the multiple suction nozzles 64 being accommodated in suction nozzle box 30, by mark camera, this Quick Response Code is made a video recording.Fitting machine 1 utilizes the information of Quick Response Code, carries out the solid identification of suction nozzle 64.
(formation of image processing part)
Below, to identify that the situation of said reference mark M1-M4 is described image processing part.At this, M1-M4 is different according to the kind of the composed component arranged for said reference mark.In addition, when confirming the absorption posture of Quick Response Code C1-C2, electronic component P, also can be suitable for and following identical technology.
As shown in figure 11, the modules 2 (with reference to Fig. 1) of fitting machine 1 possesses image processing part 100.In addition, image processing part 100 can be arranged at the main frame to the management system that multiple module 2 manages in the lump, or also can be arranged at the main frame of the management system comprising other substrate operation machine, suction nozzle washer, suction nozzle inspection machine and loader maintenance unit.
Image processing part 100 possesses the memory 120 of control device 110 and memory image process data.In addition, comprise image processing part 100, part camera head 20 and mark camera head 70 and be called recognition device.Control device 110 has: characteristic parameter generating apparatus 111, accuracy rate calculation element 112, judgment means 113 and signal output apparatus 114.Characteristic parameter generating apparatus 111 generates characteristic parameter according to the reference mark M1-M4 photographed by mark camera head 70.Various according to the pattern of reference mark M1-M4 at this characteristic parameter generated, known image recognition technology can be utilized to generate.Such as, characteristic parameter comprises by the edge of the pattern of the image data extraction of reference mark M1-M4.
At this, in the first memory 121 of memory 120, store the canonical parameter of each mark for reference mark M1-M4, reference mark M1-M4 and canonical parameter are set up corresponding relation.Accuracy rate calculation element 112 calculates the characteristic parameter of reference mark M1-M4 captured by representing and the accuracy rate of the correlation of corresponding canonical parameter.The similar degree of accuracy rate representation feature parameter and canonical parameter, similar degree is higher, then the value of accuracy rate is higher.In addition, the accuracy rate calculated by accuracy rate calculation element 112 is stored in second memory 122.In second memory 122, just this accuracy rate is stored whenever calculated the accuracy rate of reference mark M1-M4 by accuracy rate calculation element 112, thus store the time series data of the accuracy rate of each reference mark M1-M4.
At this, illustrate the example employing the image procossing searching line.The image procossing searching line is utilized to be the edge extracting utilizing the brightness data comprised in view data to carry out shooting object.Search in the image procossing of line in utilization, only utilize the brightness data searched on line to carry out edge extracting, therefore high speed processing is excellent.In addition, utilize the image procossing searching line that applicant can be used to have applied for also disclosed Japanese Unexamined Patent Publication 8-180191 publication, Japanese Unexamined Patent Publication 2004-279304 publication and the technology disclosed in Japanese Unexamined Patent Publication 2006-114821 publication.
As shown in figure 12, when reference mark M1-M4 is circular pattern, preset near the position that reference mark M1-M4 should exist and multiplely search line SL, calculate brightness datum mark jumpy according to the brightness data of each multiple datum marks searched on line SL interval, carry out the edge extracting of reference mark M1-M4.In this example embodiment, illustrate 8 and search line SL, but be not limited to this example.Multiple line SL that searches can correspond to the kind of reference mark M1-M4 and prepare as template in advance, in other words as canonical parameter.
Accuracy rate is subject to the aging impact caused such as stained, damaged by reference mark M1-M4.Such as, as shown in figure 13, when the part shortcoming of reference mark M1-M4, edge extracting cannot be carried out in search on line SL corresponding with this shortcoming position (being represented by hacures).In the example of Figure 13, search on line SL cannot carry out edge extracting at one, therefore accuracy rate calculates as 7/8=87.5%.So, when the aging aggravation caused by reference mark M1-M4 stained, damaged etc., the edge (also referred to as characteristic parameter) of reference mark M1-M4 and the similar degree searching line SL (also referred to as canonical parameter) reduce, and accuracy rate reduces.
As shown in figure 14, usually, the aging of reference mark M1-M4 aggravates along with the process of time, and accuracy rate also reduces.As shown in Figure 15 and Figure 16, the reduction of accuracy rate is not limited to the linearity along with the process of time and reduces, and also there is situation about reducing with curve mode.In addition, elapsed time is herein the total time of fitting machine 1 when working, comprises total time when fitting machine 1 works and when not working or there is causal total time for the aging of other reference mark M1-M4.
As shown in Figure 14 ~ Figure 16, when accuracy rate is lower than error thresholds (identification critical value), judgment means 113 is judged as identifying reference mark M1-M4.When accuracy rate due to the aging of reference mark M1-M4 lower than error thresholds time, control device 110 forcibly stops the operation of fitting machine 1.
Judgment means 113 is based on the accuracy rate calculated, and whether the maintenance of judgment standard mark M1-M4 is necessary.As shown in Figure 14 ~ Figure 16, whether judgment means 113 judging nicety rate is lower than safeguarding threshold value.Safeguard that threshold value is set to the value larger than the error thresholds of the accuracy rate that can not identify reference mark M1-M4.That is, even if identifying in the scope of reference mark M1-M4, when the aging aggravation of reference mark M1-M4, judgment means 113 is also judged as the maintenance needing to carry out reference mark M1-M4.When judgment means 113 is judged as the maintenance needing to carry out reference mark M1-M4, control device 110 makes maintenance request signal export from signal output apparatus 114, in input/output unit 6 (with reference to Fig. 1), inform the maintenance needing to carry out reference mark M1-M4.In addition, in input/output unit 6, the content of display can determine which reference mark M1-M4 needs to correct.In addition, as mentioned below, when the reason that the accuracy rate of reference mark M1-M4 reduces be not the aging of reference mark M1-M4 but other inscapes aging, control device 110 informs that in input/output unit 6 this inscape needs to be serviced.
Then, the flow chart of the recognizer of reference mark M1-M4 is described with reference to Figure 17.Hereinafter, be described for the reference mark M3 (with reference to Fig. 7) being documented in the upper surface of the movable guiding rail 41b of substrate transfer apparatus 40.
In step sl, mark the reference mark M3 of camera 71 to the upper surface being documented in movable guiding rail 41b to take.The view data of the reference mark M3 photographed is sent to control device 110, carries out the pre-treatments such as removal noise as required.
In step s 2, characteristic parameter generating apparatus 111 extracts the edge of the view data of the reference mark M3 read, generating feature parameter.
In step s3, characteristic parameter and canonical parameter thereof are mated, calculate accuracy rate.At this, above-mentionedly search in the image procossing of line utilizing, step S2 and step S3 carries out simultaneously.That is, control device 110 reads and corresponding with the reference mark M3 being stored in first memory 121 multiplely searches line (canonical parameter), extracts the edge (characteristic parameter) of reference mark M3, and calculating accuracy rate.
In step s 4 which, in judgment means 113, judge that whether the accuracy rate calculated is higher than error thresholds (with reference to Fig. 4 ~ Figure 16).If accuracy rate is higher than error thresholds, is then judged as the identification success marked, proceeds to step S5.Accuracy rate now shows in input/output unit 6, and is stored in second memory 122.When accuracy rate is not higher than error thresholds, be judged as that the aging of reference mark M3 has reached the scope of None-identified or there is other reasons.Fitting machine 1 stops by control device 110 forcibly.
In step s 5, in judgment means 113, judge that whether the accuracy rate of the mark M3 identified is lower than safeguarding threshold value (with reference to Figure 14 ~ Figure 16).If accuracy rate is lower than safeguarding threshold value, is then judged as that the aging of reference mark M3 does not reach the scope or other reasons that need to safeguard, proceeds to step S6.When accuracy rate be not less than safeguard threshold value, proceed to step S7.
In step s 6, in judgment means 113, read the time series data being stored in the accuracy rate of second memory 122, the time series data according to accuracy rate calculates rate of change, judges that whether this variable quantity is higher than exceptional value.At this, the value that rate of change reduces in the given time as accuracy rate calculates.Such as, as shown in figure 18, when the current time be t2, accuracy rate be h2, read the accuracy rate h1 of time t1 in the past, judge whether the reducing amount (difference of h1 and h2) of (between t1 and t2) accuracy rate in the given time exceedes exceptional value.When the rate of change of accuracy rate exceedes exceptional value, infer the phenomenon to create to differ from normal condition.Therefore, judgment means 113 proceeds to step S7, analyzes its reason.When the variable quantity of accuracy rate does not exceed exceptional value, terminate the recognizer of reference mark M3, the operation of fitting machine 1 continues.
In the step s 7, in judgment means 113, analyze the reason that accuracy rate reduces, determine the reason that accuracy rate reduces.When determining the reason that accuracy rate reduces, signal output apparatus 114 exports maintenance request signal, needs the mode of the maintenance carrying out this reason to inform in input/output unit 6 being determined as.
At this, with reference to Figure 19, an example of the program of the reduction reason for analyzing accuracy rate is in the step s 7 described.In this embodiment, the reason that whether there is the illumination of light source is discussed.
In step s 11, the illumination of light source is measured.In step s 12, judge that whether the illumination of light source is lower than illumination threshold.If the illumination of light source is lower than illumination threshold, be then judged as that reason that accuracy rate reduces is the reduction of the illumination of light source.Control device 110 makes light source maintenance request signal export from signal output apparatus 114, and informing in input/output unit 6 (with reference to Fig. 1) needs the illumination to light source to safeguard.If the illumination of light source is not less than illumination threshold, is then judged as the reason that there is reference mark M3, proceeds to step S13.
In step s 13, in judgment means 113, judge whether to exist and be judged as needing the movable guiding rail 41b of the maintenance carrying out reference mark M3 to belong to other composed components of same group.At this, multiple composed component is divided into multiple groups according to the aging speed of reference mark M1-M4.Such as, frequency of utilization also can be made to be that the element of same degree belongs to same group.In fitting machine 1, substrate transfer apparatus 40 is the Dual-conveying tall types the first Handling device 41 and the second Handling device 41 being set up in parallel two row.Therefore, the first Handling device 41 and the second Handling device 42 belong to same group, and when the reference mark M3 of the Handling device of a side needs to be serviced, the reference mark of the Handling device of the opposing party also needs to be serviced.So, in the example of the reference mark M3 of the movable guiding rail 41b of the first Handling device 41, in step S14, extract the information belonging to the movable guiding rail of second Handling device 42 of same group, and the reference mark showing the Handling device of two sides in input/output unit 6 all needs to be serviced this situation.In addition, belong to when being judged as needing the inscape of the correction carrying out reference mark to belong to other composed components of same group when not existing, in input/output unit 6, only display is judged as the information of the inscape needing the correction carrying out reference mark.
According to the recognizer of above-mentioned mark, before reference mark M1-M4 stops with reaching error thresholds and being forced property of fitting machine 1, in input/output unit 6, inform the maintenance instruction of aging reference mark M1-M4.Therefore, time during the inoperative of fitting machine 1, can safeguard that the reference mark M1-M4 of instruction safeguards to being shown.So, before can not identifying reference mark M1-M4, reference mark M1-M4 is safeguarded, thus fitting machine 1 can be avoided to be forcibly stopped, can produce swimmingly according to the production schedule.
In addition, control device 110 also can calculate accuracy rate lower than the predicted time safeguarding threshold value and/or error thresholds based on the time series data of accuracy rate, shows this predicted time in input/output unit 6.This predicted time is useful for the rational production schedule of formulation.And then, this predicted time and the production schedule data described during the duration of work of fitting machine 1 and inoperative also can compare by control device 110, when predicted time is contained in duration of work, during the inoperative before the enforcement period planning of maintenance to this duration of work, show in input/output unit 6.Useful for formulating the more reasonably production schedule.
In addition, as shown in Figure 15 and Figure 16, when accuracy rate reduces in the mode describing curve, judgment means 113 also can according to the rate of change of accuracy rate indirectly judging nicety rate whether lower than safeguarding threshold value.
Below understand the concrete example of this technology in detail, these are only examples, do not limit claims.Technology described in claims comprises the technology of the concrete example of above example being carried out various distortion, change.The technology essential factor that this specification or accompanying drawing illustrate individually or by various combination performance technology serviceability, is not limited to the combination described in claims during application.In addition, this specification or the technology exemplified by accompanying drawing can reach multiple object simultaneously, reach one of them object itself and also to possess skills serviceability.
Description of reference numerals
10: component supplying apparatus
20: part camera head
30: suction nozzle box
40: substrate transfer apparatus
50: component moving and loading device
70: mark camera head
100: image processing part
110: control device
111: characteristic parameter generating apparatus
112: accuracy rate calculation element
113: judgment means
114: signal output apparatus
120: memory
121: first memory
122: second memory

Claims (15)

1. a recognition device is the recognition device of substrate operation machine,
Described recognition device possesses:
Reading device, reading object;
Characteristic parameter generating apparatus, according to read described object generating feature parameter;
First memory, stores the canonical parameter relevant to described characteristic parameter; And
Signal output apparatus, the accuracy rate based on the correlation representing described characteristic parameter and described canonical parameter exports maintenance request signal,
Do not reach the stage of error thresholds in described accuracy rate, when described rate of accuracy reached is to the maintenance threshold value different from described error thresholds, described signal output apparatus exports described maintenance request signal.
2. recognition device according to claim 1, wherein,
Described recognition device also possesses second memory, and described second memory stores the time series data of described accuracy rate.
3. recognition device according to claim 2, wherein,
When the rate of change of described accuracy rate is greater than exceptional value, described signal output apparatus also exports described maintenance request signal.
4. the recognition device according to Claims 2 or 3, wherein,
A described object described rate of accuracy reached to described safeguard threshold value time, described signal output apparatus exports described maintenance request signal with reference to the accuracy rate of object described in other.
5. the recognition device according to any one of Claims 1 to 4, wherein,
Described reading device is camera head.
6. recognition device according to claim 5, wherein,
Described camera head has: the light source irradiating described object; And measure the determinator being irradiated to the illumination of described object,
Described rate of accuracy reached to described safeguard threshold value and described illumination reaches illumination threshold time, described signal output apparatus output packet containing light source maintenance request signal at interior described maintenance request signal.
7. the recognition device according to claim 5 or 6, wherein,
Described substrate operation machine is the fitting machine be installed to by electronic component on circuit substrate,
Described camera head has mark camera, described mark camera to be located at form described fitting machine composed component on the first mark and the second mark be located on circuit substrate that electronic component installs take,
Described safeguard that threshold value comprises that first of described first mark safeguards threshold value and described second mark second safeguard threshold value,
When the described rate of accuracy reached of described first mark safeguards threshold value to described first, described signal output apparatus output packet contains the first request signal at interior described maintenance request signal,
When the described rate of accuracy reached of described second mark safeguards threshold value to described second, described signal output apparatus output packet contains the second request signal at interior described maintenance request signal.
8. recognition device according to claim 7, wherein,
Described first mark is located on multiple composed component,
Described multiple composed component is divided into many groups,
When the described rate of accuracy reached being located at described first mark on a described composed component safeguards threshold value to described first, described signal output apparatus output packet is containing belonging to the information of composed component described in other of same group at interior described maintenance request signal.
9. the recognition device according to claim 5 or 6, wherein,
Described substrate operation machine is the fitting machine be installed to by electronic component on circuit substrate,
Described camera head has the part camera taken described electronic component.
10. recognition device according to claim 9, wherein,
Described part camera is also taken the first mark on the described composed component in the shooting visual field be located at when being present in the described electronic component of shooting,
What the described third dimension safeguarding that threshold value comprises described electronic component protected threshold value and described first mark first safeguards threshold value,
When the described rate of accuracy reached of described electronic component protects threshold value to the described third dimension, described signal output apparatus output packet contains the 3rd request signal at interior described maintenance request signal,
When the described rate of accuracy reached of described first mark safeguards threshold value to described first, described signal output apparatus output packet contains the first request signal at interior described maintenance request signal.
11. recognition devices according to claim 9 or 10, wherein,
Described recognition device also possesses correction request signal output apparatus, and described correction request signal output apparatus exports the correction request signal of the described canonical parameter of described electronic component based on the described accuracy rate of described electronic component.
12. 1 kinds of management systems, possess:
At least one recognition device according to claim 1; And
3rd memory, stores the time series data of the accuracy rate obtained at least one recognition device described.
13. management systems according to claim 12, wherein,
The time series data of described 3rd memory to the accuracy rate collected from the described recognition device at least two that are arranged in substrate operation machine, suction nozzle washer, suction nozzle inspection machine and loader maintenance unit stores.
14. management systems according to claim 12 or 13, wherein,
Described management system possesses prediction unit, based on the time series data of the described accuracy rate being stored in described 3rd memory, described prediction unit predicts that described rate of accuracy reached is to the described time of safeguarding at least one party in threshold value and described error thresholds.
15. management systems according to claim 14, wherein,
Described management system also possesses:
4th memory, stores the production schedule data during the duration of work and inoperative describing described substrate operation machine, and
Plan making device, based on the predicted time doped by described prediction unit and the production schedule data being stored in the 4th memory, generates Maintenance Planning Data,
When described predicted time is contained in described duration of work, described plan making device is by during the inoperative before the enforcement period planning of maintenance to this duration of work.
CN201280075981.5A 2012-09-27 2012-09-27 The identification device of substrate operation machine Active CN104663016B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/074846 WO2014049766A1 (en) 2012-09-27 2012-09-27 Recognition device for substrate processing machine

Publications (2)

Publication Number Publication Date
CN104663016A true CN104663016A (en) 2015-05-27
CN104663016B CN104663016B (en) 2017-12-26

Family

ID=50387231

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280075981.5A Active CN104663016B (en) 2012-09-27 2012-09-27 The identification device of substrate operation machine

Country Status (3)

Country Link
JP (1) JP5767754B2 (en)
CN (1) CN104663016B (en)
WO (1) WO2014049766A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106561079A (en) * 2015-10-05 2017-04-12 松下知识产权经营株式会社 Maintenance Support System And Maintenance Support Method In Electronic Component Mounting System
CN107108044A (en) * 2016-05-27 2017-08-29 深圳市大疆创新科技有限公司 Optical shield and the filming apparatus and unmanned plane using the optical shield
CN109152327A (en) * 2017-06-16 2019-01-04 松下知识产权经营株式会社 Equipment element maintaining management system and equipment element maintaining management method
CN109270897A (en) * 2017-07-18 2019-01-25 松下知识产权经营株式会社 Equipment component maintenance analysis system and equipment component maintenance analysis method
CN110192444A (en) * 2017-03-07 2019-08-30 雅马哈发动机株式会社 The keeping method of element fixing apparatus and substrate
CN110214476A (en) * 2017-01-31 2019-09-06 株式会社富士 Coordinate data generating means and coordinate data generation method
CN110463375A (en) * 2017-03-30 2019-11-15 株式会社富士 Maintenance management device
CN112720384A (en) * 2020-12-21 2021-04-30 苏州科韵激光科技有限公司 Display panel alignment apparatus and display panel alignment method

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107004213B (en) * 2014-11-25 2020-11-27 株式会社富士 Order processing device, identification information board and order processing method
JP2017005068A (en) * 2015-06-09 2017-01-05 富士機械製造株式会社 Component mounting machine
EP3324719B1 (en) * 2015-07-13 2020-02-12 FUJI Corporation Rotary head-type component installing machine
JPWO2017149597A1 (en) * 2016-02-29 2018-03-08 三菱電機株式会社 Equipment classification device
JP6843481B2 (en) * 2016-05-23 2021-03-17 株式会社Fuji Order processing device, identification information plate and order processing method
JP7179211B2 (en) * 2017-01-10 2022-11-28 株式会社Fuji Implementation system and error handling method
CN107658835B (en) * 2017-09-26 2023-10-27 深圳供电局有限公司 Protective pressing plate and misoperation prevention method and system thereof
CN111788882B (en) 2018-02-27 2021-11-09 松下知识产权经营株式会社 Management device, management method, and component mounting system
JP7303150B2 (en) 2020-04-14 2023-07-04 ヤマハ発動機株式会社 Maintenance notification device and maintenance notification method for component mounting machine
WO2023042368A1 (en) * 2021-09-17 2023-03-23 ヤマハ発動機株式会社 Component mounting system
WO2023074079A1 (en) * 2021-10-29 2023-05-04 パナソニックIpマネジメント株式会社 Diagnostic system and diagnostic method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07142898A (en) * 1993-11-17 1995-06-02 Sanyo Electric Co Ltd Recognizer and component mounting apparatus with recognition function
CN1582107A (en) * 2003-08-12 2005-02-16 重机公司 Device-mounting apparatus
CN1942059A (en) * 2005-09-28 2007-04-04 雅马哈发动机株式会社 Mark recognition method and printing apparatus
JP2009117579A (en) * 2007-11-06 2009-05-28 Panasonic Corp Component mounting line

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3444626B2 (en) * 1993-06-30 2003-09-08 松下電器産業株式会社 Maintenance method of component recognition part of electronic component mounting machine
JPH08204399A (en) * 1995-01-25 1996-08-09 Matsushita Electric Ind Co Ltd Mount substrate production system
JPH10190292A (en) * 1996-12-24 1998-07-21 Matsushita Electric Ind Co Ltd Method and device for component mounting

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07142898A (en) * 1993-11-17 1995-06-02 Sanyo Electric Co Ltd Recognizer and component mounting apparatus with recognition function
CN1582107A (en) * 2003-08-12 2005-02-16 重机公司 Device-mounting apparatus
CN1942059A (en) * 2005-09-28 2007-04-04 雅马哈发动机株式会社 Mark recognition method and printing apparatus
JP2009117579A (en) * 2007-11-06 2009-05-28 Panasonic Corp Component mounting line

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106561079A (en) * 2015-10-05 2017-04-12 松下知识产权经营株式会社 Maintenance Support System And Maintenance Support Method In Electronic Component Mounting System
CN107108044A (en) * 2016-05-27 2017-08-29 深圳市大疆创新科技有限公司 Optical shield and the filming apparatus and unmanned plane using the optical shield
CN110214476B (en) * 2017-01-31 2021-03-12 株式会社富士 Coordinate data generating device and coordinate data generating method
CN110214476A (en) * 2017-01-31 2019-09-06 株式会社富士 Coordinate data generating means and coordinate data generation method
CN110192444B (en) * 2017-03-07 2021-05-11 雅马哈发动机株式会社 Component mounting apparatus and method for holding substrate
CN110192444A (en) * 2017-03-07 2019-08-30 雅马哈发动机株式会社 The keeping method of element fixing apparatus and substrate
CN110463375A (en) * 2017-03-30 2019-11-15 株式会社富士 Maintenance management device
CN109152327A (en) * 2017-06-16 2019-01-04 松下知识产权经营株式会社 Equipment element maintaining management system and equipment element maintaining management method
US11246250B2 (en) 2017-06-16 2022-02-08 Panasonic Intellectual Property Management Co., Ltd. Equipment element maintenance management system and equipment element maintenance management method
CN109270897A (en) * 2017-07-18 2019-01-25 松下知识产权经营株式会社 Equipment component maintenance analysis system and equipment component maintenance analysis method
CN109270897B (en) * 2017-07-18 2023-05-09 松下知识产权经营株式会社 Equipment element maintenance analysis system and equipment element maintenance analysis method
CN112720384A (en) * 2020-12-21 2021-04-30 苏州科韵激光科技有限公司 Display panel alignment apparatus and display panel alignment method
CN112720384B (en) * 2020-12-21 2022-08-26 苏州科韵激光科技有限公司 Display panel alignment apparatus and display panel alignment method

Also Published As

Publication number Publication date
JP5767754B2 (en) 2015-08-19
CN104663016B (en) 2017-12-26
WO2014049766A1 (en) 2014-04-03
JPWO2014049766A1 (en) 2016-08-22

Similar Documents

Publication Publication Date Title
CN104663016A (en) Recognition device for substrate processing machine
US9913384B2 (en) Substrate-related-operation apparatus
EP2902861B1 (en) Production line monitoring device
US20060075631A1 (en) Pick and place machine with improved component pick up inspection
KR20060116826A (en) Pick and place machine with image acquisition device
EP3579677B1 (en) Production management device
WO2007053557A1 (en) Electronics assembly machine with embedded solder paste inspection
KR101451690B1 (en) Component mounting system, component mounting device and component inspecting device
KR101120129B1 (en) Method of adjusting work position automatically by reference value and automatic apparatus for the same
CN112276508A (en) Memory card assembling equipment and assembling method
JP2003347794A (en) Method and apparatus for taking out electronic circuit component
KR101859868B1 (en) Soldering control system with function of automatic position adjustment for iron tip
US11917765B2 (en) Device for estimating cause of mounting error, and method for estimating cause of mounting error
CN114501980A (en) Device and method for detecting pins of special-shaped components and automatically plugging in components
US11154000B2 (en) Substrate work machine
JP7466746B2 (en) Countermeasure information presentation device and countermeasure information presentation method
WO2022044111A1 (en) Error cause estimating device and error cause estimating method
JP7142169B2 (en) Image data management device and image data management method
JP2006080105A (en) Method and device for supplying electronic component and surface mounting machine
US10709049B2 (en) Component mounting machine and component mounting line
US11239101B2 (en) Wafer supply device
JP2016139712A (en) Component management system
CN116993690A (en) Automatic detection method for automobile chassis assembly quality
KR19990060082A (en) Automatic Image Recognition Method of Component Mounter

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Aichi Japan vertical city

Patentee after: Fuji Corporation

Address before: Aichi Japan vertical city

Patentee before: Fuji Machinery Manufacturing Co., Ltd.