JP2828674B2 - Board backup device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention mounts a chip-shaped electronic component such as a resistor, a capacitor or a transistor (hereinafter, referred to as a chip component) at a predetermined position on a printed circuit board. The present invention relates to an improvement of a board backup device which is incorporated in an electronic component automatic device or the like and horizontally holds a printed board before mounting chip components.

2. Description of the Related Art Conventionally, as an automatic device for electronic parts of this type, a substrate backup device having a configuration as disclosed in, for example, Japanese Patent Application Laid-Open No. 59-29492 is known.

In such a conventional board backup device,
A substrate support table is provided on an XY table that is controlled to move in the XY directions so as to be movable up and down, and a substrate feed mechanism is provided between a pair of left and right substrate transfer chutes installed opposite to each other on the substrate support table. While supporting both ends in the width direction of the printed board transferred from, a plurality of backup pins are detachably implanted on the board supporting table corresponding to the space between the pair of board transfer chutes,
By backing up these backup pins by contacting them with the back surface of the printed circuit board, the printed circuit board is prevented from warping and can be positioned and held horizontally.

[Problems to be Solved by the Invention] However, in the above-described conventional board backup device, since the backup is performed simply by abutting the backup pin on the back surface of the printed board, if the board thickness of the printed board is different, It is necessary to replace the backup pin for each printed circuit board having a different thickness.

Also, if the printed circuit board itself is warped, the printed circuit board is positioned and held in an upwardly warped or downwardly warped state, and it is difficult to hold the printed circuit board horizontally.

For this reason, especially when the printed circuit board is positioned and held with a gap between it and the backup pin in a warped state, for example, an adhesive for temporarily fixing a chip component is applied to a predetermined position on the printed circuit board by a nozzle. In the case of application by the application nozzle, the printed circuit board is pressed and deformed with the lowering of the application nozzle, and the application nozzle is elastically rebounded so as to maintain the original warped state by the rise of the application nozzle after applying the adhesive. The adhesive scatters, the printed circuit board moves with the movement of the application nozzle, and the stringing phenomenon of the adhesive occurs.
Alternatively, if a pre-installed component is mounted on the back surface of the printed circuit board, there is a problem that the pre-installed component is easily dropped.

[Object of the Invention] The present invention has been made under the above circumstances, and eliminates the necessity of exchanging backup pins for each printed circuit board having a different thickness and securely holding the printed circuit board horizontally. It is an object of the present invention to provide a substrate backup device capable of performing the following.

[Means for Solving the Problems] In order to achieve the above-described object, the present invention provides an XY table that is controlled to move in the XY directions, and is installed on the XY table so as to be able to move up and down. A pair of left and right substrate transfer chutes, which are installed on the substrate support table so as to face each other and between which a printed board is delivered and supported, and a substrate corresponding to the space between the pair of left and right substrate transfer chutes. A backup base on which a plurality of backup pins, which are mounted on a support table and are backed by contacting the back surface of the printed circuit board which is transported and supported between the pair of left and right substrate transport chutes, are detachably mounted; A memory in which data relating to the board thickness is stored for each type, and the backup pin corresponds to the type of printed circuit board to be backed up. And a lifting control means for automatically raising and lowering the backup base based on the thickness of the substrate stored in the memory.

[Operation] That is, in the present invention, a plurality of backup pins for backing up by contacting the back surface of the printed circuit board which is transported and supported between the pair of left and right substrate transport chutes are planted on the upper surface of the backup base, Only by automatically raising and lowering the base based on the board thickness stored in the memory in accordance with the type of printed circuit board to be backed up selected by an operator or the like by the lifting control means, etc. Each backup pin is positioned and adjusted to a predetermined contact position for each different printed circuit board, so that it is not necessary to exchange backup pins for printed boards having different thicknesses.

Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

As shown in FIGS. 1 and 2, (1) in the figure is an automatic adhesive dispenser for applying an adhesive for temporarily fixing a chip component (not shown) at a predetermined position on a printed circuit board (P). The main body (2) is an application head arranged on the upper part of the main body (1) of the automatic adhesive applicator.

The coating head (2) includes a holder (3), an adhesive container (4) pressurized by a pressure source (not shown) supported by the holder (3), and an adhesive container (4). ), An application nozzle (5) which is a vertically movable member formed at the tip, a guide shaft (6) for guiding the holder (3) in the vertical Z direction, and the guide shaft (6). A feed screw shaft (7) for moving the holder (3) up and down,
The feed screw shaft (7) is composed of a servomotor (9) for driving the forward and reverse rotation of the feed nozzle shaft (5) via pulleys (8a) and (8a) and a belt (8b) to move the application nozzle (5) up and down.

Reference numeral (10) in the figure denotes a substrate positioning device arranged below the coating head (2). The substrate positioning device (10) moves in the X direction via a base (11), a first guide rail (12), a slider (13) and a servomotor (14) on the base (11). An X-direction moving table (15) provided so as to be movable, and a second guide rail (16), a slider (17) and a servomotor (18) are moved on the X-direction moving table (15) in the Y direction. The XY table (20) is constituted by the Y-direction moving table (19) placed as possible.

A substrate support table (21) is provided on the XY table (20), and the substrate support table (21) is vertically moved by a first lifting / lowering device (23) via a guide shaft (22). The first lifting / lowering device (23) includes a pressing lever (25) that rotates vertically about a support shaft (24) and a pressing lever (25). A driving cylinder (26) for pushing up and rotating in the vertical direction; and a pressing shaft (2) provided at a free end of the pressing lever (25) and pressed against a lower portion of the substrate support table (21).
7).

Further, in the figure, reference numerals (28) and (28) denote a pair of left and right substrate transfer chutes installed on the substrate support table (21) so as to face each other.
9) (30) (30) (3)
0) is formed, and between the transport paths (30) and (30), as shown by the solid arrows in FIG.
The printed circuit board (P) conveyed from 0) via the conveyance belt (41) is conveyed and supported. In addition,
In the figure, reference numerals (42) and (42) denote downstream chutes installed on the downstream side of the transport paths (30) and (30). The downstream chutes are provided from the transport paths (30) and (30) via transport belts (29) and (29). The printed circuit board (P) to which the adhesive has been applied is conveyed to a next automatic chip component mounting machine (not shown) via a conveyor belt (43).

In the drawing, reference numeral (50) denotes a substrate support table (21) corresponding to the space between the pair of left and right substrate carrying / chutes (28) (28).
This is the substrate backup device installed above.

As shown in FIG. 3, the substrate backup device (50) includes a backup base (51) including a hollow portion (52).
And a plurality of mounting holes (53) formed in the upper surface of the backup base (51) so as to communicate with the hollow portion (52).
, And a plurality of backup pins (54), (56), which are implanted in the respective mounting holes (53) so as to be detachable and replaceable by screwing or the like. , Each of these backup pins (54) (56)
Is a suction backup pin (54) for sucking and holding a printed circuit board (P) having a suction function described later, in which a through passage (55) communicating with a hollow portion (52) of the backup base (51) is formed. And a backup pin (56) for supporting the mere printed circuit board (P) are appropriately mixed as necessary. By adjusting the number of these combinations, the suction force of the printed circuit board (P) can be reduced. The backup pin (5
4) Insert the plug (5) into the mounting hole (53) where the (56) is not planted.
7) is detachably sealed.

That is, each suction backup pin (54) implanted on the upper surface of the backup base (51) connects the hollow portion (52) of the backup base (51) to a vacuum drive source (not shown). Thus, the vacuum suction function has a suction function.

In the drawing, (60) is the substrate backup device (50)
A second elevating device that automatically raises and lowers the backup base in the vertical Z direction, a guide shaft (61) for guiding the backup base (51) in the vertical Z direction, and a guide shaft (61) A feed screw shaft (62) for raising and lowering the backup base (51), and a pulley (63)
(63) and a servo motor (65) driven forward and reverse through a belt (64).

This second lifting device (60) is, as shown in FIG.
By raising the backup base (51), the backup pin (54) for suction and the backup pin (56) for support are brought into contact with arbitrary locations on the bottom surface of the printed circuit board (P), and A backup pin (54) is used to hold the backup base by vacuum suction, thereby making it possible to absorb the downward warpage of the printed circuit board (P). The substrate transport chute (28) on the substrate support table (21)
The upper surface reference level of the printed circuit board (P) transported and supported by (28) is positioned, and the printed circuit board (P)
It is not necessary to replace the backup pin for each thickness.

In the figure, reference numeral (70) denotes a reflection type substrate detection sensor installed above the substrate support table (21), which is transported and supported by the substrate transport chutes (28) (28) on the substrate support table (21). The set completion state is detected by detecting the upper reference level of the printed circuit board (P).

That is, as shown in FIG. 5, the first elevating device (23) adjusts the substrate support table (21) to a predetermined reference level position by its lowering operation.
-The Y-table (20) can be moved and, as shown in FIG. 6, adhered to the printed circuit board (P) by the coating head (2) arranged on the upper part of the automatic adhesive coating machine main body (1). The application of the agent is performed.

By the way, a backup surface (55a) which is an open end of the through passage (55) of the suction backup pin (54)
As shown in Fig. 7 (a) and (b),
As shown in FIGS. 8 (a) and 8 (b), it is possible to perform counterboring, or as shown in FIGS. Different caps (58)
It is also possible to increase the suction force by increasing the suction area on the printed circuit board (P) by, for example, detachably mounting the print head.

In the above embodiment, the second elevating device (60) for elevating the substrate backup device (50) is automated. However, the servo motor (65) for automatically controlling the second elevating device (60) is used. Alternatively, as shown in FIG. 10, the operation may be performed manually by operating the handle (66).

Next, the operation of the substrate positioning device (10) incorporated in the adhesive application device and the like according to the present invention will be described with reference to FIGS. 11 to 15.

FIG. 11 shows a control block of the substrate positioning apparatus (10). A CPU (100), which is a central processing unit for performing control based on various data and information, stores a control program and the like in advance. ROM (200), RAM (300) for storing setting information, interface (400),
The input operation unit (500) and the monitor television (600) are connected respectively, and the input operation unit (500) has numeric keys (5
01), cursor key (502), set key (503),
The monitor television (600) includes various operation keys such as first and second screen selection keys (504) and (505) and a start key (506).

The interface (400) has XY
An XY table driving unit (401) for controlling the driving of the servomotors (14) and (18) of the table (20), respectively, and a driving cylinder of a first elevating device (23) for elevating the substrate support table (21). A backup base drive that drives and controls a servo motor (65) of a second lifting / lowering device (60) that raises / lowers a head drive unit (402) that drives and controls (26) and a backup base (51) of a substrate backup device (50). Unit (403), furthermore, a timer (404), a substrate detection sensor (70), a vacuum detection switch (405) for detecting a substrate suction state by the suction backup pin (54), and a hollow portion of the backup base (51). A vacuum solenoid valve (406) and an abnormality alarm (407) connected to a vacuum source for vacuuming (52) are connected to each other.

That is, in order to operate the substrate positioning device (10), a screen as shown in FIG. 12 is called on the monitor television (600) by operating a first screen selection key (504), and a cursor instruction is performed. An arbitrary display position is designated with the key (502), and data is set using the numeric keys (501).

In this manner, the application data of the adhesive application position in which the X coordinate data, the Y coordinate data, and the angle data are numerically represented for each step indicating the sequence of the application operation, and the substrate backup data of the substrate backup position are shown. Certain NC data (Numerical Control Data) is set for each type of printed circuit board (P) and stored in the RAM (300).

Then, the user operates the second screen selection key (505) to
3 Display the thickness data (PCB1 to N) for each type (No. 1 to N) of the printed circuit board (P) to be handled on the monitor television (600) as shown in FIG. The thickness of each printed circuit board (P) is set for each type using the numeric keys (501) and stored in the RAM (300).

In addition, a board is selected by designating “No.” with the cursor instruction key (502) and pressing the set key (503).

In this state, when the start key (506) is pressed, the operation starts, and first, the printed circuit board (P) is placed on the substrate transfer chutes (28) (28) on the substrate support table (21) of the substrate positioning device (10). ) Is transported via the upstream chutes (40) and (40), and is supported at a predetermined position.
At 0), the set completion state is detected.

FIG. 15 is a flowchart showing an operation control of the substrate positioning device (10). When the substrate detection sensor (70) detects a set completion state, the CPU (100) is stored in the RAM (300). The board thickness data in the PCB data is read, and the moving distance data in the Z direction is calculated from the board thickness data.

This travel distance data is stored in the backup pin (54) at the standby position (lower limit position) of the backup base (51).
The value obtained by subtracting the substrate thickness and a certain distance from the distance from the tip of (56)... To the contact surfaces (30a) (30a) of the transport chutes (30) and (30).

Then, based on the movement distance data in the Z direction calculated in this way, a movement command is output to the backup base drive unit (403) via the interface (400), and the backup base drive unit (403) drives the backup command. Backup base (51) of board backup device (50)
Is moved from the state shown in FIG. 2 to the state shown in FIG. 4, and the printed circuit board (P) supported between the pair of left and right board transfer chutes (28) on the board support table (21). On the back of each backup pin (54) (56)
And back it up.

When the printed board (P) is backed up by the backup pins (54) and (56), the first lifting device (23) drives the board support table as shown in FIG. The printed circuit board (P) supported between the pair of left and right board transfer chutes (28) and (28) is lowered.
Is lowered, and the XY table (20) can be moved.

In this state, the CPU (100) reads the step number of the board backup data, and then reads X,
The Y coordinate data is read and the XY table driving unit (40
The command is output to 1) to move the XY table (20) to the position of M104 on the substrate shown in FIG.

When the XY table (20) moves to the position of M104 and stops, a down command for sucking the substrate is output to the head driving unit (402), and the coating head (2) is lowered by the servo motor (9). Then, the printed circuit board (P) is pressed, and the vacuum solenoid valve (406) is turned on to open the valve, whereby the suction operation by the suction backup pin (54) is started. At this time, the timer (404) is set for one second, and after the time is up, a lifting command is output to the head driving unit (402) to raise the coating head (2). When the substrate is pressed, the adhesive storage container (4) is not pressurized by a pressurizing source.

Such a driving and pressing operation is similarly repeated in steps M105, M106 and M107 so as to be performed at other substrate back-up positions, and the CPU (100) detects the control command "B" shown in FIG. After that, if the vacuum detection switch (405) is in the ON state, that is, the suction state of the printed circuit board (P) by the backup pin (54) is maintained, as shown in FIG. Coating nozzle (5) operated and pressurized by a pressure source
Via a predetermined application position M1 to 10 on the printed circuit board (P)
The operation of applying the adsorbent to 3 is started. In this case, if the vacuum detection switch (405) is in the OFF state, that is, if the suction state of the printed circuit board (P) by the backup pin (54) is poor, the abnormal alarm (407) is activated and the operation is stopped, and the operation is stopped. To end.

In this way, when the operation of applying the adhesive to the printed circuit board (P) is completed and the CPU (100) detects the control command "E" in step M103, the vacuum solenoid valve (406) is turned off. To close the valve, the suction operation on the substrate is released, and the first lifting / lowering device (23) is driven to raise the substrate positioning device (10) to the initial origin position as shown in FIG. , Printed circuit board after applying adhesive (P)
Is discharged and conveyed to the downstream chutes (42) and (42).

That is, according to the present invention, since each of the backup pins (54) is provided with a vacuum suction function, when the printed board (P) is warped, the printed board supports the backup base (21). By raising to a certain reference level between the pair of left and right substrate transfer chutes (28) (28), the respective backup pins (54)
In step (56), push up the back side of the printed board in a concave shape,
Along with the suction action, the downward warpage of the printed circuit board can be absorbed.

If the printed circuit board (P) has a warpage,
The backup base (21) is raised to a certain reference level between the pair of left and right board transfer chutes (28) (28) supporting the printed board (P), and warps into a convex shape of the printed board (P). The upper surface is pushed down by, for example, an application nozzle (5) for applying an adhesive to a predetermined position on the printed circuit board, and supported by the respective backup pins (54) and (56) and the suction action of the backup pins (54) causes the printed circuit board to be attracted. Warpage can be absorbed.

In the above-described embodiment of the present invention, the adhesive nozzle is taken as an example, and the pressing operation of the printed circuit board (P) is performed by lowering the application nozzle (5) as a vertical moving member. Alternatively, another upper and lower member may be provided.

Furthermore, in the embodiment of the present invention, the adhesive application device is taken as an example, but the present invention can also be applied to an electronic component mounting device. In this case,
The pressing operation on the printed circuit board can be performed by a component suction nozzle or another vertically moving member instead of the application nozzle in the adhesive application device.

Further, the pressing of the coating nozzle (5) on the printed circuit board (P) has been described as an example with four points. However, any pressing position and number of pressing points may be set according to the size of the printed circuit board (P). it can.

[Effects of the Invention] As is apparent from the above description, the present invention includes a plurality of backup pins that abut against the back surface of the printed circuit board that is transported and supported between a pair of left and right substrate transport chutes and back up the backup pins. The backup base is implanted on the upper surface of the board, and the height of the back-up base is adjusted automatically automatically based on the board thickness stored in the memory according to the type of the printed board to be backed up by the elevation control means. Each backup pin is positioned and adjusted to a predetermined contact position for each printed circuit board having a different thickness, so that it is not necessary to exchange backup pins for printed boards having different thicknesses. In addition, the board thickness is stored for each type of printed circuit board, and when the type of printed circuit board is selected, etc., the elevation control means automatically controls the elevation, so that, for example, if an operator instructs, Even if the user does not remember the thickness, it is only necessary to select the type of the printed circuit board, and the operation is simplified.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a substrate backup device according to the present invention, FIG. 2 is an explanatory view showing the same in a longitudinal section, and FIG. FIG. 4 to FIG. 6 are explanatory views showing a substrate backup operation state. FIG. 7 (a) (b) to FIG. 9 (a) (b) are plane and longitudinal views showing the configuration of the backup pin opening end face. FIG. 10 is an explanatory view showing a main part longitudinal section of another embodiment of the substrate backup device. FIG. 11 is a control block diagram of the substrate backup control operation. FIG. 12 is a monitor. FIG. 13 is an explanatory view of the NC data in the board backup control operation displayed on the screen on the TV, FIG. 13 is an explanatory view showing the PCB data also displayed on the monitor TV screen, and FIG. Explanatory view showing a setting state of the application position and the substrate backup position of the adhesive on the printed board based on NC data that, FIG. 15 is a flowchart similarly showing a substrate backup control operation. (10) substrate positioning device, (20) XY table, (21) substrate support table, (23) first lifting device, (28) (28) substrate transport chute, (50) substrate backup device, (51) ) Backup base, (53) Mounting hole, (54) (56) Backup pin, (60) Second lifting device.

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 13/00-13/04

Claims (1)

(57) [Claims] 1. An XY table controlled to move in the XY directions, a substrate support table installed on the XY table so as to be able to move up and down, and installed on the substrate support table so as to face each other. A pair of left and right substrate transfer chutes between which the printed circuit board is transferred and supported, and a pair of left and right substrate transfer chutes mounted on a substrate support table corresponding to the space between the pair of left and right substrate transfer chutes. A backup base in which a plurality of backup pins for backing up by contacting the back surface of the supported printed circuit board are detachably implanted; a memory in which data relating to the thickness of each type of printed circuit board is stored; The backup pin is determined based on the board thickness stored in the memory according to the type of printed circuit board to be backed up. Substrate backup device being characterized in that a lifting control means for automatically lifting adjust backup base.