JPH06326498A - Board positioning equipment - Google Patents

Abstract

PURPOSE:To enable the positioning of a board when the width size of the board has irregularity. CONSTITUTION:On the basis of clamping force data of a moval plate which data are stored in an ROM for a various kinds of boards 1 to be subjected to positioning, a CPU 67 changes the widths of a fixed block 22 and a slide block 29, and adjusts, via compression springs 33, the force of the fixed block 22 and the slide block 29 which clamps the board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention supports various printed circuit boards on which a predetermined work is performed by sandwiching them between a pair of chutes and moving the movable chutes to and from the fixed chutes to change the chute width. The present invention relates to a substrate positioning device for performing positioning.

[0002]

2. Description of the Related Art As a conventional technique of this kind, there is a technique described in Japanese Patent Laid-Open No. 59-29493 filed by the present applicant. This is because the movable side chute of the substrate transfer chute is divided into an upper chute and a lower chute, and the upper chute is biased from the side surface by a biasing force of a spring and slid in the fixed chute direction, and the substrate is transferred to the substrate chute. When the substrate is supported, the movable side chute presses the substrate against the fixed side chute side for positioning in the substrate width direction. In this apparatus, the applicant considered that the substrate transported from the upstream apparatus is sequentially transported onto the substrate transport chute by using a conveyor so that the substrates are sequentially fed in order to improve productivity. In this case, since the substrate is conveyed by the conveyor, the end face of the substrate is caught on the substrate conveying surface and cannot be conveyed. Therefore, the chute width is provided with a margin so that the substrate can easily enter, and the movable side chute is moved after the substrate is conveyed, so that both side surfaces of the substrate of the outer shape reference are clamped and positioned.

However, with a constant clamping force, for example, the clamping force is too strong for a thin substrate, and the substrate warps, or for a heavy substrate such as a thick substrate or a large substrate size. On the other hand, the clamping force was weak, and the substrate sometimes swayed during the XY movement of the substrate during the work, or sometimes came off the chute. In addition, even on the same substrate, positioning may be insufficient due to variations in width size.

[0004]

SUMMARY OF THE INVENTION Therefore, it is an object of the present invention to reliably position a substrate even if the width of the substrate varies.

[0005]

Therefore, according to the present invention, various printed circuit boards to be subjected to a predetermined work are sandwiched and supported by a pair of chutes, and the movable chute is moved toward and away from the fixed chute. In a board positioning device for changing the width and performing positioning, a urging means for urging the movable side chute in the fixed side chute direction, and a storage device for storing the board clamping force data by the chutes corresponding to various boards. And a control device for adjusting the urging force by the urging means by controlling so as to change the chute width based on the clamping force data stored in the storage device.

Further, according to the present invention, a pair of fixed and movable chutes for carrying substrates, which are provided at positions opposed to each other in the width direction of the printed circuit board, and a slide block provided on the movable chute, are provided on the substrate. A pressing means for pressing the movable side chute in the width direction through an elastic means, and when the substrate is positioned in the width direction, the movable side chute is moved toward and away from the fixed side chute via a drive motor. In a substrate positioning device for detecting a movement of a slide block provided to a certain position by a detecting device, the moving amount data of the movable side chute after the movable side chute is moved to a certain position by the detecting device is stored. Based on the storage device and the movement amount data stored in the storage device after it is detected by the detection device that the movable side chute has moved to a certain position. It can in which further provided with a control device for moving the movable chute.

Further, according to the present invention, a pair of fixed-side chutes and a movable-side chute for carrying the substrate, which are provided at positions facing each other in the width direction of the printed circuit board, and a slide block provided on the movable-side chute are provided on the board. A pressing means for pressing the movable side chute in the width direction through an elastic means, and when the substrate is positioned in the width direction, the movable side chute is moved toward and away from the fixed side chute via a drive motor. In a substrate positioning device for detecting a movement of a slide block provided in a position to a certain position by a detection device, a first storage device for storing movement distance data of the movable side chute, and a movable side chute by the detection device. A second storage device for storing the pushing amount data of the movable side chute after moving to a certain position, and the first storage device for a certain substrate. The movable side chute is moved based on the stored movement distance data to position the substrate, and the detection device detects that the movable side chute has moved to a certain position on the substrate. And a control device for further moving the movable side chute based on the pushing amount data stored in the storage device.

[0008]

According to the structure of claim 1, the control device changes the chute width based on the clamping force data of the chute stored in the storage device according to the various substrates to be positioned, and the chute is operated via the biasing means. Adjust the clamping force of the board.
Further, according to the configuration of claim 2, after the detection device detects that the movable side chute has moved to a certain position, the control device further moves based on the movement amount data of the movable side chute stored in the storage device. The chute is moved to position the substrate.

Further, according to the third aspect of the present invention, the control device moves the movable side chute based on the movement amount data stored in the first storage device for positioning the certain substrate, and at the same time, for the certain substrate. First, after the detection device detects that the movable side chute has moved to a certain position, the movable side chute is further moved based on the pushing amount data stored in the second storage device to perform positioning.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. Reference numeral (1) shown in FIG. 2 is a printed circuit board mounted on an XY table (4) which is moved in XY by driving the X-axis motor (2) and the Y-axis motor (3). Reference numeral (5) is a coating unit for coating the substrate (1) with an adhesive as a coating agent stored in the syringe (7) through the nozzle (6). The coating unit includes four nozzles (6). There is. One desired nozzle (6) of the four nozzles (6) is selectively fixed to the coating unit (5), and the coating unit (5) is moved up and down by a nozzle raising / lowering mechanism (not shown) to cause the substrate (1) to move. The adhesive is dropped down and applied to the tip of the nozzle (6).

Reference numeral (11) is a supply conveyor for supplying the substrate (1) received from an upstream device (not shown) to the XY table (4), and (12) is an adhesive applied on the table (4). It is a discharge conveyor that discharges the substrate (1) to the downstream side device. (21) is a substrate positioning mechanism arranged on the XY table (4). Reference numerals (22) and (23) constitute a substrate transfer section of the XY table (4) that guides while supporting both side ends of the substrate (1) transferred from the supply conveyor (11) to the conveyor (24). As shown in FIG. 6, one fixed block (22) is a pair of fixed blocks, and one fixed block (22) is above the fixed plate (26) having a U-shaped cross section, and the other fixed block (23) is a bottom portion of the fixed plate (26). It is provided on the upper part of the movable plate (28) which is moved via the linear guide (27) by a moving mechanism described later.

Further, a part of the fixed block (23) on the movable plate (28) side is constituted by a slide block (29). As shown in FIG. 3, the slide block (29) is in a state where the pins (31) erected on the movable plate (28) are inserted into the slots (30) formed in the slide block (29). , A fixed plate (26) by a compression spring (33) having one end coming from the side surface and the other end abutting against an inverted L-shaped mounting piece (32) provided on the side surface of the movable plate (28). ) Side, it is movably attached to the movable plate (28). The slide block (29) is prevented from coming off the pin (31) by a retaining member (not shown).

Further, the side surface of the slide block (29) is swung with a light shielding plate swinging fulcrum (36) standing on a fulcrum bearing (35) projecting from the side surface of the movable plate (28). A shading plate (37) is abuttable as much as possible. The light shielding plate (37) has a compression spring receiver (39) provided at one end thereof so that the contact portion (38) is always in contact with the slide block (29) and the fixed block (23).
Is urged by a compression spring (41) inserted in an insertion hole (40) formed in the side surface of the.

FIG. 4 (43) shows a substrate positioning sensor composed of a transmissive photosensor, wherein the light projected from the light projecting portion (56) in the state where the substrate (1) is not present on the XY table (4) is described above. The light receiving part (57) is shielded from light by the light shielding plate (37).
It is designed not to receive light. Reference numeral (44) is a pulse motor of a moving mechanism for moving the movable plate (28), and the bearing (45) is driven by the motor (44).
The ball screw (46), which is supported by the fixed plate (26) via the rotary plate, rotates, and the movable plate (28), to which the slider portion (47) is fixed, is guided by the linear guide (27) to be horizontal in the substrate width direction. Be moved.

(48) is the fixed block (22) (2)
A backup base that presses a large number of backup pins (49) on the back surface of the substrate (1) supported by 3) so that the substrate (1) is supported horizontally even if the substrate (1) is warped. Is. In addition, as shown in FIG. 7, the base (48) is a substrate (1) which is positioned on the basis of a hole.
The positioning pins (51) for positioning, which enter into the positioning holes (50) provided in the substrate, can be erected on both the upstream side and the downstream side in the substrate transport direction.

(52) is movable for detecting that the fixed block (23) and the slide block (29) do not come into contact with the backup pin (49) on the backup base (48) when the movable plate (28) moves. A pair of backup pin detection sensors provided at the upstream end and the downstream end of the plate (28) in the substrate transport direction are used for the light projecting unit (6
The light projected from 1) is blocked by the backup pin (49) and is not received by the light receiving portion (not shown), so that the backup pin (49) is detected.

Reference numeral (53) is a substrate detection sensor for detecting that the substrate (1) has passed a predetermined position on the XY table (4), and the light emitted from the light projecting unit located above the substrate transport level is detected. The reflected light is reflected by the substrate (1), and the reflected light is received by the light receiving portion, and is detected. Reference numeral (54) is a substrate stopper that comes into contact with the rear end of the substrate (1) and restricts the returning operation of the substrate (1), and is moved up and down by an up-and-down mechanism (not shown).

Reference numeral (65) shown in FIG. 1 indicates N relating to the coating operation.
R as a storage device for storing various data such as C data
In the AM, (67) is a CPU as a control device for controlling the coating device in accordance with a ROM (66) as a storage device for storing various programs related to the coating operation. (6
8) is an operating portion, which includes a start key (69) and an operation key (7
0), stop key (71), pause key (72), return key (73), execute key (74), return to all origin key (75)
Is equipped with.

Reference numeral (77) is a touch panel switch connected to the interface (76), which is mounted on the screen of the CRT (78) via a mounting tool (not shown). The touch panel switch (77) has a transparent conductive film coated on the entire surface of the glass substrate, and electrodes are printed on the four sides. Therefore, when an extremely small current is applied to the surface of the touch panel switch (77) and the operator touches it, the current changes in the electrodes on the four sides, and the coordinate values touched by the circuit board connected to the electrodes are calculated. Therefore, if the coordinate value matches the coordinate value in the coordinate value group stored in advance in the RAM (65) as a switch unit for performing a certain work, the work is performed.

Various setting operations will be described below. First, when the power is turned on, the CRT (78) displays the initial screen shown in FIG. On the initial screen, operation switch sections are displayed for each item of "production operation", "setup work", "data editing", "apparatus maintenance" and "environment setting". Each operation switch section is color-coded for each item and is displayed with a double frame, and a touch panel switch (77) is attached to the upper surface thereof.

The operation switch section of "production operation" is used to start production operation, specify production operation step, modify production model data,
Touch to perform operations such as teaching. The operation switch section is displayed in green. The operation switch section of "setup work" is touched when performing operations such as model switching, home return operation, manual work, inching operation, etc.
The operation switch section is displayed in yellow green.

The operation switch section for "data editing" is NC
Touch to perform operations such as data editing, device setting data editing, offset data editing, etc. The operation switch section is displayed in blue. The operation switch section for "device maintenance" is touched when performing operations such as device operation information, information re-display, device diagnosis, test confirmation, teaching ... The operation switch section is displayed in yellow.

The operation switch section of "environment setting" is touched when performing operations such as tower light setting, buzzer setting, calendar setting ... The operation switch section is displayed in gray. Here, the operation switch section of "data edit" is touched, and the screen of "data edit" shown in FIG. 11 is displayed. This screen shows "NC data", "apparatus setting data", "test operation data" and "offset data".
The operation switch section for each item is displayed.

The operation switch portion of "NC data" includes operation data, dispensing condition data, dispensing data ...
Touch to operate the settings such as. The operation switch section of the "device setting data" has device timer settings, front / rear process mode settings, device address settings, calendar settings, ...
・ Touch when setting operation such as.

The operation switch portion of the "test operation data" has a head rotation operation selection / preceding process signal disregard selection ...
Touch to operate the settings such as. The operation switch section of “offset data” is touched when performing setting operations such as device offset, nozzle offset, nozzle holder offset ,. When the operation switch section of "device setting data" is touched on the screen shown in FIG. 11, the screen of "device setting data" shown in FIG. 12 is displayed. On this screen, "apparatus timer setting", "preceding process mode setting", "apparatus address setting", "substrate positioning reference setting", "application nozzle setting", "application pressure setting",
Each operation switch section of "Nozzle acceleration / deceleration setting" is displayed.

On this screen, touching the operation switch section for "substrate positioning reference setting" displays the "substrate positioning reference setting" screen shown in FIG. This screen has
"Board positioning standard", "Board positioning method selection",
Each device switch section of "selecting substrate holding force" is displayed.
If you touch the operation switch section of "PC board positioning reference", the switch section will light up and the "PC board positioning reference: -----
(The setting conditions so far are displayed. Data is not set at the moment.) "And the operation switch parts of" outer shape reference "and" hole reference "are displayed at the lower right of the screen. Then, when the desired "outer shape reference" operation switch section is touched, the "----" portion of the display section is displayed as "outer shape reference", and the "outer shape" is touched by touching the "setting" key at the lower right. "Reference" is set, and the switch section is displayed as "outer shape reference" (see FIG. 13). As a result, when the substrate (1) is positioned, the positioning is performed with the end face of the substrate (1) as a reference, based on the “outer shape reference” set. If the "hole reference" is set, the board (1)
Positioning is performed with reference to the positioning hole (50) of.

Next, when the operation switch section of "board positioning method selection" is touched, the switch section is lit and "board positioning method selection: -----" is displayed on the data setting display section at the lower left of the screen. Setting conditions are displayed. Data is not currently set.) "And" Standard "and" Variable "are displayed in the lower right of the screen instead of the" Outer shape reference "and" Hole reference "operation switch sections. Each operation switch section of “” is displayed. Then, when the desired "standard" operation switch section is touched, the "---" part of the display section is displayed as "standard", and the "standard" is touched by touching the "setting" key at the lower right. Set, the switch section is "standard"
Is displayed (see FIG. 14). Thereby, the substrate (1)
Based on the "standard" set at the time of positioning, the moving amount data of the movable plate (28) at the time of positioning (the data is the gap between the substrate (1) and the movable plate (28), the movable plate (28) and the substrate (1)). ) Is selected from preset data, and the substrate (1) is positioned with a constant movement amount. When "variable" is set, the amount of movement of the movable plate (28) is varied according to the substrate width size of the substrate (1) to position the substrate (1). That is,
The substrate (1) is pushed in by the set pushing amount after the detection of the substrate positioning sensor (43). Thereby, the substrate (1)
Accurate positioning is possible even if there are variations in the width size.

Next, when the operation switch section for "selecting board pressing force" is touched, the switch section is lit and "selecting board pressing force: ---
-((The setting conditions so far are displayed. No data is set at present.) "Is displayed, and" Standard "and" Variable "operation switches are replaced with" Weak ". ], “Standard”, and “Strong” operation switch sections are displayed. Then, when the desired "standard" operation switch section is touched, the "---" part of the display section is displayed as "standard", and the "standard" is touched by touching the "setting" key at the lower right. It is set and the switch section is displayed as "standard" (see FIG. 15). As a result, when the substrate (1) is positioned, based on the "standard" that has been set, further pushing is performed after the detection of the substrate positioning sensor (43) by the preset data. Similarly, even when "weak" or "strong" is set, a lesser or greater amount of movement than "standard" is further pushed after detection by the sensor (43) based on the set data, so that reliable positioning is achieved. You can do it. That is, for example, the substrate (1) having a small substrate thickness is set to “weak” to prevent the substrate (1) from warping by weakening the positioning and pushing the substrate, or a substrate having a large substrate size. For a heavy substrate (1) such as a thick substrate (1) or a thick substrate (1), set "strong" to strengthen the positioning and shake or detach the substrate (1) when the XY table (4) moves. To prevent it.

The operation will be described below. First, when the power is turned on, the CRT (65) displays the initial screen shown in FIG. When the green "production operation" operation switch section is touched on this initial screen, the production operation (application) screen shown in FIG. 9 is displayed. Then, when the start key (19) is pressed on this screen, the "stopping" screen shown in FIG. 9 is replaced with the "running" screen shown in FIG. 10, and the production operation by the coating device is started.

The positioning operation of the substrate (1) will be described below with reference to FIGS. 25 to 28. When the production operation is started, the XY table (4) is raised to the substrate transfer level (the height origin position detected by a sensor not shown). At this time, the positioning mechanism (21) is in an open state (the substrate transport unit is made wider than the substrate width so that the transported substrate (1) can enter).

Next, the substrate (1) is conveyed from the supply conveyor (11) through the conveyor (24) onto the XY table (4), and the substrate detection sensor (53) passes the substrate (1). Is detected, the driving of the supply conveyor (11) and the conveyor (24) is stopped, and the substrate stopper (54) is placed at a predetermined position of the conveyor (24) to perform positioning based on the rear end of the substrate (1). It is lowered by the vertical mechanism. After the stopper (54) descends, the conveyor (24) is reversely driven and the rear end of the substrate (1) is restricted by the stopper (54), and the movement thereof is stopped. At this time,
A timer (not shown) is set for a time sufficient for the substrate (1) to come into contact with the stopper (54), and the reverse rotation drive of the conveyor (24) is stopped after the timer expires. Further, the presence of the substrate (1) is detected by the substrate detection sensor (53).

The substrate stopper (54) is raised, and the substrate transfer section of the XY table (4) is lowered by the vertical mechanism. At this time, the substrate (1) is backed up by the backup pins (49) on the backup base (48), the substrate (1) is lowered to the lower limit position, and then the substrate (1) is positioned. The "board positioning reference" set on the "board positioning reference setting" screens of FIGS. 13, 14, and 15 is "outer shape reference", "board positioning method selection" is "standard", and "board holding force" is " Since "standard" is set, the movement amount data of the movable plate (28) satisfying this condition is stored in the ROM from the various movement amount data of the movable plate (28) set in the ROM (66).
The movable plate (28) is read from (66) and moved by a predetermined amount X1. That is, the pulse motor (44) is driven by a specified number of pulses, and this drive drives the ball screw (4
6) is rotated and guided by the linear guide (27), and the movable plate (28) is moved in the direction in which the space between the fixed blocks (22) and (23) is narrowed. At this time, the movable plate (2
Although the fixed block (23) and the slide block (29) on the movable plate (28) are also moved by the movement of 8), the slide block (29) supporting the substrate (1) is the substrate as shown in FIG. Since the movement is restricted by (1), only the fixed block (23) is moved from a certain position. Then, as shown in FIGS. 3 to 17, and further from FIGS. 17 to 19, the fixed block (23) continues to move with respect to the slide block (29) whose movement is restricted at a certain position, and during this time, the slide block (29). The light shield plate (37) which is in contact with the side surface of the is rotated clockwise about the light shield plate swing fulcrum (36), and the light shield plate (37) shields the light as shown in FIG. The light from the board positioning sensor (43) that has been used causes the CPU to pass.
(67) judges that the positioning of the substrate (1) is completed,
The CPU (67) starts the coating operation.

The coating operation is performed by the RAM (65) shown in FIG.
It is performed based on the NC data relating to the coating operation stored in. That is, in step 0001, the X coordinate data [m
m] or Y coordinate data [mm] at the coordinate position (X1, Y1) on the substrate (1), the adhesive is applied by Z (angle data) Z1 under the application condition shown by the application condition data shown in FIG. . NC data D of FIG. 20 (coating condition data number)
Is set to 001, and the nozzle number 1, the gauge 1, and the nozzle number 1 set to 001 corresponding to the coating condition data of FIG.
Based on the application time T1, the adhesive is applied to the nozzle (6) of nozzle number 1 with the pressure of gauge 1 for the application time T1 and the syringe (7).
Then, air is sent from a supply source through an air tube (not shown) to discharge a predetermined amount of adhesive from the nozzle (6) to apply the adhesive onto the substrate (1).

Next, at step 0002, NC of FIG.
The syringe (7) is pressed at the coordinate position (X2, Y2) on the substrate (1) indicated by the data with the Z (angle data) Z2 to the nozzle (6) of the nozzle number 1 with the pressure of the gauge 2 for the application time T2. , Apply the discharged adhesive. Hereinafter, similarly, the coating work from step 0003 onward is continued.

Then, when the coating on the substrate (1) is completed, the movable plate (28) is moved to expand the fixed block (23) and the slide block (29) chute by the fixed movement amount X1 to the substrate (1). The positioning is released to prepare for receiving the next substrate (1). Further, the positioning of the board (1) has not been completed (the board positioning sensor (4
The repositioning operation in the case where the presence of the substrate cannot be detected due to 3) will be described.

First, the CPU (67) determines that the positioning is abnormal, and drives the motor (44) in reverse to drive the positioning mechanism (2).
After opening 1), the XY table (4) is raised.
Then, the movable plate (28) is moved until the light of the substrate positioning sensor (43) is transmitted, and the fixed block (23) and the slide block (29) are moved in the narrowing direction. At this time, the backup pin detection sensor (5
2) the fixed block (23) and the slide block (2)
9) detects whether or not the backup pin (49) comes into contact with the backup pin (49). Also,
Whether or not the moving amount of the movable plate (28) exceeds the maximum distance (preset) is also detected based on the number of pulses, and if it exceeds, abnormal stop occurs.

When the substrate detection is completed without abnormal stop, the fixed block (23) and the slide block (29) are further selected from the position through the movable plate (28) from the setting of "substrate pressing force selection". Data corresponding to the condition is read from the ROM (66) and pushed in by the pushing amount. When the push-in is completed (substrate positioning is completed) without being detected by the backup pin detection sensor (52), the XY table (4) is lowered and the coating operation is started as described above. After the application to the substrate (1) is completed, the fixed block (23) and the slide block (29) are expanded through the movable plate (28) by the amount narrowed at the time of repositioning to receive the next substrate (1). Prepare

Next, the positioning operation when a substrate (1) of a different type from the above-mentioned substrate (1) is handled will be described.
In this case, as described above, the operation switch section of "data edit" is touched on the screen of "initial screen" shown in FIG. 8 to display the screen of "data edit" shown in FIG. 11, and "device" is displayed on this screen. Touch the operation switch section of "Setting data"
The screen of "apparatus setting data" shown in 2 is displayed. On this screen, the operation switch section for "board positioning reference setting" is touched to display the "board positioning reference setting" screen shown in FIG.

On this screen, touch the operation switch section of "board positioning reference" to light the switch section and display "board positioning reference: outer shape reference" on the data setting display section at the lower left of the screen and display the screen. "Outline standard" in the lower right,
Display each of the "hole reference" operation switches. And
Touch the desired "hole reference" operation switch section to display the "outer shape reference" portion of the display section as "hole reference", and touch the "Setting" key at the bottom right to call it "hole reference". After setting, the switch section is displayed as "hole reference" (see FIG. 22). Then, as shown in FIG. 7, a positioning pin (51) is erected on the backup base (48). As a result, when the substrate (1) is positioned, the positioning is performed with the positioning hole of the substrate (1) as a reference based on the "hole reference" set.

Next, the operation switch section of "selecting board positioning method" is touched to light the switch section, and "select board positioning method:" is displayed on the data setting display section at the lower left of the screen.
"Standard" is displayed and "Outline standard" is displayed at the bottom right of the screen.
"Standard" instead of "hole-based" operation switches
Display each variable operation switch. Then, touch the desired "Variable" operation switch section to display the "Standard" portion of the display section as "Variable", and touch the "Setting" key at the bottom right to set "Variable". , The switch section is displayed as “variable” (see FIG. 23).
As a result, based on the "variable" set when positioning the substrate (1), the amount of movement of the movable plate (28) is varied for each substrate (1) during positioning as shown in FIGS. 29 to 31. Is done. That is, the substrate (1)
Even if there are variations in the width size of the board, the board positioning sensor (43) moves until it detects (the slide block (29) comes into contact with the board (1)), and then a predetermined pushing operation is performed to ensure that The substrate (1) is positioned.

Next, touch the operation switch section for "selecting board pressing force" to light up the switch section, and select "board pressing force selection: standard" on the data setting display section at the lower left of the screen.
Is displayed, and the operation switches of “weak”, “standard”, and “strong” are displayed at the lower right of the screen instead of the operation switches of “standard” and “variable”. And the desired "strong"
Touch the operation switch of to display "standard" on the display.
The portion is displayed as "strong", the "setting" key at the lower right is touched to set "strong", and the switch portion is displayed as "strong". As a result, at the time of positioning the board (1), the board positioning sensor (43) is moved by the preset pushing amount data based on the "strong" set.
Further indentation is performed after detection of.

When the production operation is started, when the substrate (1) is transferred onto the XY table (4) as described above, the substrate (1) is positioned. 22, 2
"Board positioning reference" set on the "Board positioning reference setting" screen of 3 and 24 is "Hole reference", "Board positioning method selection" is "Variable", and "Board pressing force" is "Strong". Since it is set, the moving amount data of the movable plate (28) satisfying this condition is read from the ROM (66) from the various moving amount data of the movable plate (28) stored in the ROM (66). The movable plate (2
8) is a predetermined amount X2 (X2 is a fixed block (22) compared to X1 even if the width size of the substrate (1) is the same as shown in FIG.
Since there is a gap d between the substrate and the end face of the substrate (1), it is shorter by d. ) Moved. That is, the board positioning sensor (4
The fixed block (23) and the slide block (29) are moved in the narrowing direction via the movable plate (28) until the light of 3) is transmitted. At this time, the backup pin detection sensor (52) detects whether or not the fixed block (23) and the slide block (29) come into contact with the backup pin (49). If detected, the apparatus is abnormally stopped. Further, whether or not the moving amount of the movable plate (28) exceeds the maximum distance is also detected based on the number of pulses, and if it exceeds, abnormal stop is also performed.

When the substrate detection is completed without abnormal stop, the movable plate (28) is further pushed from that position by the pushing amount selected from the setting of "Substrate pressing force selection". When the push-in is completed (substrate positioning is completed) without being detected by the backup pin detection sensor (52), the XY table (4) is lowered and the coating operation is started as described above. After the application to the substrate (1) is completed, the movable plate (2
8) is moved to expand the fixed block (23) and the slide block (29) to prepare for receiving the next substrate (1).

Further, although the substrate pressing force has three steps in this embodiment, it is not limited to this and can be set to an arbitrary number. Incidentally, various data relating to the moving amount of the movable plate (28) may be stored in the RAM (65) so that it can be rewritten. Further, the present invention is not limited to the coating device, and may be applied to a screen printing machine for printing cream solder on a substrate through a screen and a component mounting device for mounting chip-shaped electronic components on the substrate.

[0045]

Further, even if the width size of the same substrate varies, the substrates can be surely positioned.

[Brief description of drawings]

FIG. 1 is a configuration circuit diagram of a coating device.

FIG. 2 is a front view of a coating device.

FIG. 3 is a plan view of a substrate positioning mechanism.

FIG. 4 is a front view of a substrate positioning mechanism.

FIG. 5 is a side view of the substrate positioning mechanism.

FIG. 6 is a side view of a substrate positioning mechanism.

FIG. 7 is a side view of the substrate positioning mechanism.

FIG. 8 is a screen displayed via a touch panel switch.

FIG. 9 is a screen displayed via a touch panel switch.

FIG. 10 is a screen displayed via a touch panel switch.

FIG. 11 is a screen displayed via a touch panel switch.

FIG. 12 is a screen displayed via a touch panel switch.

FIG. 13 is a screen displayed via a touch panel switch.

FIG. 14 is a screen displayed via a touch panel switch.

FIG. 15 is a screen displayed via a touch panel switch.

FIG. 16 is an enlarged view of a main part of a board positioning mechanism.

FIG. 17 is an enlarged view of a main part of a board positioning mechanism.

FIG. 18 is an enlarged view of a main part of a board positioning mechanism.

FIG. 19 is an enlarged view of a main part of the substrate positioning mechanism.

FIG. 20 is a screen displayed via a touch panel switch.

FIG. 21 is a screen displayed via a touch panel switch.

FIG. 22 is a screen displayed via a touch panel switch.

FIG. 23 is a screen displayed via a touch panel switch.

FIG. 24 is a screen displayed via a touch panel switch.

FIG. 25 is a flowchart relating to a board positioning operation.

FIG. 26 is a flowchart relating to a board positioning operation.

FIG. 27 is a flowchart relating to a board positioning operation.

FIG. 28 is a flowchart relating to a board positioning operation.

FIG. 29 is a flowchart relating to a board positioning operation.

FIG. 30 is a flowchart relating to a board positioning operation.

FIG. 31 is a flowchart relating to a board positioning operation.

[Explanation of symbols]

 (1) Printed circuit board (4) XY table (5) Coating unit (6) Nozzle (21) Board positioning mechanism (65) RAM (66) ROM (67) CPU

Claims (3)

[Claims] 1. A substrate for sandwiching and supporting various printed circuit boards on which a predetermined work is performed by a pair of chutes, and for moving the movable chutes to and from the fixed chutes to change the chute width for positioning. In the positioning device,
An urging means for urging the movable chute in the fixed chute direction, a storage device for storing the clamping force data of the substrate by the chutes corresponding to various substrates, and a clamping force data stored in the storage device based on the clamping force data. And a control device for adjusting the urging force by the urging means by controlling so as to change the chute width. 2. A pair of a fixed-side chute and a movable-side chute for transferring a substrate and a slide block provided on the movable-side chute in a width direction of the board, the pair of fixed-side chutes being provided at positions facing each other in the width direction of the printed board. And a pressing means for pressing through an elastic means, which is provided on the movable side chute by moving the movable side chute to and away from the fixed side chute via a drive motor when positioning the substrate in the width direction. In a substrate positioning device for detecting a movement of a slide block to a certain position by a detection device, a storage device for storing movement amount data of the movable side chute after the movable side chute is moved to a certain position by the detection device. , The movable side is further moved based on the moving amount data stored in the storage device after it is detected by the detection device that the movable side chute has moved to a certain position. A substrate positioning device comprising a control device for moving a chute. 3. A pair of fixed-side chutes and a movable-side chute for carrying a substrate, which are provided at positions opposed to each other in the widthwise direction of the printed circuit board, and a slide block provided on the movable-side chute in the widthwise direction of the board. And a pressing means for pressing through an elastic means, which is provided on the movable side chute by moving the movable side chute to and away from the fixed side chute via a drive motor when positioning the substrate in the width direction. In a substrate positioning device for detecting a movement of a slide block to a certain position by a detection device, a first storage device for storing movement distance data of the movable side chute, and a position where the movable side chute is present by the detection device. Second storage device for storing the pushing amount data of the movable side chute after moving up to and the movement stored in the first storage device for a certain substrate. The movable side chute is moved based on the distance data to position the substrate, and the detection device detects that the movable side chute has moved to a certain position, and then the second storage device stores the movable side chute. A substrate positioning device, further comprising: a control device for further moving the movable side chute based on the stored pushing amount data.