JP3138114B2 - Substrate positioning device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention changes the width of a chute by holding a variety of printed circuit boards on which a predetermined operation is to be performed by sandwiching the chute between a pair of chutes and moving a movable chute toward and away from a fixed chute. The present invention relates to a substrate positioning device that performs positioning by performing positioning.

[0002]

2. Description of the Related Art As a conventional technique of this kind, there is a technique described in Japanese Patent Application Laid-Open No. 59-29493 filed earlier by the present applicant. In this method, the movable chute of the board transfer chute is divided into an upper chute and a lower chute, and the upper chute is urged from the side by the urging force of a spring to slide in the direction of the fixed chute. When the substrate is supported, the movable chute presses the substrate against the fixed chute to perform positioning in the substrate width direction. In this apparatus, the applicant considered that the substrates conveyed from the upstream apparatus were sequentially conveyed onto the substrate conveyance chute using a conveyor so as to sequentially supply the substrates in order to increase the productivity. In this case, since the substrate is transported by the conveyor, the end surface of the substrate is caught on the substrate transport surface and cannot be transported. Therefore, the chute width is provided with a margin so that the board can easily enter, and the movable side chute is moved after the board is conveyed, so that both sides of the board with the outer shape reference are sandwiched and positioned.

However, with a fixed clamping force, for example, the clamping force is too strong for a thin substrate and the substrate warps, or a heavy substrate such as a thick substrate or a large substrate is used. On the other hand, the clamping force was weak, and the substrate was sometimes shaken or detached from the chute during the XY movement of the substrate during the work. In addition, even with the same substrate, positioning was sometimes insufficient due to variations in the width size.

[0004]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to make it possible to reliably position a substrate even if the width of the substrate varies.

[0005]

SUMMARY OF THE INVENTION Accordingly, the present invention provides various types of printed circuit boards on which predetermined operations are to be performed, which are sandwiched and supported by a pair of chutes, and wherein the movable chutes are moved toward and away from the fixed chutes. In a substrate positioning device that performs positioning by changing a width, a biasing unit that biases the movable chute in a fixed-side chute direction, and a storage device that stores data of a clamping force of the substrate by chutes corresponding to various substrates. And a control device for controlling the chute width based on the holding force data stored in the storage device to adjust the urging force of the urging means.

The present invention further comprises a pair of fixed-side chutes and movable-side chutes provided at positions facing each other in the width direction of the printed board, and a slide block provided on the movable-side chutes. Pressing means for pressing the substrate in the width direction via an elastic means, and moving the movable side chute toward and away from the fixed side chute via the drive motor when positioning the substrate in the width direction, so as to move the substrate on the movable side chute. In a substrate positioning device for detecting a movement operation of a slide block provided to a certain position by a detecting device, the moving amount data of the movable chute after the movable chute is moved to a certain position by the detecting device is stored. A storage device, which is based on the movement amount data stored in the storage device after the detection device detects that the movable chute has moved to a certain position. It can in which further provided with a control device for moving the movable chute.

Further, according to the present invention, a pair of a fixed-side chute and a movable-side chute for transporting a substrate provided at positions opposed to each other in the width direction of the printed board, and a slide block provided on the movable-side chute are provided on the substrate. Pressing means for pressing the substrate in the width direction via an elastic means, and moving the movable side chute toward and away from the fixed side chute via the drive motor when positioning the substrate in the width direction, so as to move the substrate on the movable side chute. A first storage device for storing movement distance data of the movable chute, wherein the first movement device stores movement distance data of the movable chute; and a movable chute by the detection device. A second storage device for storing the pushing amount data of the movable chute after moving to a certain position, and a first storage device for a certain substrate. The movable chute is moved based on the stored moving distance data to position the substrate, and for a certain substrate, after the movable device has been detected to have moved to a certain position by the detection device, the second chute is detected. And a controller for moving the movable chute further based on the pushing amount data stored in the storage device.

[0008]

According to the first aspect of the present invention, the control device changes the chute width based on the gripping force data of the chute stored in the storage device according to the various substrates to be positioned, and changes the chute width via the urging means. To adjust the holding force of the substrate by.
After the detection device detects that the movable chute has moved to a certain position, the control device further moves the movable chute based on the moving amount data of the movable chute stored in the storage device. The chute is moved to position the substrate.

Further, according to the third aspect of the present invention, the control device performs positioning by moving the movable chute on the basis of the movement amount data stored in the first storage device with respect to the certain substrate. After the detection device detects that the movable chute has moved to a certain position, the movable chute is further moved and positioned based on the pushing amount data stored in the second storage device.

[0010]

An embodiment of the present invention will be described below with reference to the drawings. (1) shown in FIG. 2 is a printed circuit board mounted on an XY table (4) that is moved XY by driving the X-axis motor (2) and the Y-axis motor (3). (5) is an application unit for applying the adhesive as an application agent stored in the syringe (7) via the nozzle (6) onto the substrate (1), and includes four nozzles (6). I have. A desired one of the four nozzles (6) is selectively fixed to the coating unit (5), and the coating unit (5) is moved up and down by a nozzle up / down mechanism (not shown) to move the substrate (1). The adhesive discharged downward and applied to the tip of the nozzle (6) is applied.

[0011] (11) is a supply conveyor for supplying the substrate (1) received from an upstream device (not shown) to the XY table (4), and (12) is an adhesive coated on the table (4). The discharge conveyor discharges the substrate (1) to a downstream device. (21) is a substrate positioning mechanism arranged on the XY table (4). (22) and (23) constitute a board transfer section of an XY table (4) that guides while supporting both side ends of the board (1) transferred from the supply conveyor (11) to the conveyor (24). As shown in FIG. 6, one fixing block (22) is a pair of fixing blocks, and one fixing block (22) is on the upper part of a fixing plate (26) having a U-shaped cross section, and the other fixing block (23) is a bottom part of the fixing plate (26). It is provided above a movable plate (28) which is moved via a linear guide (27) by a moving mechanism described later.

A part of the fixed block (23) on the movable plate (28) side is constituted by a slide block (29). As shown in FIG. 3, the slide block (29) is in a state where the pins (31) set up on the movable plate (28) are inserted into the respective elongated holes (30) formed in the slide block (29). The fixed plate (26) is compressed by a compression spring (33), one end of which is in contact with the slide block (29) from the side, and the other end is in contact with an inverted L-shaped mounting piece (32) provided on the side of the movable plate (28). ) So as to be movably attached to the movable plate (28). The slide block (29) is prevented from falling out of the pin (31) by a stopper (not shown).

Further, the side surface of the slide block (29) swings around a light-shielding plate swinging fulcrum (36) erected on a fulcrum bearing (35) projecting from the side surface of the movable plate (28). A light shielding plate (37) is abutted as much as possible. The light shielding plate (37) is provided with a compression spring receiver (39) provided at one end thereof so that the contact portion (38) is always in contact with the slide block (29).
Is urged by a compression spring (41) inserted into an insertion hole (40) formed in the side surface of the.

FIG. 4 (43) shows a substrate positioning sensor composed of a transmission type photo sensor. The light projected from the light projecting section (56) in a state where the substrate (1) is not on the XY table (4). The light receiving unit (57) is shielded from light by the light shielding plate (37).
Is not received. Reference numeral (44) denotes a pulse motor of a moving mechanism for moving the movable plate (28), and the bearing (45) is driven by driving the motor (44).
The ball screw (46) supported by the fixed plate (26) rotates through the movable plate (28) to which the slider portion (47) is fixed is guided by the linear guide (27) to be horizontal in the substrate width direction. Be moved.

(48) The fixed block (22) (2)
3) A backup base that presses a large number of backup pins (49) against the back surface of the substrate (1) supported by the substrate (1) so that, for example, the substrate (1) is horizontally supported even if it is warped downward. It is. Further, as shown in FIG. 7, a substrate (1) for positioning on the basis of a hole is provided on the base (48).
The positioning pins (51) for positioning, which enter into the positioning holes (50) formed in the substrate, can also be provided on the upstream side and the downstream side in the substrate transport direction, respectively.

(52) is movable to detect that the fixed block (23) and the slide block (29) do not contact the backup pin (49) on the backup base (48) when the movable plate (28) moves. A pair of backup pin detection sensors provided at the upstream end and the downstream end of the plate (28) in the substrate transport direction,
The light projected from 1) is blocked by the backup pin (49) and is not received by the light receiving section (not shown), so that the backup pin (49) is detected.

Reference numeral (53) denotes a substrate detection sensor for detecting that the substrate (1) has passed a predetermined position on the XY table (4). The light is reflected by the substrate (1), and the reflected light is detected by the light receiving unit. Reference numeral (54) denotes a substrate stopper which comes into contact with the rear end of the substrate (1) and regulates the return operation of the substrate (1), and is moved up and down by a vertical mechanism (not shown).

(65) shown in FIG.
R as a storage device for storing various data such as C data
In the AM, reference numeral (67) denotes a CPU as a control device that controls the coating device in accordance with a ROM (66) as a storage device for storing various programs related to the coating operation. (6
Reference numeral 8) denotes an operation unit which includes a start key (69) and an operation key (7).
0), stop key (71), pause key (72), return key (73), execute key (74), all-origin return key (75)
It has.

Reference numeral (77) denotes a touch panel switch connected to the interface (76), which is mounted on the screen of the CRT (78) via a mounting tool (not shown). The touch panel switch (77) has a transparent conductive film coated on the entire surface of the glass substrate, and electrodes are printed on four sides. For this reason, a very small current is applied to the surface of the touch panel switch (77), and when the operator touches, the current changes on the four electrodes, and the coordinate value of the touch is calculated by the circuit board connected to the electrodes. Therefore, if the coordinate value matches the coordinate value in the coordinate value group stored in advance in the RAM (65) as a switch unit for performing a certain operation, the operation is performed.

Hereinafter, various setting operations will be described. First, when the power is turned on, the CRT (78) displays an initial screen shown in FIG. On the initial screen, operation switches for respective items of “production operation”, “setup work”, “data editing”, “device maintenance”, and “environment setting” are displayed. Each operation switch section is color-coded for each item and is displayed in a double frame, and a touch panel switch (77) is attached on the upper surface thereof.

The operation switch section of "production operation" is used to start production operation, specify production operation steps, modify production model data,
Touch when performing operations such as teaching ... The operation switch unit is displayed in green. The operation switch section of "setup work" is touched when performing operations such as model switching, home return operation, manual operation, inching operation, and the like.
The operation switch unit is displayed in yellow-green.

The operation switch section of "data edit" is provided by NC
Touch to perform operations such as data editing, device setting data editing, offset data editing, etc. The operation switch unit is displayed in blue. The operation switch section of “apparatus maintenance” is touched when performing operations such as apparatus operation information, information redisplay, apparatus diagnosis, test confirmation, teaching, and the like. The operation switch unit is displayed in yellow.

The operation switch section of "environment setting" is touched when operations such as tower light setting, buzzer setting, calendar setting, etc. are performed. The operation switch unit is displayed in gray. Here, the operation switch of "data edit" is touched, and the "data edit" screen shown in FIG. 11 is displayed. This screen contains "NC data", "device setting data", "test operation data" and "offset data".
The operation switch section for each item is displayed.

The operation switch section of "NC data" includes operation data, coating condition data, coating data,...
Touch to perform setting operations such as. The operation switch section of “device setting data” is used to set the device timer, set the front and back process mode, set the device address, set the calendar,
Touch to perform setting operations such as.

The operation switch section of the "test operation data" is used to select the head rotation operation, to ignore the front and rear process signals, and to select ...
Touch to perform setting operations such as. The operation switch section of “offset data” is touched when performing an operation for setting such as device offset, nozzle offset, nozzle holder offset... When the operation switch section of “apparatus setting data” is touched on the screen shown in FIG. 11, the “apparatus setting data” screen shown in FIG. 12 is displayed. On this screen, "apparatus timer setting", "back and forth process mode setting", "apparatus address setting", "substrate positioning reference setting", "application nozzle setting", "application pressure setting",
Each operation switch section of “nozzle acceleration / deceleration setting” is displayed.

On this screen, when the operation switch section of "Set substrate positioning reference" is touched, a screen of "Set substrate positioning reference" shown in FIG. 13 is displayed. On this screen,
"PCB positioning reference", "PCB positioning method selection",
Each device switch section of "selection of substrate holding force" is displayed.
Here, when the operation switch section of “substrate positioning reference” is touched, the switch section is lit and “substrate positioning reference: −−−−” is displayed on the data setting display section at the lower left of the screen.
(The setting conditions up to now are displayed. No data is currently set.) "Is displayed, and the operation switches of" outer shape reference "and" hole reference "are displayed at the lower right of the screen. Then, when the operation switch of the desired “outline reference” is touched, the “−−−−” portion of the display section is displayed as “outline reference”. "Reference" is set, and the switch section is displayed as "Outline reference" (see FIG. 13). As a result, at the time of positioning the substrate (1), the positioning is performed with reference to the end surface of the substrate (1) based on the set “outer shape reference”. When “hole reference” is set, the board (1)
The positioning based on the positioning hole (50) is performed.

Next, when the operation switch section of "selection of substrate positioning method" is touched, the switch section is illuminated and the display for data setting at the lower left of the screen is displayed. The setting conditions are displayed. No data is currently set.) ”Is displayed, and“ Standard ”and“ Variable ”are displayed in the lower right of the screen in place of the“ Outline reference ”and“ Hole reference ”operation switches. Are displayed. When a desired "standard" operation switch is touched, the "----" portion of the display section is displayed as "standard", and the "standard" is set by touching a "set" key at the lower right. Is set, and the switch is set to "standard"
Is displayed (see FIG. 14). Thereby, the substrate (1)
Based on the "standard" set at the time of positioning, the moving amount data of the movable plate (28) at the time of positioning (the data is the gap between the substrate (1) and the movable plate (28), the movable plate (28) and the substrate (1). ) Is selected from the preset data, and the substrate (1) is positioned with a constant moving amount. When "variable" is set, the position of the substrate (1) is determined by varying the amount of movement of the movable plate (28) according to the width of the substrate (1). That is,
The board (1) is pushed in by the set pushing amount after the detection of the board positioning sensor (43). Thereby, the substrate (1)
Accurate positioning can be performed even if the width size of the sheet varies.

Next, when the operator touches the operation switch section of "selection of board holding force", the switch section is lit, and "selection of board holding force: ---" is displayed on the data setting display section at the lower left of the screen.
--- (The current setting conditions are displayed. No data is currently set.) "Is displayed, and" Low "is displayed at the lower right of the screen in place of the" standard "and" variable "operation switches. , "Standard" and "strong" are displayed. When a desired "standard" operation switch is touched, the "----" portion of the display section is displayed as "standard", and the "standard" is set by touching a "set" key at the lower right. It is set, and the switch section is displayed as "standard" (see FIG. 15). Thus, when the substrate (1) is positioned, further pressing after the detection of the substrate positioning sensor (43) is performed by the preset data based on the set “standard”. Similarly, when "weak" or "strong" is set, the amount of movement less or more than "standard" is further pushed in after the detection of the sensor (43) based on the set data, so that reliable positioning is achieved. I can do it. That is, for example, the substrate (1) having a small substrate thickness is set to “weak” to prevent the substrate (1) from being warped by being pushed in with weaker positioning, or a substrate having a large substrate size. For a heavy substrate (1) such as a substrate or a thick substrate (1), "strong" is set to strengthen the positioning, and the substrate (1) shakes or comes off when the XY table (4) moves. To prevent

The operation will be described below. First, when the power is turned on, the CRT (65) displays an initial screen shown in FIG. Touching the green “production operation” operation switch on this initial screen displays the “production operation (application)” screen shown in FIG. 9. When the start key (19) is pressed on this screen, the "stop" screen shown in FIG. 9 is replaced with the "running" screen shown in FIG. 10, and the production operation by the coating apparatus is started.

Hereinafter, the positioning operation of the substrate (1) will be described with reference to FIGS. When the production operation is started, the XY table (4) is raised to the substrate transfer level (the height origin position detected by a sensor (not shown)). At this time, the positioning mechanism (21) is in an open state (the substrate transport unit is wider than the substrate width so that the transported substrate (1) can enter).

Next, the substrate (1) is transported from the supply conveyor (11) to the XY table (4) via the conveyor (24), and is passed by the substrate detection sensor (53). Is detected, the driving of the supply conveyor (11) and the conveyor (24) is stopped, and the substrate stopper (54) is placed at a predetermined position of the conveyor (24) in order to position the substrate (1) with respect to the rear end. It is lowered by the vertical mechanism. After the stopper (54) is lowered, the conveyor (24) is driven to rotate in the reverse direction, the rear end of the substrate (1) is regulated by the stopper (54), and its movement is stopped. At this time,
A timer (not shown) is set for a time sufficient for the substrate (1) to come into contact with the stopper (54), and after the timer expires, the reverse rotation of the conveyor (24) is stopped. Further, the presence of the substrate (1) is detected by the substrate detection sensor (53).

The substrate stopper (54) is raised, and the substrate transport section of the XY table (4) is lowered by the vertical mechanism. At this time, the substrate (1) is backed up by the backup pins (49) on the backup base (48), and after the substrate (1) is lowered to the lower limit position, the substrate (1) is positioned. The “substrate positioning reference” set on the “substrate positioning reference setting” screen of FIGS. 13, 14, and 15 is “outer shape reference”, “substrate positioning method selection” is “standard”, and “substrate holding force” is “ Since the "standard" is set, the moving amount data of the movable plate (28) meeting the conditions is stored in the ROM (66) from the moving amount data of the movable plate (28) set in the ROM (66).
Reading from (66), the movable plate (28) is moved by a predetermined amount X1. That is, the pulse motor (44) is driven for a designated number of pulses, and the ball screw (4) is driven by this drive.
6) is rotated and guided by the linear guide (27) to move the movable plate (28) in a direction to narrow the space between the fixed blocks (22) and (23). At this time, the movable plate (2
The fixed block (23) and the slide block (29) on the movable plate (28) are also moved by the movement of 8), but the slide block (29) supporting the substrate (1) is a substrate as shown in FIG. Since the movement is regulated by (1), only the fixed block (23) is moved from a certain position. The fixed block (23) continues to move with respect to the slide block (29) whose movement is restricted at a certain position as shown in FIGS. 3 to 17, and further, as shown in FIGS. The light-shielding plate (37) in contact with the side surface is rotated clockwise about the light-shielding plate swinging fulcrum (36), and the light is shielded by the light-shielding plate (37) as shown in FIG. When the light from the substrate positioning sensor (43) that has been
(67) judges that the positioning of the substrate (1) has been completed,
The CPU (67) starts the application operation.

The coating operation is performed by the RAM (65) shown in FIG.
Is performed based on the NC data related to the coating operation stored in the. That is, in step 0001, the X coordinate data [m
m] or the coordinate position (X1, Y1) on the substrate (1) indicated by the Y coordinate data [mm] at Z (angle data) Z1 under the application condition indicated by the application condition data shown in FIG. . D (application condition data number) of NC data in FIG.
Is set to 001, and the nozzle number 1, gauge 1, and the like set to 001 corresponding to the application condition data in FIG.
Based on the application time T1, the adhesive is applied to the nozzle (6) of the nozzle number 1 with the pressure of the gauge 1 for the application time T1 and the syringe (7).
Air is supplied from a supply source via an air tube (not shown), and a predetermined amount of adhesive is discharged from the nozzle (6) to apply the adhesive on the substrate (1).

Next, at step 0002, the NC of FIG.
The syringe (7) is pressurized at the coordinate position (X2, Y2) on the substrate (1) indicated by the data at the Z (angle data) Z2 to the nozzle (6) of the nozzle number 1 with the pressure of the gauge 2 for the application time T2. Then, the discharged adhesive is applied. Hereinafter, similarly, the coating operation after step 0003 is continued.

When the coating on the substrate (1) is completed, the movable plate (28) is moved to extend the fixed block (23) and the slide block (29) chute by a fixed moving amount X1 to extend the substrate (1). Release the positioning and prepare for receiving the next substrate (1). Further, the positioning of the substrate (1) was not completed (the substrate positioning sensor (4
The repositioning operation in the case where the presence of the substrate cannot be detected due to 3)) will be described.

First, as a positioning error, the CPU (67) drives the motor (44) in the reverse direction to rotate the positioning mechanism (2).
After releasing 1), the XY table (4) is raised.
Then, the movable plate (28) is moved until the light from the substrate positioning sensor (43) is transmitted, and the fixed block (23) and the slide block (29) are moved in the narrowing direction. At this time, the backup pin detection sensor (5
In 2), the fixed block (23) and the slide block (2)
9) detects whether it comes into contact with the backup pin (49), and when it is detected, the apparatus is abnormally stopped. Also,
Whether or not the amount of movement of the movable plate (28) has exceeded the maximum distance (preset) is also detected based on the number of pulses.

When the substrate detection is completed without abnormal stop, the fixed block (23) and the slide block (29) are further selected from the position via the movable plate (28) from the setting of "selection of substrate holding force". The data corresponding to the condition is read out from the ROM (66), and the data is pushed in by the pushing amount. When the pushing is completed (substrate positioning is completed) without being detected by the backup pin detection sensor (52), the XY table (4) is lowered to start the coating operation as described above. When the coating on the substrate (1) is completed, the fixed block (23) and the slide block (29) are expanded via the movable plate (28) by a reduced amount at the time of repositioning, and the next substrate (1) is received. Prepare.

Next, a description will be given of a positioning operation when a substrate (1) different from the above-mentioned substrate (1) is handled.
In this case, as described above, on the “initial screen” screen shown in FIG. 8, by touching the operation switch section of “data editing”, the “data editing” screen shown in FIG. Touch the operation switch of "Setting data"
The screen of “device setting data” shown in FIG. 2 is displayed. On this screen, the operator touches the operation switch section of "Set substrate positioning reference" to display the screen of "Set substrate positioning reference" shown in FIG.

On this screen, touch the operation switch section of "substrate positioning reference" to turn on the switch section, and display "substrate positioning reference: outer shape reference" on the data setting display section at the lower left of the screen. "Outline reference"
Display each operation switch section of “hole reference”. And
Touch the desired “hole reference” operation switch section, display the “outline reference” part of the display section as “hole reference”, and touch the “setting” key at the lower right to change the “hole reference” to “hole reference”. Then, the switch section is displayed as "hole reference" (see FIG. 22). Then, as shown in FIG. 7, the positioning pins (51) are erected on the backup base (48). As a result, when positioning the substrate (1), the positioning is performed based on the set “hole reference” based on the positioning holes of the substrate (1).

Next, the operator touches the operation switch section of "selection of board positioning method" to light the switch section, and displays "selection of board positioning method:" on the data setting display section at the lower left of the screen.
"Standard" and "Outline reference" in the lower right corner of the screen.
"Standard" instead of "Hole-based" operation switches
Each of the “variable” operation switches is displayed. Then, by touching a desired “variable” operation switch section, the “standard” portion of the display section is displayed as “variable”, and the “set” key is set to “variable” by touching a lower right “setting” key. The switch is displayed as "variable" (see FIG. 23).
Thereby, based on the "variable" set at the time of positioning the substrate (1), the moving amount of the movable plate (28) is variably set for each substrate (1) at the time of positioning as shown in FIGS. Is performed. That is, the substrate (1)
Even if there is a variation in the width size of the substrate, it moves until the substrate positioning sensor (43) detects it (the slide block (29) comes into contact with the substrate (1)), and then performs a predetermined pushing operation to ensure the operation. The substrate (1) is positioned.

Next, the operator touches the operation switch section of "selection of board holding force" to light the switch section, and displays "selection of board holding force: standard" on the data setting display section at the lower left of the screen.
Is displayed, and "low", "standard", and "strong" operation switches are displayed at the lower right of the screen in place of the "standard" and "variable" operation switches. And the desired "strong"
Touch the operation switch section of "
The part is displayed as “strong”, and “strong” is set by touching the “set” key at the lower right, and the switch unit is displayed as “strong”. Thereby, based on the "strong" set at the time of positioning of the substrate (1), the substrate positioning sensor (43) is moved by the preset pushing amount data.
Further pressing after the detection of is performed.

When the production operation is started, when the substrate (1) is conveyed onto the XY table (4) as described above, the positioning of the substrate (1) is performed. FIG. 22, 2
The "board positioning reference" set on the screen of "board positioning reference setting" of 3, 24 is "hole reference", "board positioning method selection" is "variable", and "board holding force" is "strong". Since the setting has been made, the moving amount data of the movable plate (28) meeting this condition is read out of the ROM (66) from the moving amount data of the movable plate (28) set in various ways stored in the ROM (66). The movable plate (2
8) is a predetermined amount X2 (X2 is larger than X1 as shown in FIG. 7, even if the width of the substrate (1) is the same,
Since a gap d is formed between the substrate and the end face of the substrate (1), the length is shorter by d. ) Will be moved. That is, the substrate positioning sensor (4
Until the light of 3) is transmitted, the fixed block (23) and the slide block (29) are moved in the narrowing direction via the movable plate (28). At this time, the backup pin detection sensor (52) detects whether or not the fixed block (23) and the slide block (29) are in contact with the backup pin (49). If the detection is detected, the apparatus is abnormally stopped. Also, whether or not the moving amount of the movable plate (28) exceeds the maximum distance is detected based on the number of pulses, and if it exceeds, the operation is abnormally stopped.

When the substrate detection is completed without abnormal stop, the movable plate (28) is further pushed from that position by the pushing amount selected from the setting of "selection of substrate holding force". When the pushing is completed (substrate positioning is completed) without being detected by the backup pin detection sensor (52), the XY table (4) is lowered to start the coating operation as described above. When the coating on the substrate (1) is completed, the movable plate (2
8) is moved to expand the fixed block (23) and the slide block (29) to prepare for receiving the next substrate (1).

In this embodiment, the substrate pressing force has three levels, but the present invention is not limited to this, and an arbitrary number can be set. Various data relating to the amount of movement of the movable plate (28) may be stored in the RAM (65) so that it can be rewritten. Further, the present invention is not limited to the coating apparatus, and may be applied to a screen printer for printing cream solder on a substrate via a screen, or a component mounting apparatus for mounting chip-shaped electronic components on a substrate.

[0045]

The substrate can be reliably positioned even if the width of the same substrate varies.

[Brief description of the drawings]

FIG. 1 is a configuration circuit diagram of a coating apparatus.

FIG. 2 is a front view of a coating apparatus.

FIG. 3 is a plan view of a substrate positioning mechanism.

FIG. 4 is a front view of a substrate positioning mechanism.

FIG. 5 is a side view of the substrate positioning mechanism.

FIG. 6 is a side view of the substrate positioning mechanism.

FIG. 7 is a side view of the substrate positioning mechanism.

FIG. 8 is a screen displayed via a touch panel switch.

FIG. 9 is a screen displayed via a touch panel switch.

FIG. 10 is a screen displayed via a touch panel switch.

FIG. 11 is a screen displayed via a touch panel switch.

FIG. 12 is a screen displayed via a touch panel switch.

FIG. 13 is a screen displayed via a touch panel switch.

FIG. 14 is a screen displayed via a touch panel switch.

FIG. 15 is a screen displayed via a touch panel switch.

FIG. 16 is an enlarged view of a main part of the substrate positioning mechanism.

FIG. 17 is an enlarged view of a main part of the substrate positioning mechanism.

FIG. 18 is an enlarged view of a main part of the substrate positioning mechanism.

FIG. 19 is an enlarged view of a main part of the substrate positioning mechanism.

FIG. 20 is a screen displayed via a touch panel switch.

FIG. 21 is a screen displayed via a touch panel switch.

FIG. 22 is a screen displayed via a touch panel switch.

FIG. 23 is a screen displayed via a touch panel switch.

FIG. 24 is a screen displayed via a touch panel switch.

FIG. 25 is a flowchart related to a substrate positioning operation.

FIG. 26 is a flowchart relating to a substrate positioning operation.

FIG. 27 is a flowchart relating to a substrate positioning operation.

FIG. 28 is a flowchart relating to a substrate positioning operation.

FIG. 29 is a flowchart relating to a substrate positioning operation.

FIG. 30 is a flowchart relating to a substrate positioning operation.

FIG. 31 is a flowchart relating to a substrate positioning operation.

[Explanation of symbols]

 (1) Printed circuit board (4) XY table (5) Coating unit (6) Nozzle (21) Substrate positioning mechanism (65) RAM (66) ROM (67) CPU

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-53-63576 (JP, A) JP-A-59-29493 (JP, A) JP-A-3-217097 (JP, A) JP-A-4- 6900 (JP, A) JP-A-1-99300 (JP, A) JP-A-5-55787 (JP, A) JP-A-3-223012 (JP, A) JP-A-2-303734 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (3)

(57) [Claims] 1. A board for positioning by changing the width of a chute by holding and moving a movable chute toward and away from a fixed chute, while holding and supporting a variety of printed circuit boards on which predetermined operations are performed. In the positioning device,
Urging means for urging the movable chute in the direction of the fixed chute, a storage device for storing clamping force data of the substrate by chutes corresponding to various substrates, and a clamping device based on the clamping force data stored in the storage device. A control device for controlling the chute width to change the urging force by the urging means. 2. A pair of a fixed-side chute and a movable-side chute for transporting a substrate, which are provided at positions facing each other in the width direction of the printed board, and a slide block provided on the movable-side chute in a width direction of the substrate. And a pressing means for pressing via a resilient means. When positioning the substrate in the width direction, the movable chute is moved toward and away from the fixed chute via a drive motor and provided on the movable chute. In a substrate positioning device for detecting a moving operation of a slide block to a certain position by a detecting device, a storage device for storing moving amount data of the movable chute after the movable chute is moved to a certain position by the detecting device. After the detection device detects that the movable chute has moved to a certain position, the movable chute is further moved based on the movement amount data stored in the storage device. A substrate positioning device, comprising: a control device for moving a chute. 3. A pair of a fixed-side chute and a movable-side chute for transporting a substrate provided at positions facing each other in the width direction of the printed board, and a slide block provided on the movable-side chute in a width direction of the board. And a pressing means for pressing via a resilient means. When positioning the substrate in the width direction, the movable chute is moved toward and away from the fixed chute via a drive motor and provided on the movable chute. In a substrate positioning device for detecting a movement operation of a slide block to a certain position by a detection device, a first storage device for storing moving distance data of the movable chute, and a position where the movable chute is located by the detection device A second storage device for storing data of the amount of pushing of the movable chute after moving to a certain position, and for a certain substrate, a movement stored in the first storage device. The movable chute is moved based on the distance data to position the substrate, and for a certain substrate, after the movable chute is detected to have moved to a certain position by the detection device, the second storage device A substrate positioning device, further comprising: a control device for further moving the movable chute based on the stored pushing amount data.