CN110192444A - The keeping method of element fixing apparatus and substrate - Google Patents
The keeping method of element fixing apparatus and substrate Download PDFInfo
- Publication number
- CN110192444A CN110192444A CN201780083019.9A CN201780083019A CN110192444A CN 110192444 A CN110192444 A CN 110192444A CN 201780083019 A CN201780083019 A CN 201780083019A CN 110192444 A CN110192444 A CN 110192444A
- Authority
- CN
- China
- Prior art keywords
- substrate
- pressing
- base plate
- printed base
- boarded head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
Abstract
Element fixing apparatus by this disclosure is the surface mounting apparatus (10) for having support unit (50) and mounting head (32), support unit (50) has the support plate (51) that the printed base plate (P) for carrying electronic component (E) is adsorbed and kept, mounting head (32) has the suction nozzle (34) that electronic component (E) is carried to printed base plate (P), wherein, suction nozzle (34) can press printed base plate (P) to support plate (51) during support plate (51) are adsorbed and are kept fixed printed base plate (P).
Description
Technical field
It is related to the keeping method of element fixing apparatus and substrate by the technology of this disclosure.
Background technique
For example, as the element mounting device for having the bearing part for carrying out absorption holding to the substrate for carrying element,
Know the structure for thering is Japanese Unexamined Patent Publication 2004-296632 bulletin (following patent documents 1) to record.The element mounting device has deformation
Head is corrected, which has the pressing component for the entire element mounting part that can press substrate, pass through pressing component
Substrate is corrected into deformation to bearing part pressing, thus adsorbs substrate by bearing part.
Citation
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2004-296632 bulletin
Summary of the invention
Subject to be solved by the invention
However, according to such element mounting device, in order to adsorb substrate by bearing part, with for by element to base
Straightening head separately, is set to the side of boarded head by the boarded head that plate carries together with driving mechanism.Therefore, with member
The increase of part number and the space for needing to configure straightening head and driving mechanism, element mounting device enlargement.Moreover, deformation
Correction head and driving mechanism are set to the side of boarded head, therefore become the obstacle for making boarded head high-speed mobile.
In the present specification, the technology of a kind of straining element number increased and suitably keep substrate is disclosed.
Solution for solving the problem
It is related to a kind of element fixing apparatus by the technology of this disclosure, has: holding plate, to the base for carrying element
Plate is adsorbed and is kept；And boarded head, Xiang Suoshu substrate carry the element, wherein the boarded head is in the holding plate
It adsorbs and keeps that the substrate can be pressed to the holding plate during the substrate.
In addition, being related to a kind of keeping method of substrate by the technology of this disclosure, have to carrying element
Substrate is adsorbed and in the holding plate that keeps and the element fixing apparatus of boarded head for carrying the element to the substrate
The keeping method of substrate, wherein during the holding plate is adsorbed and kept to the substrate, pass through the carrying
Head presses the substrate to the holding plate.
Element fixing apparatus according to this structure, in substrate there are in the case where warpage, can by boarded head to
Holding plate presses substrate, therefore can suitably keep substrate using holding plate.Moreover, because by the way that element is carried to substrate
Boarded head press substrate to holding plate, therefore do not need it is previous like that with boarded head dividually separately setting pressing substrate by
Press mechanism can prevent the increase of element number.Moreover, because not needing the space of configuration pressing mechanism, therefore can prevent
The enlargement of element fixing apparatus.
It can be set to structure below by the element fixing apparatus of this disclosure.
The boarded head may include the suction nozzle that can press the predetermined position of the substrate.
According to this structure, by pressing the predetermined position of substrate using suction nozzle, substrate can be pressed to holding plate.
The element fixing apparatus can be also equipped with control unit, and the absorption of the substrate is detected in the holding plate not
Adequately in the case where absorption mistake, which carries out the correction process that the boarded head is pressed to the substrate.
According to this structure, in the case where absorption mistake is detected in holding plate, boarded head pressing substrate, therefore with
Such as no matter whether there is or not adsorbing the case where wrong boarded head all presses substrate to compare, it can be improved the operating efficiency of installation exercise.
Pressure and the holding when control unit can attract the substrate by comparing the holding plate
Plate has suitably attracted pressure when substrate to adsorb mistake as caused by the warpage of substrate to detect.
According to this structure, suitably attracted pressure when substrate with holding plate by comparing pressure when attracting,
It is able to detect and adsorbs mistake as caused by the warpage of substrate.As a result, with absorption that substrate is for example determined by image recognition etc.
The situation of mistake is compared, can cut down element number, and can confirm absorption mistake with easy structure.
The control unit can intermittently press the substrate by the boarded head in a correction process
Multiple positions of outer edge.
In general, substrate is easy to produce warpage in outer edge, therefore as above-mentioned structure, boarded head only passes through intermittently
Press the outer edge of substrate, it will be able to suitably keep substrate using holding plate.
In the case that the control unit can detect the elimination of the absorption mistake in a correction process, knot
Pressing of the Shu Suoshu boarded head to the substrate.
According to this structure, in the case where detecting that absorption mistake is eliminated, terminate pressing of the boarded head to substrate, because
This can be improved the operation effect of installation exercise compared with the case where for example pressing multiple positions of outer rim of substrate using boarded head
Rate.
It can be, the control unit includes storage unit, which detects by pressing institute by the boarded head
Pressing position when stating substrate and eliminating the absorption mistake, keeps the absorption of the substrate releasing the holding plate
When, the control unit carries out the fixed releasing processing of following substrate: being pressed described in the storage unit storage as the boarded head
Pressing position, and the boarded head is slowly pulled open from the substrate.
According to this structure, when the absorption for releasing substrate is kept, by the way that boarded head is slowly pulled open from substrate, energy
Enough rebounds inhibited as caused by the warpage of substrate sharply.As a result, in the holding for relieving substrate, it is able to suppress and is equipped on base
There is a situation where positions to deviate for the element of plate.
It can be, the control unit includes storage unit, which is equipped on taking for the element of the substrate
Position is carried, the duplicate feelings of loading position in the pressing predetermined position and the element of the predetermined pressing substrate of the boarded head
Under condition, stop the boarded head for the pressing with the duplicate pressing predetermined position of the loading position.
According to this structure, the case where capable of preventing through boarded head press element inhibits the breakage of the element carried.
The control unit can will be pressed under the pressing predetermined position and the duplicate situation of the loading position with described
What pressure predetermined position and the adjacent position of the loading position were determined as to be pressed by the boarded head replaces position.
According to this structure, position is replaced using boarded head pressing, thus, it is possible to inhibit to make element broken by boarded head
The case where damage, and substrate is suitably kept using holding plate.
Invention effect
According to the technology by this disclosure, it is able to suppress the increase of element number and suitably keeps substrate.
Detailed description of the invention
Fig. 1 is the top view of the surface mounting apparatus of embodiment 1.
Fig. 2 is the main view of surface mounting apparatus.
Fig. 3 is the block diagram for indicating the electrical structure of surface mounting apparatus.
Fig. 4 is the top view of support unit.
Fig. 5 is the side view that the state of head unit is equipped on support unit.
Fig. 6 is the figure for schematically showing support unit and pressure sensor.
Fig. 7 is the flow chart of substrate fixing process.
Fig. 8 is the flow chart of a correction process.
Fig. 9 is the fixed flow chart for releasing processing of substrate.
Figure 10 is the figure for indicating the positional relationship of printed base plate and support unit.
Figure 11 is to indicate that the printed base plate that warpage will be present is disposed in the perspective view of the state on support unit.
Figure 12 is to indicate that the printed base plate that warpage will be present is disposed in the side view of the state on support unit.
Figure 13 is the side view for indicating the state pressed by part of the suction nozzle to the generation warpage of printed base plate.
Figure 14 is the flow chart of a correction process of embodiment 2.
Figure 15 is to indicate to carry the figure of the state of electronic component in the pressing predetermined position of printed base plate.
Specific embodiment
<embodiment 1>
Electronic component (an example of " element ") E is mounted on printed base plate (an example of " substrate ") P by the illustration of embodiment 1
Surface mounting apparatus (an example of " element fixing apparatus ") 10.As shown in Figure 1, it is substantially that surface mounting apparatus 10, which has overlook view,
The carrying conveyer 12 of printed base plate P is carried on the base station 11 of rectangular shape, Xiang Jitai 11, carries electronics on printed base plate P
The element installation unit 20 of element E supports the support unit 50 of printed base plate P, for installing list to element in installed position
Member 20 supplies the component supplying apparatus 13 of electronic component E.
It should be noted that in the following description, left and right directions is with left and right directions (the long side side of base station 11 in Fig. 1
To and carry conveyer 12 carry direction) and Fig. 3 in left and right directions on the basis of.Moreover, front-rear direction is with upper and lower in Fig. 1
On the basis of direction (short side direction of base station 11) and the left and right directions of Fig. 4, in Fig. 1, with diagram downside for front side, in diagram
Side is rear side, in Fig. 3, with diagram left side for front side, is illustrated with diagram right side for rear side.
As shown in Figure 1, it is in the lateral direction horizontally long overlook view rectangular shape that base station 11, which is in, on base station 11
Configured with a pair of support unit carrying conveyer 12, being configured between a pair of of carrying conveyer 12 configured in the left and right sides
50, element installation unit 20 etc..
Pair of right and left carries conveyer 12 and support unit 50 is in continuous state, energy mutually in a manner of no difference of height
It is enough to carry the printed base plate P for becoming mounting object in left-right direction.As shown in Figure 1, respectively carrying conveyer 12 has along left and right
Direction carries out a pair of of conveyer belt 14 of circulation driving, and printed base plate P is installed in a manner of erection in a pair of of conveyer belt 14.Printing
Substrate P is moved in from the right side of left and right directions along installation site of the conveyer belt 14 on support unit 50, is carried out in installed position
After the installation exercise of electronic component E, move out along the left side of conveyer belt 14 in the lateral direction.
Support unit 50 is to be kept fixed when installing electronic component E on printed base plate P to printed base plate P
Structure, as shown in Fig. 2, Fig. 4~Fig. 6, in being in the lateral direction horizontally long bulk.Moreover, support unit 50 has mounting print
The support plate (an example of " holding plate ") 51 of brush substrate P, support plate 51 lower section be arranged negative pressure feeding component 52, in negative pressure
The support member 53 of supply part 52 being arranged further below, a pair of side plates 54 being arranged in front-rear direction two sides.
Support plate 51 is made of metal, and the flatness of the upper surface 51A of support plate 51 is set to height.Moreover, in support plate 51
Upper surface 51A, state of the small adsorption hole 55 for the degree that air can pass through to penetrate through support plate 51 along the vertical direction
It is multiple along being all around arranged.
Negative pressure feeding component 52 is the plate thickness tabular slightly thicker than support plate 51, is arranged to and supports along direction all around
The roughly the same size of plate 51.As shown in fig. 6, in the inside of negative pressure feeding component 52 equipped with right with the adsorption hole 55 of support plate 51
The negative pressure feeding road 56 answered supplies negative pressure from air feeder 60 to negative pressure feeding road 56.It is supplied when to negative pressure feeding road 56
When negative pressure, negative pressure is supplied to each adsorption hole 55, in the printed base plate P that the upper surface 51A of support plate 51 is loaded by negative pressure by propping up
Fagging 51 attracts and is kept fixed.
Support member 53 is arranged to the bulk in the same size along direction all around with negative pressure feeding component 52.Support
Component 53 is fixed by fixed mechanism (not shown) relative to base station 11, thus by support unit 50 relative to base station 11 into
Row is fixed.
A pair of side plates 54 is arranged to cover support plate 51, negative pressure feeding component 52, support member 53 from front-rear direction two sides
3 components are fixed with the state positioned from front-rear direction two sides for the size of lid, a pair of side plates 54.It is bounded on each side the interior of plate 54
The face of side is equipped with the carry strap 54A for carrying out circulation driving in left-right direction.Each carry strap 54A will printing on support unit 50
Substrate P is carried in left-right direction.
As shown in Figure 1, component supplying apparatus 13 is set as feed type, it is left in two lateral edge of up and down direction for carrying conveyer 12
Right direction arrangement each 2, thus it is disposed in total 4 positions.In above-mentioned component supplying apparatus 13 with neat in left-right direction
The state of arrangement is equipped with multiple loaders 16.Each loader 16 has and will contain the component feeding band of multiple electronic component E
The DYN dynamic carrying device (not shown) etc. drawn from tep reel, each loader 16 is from the end of 12 side of conveyer is carried by electronics
Element E is supplied one by one.
Element installation unit 20 is to take out the electronic component E being supplied on base station 11 from component supplying apparatus 13 and carry
Structure on printed base plate P, as shown in Figure 1, having a pair of of Y-axis frame in the arranging of the two sides of the left and right directions of base station 11
21, it is set up in the X-axis frame 26 of a pair of of Y-axis frame 21, can movably be installed on the head unit 30 of X-axis frame 26.
It is equipped with the Y-axis guide rail 24 being arranged along Y-axis frame 21, Y-axis servomotor 25 in a pair of of Y-axis frame 21, when to Y
When axis servomotor 25 carries out power control, X-axis frame 26 and the head unit 30 of X-axis frame 26 is installed on along Y-axis guide rail 24
It moves in the longitudinal direction.
X-axis frame 26 is set as the form extended in left-right direction, and the X-axis being arranged along X-axis frame 26 is equipped in X-axis frame 26
Guide rail 27 and X-axis servomotor 28, when carrying out power control to X-axis servomotor 28, head unit 30 is along X-axis guide rail
27 move in the lateral direction.
As shown in Figures 1 and 2, head unit 30 has the head unit main body 31 in box shape and carries out the peace of electronic component E
Multiple mounting heads (an example of " boarded head ") 32 of dress movement.
As shown in figures 2 and 5, multiple mounting heads 32 in such a way that from the beginning unit main body 31 is outstanding downwards in left-right direction
Arranged in parallel, each mounting head 32 is with the rotary shaft 33 vertically extended, relative to rotary shaft 33 as under front end
The suction nozzle (an example of " boarded head ") 34 that end can dismount.
Z axis servomotor 31A and R the axis servomotor being set in head unit main body 31 is installed in rotary shaft 33
31B.As shown in figure 13, rotary shaft 33 can be gone up and down along the vertical direction by Z axis servomotor 31A, pass through R axis servo-electric
Machine 31B can be pivoted.
As shown in Figures 5 and 6, suction nozzle 34 is in the substantially tubular vertically extended.Suction nozzle 34 passes through in rotary shaft 33
The maintaining part (not shown) of lower end setting keep upper end, be thus held in the lower end of rotary shaft 33.
As shown in fig. 6, the lower ending opening edge of suction nozzle 34 is set as the horizontal mode parallel with the upper surface of base station 11, inhaling
The inside of mouth 34 is equipped with the air flue (not shown) being connected to the supply road (not shown) being set in rotary shaft 33.
Negative pressure or positive pressure are supplied from the air feeder 60 that the supply road with rotary shaft 33 is connect to air flue.Suction nozzle
34 are adsorbed by the negative pressure supplied to air flue and keep electronic component E, by the positive pressure that supplies to air flue by electronics
Element E release.It should be noted that the lower ending opening edge of suction nozzle 34 can press electronic component E etc., it will be electric passing through suction nozzle 34
Subcomponent E discharge when, by the suction nozzle 34 for maintaining electronic component E for printed base plate P slightly press it is open, thus, it is possible to print
Carry electronic component E in position appropriate in brush substrate P.
Therefore, element installation unit 20 is and driving Y-axis servomotor 25 and X-axis servomotor 28 in base station
Head unit 30 can be made to move along all around on 11, and enabling Z axis servomotor 31A driving to decline suction nozzle 34
Printed base plate P carrying that is enough to take out electronic component E from component supplying apparatus 13, or being kept fixed to support unit 50
Electronic component E.
It should be noted that in head unit 30, as shown in Fig. 2, being identified in the side of head unit main body 31 equipped with substrate
Camera 20A, board-recognition camera 20A shoot printed base plate P, carry out image recognition to printed base plate P.Moreover, as shown in Figure 1,
The two sides in the front-back direction of support unit 50 on base station 11 are provided with a pair of of component recognizing camera 15, each component recognizing camera
The electronic component E that 15 shootings are kept by the absorption of mounting head 32 of head unit 30.
Next, illustrating the electrical structure of surface mounting apparatus 10 referring to Fig. 3.
Surface mounting apparatus 10 carries out blanket control by 110 pairs of entirety of control unit, and control unit 110 has to be made of CPU etc.
Arithmetic processing section (an example of " control unit ") 111.Motor control part 112, storage unit are connected in arithmetic processing section 111
113, image processing part 114, external input output section 115, component supplying apparatus communication unit 116, managing device communication unit 117,
Operation portion 118 etc..
Motor control part 112 is come according to the instruction of arithmetic processing section 111 based on the installation procedure that storage unit 113 stores
Control Y-axis servomotor 25, X-axis servomotor 28, Z axis servomotor 31A, R axis servomotor 31B, carrying are defeated
Device 12 etc. is sent, electronic component E is installed.
Storage unit 113 be stored with for printed base plate P installation electronic component E installation procedure, for being kept fixed
The various programs such as the substrate fixed routine of printed base plate P, various data etc..Various data include the printed base plate P of predetermined production
Information substrate relevant to production number, kind, support unit 50 when being kept fixed to printed base plate P with keep base
Standard presses relevant information etc..
Image processing part 114 reads the picture signal exported from board-recognition camera 20A, component recognizing camera 15, is based on
The picture signal of reading generates image.
External input output section 115 is so-called interface.Arithmetic processing section 111 by external input output section 115 read from
The detection signal that the various sensor classes 62 such as the pressure sensor 63 of air feeder 60 export, passes through external input output section
115 export control signal to air feeder 60.
Component supplying apparatus communication unit 116 is connected to component supplying apparatus 13, carries out blanket control to component supplying apparatus 13
System.
Managing device communication unit 117 can communicatedly be connect with managing device 90, and managing device 90 is based on producing scheduled
The type of printed base plate P and execute optimization procedure, be determined in advance installation electronic component E sequence etc..
Operation portion 118 has the input units (not shown) such as the display device (not shown) such as LCD monitor, keyboard, mouse
Deng carrying out the accepting of the input from operator, the output to operator.
In addition, arithmetic processing section 111 executes the substrate fixed routine that storage unit 113 stores, it is defeated from there through external input
Portion 115 controls air feeder 60 out, carries out the substrate bearing that printed base plate P is kept fixed in support unit 50
Reason.
Hereinafter, being illustrated about substrate fixing process referring to flow chart shown in Fig. 7.
In substrate fixing process, when installation site of the printed base plate P on support unit 50 is carried, calculation process
Portion 111 controls air feeder 60 by external input output section 115, supplies to the negative pressure feeding component 52 of support unit 50
Give negative pressure (S11).Negative pressure is supplied to the adsorption hole 55 of support plate 51 as a result, and the printed base plate P configured in installation site is by supporting
The support plate 51 of unit 50 attracts.
Next, arithmetic processing section 111 reads the pressure from air feeder 60 by external input output section 115
Whether the detection signal of sensor 63 determines the pressure of pressure sensor 63 than being stored on the holding base pressure of storage unit 113
It rises (S12).Here, it is slightly lower to keep base pressure to be set as the pressure generated when suitably being adsorbed than printed base plate P by support plate 51
Value.
In the case where the pressure ratio of pressure sensor 63 keeps base pressure high (S12: yes), arithmetic processing section 111 determines
Substrate P blocking is printed for whole adsorption holes 55 of support plate 51.
I.e., it is believed that be suitably kept fixed printed base plate P in the installation site of support unit 50, and terminated substrate and fix
Processing.
On the other hand, in the case where the pressure ratio of pressure sensor 63 keeps benchmark to force down (S12: no), calculation process
Portion 111 is determined as the not printed substrate P blocking of a certain adsorption hole 55 of support plate 51 and the absorption of printed base plate P becomes not fill
Point, it generates printed base plate P and is not suitably maintained fixed absorption mistake.The absorption mistake of printed base plate P is detected as a result,.
Specifically, for example, having taken the warpage etc. of printed base plate P as the part of the thus generation warpage in printed base plate P
P1 becomes the state (1 and Figure 12 referring to Fig.1) that floats relative to support plate 51, whole adsorption holes 55 in support plate 51 not by
Printed base plate P blocking, is thus determined as that printed base plate P is not suitably maintained fixation, detects that absorption is wrong (S20).
Therefore, in the case where detecting that printed base plate P is not suitably maintained fixed absorption mistake, arithmetic processing section
111 carry out correction process (S20) of temporarily correction printed base plate P, in storage unit 113 at the primary correction of storage implementation
The case where reason.It should be noted that during carrying out substrate fixing process and a correction process, from air feeder
60 to 50 sustainable supply negative pressure of support unit.
Hereinafter, being illustrated about a correction process referring to flow chart shown in Fig. 8.
In a correction process, firstly, motor control part 112 watches Y-axis according to the instruction of arithmetic processing section 111
It takes motor 25 and X-axis servomotor 28 drives, the mounting head 32 in head unit 30 is configured on printed base plate P (S21).
Next, motor control part 112 drives the Z axis servomotor 31A in head unit 30, thus make mounting head
Suction nozzle 34 in 32 declines, and presses the pressing predetermined position PP for being set in printed base plate P.
Specifically, as shown in Figures 10 and 11, pressing predetermined position PP printed base plate P outer peripheral edge portion P2 intermittently
Multiple (in the present embodiment, being set in four angles of printed base plate P) are set, in a correction process, pass through suction nozzle 34
It presses the initial pressing predetermined position PP in multiple pressing predetermined position PP and presses printed base plate P to support plate 51
(S22).It should be noted that the adsorption hole 55 of the upper surface 1 of support plate reduces number simultaneously in order to facilitate understanding in Figure 10
Amplification indicates.
Next, rising the suction nozzle 34 of decline, determine the pressure of pressure sensor 63 whether than keeping base pressure to rise
(S23)。
In the case where the pressure ratio of pressure sensor 63 keeps base pressure high (S23: yes), arithmetic processing section 111 is temporary
Correct the part P1 of the generation warpage in printed base plate P, it is believed that printed base plate P is suitably maintained fixation, and pressing position (is pressed
The pressing predetermined position PP of pressure) PF is stored in storage unit 113, terminate a correction process.
Specifically, as shown in figure 13, by carrying out the pressing predetermined position PP in printed base plate P for support plate 51
Pressing carrys out the part P1 for temporarily correcting the generation warpage in printed base plate P.Then, the part of the generation warpage in printed base plate P
P1 becomes the state being close to support plate 51 by negative pressure, and printed base plate P is maintained as the state after once correcting.Therefore,
The state that whole adsorption holes 55 as support plate 51 are blocked by printed base plate P becomes printed base plate P and is suitably maintained admittedly
Fixed state, thus the pressure ratio of pressure sensor 63 keeps base pressure high.
On the other hand, the case where the state (S23: no) that the pressure ratio of pressure sensor 63 keeps benchmark to force down continues
Under, arithmetic processing section 111 is determined as the printed substrate P blocking of whole adsorption holes 55 of support plate 51, printed base plate P not by
It is suitably kept fixed, (S24) is pressed to next pressing predetermined position PP in multiple pressing predetermined position PP.
Then, the processing of S23 and S24 is repeated until the pressure ratio of pressure sensor 63 keeps base pressure to rise to
Only, multiple pressing predetermined position PP are successively pressed.Also, base pressure is kept to rise in the pressure ratio of pressure sensor 63
In the case where, pressing position PF is stored in storage unit 113 by arithmetic processing section 111, terminates a correction process.
That is, the multiple pressing predetermined position PP for being set in printed base plate P are successively pressed by suction nozzle 34, in arithmetic processing section
111 detect due to pressure sensor 63 pressure ratio keep base pressure rise and eliminate absorption mistake in the case where, terminate
The pressing of 34 couples of suction nozzle pressing predetermined position PP.
In addition, being that last pressing is pre-positioned in pressing position PF during the processing of S23 and S24 is repeated
In the case where setting PP, arithmetic processing section 111 determines the pressure of the pressure sensor 63 after last pressing predetermined position PP pressing
Whether power is than keeping benchmark to force down (S25).Also, in the case where the pressure of pressure sensor 63 is still forced down than holding benchmark
(S25: yes), arithmetic processing section 111 are judged to once correcting printed base plate P by a correction process, pass through
Printed base plate P can not be suitably kept fixed by support unit 50.Also, the information such as error messages are shown in operation portion 118
Display device (S26), to a correction process carry out error terminate.
In a correction process, in the case where printed base plate P is suitably kept fixed by support unit 50, motor
Control unit 112 carries electronic component E to printed base plate P based on installation procedure according to the instruction of arithmetic processing section 111.
After the completion of the carrying of electronic component E, arithmetic processing section 111 stops the confession of the negative pressure from air feeder 60
It gives, the fixation of printed base plate P is released in support unit 50.Then, printed base plate P is moved out by carrying conveyer 12.
Here, printed base plate P is temporarily corrected by a correction process be kept fixed in the case where, if
Stop the supply of negative pressure, the then part (generation in printed base plate P temporarily corrected in printed base plate P for support unit 50
The part P1 of warpage) it may spring back with sudden force.Assuming that when the part of printed base plate P temporarily corrected is sprung back with sudden force,
Position deviation can occur for the electronic component E being mounted on printed base plate P.
Therefore, in the present embodiment, when releasing the fixation of printed base plate P, the rebound for inhibiting printed base plate P is carried out
The fixed releasing processing of substrate.
Hereinafter, being illustrated about the fixed releasing processing of substrate referring to flow chart shown in Fig. 9.
In the fixed releasing processing of substrate, firstly, arithmetic processing section 111 determines to fix in substrate referring to storage unit 113
Whether a correction process (S31) has been carried out in processing.In judgement the result is that in the case where not carrying out a correction process
(S31: no), arithmetic processing section 111 stop the supply of the negative pressure from air feeder 60.Then, in support unit 50
The fixation (S32) of printed base plate P is released, the fixed releasing processing of substrate is terminated.
On the other hand, it is carried out in substrate fixing process in the case where a correction process (S31: yes), arithmetic processing section
111 recall pressing position PF (S33) from storage unit 113, watch Y-axis servomotor 25, X-axis by motor control part 112
Motor 28, Z axis servomotor 31A driving are taken, the pressing position PF recalled is pressed from there through suction nozzle 34
(S34)。
Next, stopping the supply of the negative pressure from air feeder 60, printed base plate P is released in support unit 50
Fixation (S35).
Here, when stopping negative pressure, although the absorption quilt based on negative pressure of the part P1 of the generation warpage in printed base plate P
It releases, but pressing position PF is pressed by suction nozzle 34, therefore can prevent time of the part P1 of generations warpage in printed base plate P
Bullet.
Next, arithmetic processing section 111 drives Z axis servomotor 31A, in order to keep away by motor control part 112
The part P1 for exempting from the generation warpage in printed base plate P is sprung back with sudden force, makes to have pressed the suction nozzle 34 of pressing position PF with from printing
The mode that substrate P is slowly pulled open rises (S36).Then, the part P1 of the generation warpage in printed base plate P does not spring back and prints
The fixation of substrate P is released from completely, and processing terminate for the fixed releasing of substrate.
Printing is thus mounted in release having remained fixed at for printed base plate P in support unit 50 that is, being able to suppress
There is a situation where positions to deviate by electronic component E in substrate P.
As previously discussed, according to the present embodiment, even if becoming printing base for cause with warpage of printed base plate P etc.
In the case where the state that a part of plate P floats relative to support plate 51, the suction nozzle 34 in the mounting head 32 of head unit 30 also will
Multiple pressing predetermined position PP is intermittently arranged on the outer peripheral edge portion P2 of printed base plate P successively to press support plate 51, energy
Enough temporarily corrects by support plate 51 and be kept fixed printed base plate P.Thereby, it is possible to prevent the warpage etc. with printed base plate P from being
Rise thus the case where can not carrying electronic component E.
In addition, according to the present embodiment, by suction nozzle 34 from electronic component E to printed base plate P that carry by printed base plate P
It is pressed to support plate 51.That is, not needing the previous pressing machine being separately arranged like that for pressing printed base plate P to support plate 51
Structure, therefore the increase of the element number of surface mounting apparatus 10 can be prevented, and can prevent so that the space of configuration pressing mechanism is arranged
The case where for rise thus the enlargement of surface mounting apparatus 10 situation.
In addition, according to the present embodiment, in substrate fixing process, pressure sensor 63 pressure not than keeping benchmark
When pressing high, it is judged to having taken the warpage etc. of printed base plate P as the absorption mistake for thus generating printed base plate P and not being suitably maintained
Accidentally, a correction process only is carried out when generating absorption mistake.That is, for example, with no matter whether there is or not absorption mistakes all to pass through suction nozzle 34
The case where all pressing the pressing predetermined position PP of printed base plate P is compared, and can be improved the operating efficiency of installation exercise.
In addition, according to the present embodiment, by comparing the pressure for keeping negative pressure when printed base plate P and being stored in storage unit
113 holding base pressure come detect printed base plate P relative to support plate 51 float and generate absorption mistake situation, therefore with example
Such as determine that the situation of absorption mistake is compared according to the image of printed base plate P, device for obtaining image etc. can be prevented
The increase of element number, and it is able to suppress the case where surface mounting apparatus 10 becomes the structure of complexity.
In addition, according to the present embodiment, in a correction process, being set in detecting successively to press by suction nozzle 34
Multiple pressing predetermined position PP of printed base plate P and in the case where eliminating absorption mistake, terminate 34 pairs of pressings of suction nozzle and be pre-positioned
Set the pressing of PP, thus with the feelings that are all pressed the multiple pressing predetermined position PP for being set in printed base plate P by suction nozzle 34
Condition is compared, and can be improved the operating efficiency of installation exercise.
In addition, also it is contemplated that pressing printed base plate P by suction nozzle 34 in the case where the absorption mistake of printed base plate P occurs
Center portion, the printed base plate P comprising center portion is whole and the method that is kept fixed printed base plate P using support plate 51.
However, in general, the warpage of printed base plate P is in the tendency generated in the outer peripheral edge portion P2 of printed base plate P.That is, such as
Present embodiment is such, only multiple pressing predetermined position PP by intermittently setting on the outer peripheral edge portion P2 by printed base plate P
Successively press, it will be able to printed base plate P is kept fixed, therefore with for example by suction nozzle 34 press printed base plate P in
Centre part, printed base plate P entirety comprising center portion situation compare, the position pressed by suction nozzle 34, energy can be reduced
Enough further increase the operating efficiency of installation exercise.
Although still being propped up it should be noted that assuming all to press multiple pressing predetermined position PP of printed base plate P
In the case where cannot keep printed base plate P in support unit 50, error can be shown in the display device of operation portion 118 and will be printed
The case where bad situation of brush substrate P is broadcasted to operator, therefore the operating efficiency that can strongly reduce installation exercise declines.
In addition, according to the present embodiment, being generated in the absorption mistake of printed base plate P and passing through a correction process to printing
In the case that substrate P has carried out primary correction, storage has pressed the pressing position PF of printed base plate P by a correction process.
Also, in the fixed releasing processing of substrate, the pressing position PF stored in substrate fixing process is pressed by suction nozzle 34, is being solved
In addition to negative pressure is to after being kept fixed of printed base plate P, slowly increase suction nozzle 34, therefore be able to suppress in printed base plate P
The part P1 of generation warpage the case where springing back with sudden force.The electronic component E hair that thereby, it is possible to inhibit to be equipped on printed base plate P
The case where raw position is deviateed.
<embodiment 2>
Next, 4 and Figure 15 is illustrated referring to Fig.1 about embodiment 2.
Embodiment 2 is to change embodiment to can also cope with the printed base plate P in part equipped with electronic component E
The structure of a part of 1 correction process, about the structure, function and effect common with embodiment 1 due to repeating, because
The description thereof will be omitted for this.Moreover, using same appended drawing reference about structure same as embodiment 1.It should be noted that
The loading position PM for the electronic component E that printed base plate P has been carried is set as such as taking electronic component E in the embodiment 1
The information for the position carried when load, which is stored in storage unit 113 or will carry the information such as predetermined position, is stored in storage unit 113, thus
It is pre-stored within storage unit 113.
Correction process of embodiment 2 as shown in flowchart of fig. 14, in a correction process of embodiment 1
S21 later processing (processing after configuring the mounting head 32 in head unit 30 on printed base plate P) is different, S21 it
Afterwards, arithmetic processing section 111 confirms the presence or absence of the information of loading position PM of electronic component E in storage unit 113 (S31).
The case where (not carrying electronic component E in printed base plate P) is not present in the information of the loading position PM of electronic component E
Under (S31: no), execute and processing same after the S22 in a correction process of embodiment 1.
On the other hand, exist in the information of the loading position PM of electronic component E and (carry electronic component E in printed base plate P)
In the case where (S31: yes), arithmetic processing section 111 recalls the loading position of the electronic component E in printed base plate P from storage unit 113
PM (S32) determines the pressing predetermined position PP pressed by suction nozzle 34 and loading position PM with the presence or absence of repetition (S33).
In the case where pressing predetermined position PP and loading position PM do not have duplicate situation (S33: no), execute and embodiment 1
A correction process in S22 after same processing.
On the other hand, as shown in figure 15, pressing predetermined position PP and loading position PM there are in duplicate situation (S33:
It is), whether the position that arithmetic processing section 111 determines and pressing predetermined position PP and loading position PM is adjacent can be by suction nozzle 34
It presses (S34).
In the case where adjacent position can be pressed by suction nozzle 34 (S34: yes), as shown in figure 15, arithmetic processing section 111 will
Adjacent position is determined as replacing position PN (S34), and position PN will be replaced to execute and implement as new pressing predetermined position PP
Same processing after S22 in correction process of mode 1.
Although pressing predetermined position PP and loading position PM exist repeat but with pressing predetermined position PP and carrying position
Set the adjacent position PM by suction nozzle 34 can not press in the case where (S34: no), arithmetic processing section 111 can not be by once rectifying
Printed base plate P is once corrected in positive processing, can not suitably carry out keeping solid to printed base plate P by support unit 50
It is fixed, the information such as error messages are shown in the display device (S35) of operation portion 118, carrying out error to a correction process terminates.
As previously discussed, according to the present embodiment, for example, even if passing through surface mounting apparatus 10 shown in embodiment 1
In the case where Deng carrying electronic component E in a part of printed base plate P and then carrying diverse electronic component E again,
The case where electronic component E is pressed by suction nozzle 34 can be prevented, can be avoided the damage of the electronic component E carried.
In addition, according to the present embodiment, not only avoiding the damage of electronic component E carried, but also determines and press
Predetermined position PP adjacent replacement position PN replaces position PN that can utilize support unit 50 by pressing this using suction nozzle 34
Suitably it is kept fixed printed base plate P.
<other embodiments>
Technology disclosed in this specification is not limited to the embodiment of above-mentioned description and Detailed description of the invention, includes for example yet
Following various forms.
(1) in the above-described embodiment, it as an example of substrate, is set as having used the structure of printed base plate P.However, simultaneously
It is not limited to this, technology disclosed in this specification can also be applied in the sheet metal of lead frame etc..
(2) in the above-described embodiment, the pressure in pressure sensor 63 is set as not higher than the guarantor stored in storage unit 113
It is determined as that in support plate 51, there are the structures of the absorption mistake of printed base plate P in the case where holding base pressure.However, not limiting to
In this, it also can be set to through other testing agencies such as image procossing and determine the structure of absorption mistake.
(3) in the above-described embodiment, it is pre- to set pressing for four angles of the interval in the outer peripheral edge portion of printed base plate P
PP is set in positioning.However, it is not limited to which this can also be by the central portion on each side, printing other than four angles of printed base plate
The center of substrate is set as pressing predetermined position.
(4) in the above-described embodiment, it is set as in a correction process in the above-mentioned guarantor of the pressure ratio of pressure sensor 63
It is high and terminate the structures of the pressing of 34 couples of suction nozzle pressing predetermined position PP in the case where eliminating absorption mistake to hold base pressure.So
And, it is not limited to this, it also can be set to the structure in the whole pressing predetermined position of the suction nozzle pressing in a correction process.
(5) in the above-described embodiment, it is set as in the fixed releasing processing of substrate in pressing predetermined position PP and carries position
It sets and is determined as the position adjacent with pressing predetermined position PP and loading position PM when PM is repeated to replace the structure of position PN.So
And, it is not limited to this, can be set to can not be single in support by printed base plate when pressing predetermined position and loading position repeats
The structure of error display is kept fixed and carried out in member.
Description of symbols
10: surface mounting apparatus (an example of " element fixing apparatus ")
32: mounting head (an example of " boarded head ")
34: suction nozzle (an example of " boarded head ")
51: support plate (an example of " holding plate ")
110: control unit
111: arithmetic processing section (an example of " control unit ")
113: storage unit
E: electronic component (an example of " element ")
P: printed base plate (an example of " substrate ")
P2: the outer edge of substrate
PF: pressing position
PM: loading position
PN: instead of position
PP: pressing predetermined position
Claims (10)
1. a kind of element fixing apparatus, has:
Holding plate is adsorbed and is kept to the substrate for carrying element；And
Boarded head, Xiang Suoshu substrate carry the element, wherein
Described in the boarded head can press during the holding plate adsorbs and keeps the substrate to the holding plate
Substrate.
2. element fixing apparatus according to claim 1, wherein
The boarded head includes the suction nozzle that can press the predetermined position of the substrate.
3. element fixing apparatus according to claim 1 or 2, wherein
The element fixing apparatus is also equipped with control unit, and the insufficient suction of the absorption of the substrate is detected in the holding plate
In the case where attached mistake, the control unit carries out the correction process that the boarded head is pressed to the substrate.
4. element fixing apparatus according to claim 3, wherein
Pressure and the holding plate when control unit attracts the substrate by comparing the holding plate are suitably
Pressure when substrate has been attracted to adsorb mistake as caused by the warpage of substrate to detect.
5. element fixing apparatus according to claim 3 or 4, wherein
The control unit intermittently presses the outer edge of the substrate in a correction process by the boarded head
Multiple positions.
6. element fixing apparatus according to claim 5, wherein
In the case where detecting the elimination of the absorption mistake in a correction process, the control unit terminates described take
Pressing of the carrier head to the substrate.
7. element fixing apparatus according to claim 6, wherein
The control unit includes storage unit, and the storage unit storage is detected to be disappeared and pressing the substrate by the boarded head
Pressing position when in addition to the absorption mistake,
When releasing absorption holding of the holding plate for the substrate, the control unit carries out the fixed releasing of following substrate
Processing: the pressing position of the storage unit storage is pressed by the boarded head, and the boarded head is delayed from the substrate
Slowly pull open.
8. the element fixing apparatus according to any one of claim 3~7, wherein
The control unit includes storage unit, and the storage unit storage is equipped on the loading position of the element of the substrate,
The case where the pressing predetermined position of the predetermined pressing substrate of the boarded head and the loading position of the element repeat
Under, stop the boarded head for the pressing with the duplicate pressing predetermined position of the loading position.
9. element fixing apparatus according to claim 8, wherein
Under the pressing predetermined position and the duplicate situation of the loading position, the control unit will be pre-positioned with the pressing
Set the replacement position that the position adjacent with the loading position is determined as to be pressed by the boarded head.
It is to have the holding plate that the substrate for carrying element is adsorbed and kept and to institute 10. a kind of keeping method of substrate
State the keeping method of the substrate in the element fixing apparatus for the boarded head that substrate carries the element, wherein
During the holding plate is adsorbed and kept to the substrate, pressed by the boarded head to the holding plate
Press the substrate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2017/008997 WO2018163284A1 (en) | 2017-03-07 | 2017-03-07 | Component mounting device and method for holding substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110192444A true CN110192444A (en) | 2019-08-30 |
| CN110192444B CN110192444B (en) | 2021-05-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780083019.9A Active CN110192444B (en) | 2017-03-07 | 2017-03-07 | Component mounting apparatus and method for holding substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6840223B2 (en) |
| KR (1) | KR102208102B1 (en) |
| CN (1) | CN110192444B (en) |
| WO (1) | WO2018163284A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023079754A1 (en) * | 2021-11-08 | 2023-05-11 | 株式会社Fuji | Board work machine and board fixing method |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2018163284A1 (en) | 2019-11-21 |
| JP6840223B2 (en) | 2021-03-10 |
| KR20190087578A (en) | 2019-07-24 |
| KR102208102B1 (en) | 2021-01-27 |
| WO2018163284A1 (en) | 2018-09-13 |
| CN110192444B (en) | 2021-05-11 |
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